An Investigation Into Ball Grid Array Inspection Techniques

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~esa STM-261 Figure 40. Detailed sectioll through ball E JO of sample 2, showillg IIoll-wettillg of the solder OlltOthe pad. Figure 41. Detailed sectioll through ball K 12 of sample 2, showillg IIOII-wettillg of the solder OlltO the pad. 32
33 Ball Grid Array Inspection Techniques Figure 42. Detailed microsectioll through ball H8 of sample 2, showillg missillg ball. Figure 43. Detailed microsectioll through ball K8 of sample 2, showillg missillg ball.
Page 1 and 2: An Investigation Into Ball Grid Arr
Page 3: Abstract An evaluation of four diff
Page 7 and 8: 1 Introduction X-ray techniques hav
Page 9 and 10: X-rays and displays them as an imag
Page 11 and 12: Each defect was identified using th
Page 13 and 14: 2.3 BGA PCB Image Summary of defect
Page 15 and 16: Sample 4 Misaligned component 2.4 U
Page 17 and 18: 4. Equipment Evaluated Four machine
Page 19 and 20: 'If ~ c.S"'
Page 21 and 22: 5. Results This section is structur
Page 23 and 24: ...~,.--= o't:ll.JOII_s_8I:Jt11l .
Page 25 and 26: 19 Ball Grid Array Inspection Techn
Page 27 and 28: .-:;,... ~ "''' . ..~ , '. ., ' -,
Page 29 and 30: 5.3 Results For Sample 2 The defect
Page 35: ~e 88el, e~.~tti '88.~_",! 88M_llle
Page 39 and 40: 5.5 Results For Sample 3 The defect
Page 41 and 42: ~. ij.ij, --- - -- - # . '\>. ~ l 3
Page 43 and 44: ~,-a;_:,t. ,"""~.. '~::-~-",;;:-:~,
Page 45 and 46: . ..~.' '...~ .' _.I:t!IIDJ:I ""'1:
Page 47 and 48: The laminography system also behave
Page 51 and 52: f '~"~>-" . 1 ~"I ,} ""'"''-'''''''
Page 55 and 56: 5.11. Identification of voids withi
Page 57 and 58: Table 1: Defect Detectability and L
Page 59 and 60: 7. Recommendations The most sensiti
Page 61 and 62: 9. References 1. ESA PSS 01-708 The
Page 63: ~esa STM-261 Editor: Copyright: Pub

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