WLCSP - I-Micronews

WLCSP Market and 

Industrial Trends 

WEBCAST event – March 2012 

Infineon 

FhG IZM 

STMicro 

Broadcom 

STEricsson 

Hamamatsu 

© 2011 

Copyrights © Yole Developpement SARL. All rights reserved.

About the authors of this report 

Jean-Marc Yannou 

– Jean-Marc joined Yole Developpement as technology and market expert in the fields of advanced 

packaging and Integrated Passive Devices. He has 15-years of experience in the semiconductor 

industry. He worked for Texas Instruments & NXP semiconductors where he was Innovation 

Manager for System-in-Package technologies 

Contact: yannou@yole.fr 

Lionel Cadix 

– Lionel joined Yole after the completion of several projects linked to the 

characterization and modeling of high density TSV and 3DIC chip stacking in collaboration 

with CEA-Leti and STMicroelectronics during his PhD. He is author of several publications and 8 

patents in the field of 3D Integration 

Contact: cadix@yole.fr 

Jerome Baron 

– Jerome is leading the MEMS & Advanced Packaging market research at Yole Developpement. He 

has been following the 3D packaging market evolution since its early beginnings at device, 

equipment and material levels. He was granted a Master of Science degree in Nanotechnologies 

from the National Institute of Applied Sciences in Lyon, France 

Contact: baron@yole.fr 

© 2011 • 2 

Copyrights © Yole Développement SA. All rights reserved.

Table of Content of the Report 

• Scope of the Report & Definitions …..… 9 

- Definitions of wafer scale packaging, wafer level 

packaging & wafer level chip scale packaging .………..... 9 

- Scope of the report ……..……………………………............ 12 

• Executive Summary ….………………….. 17 

• WLCSP Market Forecasts …................... 43 

- Top-down analysis & 2010-2016 unit, wafer and market 

forecast …………………………………………………………. 45 

- Bottom-up analysis and 2010 production capacity and 

market shares ……………………………………………......... 76 

- Detailed view of WLCSP‟s IC design wins on the market 82 

- IC Player capacity for each WLCSP application ……….. 89 

• WLCSP Infrastructure & Supply Chain.. 95 

- Supply chain: Fan-in WLCSP .…………………...………….. 103 

- Supply chain: 3D WLCSP …..……………………………….. 111 

- Business model examples ………..…………………………. 125 

• WLCSP Technologies …………………… 140 

- RDL, UBM and balling ........................................................ 146 

- Test of WLCSP ..................................................................... 163 

• Cost of WLCSP .……….…………… 173 

- „Fan-in‟ WLCSP cost structure ............................. 174 

- 2008-2016 „Fan-in‟ WLCSP cost roadmap by 

main steps ................................................................ 175 

- Cost comparisons of different package 

platforms for a 64 I/O device ................................... 179 

• WLCSP Application Focus ……….. 186 

- WLCSP ICs in handsets, tablet PCs and MP3 ..... 188 

- WLCSP ICs for computing ..................................... 214 

- WLCSP for ICs in medical, automotive & space 

applications …………………………………………… 

218 

- WLCSP of CMOS image sensors …………………. 225 

- WLCSP of MEMS devices ………………………….. 255 

• Conclusion & Perspectives ………. 280 

• Appendix ……………….................... 283 

- Yole Développement company presentation ....... 284 

- Company services …………………………………… 285 

- Advanced Packaging team analysts ……………… 292 

© 2011 • 3 


Scope of the Report 

& Definitions 

© 2011 


Scope of Yole‟s Research in Advanced Packaging 

PANEL / Wafer-Scale-Packaging Platforms 

Wafer-Level 

Interface / Encapsulation 

Wafer-Level 

Electrical Redistribution 

Flip-chip & Wafer-Level 

Stacking / Integration 

WLCSP 

Glass / Silicon 

FOWLP Embedded IC 3D IC 

WLOptics 2.5D 

For MEMS & sensors ‘Fan-in’ ‘Fan-Out’ in PCB / laminate & TSV 

interposers 

LED & Sensors 

3D-WLCSP 

Flip-chip 

wafer bumping 

on BGA 

• Wafer-level-packaging technologies encompass multiple different platform flavors 

but leverage similar types of process manufacturing know-how 

© 2011 • 5 

FOCUS of this 

research report update! 


