Microvision establishes first global R&D center in ... - I-Micronews

19
MAY 2011 issue n°112
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE
ADVANCED PACKAGING
Major semiconductor companies join SEMATECH’s 3D enablement center to
accelerate adoption of 3D TSV technologies
Advanced Semiconductor Engineering (ASE), Altera Corporation, Analog Devices, LSI Corporation, ON Semiconductor,
and Qualcomm collaborate to develop standards and technical specifications for 3D ICs.
SEMATECH announced that these companies
have joined SEMATECH’s 3D Enablement
program based at the College of Nanoscale
Science and Engineering (CNSE) of the University
at Albany. These leading semiconductor companies
will join CNSE, GlobalFoundries, Hewlett Packard,
Hynix, IBM, Intel, Samsung, and UMC to extend the
program’s position as a broad, cohesive initiative
and to enable industry-wide ecosystem readiness
for cost effective TSV-based 3D stacked IC
solutions.
As members, these program participants will work
with SEMATECH researchers to contribute to the
overall vision of the Enablement Center, which
includes identification of critical needs for 3D
technologies, and the development of path fi nding
capabilities, EDA tools, and appropriate test vehicles.
In December 2010, SEMATECH, along with the
Semiconductor Industry Association (SIA) and the
Semiconductor Research Corporation (SRC),
launched a new 3D Enablement program to drive
industry standardization efforts and technical
specifi cations for heterogeneous 3D integration. As
a fi rst-of-its-kind effort, the 3D Enablement program
aims to establish the infrastructure necessary for the
entire industry to leverage 3D packaging technology
for innovative new applications. The primary focus is
on developing technologies and specifications
necessary for establishing standards in critical areas
such as inspection, metrology, microbumping,
bonding and thin wafer, and die handling.
www.sematech.org
ASE steps up investment in China
Advanced Semiconductor Engineering (ASE) has revealed plans to invest a total of US$1.2 billion on manufacturing
facilities in Shanghai, China.
ASE will build a 180,000-square-meter plant as
part of an effort to expand its operations in
China, the company said. Located in Jinqiao,
Pudong New Area, the new facility will target higherend
wirebonding and packaging services with volume
production slated for the second half of 2011.
ASE also unveiled plans to set up its regional
headquarters and R&D center in Zhangjiang,
Shanghai. Construction of the 116,000-square-meter
factory building will be divided into three phases, ASE
said, adding that operations are scheduled to
commence in 2012. In November 2010, ASE
announced investment worth US$60 million to
expand capacity at its subsidiary ASE (Weihai) in
Shandong Province, China. Earlier in the year, the
company said it would spend a total of US$124 million
on operation expansion in China, including
construction of a new plant in the Pudong industrial
district of Shanghai and additional production lines
at its Kunshan, Jiangsu Province facility.
www.digitimes.com
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