An Investigation Into Ball Grid Array Inspection Techniques
An Investigation Into Ball Grid Array Inspection Techniques An Investigation Into Ball Grid Array Inspection Techniques
~esa STM-261 Figure 4. Balllllimberiflg of PB GA225 whefl viewed from above the assembly. Figure 5. Tear-drop pad desigfl. 12 3 4 5 6 7 8 9 101112131415 R............... p............... N............... M............... L............... K... . . . . . . . . . . . . . J............... H. G............... . . . . . . ... . . . . . . F............... E............... D............... C'.............. B............... A............... 6
2.3 BGA PCB Image Summary of defects Sample 1 Partial reflow of solder paste Sample 2 Missing balls Bridges Non-wetted pads Sample 3 Missing balls: Bridges Non-wetted pads ! ! ! ! KS, HS, PI4, P15, RI KI / K2 / Ll / L2 / M I / M2, / N3 / P2 / P3 EIO, KI3, L4 C5,F2 PI5 / RI5 CI3, FI3, G9, K9, MS, PIG 7 Ball Grid Array Inspection Techniques Figure 6. Diagram showing masking of pad area during perpendicular transmi.~sion X-ray inspection.
- Page 1 and 2: An Investigation Into Ball Grid Arr
- Page 3: Abstract An evaluation of four diff
- Page 7 and 8: 1 Introduction X-ray techniques hav
- Page 9 and 10: X-rays and displays them as an imag
- Page 11: Each defect was identified using th
- Page 15 and 16: Sample 4 Misaligned component 2.4 U
- Page 17 and 18: 4. Equipment Evaluated Four machine
- Page 19 and 20: 'If ~ c.S"'
- Page 21 and 22: 5. Results This section is structur
- Page 23 and 24: ...~,.--= o't:ll.JOII_s_8I:Jt11l .
- Page 25 and 26: 19 Ball Grid Array Inspection Techn
- Page 27 and 28: .-:;,... ~ "''' . ..~ , '. ., ' -,
- Page 29 and 30: 5.3 Results For Sample 2 The defect
- Page 31 and 32: 25 Ball Grid Array Inspection Techn
- Page 33 and 34: 29 Ball Grid Array Inspection Techn
- Page 35 and 36: ~e 88el, e~.~tti '88.~_",! 88M_llle
- Page 37 and 38: 33 Ball Grid Array Inspection Techn
- Page 39 and 40: 5.5 Results For Sample 3 The defect
- Page 41 and 42: ~. ij.ij, --- - -- - # . '\>. ~ l 3
- Page 43 and 44: ~,-a;_:,t. ,"""~.. '~::-~-",;;:-:~,
- Page 45 and 46: . ..~.' '...~ .' _.I:t!IIDJ:I ""'1:
- Page 47 and 48: The laminography system also behave
- Page 49 and 50: 47 Ball Grid Array Inspection Techn
- Page 51 and 52: f '~"~>-" . 1 ~"I ,} ""'"''-'''''''
- Page 53 and 54: 51 Ball Grid Array Inspection Techn
- Page 55 and 56: 5.11. Identification of voids withi
- Page 57 and 58: Table 1: Defect Detectability and L
- Page 59 and 60: 7. Recommendations The most sensiti
- Page 61 and 62: 9. References 1. ESA PSS 01-708 The
~esa STM-261<br />
Figure 4. <strong>Ball</strong>lllimberiflg of PB GA225<br />
whefl viewed from above the assembly.<br />
Figure 5. Tear-drop pad desigfl.<br />
12 3 4 5 6 7 8 9 101112131415<br />
R...............<br />
p...............<br />
N...............<br />
M...............<br />
L...............<br />
K... . . . . . . . . . . . . .<br />
J...............<br />
H.<br />
G...............<br />
. . . . . . ... . . . . . .<br />
F...............<br />
E...............<br />
D...............<br />
C'..............<br />
B...............<br />
A...............<br />
6
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