iida - section 5 - Research Services

IID-A 

Herschel/Planck 

REFERENCE : SCI-PT-IIDA-04624 

DATE : 12/02/2004 

Instrument Interface Document 

IID PART A 

Name Signature 

Prepared/ 

compiled by 

Herschel/Planck Project Team 

Alcatel / Astrium / Alenia 

Agreed by Instrument Pi's: 

Planck HFI: J.L.Puget 

Planck LFI: N.Mandolesi 

Herschel PACS: A.Poglitch 

Herschel SPIRE: M.Griffin 

Herschel HIFI: Th. De Graauw 

Approved by Industry Project Managers 

Alcatel J.-J. Juillet 

Alenia: P.Musi 

Astrium. W.Ruehe 

Approved by ESA Project Manager T.Passvogel 

ESA/ESTEC/SCI/PT 

ISSUE : 3.1 PAGE : i

IID-A 

DISTRIBUTION LIST 

(Distribution in electronic format (Adobe PDF) 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE : ii 

Qty Organisation Institute e.mail 

1 ESA ESA herschel.planck@esa.int 

1 Prime Contractor 

Planck PLM 

Alcatel herschel.planck@space.alcatel.fr 

1 Herschel EPLM Astrium GmbH Herschel.project.ED@astrium-space.com 

1 SVM Alenia marco.cesa@sofiter.it 

1 Herschel SPIRE Univ.Cardiff/RAL J.A.Long@rl.ac.uk 

1 Herschel PACS MPE pacs@mpe.mpg.de 

1 Herschel HIFI SRON HIFI-Prof@sron.nl 

1 Planck LFI TESRE/CNR taddei@tesre.bo.cnr.it 

1 Planck HFI IAS valerie.demuyt@ias.u-psud.fr 

1 Planck Reflectors DSRI

Issue- 

Rev 

IID-A 

DOCUMENT CHANGE RECORD 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE : iii 

Date Version Pages affected 

1-0 01/09/2000 Initial Issue for ITT New Document 

2-0 31/07/2001 Issue for SRR Complete Revision: 

Renaming of FIRST by Herschel. 

Changes marked by change bars 

(including editorial changes). 

3-0 30/06/02 PDR version 

3.1 12/02/2004 CDR version 

PDR version 

Taking into account 

Alcatel Change requests 

HP-ASPI-CR 21, 22, 23, 24, 25 

HIFI Change requests 

HP-HIFI-CR- 9 issue 2, 16 issue 2, 18, 19, 20, 

21 

+ red line copy including update of the 

spacecrafts design by industry 

Based on Instruments and industry comments, 

and evolution of the design., tracked by change 

record database IID-A_modification 

list_3.0_to_3.1.xls, on ftp server) 

Main changes are: Mechanical loads update 

(section 9), data handling refined (section 5.11), 

and most figures to comply with current design 

Update of all interface control drawings 

(annexes) 

New annexes: 

System ICD (annex 9) (replace ICD templates) 

WIH ICD (annex 10 

Herschel telescope ICD (annex 11) 

Planck scanning strategy (added in annex 2)

1 INTRODUCTION 

IID-A 

TABLE OF CONTENTS 

2 APPLICABLE/REFERENCE DOCUMENTS 

2.1 APPLICABLE DOCUMENTS 

2.2 REFERENCE DOCUMENTS 

2.3 LIST OF ACRONYMS 

3 KEY PERSONNEL AND RESPONSIBILITIES 

3.1 ESA PERSONNEL 

3.2 CONTRACTOR PERSONNEL 

4 SATELLITE DESCRIPTION 

4.1 INTRODUCTION 

4.2 SYSTEM DESCRIPTION 

4.3 Herschel PAYLOAD MODULE (FPLM) 

4.3.1 Herschel Telescope 

4.3.2 Helium Cryostat 

4.3.3 Herschel PLM Cryo Cover 

4.4 Planck PAYLOAD MODULE (PPLM) 

4.4.1 Planck Telescope and FPU 

4.4.2 PSVM Units 

4.5 SERVICE MODULES (SVM) 

4.5.1 Herschel Service Module 

4.5.2 Planck Service Module 

4.5.3 SVMs Subsystems 

4.6 OPERATING MODES 

4.6.1 Launch 

4.6.2 Herschel 

4.6.3 Planck 

5 INTERFACE WITH INSTRUMENTS 


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5.1 IDENTIFICATION AND LABELLING 

