Microvision establishes first global R&D center in ... - I-Micronews

More documents

Recommendations

Info

MAY 2011 issue n°112 THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE COMPOUND SEMICONDUCTORS A global SiC materials license agreement between Cree and Nippon Steel Cree announces it has entered into a silicon carbide (SiC) materials license agreement with Nippon Steel Corporation. Under the terms of the agreement, Nippon Steel Corporation, and affiliates including Nippon Steel Materials Co., Ltd., have been given the right to manufacture and sell silicon carbide materials for electronic device applications. Over the lifetime of the agreement, Cree will receive certain financial considerations from Nippon Steel. As part of this agreement, Cree was also granted rights to Nippon Steel’s relevant SiC-related patents. Other terms of the agreement were not disclosed. No technology transfer between the parties was included. SiC is a high-performance semiconductor material used in the production of a broad range of lighting, power and communication components, including light-emitting diodes (LEDs), power switching devices and RF power transistors for wireless communications. SiC devices are used today for solar inverters, highvoltage power supplies and power conditioning in many industrial power applications. “Cree is a pioneer in SiC materials technologies, resulting in energy-efficient power switching devices and high brightness LEDs,” said Steve Kelley, Cree chief operating officer. “We are pleased that Nippon Steel joins us in supporting the electronics device industry with licensed SiC materials.” “Nippon Steel has been conducting intensive R&D on SiC materials over twenty years,” said Dr. Misao Hashimoto, Nippon Steel, fellow and director of the Advanced Technology Research Laboratory. “The good working relationship between Cree and Nippon Steel enabled us to achieve our commitment for growing the global SiC market.” Cree is a market-leading innovator of semiconductor solutions for wireless and power applications, lightingclass LEDs, and LED lighting solutions. Cree has more than 1,800 patents issued worldwide and more than 2,600 pending patent applications that address LED chip, component and lighting technology, as well as SiC materials, and RF and Power electronics. (Courtesy of Cree and Nippon Steel Corporation) Cree’s product families include power-switching devices and radio-frequency/wireless devices, blue and green LED chips, high-brightness LEDs, lightingclass power LEDs, and LED fixtures and bulbs. Cree solutions are driving improvements in applications such as variable-speed motors, wireless communications, general illumination, backlighting and electronic signs and signals. www.cree.com Copyrights © Yole Développement SA. All rights reserved - Recycled paper TSMC spins off two green energy business units Taiwan Semiconductor Manufacturing (TSMC`s) board of directors approved, at a provisional meeting, a proposal to reorganize two green-energy business units into wholly-owned subsidiaries. The board determined initial paid-in capital for its solar-energy business unit, christened TSMC Solar Ltd., at NT$12.5 billion (US$416 million at US$1:NT$30) and the capital for its LED (light emitting diode) business unit, named TSMC Solid State Lighting Ltd., at NT$2.8 billion (US$93 million). The company has set baseline date for the splits on August 1 this year. It said the main thrust of spinning off the two business units into subsidiaries is to motivate entrepreneurship and facilitate business specialization in order to boost overall competitiveness and operational efficiency. GT Solar International, a provider of sapphire crystalline growth systems and materials for the solar, LED and other specialty markets, reports that that it has received an order for its sapphire crystallization furnaces totaling $218.9 million from TSMC stressed that the splits will not affect its shareholders’ interests as its ownership capital in the two subsidiaries is equivalent to their operating value, suggesting the company does not overvalue the two subsidiaries. Guizhou Haotian Optoelectronics Technology Co. LTD (HTOT). The order will be placed in HTOT's new sapphire production facility to supply manufacturers with sapphire wafers for LED chip production. GT Solar In recent years, TSMC has seen some results from its investments in green-energy industries; the company has bought into solar-cell maker Motech Industries Inc., entered into partnership with German solar module maker, CENTROSOLAR, on polycrystalline silicon business, and begun constructing a CIGSbased (copper indium gallium selenide-based) solarcell factory. In the LED field, TSMC has begun pilot production in a wafer factory in the Hsinchu Science Park running around eight to 12 MOCVD (metal organic chemical vapor deposition) chambers. The TSMC-held VisEra Technologies Co., Ltd. has begun offering packaging and test service to its LED wafer factory. TSMC will make its LED light sources and light engines available on the market with its brand names. news.cens.com GT Solar gets order for sapphire growth systems from new entrant into LED-related material market says that the order marks HTOT's entrance into the LED industry. www.sslighting.net 14