WLCSP and 3D WLCSP Definition - technology scope of the report 

Scope of the report 

FOWLP 

„Fan-in‟ WLCSP 

+ 

3D WLCSP 

2.5D 

Interposer 

3DIC 

ST 

Elpida 

Xilinx 

3D 

FOWLP 

Flip Chip 

wafer bumping 

• This report does not address all Wafer Level Packaging technologies but only the “Fan-in” type of 

WLCSP. These include 2 categories: 

– Regular WLCSP chips: single ICs in WLCSP format or CMOS Image Sensors without 3D TSVs or interconnects 

– 3D WLCSP: WLCSP packages with multiple levels / dies / interconnected by means of backside TSVs (Through 

Silicon Vias) and wafer-level bonding steps (such as in CMOS image sensors and MEMS devices) 

© 2011 • 6 


Difference Between Flip Chip Packages 

and Wafer-Level Chip-Scale Packages (WLCSP) 

With WLCSP, the bumped integrated circuits can be directly mounted onto the 

Printed Circuit Board of the system by the Original Equipment Maker 

Flip Chip packages utilize an intermediate “high density interconnect” (HDI) 

printed circuit board 

In this report we do not address Flip Chip which is the topic of a separate, 

dedicated Yole Market research report 

UBM 

Underfiller 

Bump 

Package substrate 

© 2011 • 7 

Flip Chip 

Copyrights © Yole Developpement SARL. All rights reserved. 

WLCSP

Packaging With Bumping: When is WLCSP More Appropriate 

With respect to the other WLP technologies? 

• WLCSP is a wafer-level based package technology with no need for a fan-out area. 

It applies to low I/O density ICs with a limited die size (generally lower than 

30mm²) and fine ball pitches to the application PCB (equal to or lower than 0.5mm) 

Fan-in WLCSP Fan-out WLCSP Flip Chip 

1 2 3 5 

This limit will move to 

higher ratios as eWLB 

production moves from 

300mm wafers to large 

panels and the cost 

of eWLB/fan-out lowers 

Package/IC 

size ratio* 

*package size is determined 

by the I/O count and pitch 

on the destination PCB 

© 2011 • 8 


Objectives of the Report 

• The objectives of this report are 

– To describe the Wafer-Level-Packaging market 

– To discuss the current technology trends 

– To forecast this market‟s future states and trends 

• The WLP market is studied from the following angles 

– State-of-the-art technology and trends 

– End-user applications and drivers 

– Materials and equipment 

– Market Value 

– Industrial supply chain & value chain 

– Production cost 

© 2011 • 9 


What‟s New Since the “WLP 2009” Report? 

• This report is fully focused on the evolution of the WLCSP business 

– Namely called „Fan-in‟ WLCSP and 3D WLCSP platforms (please refer to next 

slides for more details about definitions) 

• What we added/did differently with respect to the 2009 report? 

– Deeper analysis of the supply chain for WLCSP and 3D WLCSP 

– Top-Down meets Bottom up (whereas the previous report was only based on a 

top-down analysis) leading to more exhaustive / detailed market forecasts 

– Deeper cost analysis and technologies update 

– We now include the value of wafer test in the WLCSP market value charts, and 

we added a complete section dedicated to test needs and challenges 

• Changes in the WLCSP ecosystem/infrastructure 

– Nokia fall-off in overall demand while more OEM players took to WLCSP 

– More 300mm wafer capacity overall from OSATs, Wafer bumping houses and 

IDMs worldwide 

– Some new CMOS foundry (TSMC) entrants started to invest additional 

capacity in order to provide full Fan-in WLCSP turnkey services 

© 2011 • 10 


WLCSP Market Forecasts 

© 2011 


Sales (M$) 

Yole‟s Market Forecasting Methodology 

• Yole‟s market forecasting methodology is based on the “top-down meets bottom-up” analysis 

– 2 complementary analyses are carried out and cross-checked: 

