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MAY 2011 issue n°112 THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE CALL FOR PAPERS MEMS – Entering a New Growth Cycle! The SEMICON Europe 2011 is the perfect platform for all players in the MEMS/MST industry. The show will be in Dresden/ Germany from 11 – 13 October. The development of the MEMS Market is hardly to be overlooked. With a 22 % growth in 2010, the MEMS and Sensor Market is back on track again. According to reliable prognoses this trend will further extend until 2015. The new growth stands on a solid basis and several reasons support that this may be a long-term development: • MEMS markets for consumer electronics and mobile phones will grow at an accelerated rate over the next 4 years, in particular revenue for handsets and slate tablets. • The soaring demand for MEMS sensors from BRIC countries (Brasil, Russia, India and China) in all sectors from cars to infrastructure e.g. for smart meters and optical telecom is driving demand. • Sales of DLP chips (Digital Light Processing) were again up in 2010. • Increasing use of sensors in addressing critical areas like energy and aging population. Therefore, the relevance of the International MEMS/MST Industry Forum on the SEMICON Europa 2011 cannot be underestimated. The Forum takes focus on the key success factors of the new growth cycle: • An area of new interesting applications promotes new technologies and provides line utilization; • Successful management of distributed operations including foundries, with methodologies for steep learning curves, best system know-how and ever shorter time-to-revenue cycles; • Effi cient high volume testing and quality assurance; • Innovative integration concepts for complex sensor systems. The MEMS applications will be the centre of attraction for many visitors: What will be their future usage in the automotive industry, biomedicine and life science, consumer electronics, optical telecommunication and also in high-end areas like aeronautics and industrial manufacturing? Additionally, the conference will cover all standard parts which are important for the day-to-day industrial production. The current leverage of the standardization, testing methods and results as well as strategies for high added volume and emerging products will be in the focus during the show. The range of the conference contains the know-how of technical processes and new materials for the MEMS in front-end, back-end and testing. This technical part deals with 3D and TSV (through silicon via) processes. Different Chip and WLP (wafer level package) technologies are also part of the program. Another session deals with the MEMS application markets, the chances and risks but also with forecasts and outlook. For information on SEMICON Europa 2011, please visit www.semiconeuropa.org or contact Carlos Lee, per email clee@semi.org or per telephone: +32 2 6095334 Copyrights © Yole Développement SA. All rights reserved - Recycled paper 4
MAY 2011 issue n°112 THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE INDUSTRY OUTLOOK “ Permanent Wafer Bonding will be a key enabling technology for advanced semiconductor manufacturing” says Yole Développement Yole Développement announces the publication of its technology study and market research report, Permanent Wafer Bonders Applications & Market Report. Historically developed for MEMS & SOI substrates, the wafer bonding technology is today becoming a key processing technology for a wide range of applications: MEMS, CMOS Image Sensors, LEDs, Power Devices, RF and Advanced Packaging. The wafer bonding market is a very complex one crossing different wafer sizes (from 2’’ to 12’’), different applications and different bonding technologies. Market overview Wafer bonding is usually defi ned as a process that temporarily or permanently joins two wafers or substrates using a suitable process. Historically developed for MEMS and then SOI wafers, wafer bonding technology has shifted to non-mainstream IC applications over the last years. Our report aims at analyzing the market perspectives and technical trends for permanent bonding. “MEMS have been the fi rst application where wafer bonders have been massively used (the wafer bonding step is mostly used to protect the MEMS sensitive element). And CMOS Image Sensors is also a very large market for wafer bonders”, explained Dr Eric Mounier, Project Manager at Yole Développement. But besides MEMS and CIS, wafer bonder can be also used for LEDs or Power Devices. Indeed, in a typical LED active region, spontaneous emission scatters photons in all directions. If the substrate material has a smaller band gap than the active region, approximately half of the light is absorbed in the substrate; significantly reducing device performance. So, one of the manufacturing solutions for photon loss involves bonding a wafer containing an array of devices to another wafer that provides both a refl ective surface for maximum light extraction and a heat sink for thermal management. And of course, over the 5 past years, much attention has been given to this technology for 3D integration of memories for example. Technology challenges For MEMS, there is today a shift from Glass Frit for eutectic/metal-based bonding mainly to increase real estate by smaller bond frames. Metal direct bonding also gives good hermeticity and mechanical stability for many MEMS applications. For example, Nasiri process is using eutectic bonding of the MEMS directly on the aluminum layer of the CMOS wafer. This leads to smaller package footprints & package heights. STMicroelectronics’ latest 3-axis accelerometer also shows a different sealing technique compared to what is usually done: gold eutectic sealing allows a dramatic die size reduction. For CMOS Image sensors, the advent of the BSI (Back Side Illumination) technology has raised a competition between Molecular Bonding and adhesive bonding. Here, cost and fi nal application will drive the technology fi nal choice. Yole Développement has estimated the wafer bonder to have big market growth for the next year. The growth will be driven small size wafer for LEDs and 12” wafer for 3D stacking and CIS. Yole Développement’s report analyzes in details the technical & economical evolution of the permanent wafer bonding process. It gives, for example, 2010- 2016 market forecasts for permanent bonding, number of equipment, an overview of the different bonding approaches and equipment players market shares. It describes the applications for wafer bonding with main characteristics, challenges and technical trends. For more information about Yole Développement reports, please contact D. Jourdan (jourdan@yole.fr) Permanent Wafer Bonding Applications (Source: Yole Développement, May 2011) Accelerometers 1st level packaging Microbolometers Gyros SGOI SOQ Optical MEMS Microphones Pressure sensor Microfluidics IGBTs Resonators RF MEMS Stress isolation/ device manufacturing Thin films LEDs Power MEMS LEDs Wafer Bonding Advanced substrates RF Devices Advanced Packaging CMOS Image Sensors SOI GOI Encapsulation Interposers FO WLP Microbumps MMIC 3D ICs 5Copyrights © Yole Développement SA. All rights reserved - Recycled paper
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