ICE Shared Construction Analysis SCA 9712-570 - Smithsonian ...

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PACKAGE MARKINGS Top (National logo) 66AB 2672 M3.3 Bottom none WIREBOND STRENGTH Wire material: 1.3 mil diameter gold Die pad material: Aluminum sample 4 # of wires tested: 11 Bond lifts: 0 Force to break - high: 18g - low: 17g - avg.: 17.9g - std. dev.: 0.28 DIE MATERIAL ANALYSIS Passivation: Nitride over silicon-dioxide. Die metallization: Aluminum. Intermetal dielectric: Silicon-dioxide. Pre-metal glass: Single layer of reflow glass. Grown and densified oxides were also present. - 10 -
HORIZONTAL DIMENSIONS Die size: 1.8 x 3.5 mm (73.5 x 140.5 mils) Die area: 6.3 mm 2 (10,326 mils 2 ) Min pad size: 0.13 mm x 0.13 mm (5.1 x 5.1 mils) Min pad window: 0.11 mm x 0.11 mm (4.4 x 4.4 mils) Min metal 2 width: 7.3 microns Min metal 2 space: 7.7 microns Min metal 2 pitch: 15 microns Min via: 5.3 microns Min metal 1 width: 3.4 microns Min metal 1 space: 4.3 microns Min metal 1 pitch: 7.7 microns Min contact: 3 microns Min poly width: 3.7 microns Min poly space: 4.7 microns Min gate length* - (N-channel) 3.7 microns - (P-channel) 5.0 microns Min N+ emitter: 16 microns (round) Min P+ emitter: 12 microns (round) Min P+ isolation: 10 microns Min edge of base to P+ iso: 12 microns Min emitter to edge of base: 8 microns * Physical gate length - 11 -
Page 1 and 2: Construction Analysis National Semi
Page 3 and 4: INTRODUCTION This report describes
Page 5 and 6: TECHNOLOGY DESCRIPTION (continued)
Page 7 and 8: Die Process and Design: Questionabl
Page 9 and 10: ANALYSIS RESULTS II (continued) •
Page 11: OVERALL QUALITY EVALUATION: Overall
Page 15 and 16: INDEX TO FIGURES PACKAGE ASSEMBLY F
Page 17 and 18: National LM2672 PIN 1 top side Figu
Page 19 and 20: INTERMETAL DIELECTRIC PRE-METAL DIE
Page 21 and 22: IMD LOCAL OXIDE PASSIVATION METAL 2
Page 23 and 24: National LM2672 Figure 5a. Detailed
Page 25 and 26: Mag. 400x Mag. 500x Figure 6. Die i
Page 27 and 28: Figure 7. Optical views of the die
Page 29 and 30: National LM2672 METAL 1 POLY N+ PRE
Page 31 and 32: National LM2672 METAL 2 Mag. 2000x
Page 33 and 34: National LM2672 PASSIVATION 2 METAL
Page 35 and 36: National LM2672 METAL 1 POLY POLY M
Page 37 and 38: National LM2672 Si PASSIVATION IMD
Page 39 and 40: National LM2672 Mag. 1300x DIFFUSIO
Page 41 and 42: National LM2672 GATE OXIDE PASSIVAT
Page 43 and 44: National LM2672 STEP N+ POLY GATE O
Page 45 and 46: National LM2672 METAL 1 LOCOS P- BO
Page 47 and 48: National LM2672 METAL 1 Si Si POLY
Page 49 and 50: N+ COLLECTOR PASSIVATION P+BASE N+
Page 51 and 52: National LM2672 P+ ISO P+ EMITTER N
Page 53 and 54: National LM2672 PROBE MARK Integrat

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