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Henkel Semiconductor Solutions

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<strong>Semiconductor</strong><br />

Market MaTERIALS <strong>Solutions</strong><br />

Discrete DIE ATTACH Market films<br />

Non-conductive DDF: DA1<br />

PRODUCT<br />

DESCRIPTION<br />

FILM<br />

THICKNESS, µm<br />

UV Dicing<br />

Tape<br />

MRT<br />

CTE °C (Below<br />

Tg/Above Tg)<br />

Cure Type<br />

CURE SCHEDULE<br />

ABLESTIK<br />

ATB-100<br />

Single layer format. 30, 40 No L3 - 260 46/139 Cure<br />

30 min. @ 100°C<br />

+ 30 min. @ 120°C<br />

ABLESTIK<br />

ATB-100U<br />

ABLESTIK<br />

ATB-100US<br />

Single layer format, fast cure and high flowability for DA on rough<br />

surface application.<br />

Non-conductive 2-in-1 Dicing Tape Die Attach Film with good bondline<br />

thickness control. Will not bleed and does not require cure prior<br />

wirebonding. Excellent thin die pickup.<br />

20, 30 No L2 - 260 63/238 Cure 30 min. @ 120°C<br />

20, 25, 30 No L2-260 81/N/A SkipCure N/A<br />

Non-conductive DDF: DAX<br />

PRODUCT<br />

DESCRIPTION<br />

FILM<br />

THICKNESS, µm<br />

UV Dicing<br />

Tape<br />

MRT<br />

CTE °C (Below<br />

Tg/Above Tg)<br />

Cure Type<br />

CURE SCHEDULE<br />

ABLESTIK<br />

ATB-100<br />

Single layer format. 20 No L2 - 260 46/139 Cure<br />

30 min. @ 100°C<br />

+ 30 min. @ 120°C<br />

ABLESTIK<br />

ATB-100A<br />

Excellent pick-up performance with PSA D/T and controlled flow<br />

for die stacking.<br />

5, 10, 20 No L2 - 260 62/224 Cure<br />

30 min. @ 100°C<br />

+ 30 min. @ 120°C<br />

ABLESTIK<br />

ATB-100U<br />

Single layer format with fast cure. 5, 10, 20 No L2 - 260 63/238 Cure 30 min. @ 120°C<br />

ABLESTIK<br />

ATB-100US<br />

Non-conductive 2-in-1 Dicing Tape Die Attach Film with good bondline<br />

thickness control. Will not bleed and does not require cure prior<br />

wirebonding. Excellent thin die pickup.<br />

5, 10, 15, 20 No L2-260 81/N/A SkipCure N/A<br />

Conductive Films<br />

PRODUCT<br />

DESCRIPTION<br />

FILM<br />

THICKNESS, µm<br />

UV Dicing<br />

Tape<br />

MRT<br />

CTE °C (Below<br />

Tg/Above Tg)<br />

Cure Type<br />

CURE SCHEDULE<br />

ABLESTIK<br />

C115<br />

Die Attach Adhesive Film is suitable for tight geometry (

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