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An Investigation Into Ball Grid Array Inspection Techniques

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19<br />

<strong>Ball</strong> <strong>Grid</strong> <strong>Array</strong> <strong>Inspection</strong> <strong>Techniques</strong><br />

Figure 18. View showillg lIo/l-reflow of<br />

solder paste 011sample I.<br />

Figure 19. Microsectio/l through BGA 011<br />

sample I showillg partial reflow of solder<br />

paste 011hal/mlmhers A3, A4 amI AS.

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