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An Investigation Into Ball Grid Array Inspection Techniques

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Gesa STM-261<br />

Figure 20. Detailed microsectioll through<br />

ball A2 of sample I, showillg complete<br />

reflow of solder.<br />

Figure 21. Detailed microsectioll through<br />

ball A4 of sample I, showillg solder reflow<br />

but illcomplete meltillg of solder ball.<br />

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