Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
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<strong>Semiconductor</strong><br />
MaTERIALS<br />
As the only manufacturer with<br />
materials solutions for the entire<br />
semiconductor packaging value chain,<br />
<strong>Henkel</strong>’s proven and trusted semiconductor<br />
products provide superior manufacturing<br />
advantages. We simplify the supply chain by<br />
delivering exceptionally engineered products and a low-risk<br />
partnership proposition. Our forward-looking, innovative philosophy and<br />
global presence further enable your business by delivering next-generation<br />
technologies today and supporting them with knowledgeable, experienced<br />
worldwide staff.<br />
The full line of <strong>Henkel</strong> packaging materials includes Die Attach Paste<br />
Adhesives, Dicing Die Attach Films and Flow-Over-Wire (FOW) Films, Wafer<br />
Backside Coating (WBC) Die Attach Materials, Package Level Underfills,<br />
Encapsulants, Molding Compounds, Non-Conductive Pastes (NCPs) and Tacky<br />
Fluxes.<br />
Across the Board,<br />
Around the Globe.<br />
www.henkel.com/electronics<br />
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