LTCC PROCESSING INSTRUCTIONS For Ferro A6 and L8 Tape

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<strong>L8</strong> All Ag CN33- 498 Ag
2.2 GROUND AND POWER PLANES IC Bonding Fingers FEATURE SURFACE PLANE BURIED PLANES SOLID GROUND/POWER PLANE COMPLETE COVERAGE 100 MIL WIDE STRIPS MAX GRID SIZE 10 MIL CONDUCTOR 10 MIL CONDUCTOR 15 MIL SPACING 15 MIL SPACING CASTELLATION N/A AT EDGES OF PART OR AT CAVITY WALL CASTELLATION N/A ENDS >10 MILS FROM CLEARANCE EDGE OR WALL GROUNDING N/A ENDS EXTEND >10 MILS CASTELLATION PAST EDGE FEED THROUGH CLEARANCE 20 MILS ALL SIDES 20 MILS ALL SIDES TAPE LAYERS ABOVE OR OFFSET SPACE AND OFFSET SPACE AND BELOW GRID PLANES LINES BY 12 MILS LINES BY 12 MILS X-Y X-Y
Page 1 and 2: 1.1 UNREEL TAPE LTCC PROCESSING INS
Page 3 and 4: ased stencils. A vacuum pull throug
Page 5 and 6: no metallization, etc. Only minimum
Page 7 and 8: L8 Tape Burn out & Firing Profile B
Page 9: LTCC DESIGN RECOMMENDATIONS 2.1 CON
Page 13 and 14: 2.4 ELECTRICAL VIAS Electrical via
Page 15 and 16: Thermal Hexagonal Via Pattern: Six
Page 17 and 18: Resistor to conductor termination o

LTCC PROCESSING INSTRUCTIONS For Ferro A6 and L8 Tape

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