10.08.2013 Views

An Investigation Into Ball Grid Array Inspection Techniques

An Investigation Into Ball Grid Array Inspection Techniques

An Investigation Into Ball Grid Array Inspection Techniques

SHOW MORE
SHOW LESS

Create successful ePaper yourself

Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.

Abstract<br />

<strong>An</strong> evaluation of four different X-ray inspection systems has been undertaken. Two<br />

perpendicular transmission X-ray systems, an angled X-ray transmission system and an<br />

automatic X-ray laminography system were evaluated. The samples inspected were<br />

assembled ball grid array (BGA) components with known defects. The defects included<br />

misalignments, missing balls, bridges, non-wetted pads and partially reflowed solder<br />

joints. The presence of these defects was confirmed after X-ray inspection by<br />

metallographic examination.<br />

All the X-ray systems evaluated were found capable of identifying misalignments,<br />

bridges and missing balls. Only the angled transmission X-ray system was completely<br />

successful at finding the non-wetted pads. The efficiency of locating non-wetted pads<br />

using perpendicular transmission X-ray systems may be improved by altering the<br />

substrate pad shape from round to tear-drop. Similarly the laminography system<br />

efficiency may be improved by taking advantage of such a pad design.<br />

111<br />

<strong>Ball</strong> <strong>Grid</strong> <strong>Array</strong> <strong>Inspection</strong> <strong>Techniques</strong>

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!