download
download
download
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
Introducing ESPEC EUROPE GmbH<br />
Rapid-Rate Thermal Cycle Chamber TCC-150<br />
Electromigration Evaluation System (AEM-2000)<br />
Advent of the Rapid-Rate Thermal Cycle Chamber just<br />
suited for quick changes in specimen temperature, covering<br />
various applications from JEDEC standard tests to<br />
screening.<br />
The Rapid-Rate Thermal Cycle Chamber incorporates new<br />
technologies, such as a specimen temperature control that<br />
maintains linear specimen temperature change rates,<br />
during rapid thermal cycling, and temperature ramp control.<br />
Espec offers a new chamber that sets the industrial standard<br />
for the new era of thermal cycling.<br />
- Conformity to JEDEC (JESD22-A104-B) standard test<br />
- New temperature ramp control functions<br />
- Specimen temperature control and air temperature control<br />
- Uniform temperature load and highly repeatable<br />
temperature change rate.<br />
Increasing use is being made of microfabrication and new<br />
materials in order to increase the levels of performance and<br />
integration achieved with semiconductor devices. And as the<br />
operating life of devices depends on microfabrication and<br />
such new materials, it has become increasingly important to<br />
evaluate electromigration under high-precision<br />
life-acceleration conditions. High-precision control is used<br />
for the temperature (max. 400℃) and current stress that<br />
form the main factors in this life acceleration. A Black's<br />
model equation and analytical software have been provided<br />
to determine product life.<br />
- Electromigration testing is available at 1μA, 400℃<br />
- Capable of testing up to 240 channels per cabinet<br />
- Newly developed highly reliable board and socket<br />
- 18 -<br />
Espec Technology Report No.23