An Investigation Into Ball Grid Array Inspection Techniques
An Investigation Into Ball Grid Array Inspection Techniques An Investigation Into Ball Grid Array Inspection Techniques
Gesa STM-261 Figure 24. Glellbrook trallsmissioll image of sample 2 with the locatioll of (1) bridges (-K3 alld P3), (2) lIoll-wetted pad (L4), (3) missillg balls (H8, K8 alld RI)) alld (4) solder balls. Figure 25. Nicolet perpelldicular trallsmissioll image of .mmple 2 with the locatioll of (1) missillg balls (K8, H8, RI, P/4, P/5), (2) bridges (-K3 alld P3) alld (3) lIoll-wetted pads (K I 2, L4 alld E I 0). . 24 2 t:_AI:IIn."'1IJ~f_i:lir.JIJ:rIi~:GCl:IiDI-.:1I3:--'II:J~~.I'IJI.I)"*.
25 Ball Grid Array Inspection Techniques Figure 26. X-tek perpendicular transmission image of sample 2 with the location of (1)missing balls (K8, H8, RI, P14, PI5), (2) bridges (-K3 alld P3) alld (3) nOli-wetted pads (K12, L4 alld £10). Figure 27. HP5DX ball slice lamillography image of sample 2 with the locatioll of (1) missing ball at RI, (2) bridges at KI and P3 and (3) non-wetted joint at L4.
- Page 1 and 2: An Investigation Into Ball Grid Arr
- Page 3: Abstract An evaluation of four diff
- Page 7 and 8: 1 Introduction X-ray techniques hav
- Page 9 and 10: X-rays and displays them as an imag
- Page 11 and 12: Each defect was identified using th
- Page 13 and 14: 2.3 BGA PCB Image Summary of defect
- Page 15 and 16: Sample 4 Misaligned component 2.4 U
- Page 17 and 18: 4. Equipment Evaluated Four machine
- Page 19 and 20: 'If ~ c.S"'
- Page 21 and 22: 5. Results This section is structur
- Page 23 and 24: ...~,.--= o't:ll.JOII_s_8I:Jt11l .
- Page 25 and 26: 19 Ball Grid Array Inspection Techn
- Page 27 and 28: .-:;,... ~ "''' . ..~ , '. ., ' -,
- Page 29: 5.3 Results For Sample 2 The defect
- Page 33 and 34: 29 Ball Grid Array Inspection Techn
- Page 35 and 36: ~e 88el, e~.~tti '88.~_",! 88M_llle
- Page 37 and 38: 33 Ball Grid Array Inspection Techn
- Page 39 and 40: 5.5 Results For Sample 3 The defect
- Page 41 and 42: ~. ij.ij, --- - -- - # . '\>. ~ l 3
- Page 43 and 44: ~,-a;_:,t. ,"""~.. '~::-~-",;;:-:~,
- Page 45 and 46: . ..~.' '...~ .' _.I:t!IIDJ:I ""'1:
- Page 47 and 48: The laminography system also behave
- Page 49 and 50: 47 Ball Grid Array Inspection Techn
- Page 51 and 52: f '~"~>-" . 1 ~"I ,} ""'"''-'''''''
- Page 53 and 54: 51 Ball Grid Array Inspection Techn
- Page 55 and 56: 5.11. Identification of voids withi
- Page 57 and 58: Table 1: Defect Detectability and L
- Page 59 and 60: 7. Recommendations The most sensiti
- Page 61 and 62: 9. References 1. ESA PSS 01-708 The
- Page 63: ~esa STM-261 Editor: Copyright: Pub
Gesa STM-261<br />
Figure 24. Glellbrook trallsmissioll image<br />
of sample 2 with the locatioll of<br />
(1) bridges (-K3 alld P3),<br />
(2) lIoll-wetted pad (L4),<br />
(3) missillg balls (H8, K8 alld RI)) alld<br />
(4) solder balls.<br />
Figure 25. Nicolet perpelldicular<br />
trallsmissioll image of .mmple 2 with<br />
the locatioll of<br />
(1) missillg balls (K8, H8, RI, P/4, P/5),<br />
(2) bridges (-K3 alld P3) alld<br />
(3) lIoll-wetted pads (K I 2, L4 alld E I 0).<br />
.<br />
24<br />
2<br />
t:_AI:IIn."'1IJ~f_i:lir.JIJ:rIi~:GCl:IiDI-.:1I3:--'II:J~~.I'IJI.I)"*.
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