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An Investigation Into Ball Grid Array Inspection Techniques

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51<br />

<strong>Ball</strong> <strong>Grid</strong> <strong>Array</strong> <strong>Inspection</strong> <strong>Techniques</strong><br />

Figure 70. X-tek angled transmission image<br />

ofsample 2 showing non-wetted pad at EIO<br />

with Cu/ln/Cu backing. High wetting angle<br />

clearly evident (compare with Figure 38).<br />

Figure 7/. HP5DX ball slice laminography<br />

image of sample 2 with CulnCu backing<br />

(compare with Figure 39).

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