Lecture 9 - Åbo Akademi
Lecture 9 - Åbo Akademi
Lecture 9 - Åbo Akademi
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Motivation<br />
• Copper interconnects also constitute up to 70% of total onchip<br />
capacitance<br />
• major sources of power dissipation<br />
• According to the International Technology Roadmap for<br />
Semiconductors (ITRS), interconnect innovation with new<br />
technologies is vital<br />
• to satisfy performance, reliability, power requirements in long term<br />
• support ultra-high data rates (greater than 100 Gbps/pin)<br />
• be scalable enough to support tens to hundreds of concurrent<br />
communication streams