PA015 series Power LED chips integrated module
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Recommend Heat Sink Surface Area<br />
The following tables describe recommend heat sink surface area to make sure the junction<br />
temperature Tj below 70°C and ensure the product’s life time of Pacific-S <strong>series</strong>.<br />
Chip Distribution<br />
Square<br />
Circle<br />
*Note 1<br />
Note 1 : Describe about die distribution.<br />
Square : example as below<br />
Circle : example as below<br />
Table 7.<br />
Wattage<br />
Suggested Surface<br />
(W)<br />
Area<br />
(cm 2 )<br />
5 150<br />
7 300<br />
10 500<br />
15 800<br />
20 1000<br />
30 2500<br />
40 3200<br />
50 4000<br />
60 >4000<br />
100 >15000<br />
120 >20000<br />
10 500<br />
15 500<br />
20 500<br />
Test point<br />
Revision :3.1 Page 13 of 13
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