ICE Shared Construction Analysis SCA 9712-570 - Smithsonian ...
ICE Shared Construction Analysis SCA 9712-570 - Smithsonian ... ICE Shared Construction Analysis SCA 9712-570 - Smithsonian ...
INDEX TO TEXT TITLE PAGE INTRODUCTION 1 MAJOR FINDINGS 1 TECHNOLOGY DESCRIPTION Assembly 2 Die Process and Design 2 - 3 ANALYSIS RESULTS I Assembly 4 ANALYSIS RESULTS II Die Process and Design 5 - 7 TABLES Procedure 8 Overall Quality Evaluation 9 Package Markings 10 Wirebond Strength 10 Die Material Analysis 10 Horizontal Dimensions 11 Vertical Dimensions 12 i
INTRODUCTION This report describes a construction analysis of the National Semiconductor LM2672 Simple Switcher voltage regulator. Five devices were supplied, encapsulated in 8-pin Dual-In-Line plastic packages (DIP). Date codes were not identifiable. Questionable Items: 1 MAJOR FINDINGS • Metal cracks were noted at contact edges. • Significant silicon in contacts. Special Features: • Linear Power BiCMOS process which includes a double diffused (DMOS) process. • Extended shallow source/drain N-channel transistor structure. Design Features: • Large area for double diffused (DMOS) process. • Large capacitor structures. 1 These items present possible quality or reliability concerns. They should be discussed with the manufacturer to determine their possible impact on the intended application. - 1 -
- Page 1: Construction Analysis National Semi
- Page 5 and 6: TECHNOLOGY DESCRIPTION (continued)
- Page 7 and 8: Die Process and Design: Questionabl
- Page 9 and 10: ANALYSIS RESULTS II (continued) •
- Page 11 and 12: OVERALL QUALITY EVALUATION: Overall
- Page 13 and 14: HORIZONTAL DIMENSIONS Die size: 1.8
- Page 15 and 16: INDEX TO FIGURES PACKAGE ASSEMBLY F
- Page 17 and 18: National LM2672 PIN 1 top side Figu
- Page 19 and 20: INTERMETAL DIELECTRIC PRE-METAL DIE
- Page 21 and 22: IMD LOCAL OXIDE PASSIVATION METAL 2
- Page 23 and 24: National LM2672 Figure 5a. Detailed
- Page 25 and 26: Mag. 400x Mag. 500x Figure 6. Die i
- Page 27 and 28: Figure 7. Optical views of the die
- Page 29 and 30: National LM2672 METAL 1 POLY N+ PRE
- Page 31 and 32: National LM2672 METAL 2 Mag. 2000x
- Page 33 and 34: National LM2672 PASSIVATION 2 METAL
- Page 35 and 36: National LM2672 METAL 1 POLY POLY M
- Page 37 and 38: National LM2672 Si PASSIVATION IMD
- Page 39 and 40: National LM2672 Mag. 1300x DIFFUSIO
- Page 41 and 42: National LM2672 GATE OXIDE PASSIVAT
- Page 43 and 44: National LM2672 STEP N+ POLY GATE O
- Page 45 and 46: National LM2672 METAL 1 LOCOS P- BO
- Page 47 and 48: National LM2672 METAL 1 Si Si POLY
- Page 49 and 50: N+ COLLECTOR PASSIVATION P+BASE N+
- Page 51 and 52: National LM2672 P+ ISO P+ EMITTER N
INDEX TO TEXT<br />
TITLE PAGE<br />
INTRODUCTION 1<br />
MAJOR FINDINGS 1<br />
TECHNOLOGY DESCRIPTION<br />
Assembly 2<br />
Die Process and Design 2 - 3<br />
ANALYSIS RESULTS I<br />
Assembly 4<br />
ANALYSIS RESULTS II<br />
Die Process and Design 5 - 7<br />
TABLES<br />
Procedure 8<br />
Overall Quality Evaluation 9<br />
Package Markings 10<br />
Wirebond Strength 10<br />
Die Material <strong>Analysis</strong> 10<br />
Horizontal Dimensions 11<br />
Vertical Dimensions 12<br />
i
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