An Investigation Into Ball Grid Array Inspection Techniques

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Gesa STM-261 Figure 9. Diagram of allgled trallsmissioll X-ray system. ! ! ! ! Detector ! ! ! ! BGA perpendicular transmission and angled perpendicular transmission modes as shown in Figure 9. It is capable of magnifications of 1.1 to 160X, with a maximum field of view of approximately 120 x 160 mm. Movement of the sample is possible in 5 axes (x, y, z, tilt and rotate) using joystick control. The system is simple to use and has a typical selling price of approxim:Jtp.ly (: 700 000 Thp.systp.m1ISp.nto ~:Jrry out the evaluation incorporated an image intensifier. The images shown in this report are digitised images saved direct to media which have been mirrored and rotated to align with the images from other machines. 4.4. Hewlett Packard Four Pi SDX The Hewlett Packard Four Pi 50X system differs from the others reviewed in this report in that it is a laminography system. Laminography systems are essentially industrial versions of medical body scanners and work by creating a thin, horizontal focal plane by rotating an X-ray beam around a vertical axis in synchrony with a rotating X-ray detector. The image created represents a slice through the workpiece about 0.3 mm thick. Components outside the focal plane are unfocused and do not interfere with the image. The images from such a system are not as easy to interpret as transmission X-ray images but double sided assemblies do not present a problem. The images on the 50X machine are automatically interpreted by comparing measurements taken from the images with tolerances set by the user for each joint type. The system therefore needs extensive programming for each design to be inspected, but once this task is 12
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Page 1 and 2: An Investigation Into Ball Grid Arr
Page 3: Abstract An evaluation of four diff
Page 7 and 8: 1 Introduction X-ray techniques hav
Page 9 and 10: X-rays and displays them as an imag
Page 11 and 12: Each defect was identified using th
Page 13 and 14: 2.3 BGA PCB Image Summary of defect
Page 15 and 16: Sample 4 Misaligned component 2.4 U
Page 17: 4. Equipment Evaluated Four machine
Page 21 and 22: 5. Results This section is structur
Page 23 and 24: ...~,.--= o't:ll.JOII_s_8I:Jt11l .
Page 25 and 26: 19 Ball Grid Array Inspection Techn
Page 27 and 28: .-:;,... ~ "''' . ..~ , '. ., ' -,
Page 29 and 30: 5.3 Results For Sample 2 The defect
Page 35 and 36: ~e 88el, e~.~tti '88.~_",! 88M_llle
Page 39 and 40: 5.5 Results For Sample 3 The defect
Page 41 and 42: ~. ij.ij, --- - -- - # . '\>. ~ l 3
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Page 45 and 46: . ..~.' '...~ .' _.I:t!IIDJ:I ""'1:
Page 47 and 48: The laminography system also behave
Page 51 and 52: f '~"~>-" . 1 ~"I ,} ""'"''-'''''''
Page 55 and 56: 5.11. Identification of voids withi
Page 57 and 58: Table 1: Defect Detectability and L
Page 59 and 60: 7. Recommendations The most sensiti
Page 61 and 62: 9. References 1. ESA PSS 01-708 The
Page 63: ~esa STM-261 Editor: Copyright: Pub

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