An Investigation Into Ball Grid Array Inspection Techniques
An Investigation Into Ball Grid Array Inspection Techniques
An Investigation Into Ball Grid Array Inspection Techniques
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Oesa STM-261<br />
Figure 52. X-tek angled transmission image<br />
of sample 3 showing<br />
(1) non-wetted pad (C13) and<br />
(2) solder balls.<br />
Figure 53. Glenbrook perpendicular<br />
transmission image of sample 3 showing<br />
non-wetted pads (C13, F13, G9). Solder<br />
balls were not detected at this<br />
magnification.<br />
40