An Investigation Into Ball Grid Array Inspection Techniques

More documents

Recommendations

Info

~esa STM-261 8. Acknowledgements The sample preparation and radiographic inspection presented in this report were performed by the National Physical Laboratory, Teddington, United Kingdom and funded by the European Space Agency. The metallographic evaluation was performed at ESA's European Space Research and Technology Centre (ESTEC), Noordwijk, The Netherlands. The contributions of the following organisations is also acknowledged: A & D Automation (Sales) Ltd. Planar Connect. Fujitsu Telecommunications Europe Ltd. X-tek Systems Ltd. Hewlett Packard Test and Instrumentation. 58
9. References 1. ESA PSS 01-708 The manual soldering of high-reliability electrical connections. Noordwijk Netherlands: ESA Publications Division. 2. ESA PSS 01-738 High-reliability soldering for surface-mount and mixed technology printed-circuit Division. boards. Noordwijk Netherlands: ESA Publications 59 Ball Grid Array Inspection Techniques
Page 1 and 2:
An Investigation Into Ball Grid Arr
Page 3:
Abstract An evaluation of four diff
Page 7 and 8:
1 Introduction X-ray techniques hav
Page 9 and 10: X-rays and displays them as an imag
Page 11 and 12: Each defect was identified using th
Page 13 and 14: 2.3 BGA PCB Image Summary of defect
Page 15 and 16: Sample 4 Misaligned component 2.4 U
Page 17 and 18: 4. Equipment Evaluated Four machine
Page 19 and 20: 'If ~ c.S"'
Page 21 and 22: 5. Results This section is structur
Page 23 and 24: ...~,.--= o't:ll.JOII_s_8I:Jt11l .
Page 25 and 26: 19 Ball Grid Array Inspection Techn
Page 27 and 28: .-:;,... ~ "''' . ..~ , '. ., ' -,
Page 29 and 30: 5.3 Results For Sample 2 The defect
Page 35 and 36: ~e 88el, e~.~tti '88.~_",! 88M_llle
Page 39 and 40: 5.5 Results For Sample 3 The defect
Page 41 and 42: ~. ij.ij, --- - -- - # . '\>. ~ l 3
Page 43 and 44: ~,-a;_:,t. ,"""~.. '~::-~-",;;:-:~,
Page 45 and 46: . ..~.' '...~ .' _.I:t!IIDJ:I ""'1:
Page 47 and 48: The laminography system also behave
Page 51 and 52: f '~"~>-" . 1 ~"I ,} ""'"''-'''''''
Page 55 and 56: 5.11. Identification of voids withi
Page 57 and 58: Table 1: Defect Detectability and L
Page 59: 7. Recommendations The most sensiti
Page 63: ~esa STM-261 Editor: Copyright: Pub
show all

An Investigation Into Ball Grid Array Inspection Techniques

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?