An Investigation Into Ball Grid Array Inspection Techniques
An Investigation Into Ball Grid Array Inspection Techniques
An Investigation Into Ball Grid Array Inspection Techniques
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51<br />
<strong>Ball</strong> <strong>Grid</strong> <strong>Array</strong> <strong>Inspection</strong> <strong>Techniques</strong><br />
Figure 70. X-tek angled transmission image<br />
ofsample 2 showing non-wetted pad at EIO<br />
with Cu/ln/Cu backing. High wetting angle<br />
clearly evident (compare with Figure 38).<br />
Figure 7/. HP5DX ball slice laminography<br />
image of sample 2 with CulnCu backing<br />
(compare with Figure 39).