• The top-down analysis derives the wafer forecasts from an analysis of the WLCSP products, application by application, 

taking into account the penetration rate of the technology for each product type, as well as their yields and die sizes 

Std. Product 

Unit forecasts 

Techno 

penetration % 

WLCSP IPD market 

In B Munit units 

WLCSP ASP 

$$$ 

Sources: iSuppli, IC Insights … 

Thin film IPD Market Forecast per Application Field (in M$) 

1 800 

Yole Developpement © June 2009 

1 600 

1 400 

1 200 

1 000 

800 

600 

Wafer 

Forecasts & 2010 

processed wafers 


Die sizes 

(mm²) 

400 

200 

Manufacturing 0 

Yield 

by product 


market 

In $M 

2008 2009 2010 2011 2012 2013 2014 2015 

TOT Thin-film IPD revenues 614 580 631 725 827 1 012 1 276 1 750 

• The bottom-up analysis is based on the evaluation of the worldwide production capacity evaluated through interviews of 

industry players (foundries, OSATs, equipment and material makers) and company revenue reports. For this report on 

WLCSP, we used our “wafer bumping for flip chip database”. 

Wafer Bumping 

capacity 

Loading 

rate % 

2010 Processed 

Wafers for 

flip chip bumping 

© 2011 • 12 

• 2010 wafer capacity is therefore estimated using both ways: top-down and bottom-up. The wafer start analysis only stops 

when both results are well aligned. 


Sales (M$) 

Std. Product 

Unit forecasts 

Techno 

penetration % 

WLCSP IPD market 

In B Munit units 

WLCSP ASP 

$$$ 

Sources: iSuppli, IC Insights … 

Thin film IPD Market Forecast per Application Field (in M$) 

1 800 

Yole Developpement © June 2009 

1 600 

1 400 

1 200 

1 000 

800 

600 

Wafer 

Forecasts & 2010 

processed wafers 


Die sizes 

(mm²) 

400 

200 

Manufacturing 0 

Yield 

by product 


market 

In $M 

2008 2009 2010 2011 2012 2013 2014 2015 

TOT Thin-film IPD revenues 614 580 631 725 827 1 012 1 276 1 750 

TOP-DOWN ANALYSIS 

WLCSP MARKET VALUE AND FORECASTS 

© 2011 • 13 


Market value (M$) 

© 2011 • 14 

WLCSP Market Value Forecast ($M) 

WLCSP and 3D-WLCSP 

• Total Market value (subcontracted + insourced) of the WLCSP wafer and die assembly 

services, final test included, based on the price of the subcontracted service by OSATs 

• The Fan-in WLCSP market value 

totaled close to $1.4B in 2010, of which 

– $1091M for WLCSP of ICs 

– and $300M of CMOS image 

sensors and MEMS 

• The 3D-WLCSP market is expected to 

grow at a 2010-2016 CAGR of 25% fostered 

by both the fast growth rate of MEMS and CIS 

and by the acceleration of the penetration 

of WLP packages for these devices. 

• The WLCSP market value for 

integrated circuits is expected 

to grow at a 2010-2016 CAGR of 7%. 

It is significantly lower than the 16.5% growth 

rate of this market as expressed in 

300mm equivalent wafers over the same 

period of time due to 

– Declining margins 

– Fast adoption of lower cost 

WLCSP on 300mm wafers (in terms 

of cost per die) 


3 000 

2 500 

2 000 

1 500 

1 000 

500 

0 

WLCSP Market Value ($M) 

Yole Developpement © September 2011 

2010 2011 2012 2013 2014 2015 2016 

3DWLCSP market (M$) 267,9 384,1 511,4 618,9 716,3 856,4 1001,3 

WLCSP market (M$) 1120,0 1277,8 1389,9 1480,1 1567,2 1632,8 1669,2

WLCSP Adoption Drivers 

• Drivers for WLCSP 

– Footprint reduction die size = package size 

– Electrical performance bumps have a lower inductance than wire-bonds 

– Legacy die converted to WLCSP through use of RDL (lower price and no need for 

silicon redesign) 

– Thin package profile (Z < 1.0mm) 

