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MCP23008/MCP23S08 - Microchip

MCP23008/MCP23S08 - Microchip

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3.0 PACKAGING INFORMATION<br />

3.1 Package Marking Information<br />

18-Lead PDIP (300 mil)<br />

XXXXXXXXXXXXXXXXX<br />

XXXXXXXXXXXXXXXXX<br />

YYWWNNN<br />

18-Lead SOIC (300 mil)<br />

XXXXXXXXXXXX<br />

XXXXXXXXXXXX<br />

XXXXXXXXXXXX<br />

YYWWNNN<br />

20-Lead SSOP<br />

XXXXXXXXXXXX<br />

XXXXXXXXXXXX<br />

YYWWNNN<br />

<strong>MCP23008</strong>/<strong>MCP23S08</strong><br />

Example:<br />

Example:<br />

20-Lead QFN Example<br />

XXXXX<br />

XXXXXX<br />

XXXXXX<br />

YWWNNN<br />

Example:<br />

<strong>MCP23008</strong>-E/P^^ e3<br />

23S08<br />

E/ML^^ e3<br />

0637<br />

256<br />

0634256<br />

<strong>MCP23008</strong><br />

E/SO^^ e3<br />

0634256<br />

<strong>MCP23S08</strong><br />

XXXXXXXXXXXX E/SS^^ e3<br />

0634256<br />

Legend: XX...X Customer-specific information<br />

Y Year code (last digit of calendar year)<br />

YY Year code (last 2 digits of calendar year)<br />

WW Week code (week of January 1 is week ‘01’)<br />

NNN Alphanumeric traceability code<br />

e3<br />

Pb-free JEDEC designator for Matte Tin (Sn)<br />

* This package is Pb-free. The Pb-free JEDEC designator ( e3<br />

)<br />

can be found on the outer packaging for this package.<br />

Note: In the event the full <strong>Microchip</strong> part number cannot be marked on one line, it will<br />

be carried over to the next line, thus limiting the number of available<br />

characters for customer-specific information.<br />

© 2007 <strong>Microchip</strong> Technology Inc. DS21919E-page 33

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