PA015 series Power LED chips integrated module
Recommend Heat Sink Surface Area The following tables describe recommend heat sink surface area to make sure the junction temperature Tj below 70°C and ensure the product’s life time of Pacific-S series. Chip Distribution Square Circle *Note 1 Note 1 : Describe about die distribution. Square : example as below Circle : example as below Table 7. Wattage Suggested Surface (W) Area (cm 2 ) 5 150 7 300 10 500 15 800 20 1000 30 2500 40 3200 50 4000 60 >4000 100 >15000 120 >20000 10 500 15 500 20 500 Test point Revision :3.1 Page 13 of 13
How to measure the junction temperature It’s very easily to make sure the junction temperature by measure the temperature of test point designed on the substrate near the chips. By choose suitable heat sink and measure the test point temperature to make sure the junction temperature at least below 80°C . 1. Attach product on the heat-sink with high heat conductive paste. Test point. Via diameter 1.0mm 2. Let the thermal wire contact the via bottom metal and fixed. Suggest thermal wire diameter below 0.15mm Thermal meter 3. Light on and waiting for heat equilibrium. The equilibrium time depend on the heat-sink size you chose. Normally 2.5hr waiting time is necessary. 4. Read temperature and plus 3 degree will be the junction temperature. Revision :3.1 Page 14 of 13
- Page 1 and 2: Av. División del Norte 3115 Col. L
- Page 3 and 4: Table of Contents Technology Overvi
- Page 5 and 6: PA 015 C CU H - 001 Pacific Power P
- Page 7 and 8: Circuit Layout Product code below n
- Page 9 and 10: Reliability Test The following tabl
- Page 11 and 12: Color Temperature Characteristics T
- Page 13: Revision :3.1 Page 12 of 13
How to measure the junction temperature<br />
It’s very easily to make sure the junction temperature by measure the temperature of test<br />
point designed on the substrate near the <strong>chips</strong>. By choose suitable heat sink and measure<br />
the test point temperature to make sure the junction temperature at least below 80°C .<br />
1. Attach product on the heat-sink<br />
with high heat conductive paste.<br />
Test point.<br />
Via diameter 1.0mm<br />
2. Let the thermal wire contact the<br />
via bottom metal and fixed.<br />
Suggest thermal wire diameter<br />
below 0.15mm<br />
Thermal meter<br />
3. Light on and waiting for heat equilibrium.<br />
The equilibrium time depend on the<br />
heat-sink size you chose. Normally 2.5hr<br />
waiting time is necessary.<br />
4. Read temperature and plus 3 degree will<br />
be the junction temperature.<br />
Revision :3.1 Page 14 of 13
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