GAMM Rundbrief 2002/Heft 2

Wissenschaftliche Tagungen 73
To conclude, Sydney is still beckoning seductively. I attended a trade exhibition
yesterday at the Sydney Convention and Exhibition Centre, and the site looked really
attractive. You might like to explore the following web site:
http://www.dha.nsw.gov.au/ map.asp?langid=256&section_id=18
I shall now write to you on a weekly basis so that you can follow our progress closely.
Info: Congress Director Dr Noel Barton
Tel.: +61 2 9325 3270 Fax: 61 2 9325 3200
mail: Noel.Barton@cmis.csiro.au
web: http://www.iciam.org
June 08 – 11, 2003
Thermal Stresses 2003
Virginia Polytechnic Institute and State University, Blacksburg, VA, USA
Among the objectives of the Congress there are: to provide a forum for scientists and
engineers from academia, research labs and industry from all over the world, involved
in problems where the temperature has a great impact on the properties and behavior of
materials/structures, on aerodynamics/hydrodynamics and on other field interactions,
such as piezothermoelasticity, etc.; exchange ideas, extend further cooperation and
foster the development of basic and applied research in the topics related to the
Congress. The Congress should forge cooperative links between researchers and
engineers by bringing them at one place, where they present their achievements and
conduct discussions. Participants from all over the world, interested to attend the
Congress for discussions or presentation of their results are welcome.
Topics
The topics of interest of the ICTS include but are not limited to:
- Thermoelasticity,
- Thermoplasticity,
- Thermoviscoelastoplasticity,
- Thermopiezoelectricity,
- Thermomagnetoelasticity,
- Thermal Shock,
- Thermal Stresses in Fracture, Cracking and Fatigue,
- Mechanical Behavior of Materials Structures at Elevated and Cryogenic
Temperatures,
- Engineering Approaches to High/Low Temperature,
- Design,
- Thermal Stresses and Fatigue in Ceramics and Porous Materials,
- Anisotropic Thermomechanical Problems,
- Thermodynamics of Structures,
- Thermal Protection Structural Systems,
- Inverse and Optimization Methods for ThermalProblems,
- Thermal Stresses in Materials and Forming Processes,
- Thermal Stresses and Mechanical Problems in Electronic Packaging,
- Heat Conduction Problems,
- Active/Passive Control in High Temperature Structures,
- Computational Methods in Thermal Problems,