Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
Henkel Semiconductor Solutions
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<strong>Semiconductor</strong><br />
Market <strong>Solutions</strong><br />
QFN<br />
Though they share similar names, the Quad Flat<br />
No-Lead (QFN) package differs from the QFP in its<br />
lead structure. With the QFN, the leads are located<br />
underneath the device as opposed to protruding from<br />
the sides. The QFN package also includes an exposed<br />
thermal pad, which enhances the ability of this<br />
package to remove heat from the IC. As this package<br />
is designed to manage heat dissipation, the Die Attach<br />
materials employed will most likely be thermally<br />
conductive.<br />
QFN<br />
Die Attach Adhesives<br />
Molding<br />
Compounds<br />
Electrically<br />
Conductive<br />
Non-Electrically<br />
Conductive<br />
Green<br />
ABLEBOND<br />
3230<br />
ABLEBOND<br />
8200C<br />
ABLEBOND<br />
2025DSI<br />
ABLEBOND<br />
8900NC<br />
HYSOL<br />
KL-G900HC<br />
ABLECOAT<br />
8008HT (WBC)<br />
ABLEBOND<br />
8200TI<br />
HYSOL<br />
QMI536HT<br />
ABLECOAT<br />
8008NC (WBC)<br />
HYSOL<br />
KL-G900HP<br />
ABLESTIK<br />
8008MD (WBC)<br />
ABLEBOND<br />
8290<br />
HYSOL<br />
QMI538NB<br />
ABLECOAT<br />
8006NS (WBC)<br />
HYSOL<br />
QMI519<br />
ABLEBOND<br />
84-1LMISR8<br />
ABLESTIK<br />
ABP-8910T<br />
HYSOL<br />
QMI529HT<br />
ABLEBOND<br />
FS849-TI<br />
HYSOL<br />
QMI547<br />
HYSOL<br />
QMI529HT-LV<br />
ABLESTIK<br />
C100 (Film)<br />
8
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