– Cost is competitive with other package types 

• Developments and evolutions 

– Thinner package height ( improve routing 

• 2 primary Board Level Reliability tests are important for WLCSP performance: Drop 

test (DT) and Temperature Cycling Test (TCT) 

© 2011 • 15 


Examples of WLCSP Penetration in Real Products 

Yole Developpement 

© September 2011 

Relative package uses in end devices 

(in % of units by package type) 

100% 

90% 

80% 

70% 

60% 

50% 

40% 

30% 

20% 

10% 

0% 

Motorola 

Atrix 4G 

Apple 

iPaD2 

Samsung 

Galaxy tab 

Gt P-1000 

Nokia N8- 

00 

Blackberry 

Bold 9700 

Google 

(Samsung) 

Nexus S GT 

Apple 

iPhone 3GS 

iPoD touch 

2nd 

generation 

8GB 

Apple Max 

Mini A1347 

QFP 0% 0% 0% 0% 0% 0% 0% 0% 0% 5% 

SO/SOT/TSSOP 3% 3% 10% 0% 0% 26% 12% 0% 41% 49% 

LGA 3% 5% 5% 2% 0% 4% 2% 0% 0% 0% 

BGA 27% 30% 19% 15% 28% 13% 21% 20% 9% 5% 

DFN/QFN 37% 33% 45% 6% 13% 39% 28% 15% 48% 41% 

WLCSP 30% 30% 21% 77% 60% 17% 37% 65% 2% 0% 

Lenovo 

IdeaPad 

S10 

© 2011 • 16 


tablets smartphones MP3/PMP PC

Device count (Mu) 

2010-2016 WLCSP Unit Forecast - by end equipment type 

50 000 

45 000 

WLCSP forecast 

by end equipment type (in M unit shipments) 

Yole Developpement © September 2011 

40 000 

35 000 

30 000 

25 000 

20 000 

15 000 

10 000 

5 000 

0 

2010 2011 2012 2013 2014 2015 2016 

others (medical, automotive...) 700 770 847 932 1044 1169 1309 

notebooks 36 43 51 61 73 87 101 

set top box 

2 3 4 5 5 5 5 

PMP/MP3 1 675 1 602 1 496 1 402 1 316 1 250 1 201 

tablets 241 784 1 315 1 920 2 671 3 487 4 200 

smartphones 5 302 7 523 9 800 12 075 14 481 17 016 19 343 

feature phones 8 501 9 779 11 025 12 463 13 804 15 258 16 519 

voice phone 3 430 3 178 3 036 2 899 2 803 2 657 2 522 

CAGR (%) 

11.0 

18.7 

22.2 

-5.4 

61.0 

24.0 

11.7 

-5.0 

© 2011 • 17 

total 19,887 23,682 27,575 31,756 36,197 40,929 45,201 14.66 


WLCSP Penetration Status in Mobile Platforms 

CPU 

In grey: parts which can not be 

found in „Fan-in‟ WLCSP form 

Drivers 

In orange: these devices are increasingly 

packaged in „Fan-in‟ WLCSP! 

Discrete passives 

• This is by far the largest „Fan-in‟ WLCSP end application 

• WLCSP ICs started in 2000 in handsets, 

with small ESD/EMI 

protection/interface conditioning 

devices Integrated Passive 

Devices (IPD) at first, and 

then with larger 

ICs. 

• The drivers 

are Size 

(footprint 

first, then 

thinness & 

weight) and 

Cost 

© 2011 • 18 


WLCSP Device Categories 

WLCSP device categories 

Analog & 

mixed signal 

Wireless 

Connectivity 

Opto 

MEMS & sensors 

ASIC IC 

MEMS 

IPD (ESD/EMI 

protection, RF filtering) 

Power Amplifiers 

BAW & SAW filters 

IC drivers (LED, 

battery, display…) 

Local Power 

(DC-DC converters, 

MOSFET, oscillators) 

PMU 

Audio & Video 

(Codec, amplifiers…) 

Bluetooth + 

FM + WLAN 

combos 

(+ combos) 

WLAN single 

chip 

GPS, A-GPS 

single chip 

CMOS image 

sensors 

AL sensor 

photonic 

Misc Logic 

and Memory 

Logic gates 

EEPROMs 

µcontrollers 

Accelerometers 

Gyroscopes 

RF-MEMS (switches, 

resonators…) 

