An Investigation Into Ball Grid Array Inspection Techniques
An Investigation Into Ball Grid Array Inspection Techniques
An Investigation Into Ball Grid Array Inspection Techniques
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Contents<br />
1 Introduction<br />
2 Test Sample Manufacture<br />
2.1 Method<br />
2.2 Classification of defects<br />
2.3 Summary of defects<br />
2.4 Use of tear-drop pad design<br />
2.5 X-ray inspection of multilayer substrates<br />
3 Metallurgical Examination<br />
4 Equipment Evaluated<br />
4.1 Glenbrook RTX Mini<br />
4.2 Nicolet NXR-1400i<br />
4.3 X-tek RTR225kV<br />
4.4 Hewlett Packard Four Pi 5DX<br />
4.5 Equipment evaluation<br />
5 Results<br />
5.1 Results for Sample I<br />
5.2 Comments on Sample I<br />
5.3 Results for Sample 2<br />
5.4 Comments on Sample 2<br />
5.5 Results for Sample 3<br />
5.6 Comments on Sample 3<br />
5.7 Results for Sample 4<br />
5.8 Comments on Sample 4<br />
5.9 Results for samples with CuInCu backing substrate<br />
5.10 Comments on samples with CulnCu backing substrate<br />
5.11 Identification of Voids within Solder<br />
5.12 Comments on images of voiding<br />
6 Conclusions<br />
7 Recommendations<br />
8 Acknowledgements<br />
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<strong>Ball</strong> <strong>Grid</strong> <strong>Array</strong> <strong>Inspection</strong> <strong>Techniques</strong>
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