Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
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<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
BGA / CSP<br />
Ball Grid Arrays (BGAs) and Chip Scale Packages (CSPs)<br />
are laminate-based devices, which means they are<br />
essentially micro printed circuit boards (PCBs) on<br />
which ICs are mounted. Some BGA-type packages may<br />
alternatively use flip-chip ICs for interconnecting<br />
instead of wirebonds. In this case, the flip-chip<br />
mounted device dictates an assembly process change<br />
in which Wafer Bumping Solder Paste or Tacky Flux is<br />
used to attach the die instead of traditional die attach<br />
materials. Additionally, Underfills are used to protect<br />
the solder connections.<br />
BGA / CSP<br />
Die Attach<br />
Paste Adhesives<br />
Die Attach<br />
Film Adhesives<br />
Encapsulants<br />
Molding<br />
Compounds<br />
Tacky<br />
Fluxes<br />
Underfills<br />
Wafer<br />
Bumping<br />
Lid Attach<br />
Adhesives<br />
Electrically<br />
Conductive<br />
Non-Electrically<br />
Conductive<br />
DA1, PBGA,<br />
CSP, SCSP<br />
DAX, PBGA,<br />
SCSP<br />
Dam<br />
Fill<br />
HYSOL<br />
GR9810 series<br />
MULTICORE<br />
TFN600<br />
ABLEFILL<br />
UF8806G<br />
MULTICORE<br />
WS300<br />
ABLEBOND<br />
3003<br />
ABLEBOND<br />
2000B<br />
ABLESTIK<br />
2025D-SF<br />
ABLESTIK<br />
ATB-100<br />
(20, 30µm)<br />
ABLESTIK<br />
ATB-100<br />
(5, 10, 20µm)<br />
HYSOL<br />
FP4451<br />
HYSOL<br />
CB0260<br />
MULTICORE<br />
WS300<br />
ABLEFILL<br />
UF8826<br />
ABLEBOND<br />
3005<br />
ABLEBOND<br />
2100A<br />
ABLEBOND<br />
2300<br />
HYSOL<br />
QMI536HT<br />
HYSOL<br />
QMI538NB<br />
ABLEBOND<br />
2025DSI<br />
ABLESTIK<br />
ATB-100U<br />
(20, 30µm)<br />
ABLESTIK<br />
ATB-100US<br />
(20, 30µm)<br />
ABLESTIK<br />
ATB-100U<br />
(5, 10, 20µm)<br />
ABLESTIK<br />
ATB-100US<br />
(5, 10, 20µm)<br />
HYSOL<br />
FP4451TD<br />
HYSOL<br />
CB0260-1<br />
HYSOL<br />
FP4450<br />
HYSOL<br />
FP4450HF<br />
ABLEFILL<br />
UF8828<br />
ABLEFILL<br />
UF8829<br />
HYSOL<br />
FP4545FC<br />
ABLEBOND<br />
MC723<br />
ABLEBOND<br />
2053S<br />
ABLESTIK C115<br />
(Conductive)<br />
HYSOL<br />
FP4450LV<br />
HYSOL<br />
FP4549<br />
ABLESTIK<br />
ATB-100 Series<br />
(Curable Film)<br />
ABLESTIK C130<br />
(Conductive)<br />
HYSOL<br />
FP4470<br />
ABLESTIK<br />
ATB-100US<br />
(Skip Cure Film)<br />
10
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