Si Microphones 

Pressure sensors 

Optical MEMS 

micro-mirrors (DLP, 

pico-projectors, datacom) 

µ-probes 

µ-fluidic, µ-fuel cells 

© 2011 • 19 


Wafer Bumping 

capacity 

Loading 

rate % 

2010 Processed 

Wafers for 

flip chip bumping 

BOTTOM-UP ANALYSIS 

2010 WLCSP INDUSTRY STATUS AND 

WAFER PROCESSING CAPACITY 

© 2011 • 20 


2010 WLCSP + 3D WLCSP Regional Capacities 

Korea 

192,000 wafers 

8% 

China 


8% 

2010 WLCSP + 3D WLCSP geographic installed capacities 

(300mm eq. wafers) 

Singapore 


6% 

Philippines 


5% 

Malaysia 

46,800 wafers 

2% 

Thailand 

36,000 

2% 

Canada 

19,800 

wafers 

1% 

Morocco 

5,280 wafers 

0% 

Taiwan 


39% 

TOT ~ 2.4 Million 

wafers (300mm eq.) 

USA 


8% 

Europe 


8% 

Japan 


13% 

Yole Developpement © 

September 2011 

© 2011 • 21 


WLCSP Infrastructure 

& Supply Chain 

© 2011 


Supply Chain for WLCSP Manufacturing 

WLCSP operations 

PVD / Plating equipment 

Passivation resist suppliers 

IC design 

Si CMOS 

manufacturing 

RDL / Passivation 

Balling 

Wafer test Back-end: OEM / 

dicing, marking, T&R EMS 

Fully integrated IDMs 

Vertical integration? 

Fabless 

CMOS 

foundries 

Wafer bumping house 

Test house 

BE service 

Wafer Packaging House 

OSAT 

© 2011 • 23 


WLCSP Design Wins for Small Logic, Memory and RF Connectivity 

IC design 

companies 

logic gates / 

bus buffers / 

level 

translators 

EEPROM / serial 

Flash memories 

SRAM 

memories 

Microcontroller 

Bluetooth + FM 

chip 

GPS 

chip 

WLAN (single 

chip) 

Combos (mix of 

WLAN / BT / FM 

/ GPS) 

Atmel (US) 

X 

Broadcom (US) X X X 

CSR (US) X X X 

Cypress Semi (US) 

X 

Infineon (GE) 

X 

Macronix (TW) 

X 

Marvell (US) 

X 

Maxim IC (US) 

Microchip (US) 

X 

X 

Qualcomm / Atheros (US) 

X 

SST / Green Liant (US) 

X 

STEricsson (FR) 

X 

STMicroelectronics (FR) X X 

Texas Instruments (US) X X X X X 

© 2011 • 24 


Texas Instrument‟s WLCSP wafer shipment 

Breakdown by application (12’’ eq wspy) 

2010 Texas Instruments' WLCSP wafer shipments 

Breakdown by application (12'' eq wspy) 

Yole Developpement © 

September 2011 

Combos (mix of WLAN / BT / FM 

/ GPS) 

50 000 

20% 

IPD (ESD / EMI) 

10 000 

4% 

DC/DC converter, LDO 

30 000 

12% 

Amplifier, generator, analog 

switches IC drivers, RF power 

detectors 

15 000 

6% 

WLAN (single chip) 

25 000 

10% 

Touch screen controller 

3 600 

1% 

GPS chip 

20 750 

8% 

microcontroller 

4 000 

2% 

logic gates / bus buffers / level 

LED drivers 

translators 

3 300 

40 000 

1% 

16% 

battery charger 

25 000 

10% 

Audio / Video codec 

15 000 

6% 

Audio power amplfier/ video 

driver (amplifier, noise canceler, 

TV tuner etc…) 

5000 

2% 

• Texas Instruments (US) can be considered as #1 company in the WLCSP area since the company 

has a diversified product portfolio of analog IC design wins in WLCSP plus important internal 

capabilities for Fan-in WLCSP manufacturing (in its Clark facility in Philippines) 

© 2011 • 25 


WLCSP Technologies 

© 2011 


WLCSP Technology & Industrial Roadmap 

Demonstrated On the market! 

