Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
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<strong>Semiconductor</strong><br />
MaTERIALs<br />
DIE ATTACH PASTE ADHESIVES<br />
Die Attach Paste Adhesives<br />
Laminate Packages<br />
BGA, CSP, DRAM, Smart Card<br />
Leaded Packages<br />
SOIC, SOP, QFN, QFP, Discretes<br />
Die Attach Solder Paste<br />
Electrically<br />
Conductive<br />
Non-Electrically<br />
Conductive<br />
Electrically<br />
Conductive<br />
Non-Electrically<br />
Conductive<br />
Dispensable<br />
Printable<br />
ABLEBOND<br />
2000B<br />
ABLEBOND<br />
2025DSI<br />
ABLEBOND<br />
84-1LMISR4<br />
ABLEBOND<br />
2025DSI<br />
MULTICORE<br />
DA100<br />
MULTICORE<br />
DA101<br />
ABLEBOND<br />
2030SC<br />
ABLEBOND<br />
2033SC<br />
ABLEBOND<br />
84-1LMISR8<br />
ABLECOAT<br />
8006NS (WBC)<br />
ABLEBOND<br />
2100A<br />
ABLEBOND<br />
2035SC<br />
ABLEBOND<br />
3230<br />
ABLECOAT<br />
8008NC (WBC)<br />
ABLEBOND<br />
2300<br />
ABLESTIK<br />
2025D-SF<br />
ABLECOAT<br />
8008HT (WBC)<br />
ABLEBOND<br />
8900NC<br />
ABLEBOND<br />
8384<br />
ABLEBOND<br />
2053S<br />
ABLESTIK<br />
8008MD (WBC)<br />
ABLESTIK<br />
ABP-8910T<br />
ABLEBOND<br />
8387B<br />
ABLEFLEX<br />
6200<br />
ABLEBOND<br />
8200C<br />
HYSOL<br />
QMI536HT<br />
ABLEBOND<br />
8387BS<br />
ABLEFLEX<br />
6202CX<br />
ABLEBOND<br />
8200TI<br />
HYSOL<br />
QMI547<br />
ABLEBOND<br />
GA-2W<br />
ABLEBOND<br />
8290<br />
HYSOL<br />
QMI536HT<br />
ABLEBOND<br />
8352L<br />
HYSOL<br />
QMI538NB<br />
ABLEBOND<br />
FS849-TI<br />
ABLETHERM<br />
2600AT<br />
HYSOL<br />
QMI519<br />
HYSOL<br />
QMI529HT<br />
HYSOL<br />
QMI529HT-LV<br />
(WBC) = Wafer-Backside Coating<br />
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