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Introducing ESPEC EUROPE GmbH<br />

Rapid-Rate Thermal Cycle Chamber TCC-150<br />

Electromigration Evaluation System (AEM-2000)<br />

Advent of the Rapid-Rate Thermal Cycle Chamber just<br />

suited for quick changes in specimen temperature, covering<br />

various applications from JEDEC standard tests to<br />

screening.<br />

The Rapid-Rate Thermal Cycle Chamber incorporates new<br />

technologies, such as a specimen temperature control that<br />

maintains linear specimen temperature change rates,<br />

during rapid thermal cycling, and temperature ramp control.<br />

Espec offers a new chamber that sets the industrial standard<br />

for the new era of thermal cycling.<br />

- Conformity to JEDEC (JESD22-A104-B) standard test<br />

- New temperature ramp control functions<br />

- Specimen temperature control and air temperature control<br />

- Uniform temperature load and highly repeatable<br />

temperature change rate.<br />

Increasing use is being made of microfabrication and new<br />

materials in order to increase the levels of performance and<br />

integration achieved with semiconductor devices. And as the<br />

operating life of devices depends on microfabrication and<br />

such new materials, it has become increasingly important to<br />

evaluate electromigration under high-precision<br />

life-acceleration conditions. High-precision control is used<br />

for the temperature (max. 400℃) and current stress that<br />

form the main factors in this life acceleration. A Black's<br />

model equation and analytical software have been provided<br />

to determine product life.<br />

- Electromigration testing is available at 1μA, 400℃<br />

- Capable of testing up to 240 channels per cabinet<br />

- Newly developed highly reliable board and socket<br />

- 18 -<br />

Espec Technology Report No.23

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