15 MAY 2011 issue n°112 THE DISRUPTIVE SEMICONDUCTOR TECHNOLOGIES MAGAZINE PHOTONICS Strong growth projected for silicon photonics market according to new market survey The silicon photonics market is expected to reach a value of the $2.02 billion by 2015, reflecting a five-year compound annual growth rate of 78.2 percent, according to the report Global Silicon Photonics Market (2010-2015), published by MarketsandMarkets. Highlights of the market report include the following: • Silicon photonics technology is gaining ground as a low-cost alternative for addressing the speed and bulk data transfer challenges faced by microelectronics. The market is in its infancy and is expected to be commercialized by 2016. • In 2010, the wavelength division multiplex filters contributed $35,212 to the global silicon photonics market, mainly because of early commercialization and extensive usage in optical switches and transceiver devices. • The silicon photonics LED market is expected to experience the relatively high compound annual growth rate of 87.6 percent from 2010 to 2015 because of an increasing need for an efficient light source in small-distance communication networks. • At present, North America dominates the silicon photonics market, having generated $59,667 in 2010. The worth of the market in the region is projected to reach $849,587 in 2015 with a compound annual growth rate from 2010 to 2015 of 70.1 percent. • Major players in the global silicon photonics market include Kotura, Lightwire, Luxtera and Chiral Photonics, all US companies. www.marketsandmarkets.com New managing director at 3S Photonics French subsidiary New managing director at 3S Photonics French subsidiary 3S Photonics Group announced the nomination of Jean-Michel Bonard as its managing director in France, as well as the creation of three new transversal positions within the group’s board. Bonard joined the company in 2009 as deputy general manager in charge of company operations. In addition, he was responsible for the finance department. Prior to joining the group, he worked at Katun Corp. and GE Capital Finance, and he created JMB Conseils, a financial consulting firm for telecom and IT companies. To strengthen the collaboration between its entities, the company has created three transversal and strategic positions within its board: Jean-Pierre Hirtz, business development director; Geoffroy Morel, chief financial officer; and Fotis Konstantinidis, vice president of sales. The announcement follows the company’s February 2010 acquisition of Avensys Inc., based in Canada. To reinforce its international position, 3S Photonics has also launched a policy for diversification, geographical expansion and strategic partnerships. 3S Photonics designs, develops and markets optical components and modules, and modules based on optical fiber. Through its subsidiary Avensys Solutions, it provides environmental and industrial process surveillance. www.3sphotonics.com The City College of New York set up a new metamaterials center A new industry and university cooperative research center proposes to provide a one-stop shop for the design, fabrication and testing of a wide range of metamaterials designed to aid solar photovoltaic systems, specialized light sensors and more. Researchers at the National Science Foundation-sponsored center will focus on fundamental research concepts that are limiting the application and implementation of metamaterials to commercial products. For example, by controlling the composition of a material, it may be possible to produce superlenses with near-perfect resolution. The center's research thrusts will encompass fundamental metamaterials research, including the following: materials for rapid prototyping, metamaterials building blocks, all-dielectric resonator Universal Display announced the release of a novel single-layer encapsulation technology for plastic substrate systems and thin-film devices, including rigid and flexible OLED displays and lighting panels. Developed in collaboration with research partner Princeton University, the single-layer hybrid organic-inorganic layer approach was demonstrated successfully as an encapsulant for flexible and rigid OLED devices. Its encapsulation layer provides a permeation barrier to protect thin-film devices from environmental conditions such as metamaterials, development of modeling and design algorithms, process development of composite materials, aperture and cavity arrays, tools for characterization of metamaterials, next-generation metallic resonator metamaterials, and high-, zero-, and negative-refractive-index materials. Industry and university cooperative research centers conduct fundamental research. The companies that participate in the center direct the research and receive royalty-free, nonexclusive licenses to the intellectual property the center produces. Placing thin metamaterial films over silicon panels Universal Display unveils novel encapsulation technology moisture and oxygen, a quality that is critical for the long-term performance of OLED display and lighting products. The encapsulation technology was supported in part by National Science Foundation, US Department of Defense and US Department of Energy SBIR contracts. To demonstrate the technology’s would allow solar light to pass through to silicon surfaces unblocked. The same film would capture the electricity produced by those surfaces, possibly raising the efficiency of terrestrial solar cells from 17 to 21 percent, he said. Because the film would spread light laterally across the cell, thinner silicon wafers could be used, which would reduce costs. The sensor projects, being conducted with NASA and DARPA, aim to produce lightweight polar image metric sensors capable of measuring light's intensity, color and polarization or orientation. www.ccny.cuny.edu effectiveness for flexible OLED display prototype, the company has worked with the US Army Research Laboratory and the Flexible Display Center at Arizona State University. www.universaldisplay.com Copyrights © Yole Développement SA. All rights reserved - Recycled paper
Page 1 and 2: THE DISRUPTIVE SEMICONDUCTOR TECHNO
Page 3 and 4: MAY 2011 issue n°112 THE DISRUPTIV
Page 5 and 6: MAY 2011 issue n°112 THE DISRUPTIV
Page 7 and 8: 7 MAY 2011 issue n°112 THE DISRUPT
Page 9 and 10: 9 MAY 2011 issue n°112 THE DISRUPT
Page 11 and 12: 11 MAY 2011 issue n°112 MEPTEC PRE
Page 13: 13 MAY 2011 issue n°112 THE DISRUP
Page 17 and 18: 17 MAY 2011 issue n°112 THE DISRUP
Page 23: 23 MAY 2011 issue n°112 THE DISRUP

Microvision establishes first global R&D center in ... - I-Micronews

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?