An Investigation Into Ball Grid Array Inspection Techniques
An Investigation Into Ball Grid Array Inspection Techniques An Investigation Into Ball Grid Array Inspection Techniques
~esa STM-26I r"'. Igure. 16 X-tek allg led trallsmissioll image . of samp Ie, I vilh mlsa I, 'gll mellt OJ .1'som e balls alld solder pas t e shadow due to partial reflolV. Figure. ' 1 7. HP , Four P I' 5 DX ball (left) alld pad (right) slice I ami 'llography images oJ .1' sample 1. ~"""..". ~~---- - .e.~-- ~ 18
19 Ball Grid Array Inspection Techniques Figure 18. View showillg lIo/l-reflow of solder paste 011sample I. Figure 19. Microsectio/l through BGA 011 sample I showillg partial reflow of solder paste 011hal/mlmhers A3, A4 amI AS.
- Page 1 and 2: An Investigation Into Ball Grid Arr
- Page 3: Abstract An evaluation of four diff
- Page 7 and 8: 1 Introduction X-ray techniques hav
- Page 9 and 10: X-rays and displays them as an imag
- Page 11 and 12: Each defect was identified using th
- Page 13 and 14: 2.3 BGA PCB Image Summary of defect
- Page 15 and 16: Sample 4 Misaligned component 2.4 U
- Page 17 and 18: 4. Equipment Evaluated Four machine
- Page 19 and 20: 'If ~ c.S"'
- Page 21 and 22: 5. Results This section is structur
- Page 23: ...~,.--= o't:ll.JOII_s_8I:Jt11l .
- Page 27 and 28: .-:;,... ~ "''' . ..~ , '. ., ' -,
- Page 29 and 30: 5.3 Results For Sample 2 The defect
- Page 31 and 32: 25 Ball Grid Array Inspection Techn
- Page 33 and 34: 29 Ball Grid Array Inspection Techn
- Page 35 and 36: ~e 88el, e~.~tti '88.~_",! 88M_llle
- Page 37 and 38: 33 Ball Grid Array Inspection Techn
- Page 39 and 40: 5.5 Results For Sample 3 The defect
- Page 41 and 42: ~. ij.ij, --- - -- - # . '\>. ~ l 3
- Page 43 and 44: ~,-a;_:,t. ,"""~.. '~::-~-",;;:-:~,
- Page 45 and 46: . ..~.' '...~ .' _.I:t!IIDJ:I ""'1:
- Page 47 and 48: The laminography system also behave
- Page 49 and 50: 47 Ball Grid Array Inspection Techn
- Page 51 and 52: f '~"~>-" . 1 ~"I ,} ""'"''-'''''''
- Page 53 and 54: 51 Ball Grid Array Inspection Techn
- Page 55 and 56: 5.11. Identification of voids withi
- Page 57 and 58: Table 1: Defect Detectability and L
- Page 59 and 60: 7. Recommendations The most sensiti
- Page 61 and 62: 9. References 1. ESA PSS 01-708 The
- Page 63: ~esa STM-261 Editor: Copyright: Pub
~esa STM-26I<br />
r"'. Igure. 16 X-tek allg led trallsmissioll image<br />
.<br />
of samp Ie, I vilh mlsa I, 'gll mellt OJ .1'som e<br />
balls alld solder pas t e shadow due to<br />
partial reflolV.<br />
Figure. ' 1 7. HP<br />
,<br />
Four P I'<br />
5 DX ball (left) alld<br />
pad (right) slice I ami 'llography images oJ .1'<br />
sample 1.<br />
~"""..".<br />
~~----<br />
-<br />
.e.~--<br />
~<br />
18
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