Lecture 9 - Åbo Akademi
Lecture 9 - Åbo Akademi Lecture 9 - Åbo Akademi
RF/Wireless Interconnects • Paths formed by • passage through air • refraction through the SiO 2 layer and reflection at the interface between the silicon substrate and the underlying dielectric layer (A1N) • refraction through the SiO 2 and dielectric layers, and reflection by the metal chuck that emulates a heat sink in the back of a die
RF/Wireless Interconnects: Research • Wireless interconnects may not only reduce the wires in integrated circuits, but can also be used to replace I/O pins • Signals propagating on these multiple paths constructively and destructively interfere • It was found by O et al. [ICCAD 2005] that by increasing the A1N thickness, destructive signal interference is significantly reduced
- Page 34 and 35: NoC Topology • Indirect Topologie
- Page 36 and 37: NoC Topology • (m, n, r) symmetri
- Page 38 and 39: NoC Topology • Irregular or ad ho
- Page 40 and 41: Switching strategies • Two main m
- Page 42 and 43: Switching strategies • Allocating
- Page 44 and 45: Switching strategies • VCT (virtu
- Page 46 and 47: Routing algorithms • Static and d
- Page 48 and 49: Routing algorithms • Minimal and
- Page 50 and 51: Routing algorithms • Routing algo
- Page 52 and 53: ACK/NACK flow control scheme • wh
- Page 54 and 55: Clocking schemes • Fully synchron
- Page 56 and 57: NoC Architectures examples
- Page 58 and 59: HERMES • Developed at the Faculda
- Page 60 and 61: Nostrum • Developed at KTH in Sto
- Page 62 and 63: QNoC • Developed at Technion in I
- Page 64 and 65: SPIN • Scalable programmable inte
- Page 66 and 67: Emerging NoC paradigms Overall goal
- Page 68 and 69: Novel Interconnect Paradigms for Mu
- Page 70 and 71: Motivation • Increasingly harder
- Page 72 and 73: Emerging Alternatives • Optical I
- Page 74 and 75: Optical Interconnects • Board-to-
- Page 76 and 77: Optical Interconnects • Waveguide
- Page 78 and 79: Optical Interconnects • OIs have
- Page 80 and 81: Optical Interconnects: Open Problem
- Page 82 and 83: RF/Wireless Interconnects • Micro
- Page 86 and 87: RF/Wireless Interconnects: Open Pro
- Page 88 and 89: CNT Interconnects • Carbon nanotu
- Page 90 and 91: Multi-Wall Carbon Nanotubes (MWCNT)
- Page 94 and 95: Conceptual transmitter and receiver
- Page 98 and 99: 3D and NoCs • 3D stacking technol
RF/Wireless Interconnects<br />
• Paths formed by<br />
• passage through air<br />
• refraction through the SiO 2 layer and reflection at the interface between<br />
the silicon substrate and the underlying dielectric layer (A1N)<br />
• refraction through the SiO 2 and dielectric layers, and reflection by the<br />
metal chuck that emulates a heat sink in the back of a die
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