An Investigation Into Ball Grid Array Inspection Techniques

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Page 1 and 2: An Investigation Into Ball Grid Arr
Page 3: Abstract An evaluation of four diff
Page 7 and 8: 1 Introduction X-ray techniques hav
Page 9 and 10: X-rays and displays them as an imag
Page 11 and 12: Each defect was identified using th
Page 13 and 14: 2.3 BGA PCB Image Summary of defect
Page 15 and 16: Sample 4 Misaligned component 2.4 U
Page 17 and 18: 4. Equipment Evaluated Four machine
Page 19 and 20: 'If ~ c.S"'
Page 21 and 22: 5. Results This section is structur
Page 23 and 24: ...~,.--= o't:ll.JOII_s_8I:Jt11l .
Page 25 and 26: 19 Ball Grid Array Inspection Techn
Page 27 and 28: .-:;,... ~ "''' . ..~ , '. ., ' -,
Page 29 and 30: 5.3 Results For Sample 2 The defect
Page 35 and 36: ~e 88el, e~.~tti '88.~_",! 88M_llle
Page 39 and 40: 5.5 Results For Sample 3 The defect
Page 41 and 42: ~. ij.ij, --- - -- - # . '\>. ~ l 3
Page 43 and 44: ~,-a;_:,t. ,"""~.. '~::-~-",;;:-:~,
Page 45 and 46: . ..~.' '...~ .' _.I:t!IIDJ:I ""'1:
Page 47 and 48: The laminography system also behave
Page 49: 47 Ball Grid Array Inspection Techn
Page 55 and 56: 5.11. Identification of voids withi
Page 57 and 58: Table 1: Defect Detectability and L
Page 59 and 60: 7. Recommendations The most sensiti
Page 61 and 62: 9. References 1. ESA PSS 01-708 The
Page 63: ~esa STM-261 Editor: Copyright: Pub

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