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New Opportunities for Tin Use
More than 15
new technologies could
represent significant new use
for tin over the next 5-10 years.
These include continued implementation of
major technologies such as lead-free soldering for
electronics, newly launched commercial products in key
sectors such as lithium ion batteries and stainless steel and a
whole range of new technologies still in the development stage.
They are balanced by other technology threats, notably
miniaturisation of electronics. However the overall picture
looks very positive for tin over the medium term.
leaD-FRee electRonIcS
Introduction of lead-free solders over the last decade is
something of a revolution in the electronics industry, changing
the basic glue that holds together equipment key to modern
quality of life, communications, transport and security. Leadfree
solders contain more than 95% tin and today around half
of all tin is used in solder.
Implementation
of lead-free soldering
in electronics is now well
advanced, with an estimated
65% conversion globally. The first
sectors were principally those such as
household electronics which make a significant
contribution to the electronics waste stream.
However, the technology change grew to have a much
wider impact on electronics production due to globalisation,
supply chain dynamics and sustainability pressures.
The original driving force for conversion was the EU RoHS
Directive in force since 2006. A revision has been published
in 2011, with a controversial widening of the scope to all
electrical and electronic equipment not specifically excluded
or exempted. Categories such as industrial monitoring
control equipment and medical devices have been given new
deadlines for transition.
At the same time a set of new regulations are also being
published in China, solder’s largest sector, significantly increasing
pressure on its national market. New ‘India RoHS’ policies have
also been announced, to come into force in May 2012.
Military and aerospace markets are specifically excluded
from the RoHS Directive but in fact pressure to convert in the
marketplace is still growing strongly. As lead-free components
become the majority offering, the costs, inventory pressures
and obsolescence risks associated with continued sourcing of
leaded components become greater. Added to this is the trend
towards more outsourcing of electronics assembly, leading to
commercial pressures from contractors who need to reduce
dual-streaming of lead-free and leaded production. Major US
military and aerospace consortia, including NASA, have been
actively assessing lead-free technologies during the year, with
significant US government funding, although there is still an
obvious reluctance to implement any changes.
MALAYSIA SMELTING CORPORATION BERHAD (43072-A) • ANNUAL REPORT 2011 39