Silicon node 

65nm 

45nm 

32 / 22nm 

PCB pitch 

0.4 - 0.5mm 

0.25 - 0.3mm 

Minimum Line/space 

15/15um 

12/12um 

10/10um 


techno 

Wafer thickness 

> 30- 40 mm 2 

Max die size 0.6 - 27mm 2 250 – 350um 

200 – 300um 

150 – 250um 

New equipment 

DRIE 

Grinding & CMP 

Laser dicing 

inspection 

Passivation material 

BCB, PI 

PI, PBO, Al-X, etc… 

Package integration 

TSV (3D WLP) 

Fan-in only 

Fan-out / Embedding 

IPD 


infrastructure 

12 inch 

wafers 

Solar 

infrastructure? 

< 2007 

2008 

2009 

2010 2011 2012 2013 2014 2015 

© 2009 • 27 

Copyrights © Yole Développement SARL. All rights reserved.

WLCSP Extending to Higher I/O Levels in PMU Applications 

• The largest WLCSP IC on the market: Fujitsu MB38C311A 

– 309 WLCSP balls: world record highest WLCSP pin count 

– 50mm² 

– 0.4mm pitch 

– Designed and manufactured by Casio Micronics (now TeraMikros) 

– Balls on copper posts: eWLP technology 

– PMU + Audio interface functions combined 

– Found in Sharp SH-01A phone 

Pictures are courtesy of ‘System Plus Consulting’ 

© 2011 • 28 


WLCSP for Audio Amplifier 

• By using WLCSP, the audio control chip and amplification IC of the iPod Shuffle 

could be squeezed in the headphones, making it compulsory to use the Apple 

headphones or some specific headphones under Apple license (the shuffle device 

has no audio circuitry) The IC (1.35 mm x 0.85) is made by Texas Instruments 

© 2011 • 29 

WLP of Class D audio amplifiers from TI 


VTI – 3D Axis Accelerometer 

a 3D-WLCSP example 

• The WLCSP package of the CMR3000 integrates two dies (ASIC + MEMS). The 

ASIC die is flip-chipped on the MEMS die (the gap between the 2 dies is 

underfilled) 

• The ASIC die is manufactured using a CMOS technology with a 0.4μm process. 

• The MEMS die is manufactured using three bonded wafers (c-SOI sensor + Cap) 

processed with bulk micromachining technologies. 

Package type: 10-pin WLP 

• Dimensions: 4.10mm x 3.10mm x 0.83mm 

• Pin pitch: 0.50mm 

Courtesy of Chipworks 

© 2011 • 30 


Conclusions & Perspectives 

© 2011 


Conclusions 

• The number of devices packaged with „Fan-in‟ WLCSP will exceed 25 Billion units in 2012, 

exceeding more than 2 million 300mm equivalent wafers 

• We estimate that the „Fan-in‟ WLCSP industry value to be over 1.9 billion dollars in 2012. 

This includes wafer level services (including test) and die level services, as well as the 

service margin 

• This market value is expected to keep on growing at a 2010-2016 CAGR of 12% despite 

decreasing prices. However it does not grow equally across all device types 

• The use of „Fan-in‟ WLCSP for a given application tends to be more and more standardized: 

it is now clear, for example, that the penetration rate of „Fan-in‟ WLCSP for connectivity 

devices in handsets is close to 100%, while some players still proposed QFN or BGA 

solutions a couple of years ago for this same application 

• The maximum die size increased recently, and it is now common place to find 36mm² „Fanin‟ 

WLCSP devices in smartphones and tablets. The world record is 50mm² with 309 balls. 

Any „Fan-in‟ WLCSP device larger than 4mm in side needs to be underfilled on the PCB 

• „Fan-in‟ WLCSP is a maturing technology and market. It still grows faster than the average 

semiconductor packaging market mainly thanks to the fast growth rates of smartphones and 

tablet PCs in which WLCSP considerably helps save space and costs. 

© 2011 • 32 


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