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MAY 2011 issue n°112
THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE
ADVANCED PACKAGING
STATS ChipPAC expands 300mm
Through Silicon Via capabilities
From page 1
STATS ChipPAC has complete front to back-end manufacturing capabilities
for 200mm wafers and currently handles both chip-to-chip and chip-to-wafer
assembly for TSV technology. This includes high density microbump
capabilities in both solder and copper column materials, microbump bonding down
to 40um pitch, thin wafer handling, wafer level underfill, thin wafer dicing and
microbumps for flip chip interconnection. Microbump technology is critical to
delivering fine pitch, low profile solutions for high performance devices.
The latest TSV investment that STATS ChipPAC has made is the addition of a
300mm “mid-end” process flow that occurs between the wafer fabrication and
back-end assembly process. Mid-end processes support the advanced
manufacturing requirements of 2.5D and 3D TSV as well as wafer level packaging,
flip chip and embedded die technology.
Recent Through-Silicon-Via and micro-bumping realisations
from STATS ChipPAC:
2.5D silicon interposer "PoP module" demonstrator from STATS ChipPAC
www.statschippac.com
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CEA-Leti to implement multiple
EV Group systems on its new 300-mm
fab line dedicated to 3D integration
EV Group (EVG) announced that its longtime customer and
partner, CEA-Leti, has installed multiple EVG tools in its
industry-first 300-mm cleanroom dedicated to R&D and
prototyping for 3D-integration applications.
While Leti's new state-of-the-art facility is focused on R&D and prototyping,
EVG's equipment will be leveraged with an eye toward widespread adoption
of 3D technology for high-volume applications. Specifically, EVG's
equipment will be used in 3D technology demonstrations for Leti's global customer
base, as well as low-volume pilot production on 300-mm wafers with the end goal of
transferring the processes to their industrial partners' high-volume manufacturing
environments. The EVG systems to be deployed on CEA-Leti's new 300-mm 3D line
include an IQ Aligner production mask alignment system, a SmartView NT highest
precision bond alignment system, an EVG560 production wafer bonding system and
an EVG850 production bonding system for direct wafer bonding. These lithography
and packaging systems were specifi cally chosen for the advantages they deliver in
3D-integration processing. Moreover, CEA-Leti will be able to tap EVG's extensive
process know-how in 3D integration and through-silicon via (TSV) manufacturing, as
the institute's 3D offerings include TSVs along with advanced capabilities in alignment,
bonding, thinning and interconnects.
EVG works not only with research consortia and institutions such as CEA-Leti, but also
with global consortia, including EMC-3D, SEMI, NILCOM, NIL Austria, and Mancef.
www.EVGroup.com
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