ECSS--Q--70--07A
ECSS--Q--70--07A ECSS--Q--70--07A
30 Table B -1: Solder joint discrepancy log Part identification Wave soldering parameters Assembly: __________ PCB P/N: __________ Preheat temp: ________ Solder temp: ________ Conveyer Speed: ________ Wave height: _________ Description Insufficient Excess Miscellaneous MLB q No. of thru holes: ______ p No. No. of layers: ______ oids nent side; B: bottom side Lead poor wetting T: Ground plane estimated area: Topside: ______% Acceptable rework level: ___% total Date Botside: ______% Inspector Insptn. S/N compone Inspector’s p T observations: B T B T B T B T B T B T B T B T B T B T B Totals: Pad poor wetting w Large voids ds Small bottoomless vo solder Insufficient flow-thru solder Depressed Bridging Icicling Accumulatioons Excess sold lder (lead d obscured) Stress-relief ef bends fi filled Raised commponent Other solder discrepancies (specify) Subtotals % for rework ECSS--Q--70--07A 20 January 1998 ECSS
ECSS--Q--70--07A ECSS 20 January 1998 ECSS Document Improvement Proposal 1. Document I.D. ECSS--Q--70--07A 2. Document Date 20 January 1998 3. Document Title Verification and approval of automatic machine wave soldering for spacecraft hardware 4. Recommended Improvement (identify clauses, subclauses and include modified text and/or graphic, attach pages as necessary) 5. Reason for Recommendation 6. Originator of recommendation Name: Organization: Address: Phone: Fax: E--Mail: 8. Send to ECSS Secretariat Name: W. Kriedte ESA--TOS/QR Address: Keplerlaan 1 2200AG Noordwijk Netherlands 7. Date of Submission: Phone: +31--71--565--3952 Fax: +31--71--565--6839 E--Mail: wkriedte@estec.esa.nl Note: The originator of the submission should complete items 4, 5, 6 and 7. This form is available as a Word and Wordperfect--Template on internet under http://www.estec.esa.nl/ecss/improve/ 31
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30<br />
Table B -1: Solder joint discrepancy log<br />
Part identification Wave soldering parameters<br />
Assembly: __________ PCB P/N: __________ Preheat temp: ________ Solder temp: ________ Conveyer Speed: ________ Wave height: _________<br />
Description Insufficient Excess Miscellaneous<br />
MLB q No. of thru holes: ______<br />
p No. No. of layers: ______<br />
oids<br />
nent side;<br />
B: bottom side<br />
Lead poor wetting<br />
T:<br />
Ground plane estimated area: Topside: ______%<br />
Acceptable<br />
rework level:<br />
___% total Date<br />
Botside: ______%<br />
Inspector Insptn. S/N compone<br />
Inspector’s p<br />
T<br />
observations:<br />
B<br />
T<br />
B<br />
T<br />
B<br />
T<br />
B<br />
T<br />
B<br />
T<br />
B<br />
T<br />
B<br />
T<br />
B<br />
T<br />
B<br />
T<br />
B<br />
T<br />
B<br />
Totals:<br />
Pad poor wetting w<br />
Large voids ds<br />
Small bottoomless<br />
vo<br />
solder<br />
Insufficient<br />
flow-thru<br />
solder<br />
Depressed<br />
Bridging<br />
Icicling<br />
Accumulatioons<br />
Excess sold lder (lead d<br />
obscured)<br />
Stress-relief ef bends fi filled<br />
Raised commponent<br />
Other solder<br />
discrepancies<br />
(specify) Subtotals % for rework<br />
<strong>ECSS</strong>--Q--<strong>70</strong>--<strong>07A</strong><br />
20 January 1998<br />
<strong>ECSS</strong>
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