Chapter 2. COST PER WAFER - Smithsonian - The Chip Collection

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1,000 Employees 150 140 130 120 110 100 90 1978 1979 1980 1981 1982 1983 1984 1985 Cost Per Wafer INTEGRATED CIRCUIT ENGINEERING CORPORATION 2-15 1986 Source: SIA 22732 $1,000 Per Employee 70 60 50 40 30 20 10 0 North America Offshore Year 1987 1988 1989 1990 1991 Figure 2-19. North America and Offshore Employment Levels North American Worldwide Average 1978 1979 1980 1981 1982 1983 1984 1985 1986 1987 1988 1989 1990 1991 1992 1993 1994 1995 Source: SIA 22733 Year Figure 2-20. Labor Expenses Per Employee 1992 Annual Growth Trend = 10.8% Offshore 1993 1994 1995
Cost Per Wafer DRAM, MPU and ASIC Manufacturing Costs The semiconductor industry has traditionally been driven by the needs of the DRAM manufacturers because these companies are the single largest consumers of semiconductor equipment and materials, and because DRAM devices, until recently, were the technology drivers. In recent years, microprocessors have become the technology driver as Intel has speeded its transitions to smaller feature sizes faster than the transitions in the 2-16 Feature Size (µm) 1.5 1.0 0.8 0.5 0.35 Source: ICE Wafer Size (mm) CMOS 14-16 Masks 125 125/150 150/200 150/200 200 170 —/310 390/— 525/— — Advanced CMOS 18-20 Masks — — 600/990 700/1,140 1,415 Process Technology Advanced BiCMOS 22 Masks 360 —/575 660/ — 900/1,400 1,800 Bipolar 8-10 Masks 210 — — — — Figure 2-21. Whole Wafer Cost Before Probe ($) Tested Wafer Cost Die Size Total Dice Available Probe Yield Number Of Good Dice Package Cost Assembly Yield Final Test Cost Final Test Yield Factory Cost ASP (1,000) Approx. Revenue/Wafer Start Revenue/Sq In. Started Gross Margin Source: ICE BiCMOS MPU (0.35µ) $1,890 (200mm epi wafer) 135,000 sq mils (90mm2) 292 37% (at 1.2 defects/cm 2) 108 $25.75 (296-pin CPGA) 99% $35.00 70% $112.41 $350 $26,195 $542 68% 14448G Figure 2-22. Pentium (166MHz P54CS) Cost Analysis (3Q96) Bipolar 14-16 Masks 245 270/— — — — Advanced Bipolar 22 Masks 360 —/575 660/— 900/— — 20279A DRAM device sector. In addition, the manufacturing technology using multilevel metalization designs of 5 layers or more is driven by needs of the microprocessor supplier. The industry therefore has two very strong segments, DRAMs and microprocessors, driving the designs of process equipment, facilities, automation and factory management. DRAM manufacturers produce ICs in high volume, thereby driving the development of equipment that delivers the highest throughput possible, while meeting processing INTEGRATED CIRCUIT ENGINEERING CORPORATION
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Chapter 2. COST PER WAFER - Smithsonian - The Chip Collection

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