Henkel Semiconductor Solutions

Semiconductor
MaTERIALS
DIE ATTACH ADHESIVES
As higher-temperature processes are now the norm,
semiconductor packaging materials must be able
to withstand these stressful conditions while still
maintaining their integrity and performance. To
this end, Henkel has developed a full suite of Die
Attach products that address the needs of varying
die size and stack requirements, as well as Pb-free
capability. Through the use of Henkel’s patented
Bismaleimide (BMI) chemistry, superior Pb-free
processing is achieved. Because the chemistry is
ultrahydrophobic, Henkel’s Die Attach Adhesives
deliver superior adhesive strength, elongation
at break, and cohesive energy at high reflow
temperatures. These characteristics enable Henkel’s
Die Attach products to maintain adhesive strength
and structural integrity during moisture soak and
alleviate stresses induced by deformations associated
with higher-temperature Pb-free reflow processing.
Henkel’s advancements in materials technology
have enabled the development of some
revolutionary new Die Attach products with
unprecedented performance characteristics.
Ablestik Die Attach Paste Adhesives have been
formulated to address multiple process conditions
and application-specific requirements. From our
traditional Ablestik Die Attach Pastes to Self-
Filleting materials and controlled flow technique,
as well as award-winning Wafer-Backside Coating
(WBC) technologies and Multicore Die Attach Solder
Paste for semiconductor power devices, Henkel’s
Die Attach Paste solutions are unmatched.
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