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MACROMELT OM 648<br />
Circuit Board Protection Product<br />
MACROMELT OM 648 circuit board protection product provides good adhesion and is UV stable at operating temperature -40 to<br />
125°C, sealing and protecting electronics from moisture, mechanical damage and heat. MACROMELT OM 648 encapsulants cure in<br />
seconds by cooling, reducing cost by more than 50% through eliminating curing ovens and lights. Suitable for the automotive, RFID,<br />
consumer electronics, photovoltaic and the aerospace industries.<br />
Low-pressure molding is the solution to production issues associated with traditional high-pressure injection molding over sensitive<br />
electronic components or circuit boards. The polyamide hot melt adhesive material may actually be used to mold-in mounting<br />
studs or eyes, eliminate injection molded housings and covers, and replace epoxy potting operations all in one simple process. The<br />
materials also provide great strain relief in molded grommets and connectors.
MACROMELT OM 648 Circuit Board Protection Product<br />
Target Applications<br />
• Photovoltaic junction boxes and connectors<br />
• LED lighting<br />
• RFID tags<br />
• Industrial sensors<br />
• General electronics used in outdoor<br />
environments<br />
Macromelt Advantages<br />
• Complete watertight encapsulation<br />
• Fast cycle time (15-45 seconds)<br />
• Low capital equipment costs<br />
• Safe, 1-component, UL 94-V-0 Approved<br />
• Low pressure and high speed molding for<br />
electronics encapsulation<br />
MACROMELT OM 648<br />
Description: UV stable low pressure molding encapsulant based on <strong>Henkel</strong>‘s<br />
polyamide hot melt technology<br />
Key Benefits:<br />
• Low application pressure<br />
• Operating temperature (-40/+100°C)<br />
• UL rating of 94-V-0<br />
• Excellent adhesion to all substrates<br />
• Extended UV stability<br />
• No need for curing ovens, UV light etc.<br />
• Recyclable resins<br />
• Specific gravity of material less than potting compounds<br />
• Savings on material consumption<br />
Elongation after UV Exposure<br />
Elongation (%)<br />
800<br />
700<br />
600<br />
500<br />
400<br />
300<br />
200<br />
100<br />
0 0 10 20 30 40 50 60 70 80 90<br />
Time (Days)<br />
The tensile properties of OM 648 decreased by about 35% over the 80 days accelerated test,<br />
while the base material OM 641 decreased 85% in under 10 days.<br />
Except as otherwise noted, all marks used are trademarks and/or registered trademarks of <strong>Henkel</strong> and/or its affiliates in the U.S. and elsewhere. ® = registered in the U.S. Patent and Trademark Office. © <strong>Henkel</strong> Corporation, 2011. All rights reserved. LT-6562 (6/12)<br />
Across the Board, Around the Globe.<br />
www.henkel.com/electronics<br />
<strong>Henkel</strong> Electronic Materials LLC<br />
14000 Jamboree Road<br />
Irvine, CA 92606<br />
1.714.368.8000<br />
1.800.562.8483<br />
<strong>Henkel</strong> Europe<br />
Hemel Hempstead,<br />
Hertfordshire, HP2 4RQ<br />
United Kingdom<br />
+44.1442.278.000<br />
<strong>Henkel</strong> Asia<br />
332 Meigui South Road<br />
WaiGaoQiao FTZ<br />
Shanghai 200131 China<br />
+86.21.3898.4800
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