ICE Shared Construction Analysis SCA 9712-570 - Smithsonian ...

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National LM2672 Au LEADFRAME Au Figure 4. SEM views of typical wirebonds. Mag. 500x, 60°. Integrated Circuit Engineering Corporation
IMD LOCAL OXIDE PASSIVATION METAL 2 P+ ISO Au BOND INTERMETALLIC N-EPI Mag. 500x METAL 1 Mag. 6500x N+ BURIED LAYER M2-M1 Au BOND Figure 4a. Optical and SEM section views of the bond pad structure. National LM2672 Integrated Circuit Engineering Corporation
Page 1 and 2: Construction Analysis National Semi
Page 3 and 4: INTRODUCTION This report describes
Page 5 and 6: TECHNOLOGY DESCRIPTION (continued)
Page 7 and 8: Die Process and Design: Questionabl
Page 9 and 10: ANALYSIS RESULTS II (continued) •
Page 11 and 12: OVERALL QUALITY EVALUATION: Overall
Page 13 and 14: HORIZONTAL DIMENSIONS Die size: 1.8
Page 15 and 16: INDEX TO FIGURES PACKAGE ASSEMBLY F
Page 17 and 18: National LM2672 PIN 1 top side Figu
Page 19: INTERMETAL DIELECTRIC PRE-METAL DIE
Page 23 and 24: National LM2672 Figure 5a. Detailed
Page 25 and 26: Mag. 400x Mag. 500x Figure 6. Die i
Page 27 and 28: Figure 7. Optical views of the die
Page 29 and 30: National LM2672 METAL 1 POLY N+ PRE
Page 31 and 32: National LM2672 METAL 2 Mag. 2000x
Page 33 and 34: National LM2672 PASSIVATION 2 METAL
Page 35 and 36: National LM2672 METAL 1 POLY POLY M
Page 37 and 38: National LM2672 Si PASSIVATION IMD
Page 39 and 40: National LM2672 Mag. 1300x DIFFUSIO
Page 41 and 42: National LM2672 GATE OXIDE PASSIVAT
Page 43 and 44: National LM2672 STEP N+ POLY GATE O
Page 45 and 46: National LM2672 METAL 1 LOCOS P- BO
Page 47 and 48: National LM2672 METAL 1 Si Si POLY
Page 49 and 50: N+ COLLECTOR PASSIVATION P+BASE N+
Page 51 and 52: National LM2672 P+ ISO P+ EMITTER N
Page 53 and 54: National LM2672 PROBE MARK Integrat

ICE Shared Construction Analysis SCA 9712-570 - Smithsonian ...

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