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Lecture 9 - Åbo Akademi

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3D and NoCs<br />

• 3D stacking technologies<br />

• Massive parallelism<br />

• Distributed memory architecture<br />

‣ 3D NoCs faster<br />

• 3D<br />

• Multiple silicon layers<br />

• Attractive solution for growing pace of SoC<br />

• Easier heterogeneous layers<br />

• One layer -> one technology<br />

• NoCs: necessity for 3D chips<br />

• Arbitrarily good scalability<br />

• Efficient parallelism of computation and communication

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