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An Investigation Into Ball Grid Array Inspection Techniques

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Oesa STM-261<br />

Figure 52. X-tek angled transmission image<br />

of sample 3 showing<br />

(1) non-wetted pad (C13) and<br />

(2) solder balls.<br />

Figure 53. Glenbrook perpendicular<br />

transmission image of sample 3 showing<br />

non-wetted pads (C13, F13, G9). Solder<br />

balls were not detected at this<br />

magnification.<br />

40

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