An Investigation Into Ball Grid Array Inspection Techniques
An Investigation Into Ball Grid Array Inspection Techniques
An Investigation Into Ball Grid Array Inspection Techniques
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Gesa STM-26I<br />
3. Metallurgical Examination<br />
After examination by the X-ray systems, microsections of the BOAs were prepared<br />
using standard methods of mounting, grinding, polishing and etching. Metallurgical<br />
examination of the BOAs was performed using a Reichert MEF3a inverted<br />
metallurgical microscope with magnifications up to X 1500 available.<br />
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