5.1.1 Project code 

5.1.2 Unit identification code 

5.1.3 Connector identification 

5.2 COORDINATE SYSTEM 

5.2.1 Spacecraft's Coordinate system 

5.2.2 Instrument unit co-ordinate system 

5.3 LOCATION AND ALIGNMENT 

5.3.1 Instrument location 

5.3.2 Instrument alignment 

5.4 EXTERNAL CONFIGURATION DRAWINGS 

5.5 SIZES AND MASS PROPERTIES 

5.5.1 Mass tolerances 

5.5.2 Centre of Gravity Location and Tolerances 

5.5.3 Moments of Inertia and Tolerances 

5.5.4 Overall Instrument Mass Allocation 

5.6 MECHANICAL INTERFACES 

5.6.1 Herschel Payload Module 

5.6.2 Planck Payload Module 

5.6.3 Service Modules 

5.7 THERMAL INTERFACES 




5.7.4 Temperature monitoring 

5.8 OPTICAL INTERFACES 

5.8.1 Herschel Instruments 

5.8.2 Planck Instruments 

5.9 POWER 

5.9.1 Thermal dissipation on Herschel Payload Module 

5.9.2 Thermal dissipation on Planck Payload Module 

5.9.3 Thermal dissipation on Herschel Service Module 

5.9.4 Thermal dissipation on Planck Service Module 

5.9.5 Power Supply - Load on main-bus

IID-A 


DATE : 12/02/2004 

5.10 CONNECTORS, HARNESS, GROUNDING, BONDING 

5.10.1Connectors 

5.10.2Harness 

5.10.3Grounding and Isolation 

5.10.4Bonding 

5.11 DATA HANDLING 

5.11.1Telemetry 

5.11.2SSR Mass Memory 

5.11.3Timing 

5.11.4Telecommands 

5.11.5.Polling Strategy 

5.11.6Special signals 

5.11.7Interface circuits 

5.11.8Application Process Identifiers 

5.11.9. Observation Identifiers 

5.11.10. Addresses on 1553 bus 

5.12 ATTITUDE AND ORBIT CONTROL/POINTING 

5.12.1Terminology 

5.12.2Herschel Pointing Requirements 

5.12.3Planck Pointing Requirements 

5.12.4Herschel Scientific Pointing modes 

5.12.5Calibration 

5.12.6On-Target Flag 

5.12.7Planck Reference Star Pulse 

5.12.8Herschel Slews 

5.12.9Planck Slews 

5.12.10. Attitude constraints 

5.13 ON-BOARD HARDWARE/SOFTWARE AND AUTONOMY 

FUNCTIONS 

5.13.1On-board hardware 

5.13.2On-board software 

5.14 EMC 

5.14.1Electrical Interfaces 

5.14.2Harness, Connectors and Shielding 

ISSUE : 3.1 PAGE : vi

IID-A 

5.14.3EMC Performance Requirements 

5.14.4Conducted Emission/Susceptibility 

5.14.5Radiated Emission/Susceptibility 

5.14.6Frequency Plan 

5.14.7. Plug-in and Inrush current 

5.15 INSTRUMENT HANDLING 

5.15.1Transport container 

5.15.2Cleanliness 

5.15.3Physical handling 

5.15.4Purging 

5.15.5Mechanism positions 

5.16. Environment requirements 

5.16.1. Pressure environment 

5.16.2. Radiation environment 

5.16.3. Micrometeorite environment 

5.16.4 Displacements in Planck PPLM 

6 GROUND SUPPORT EQUIPMENT 

6.1 Mechanical Ground Support Equipment 

6.2 Electrical Ground Support Equipment 

6.3 Commonality 

6.3.1 EGSE 

6.3.2 Instrument Control and Data Handling 

6.3.3 Other Areas 


DATE : 12/02/2004 

7 INTEGRATION, TESTING AND OPERATIONS 

7.1 AIV Sequence Overview 

7.1.1. Herschel/Planck Satellites Model Philosophy 

7.1.2. Herschel AIV Sequence Overview 

7.1.3. Planck AIV Sequence Overview 

7.1.4. Satellite Test Plans - Summary 

7.2 Integration 

7.2.1 FPLM Integration 

7.2.2 PPLM Integration 

ISSUE : 3.1 PAGE : vii

IID-A 

7.2.3 FSVM Integration 

7.2.4 PSVM Integration 

7.2.5 Herschel S/C PFM Integration 

7.2.6 Planck S/C Integration 

7.3 Herschel Testing 

7.3.1 Herschel PLM CQM Testing 

7.3.2 Herschel S/C CQM Testing 

7.3.3 Herschel PLM PFM Testing 

7.3.4 Herschel S/C PFM Testing 

7.4 Planck testing 

7.4.1 Planck PLM CQM Testing 

7.4.2 Planck S/C CQM Testing 

7.4.3 Planck PLM PFM Testing 

7.4.4 Planck S/C PFM Testing 

7.5 Operations 


8 PRODUCT ASSURANCE 

9 DEVELOPMENT and VERIFICATION 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE : viii 

9.1 General 

9.1.1 Definitions 

9.1.2 Documentation 

9.2 Model Philosophy 

9.2.1 Spacecraft Models 

9.2.2 Deliverable Instrument Models 

9.3 Deliverable Instrument Test Plan 

9.3.1 Instrument Verification 

9.3.2 Instrument Scientific Performance Validation 

9.4 Design and Analysis Requirements 

9.4.1 Mechanical Design and Analysis 

9.4.2 Thermal Verification Requirements 

9.4.3 Mechanism Verification Requirements 

9.4.4 Electrical and Software Verification Requirements

IID-A 

9.4.5 Radiation Environment Verification 

9.5 Verification and Testing 

9.5.1 General Test Requirements 

9.5.2 Test Level Tolerances 

9.5.3 Mechanical Verification and Testing 

9.5.4 Thermal Verification and Testing 

9.5.5 Mechanism Verification and Testing 

9.5.6 EMC Verification and Testing 

9.5.7 Qualification to the Radiation Environment 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE : ix 

10 MANAGEMENT, PROGRAMME, SCHEDULE 

10.1 General 

10.2 Management 

10.2.1ESA Responsibilities 

10.2.2ESA Organisation 

10.2.3. Prime contractor Responsibilities 

10.2.4. Prime contractor Organisation related to instrument 

interfaces 

10.2.5Principal Investigator Responsibilities 

10.2.6Instrument Team Organisation 

10.2.7Formal Communication 

10.2.8Financing 

10.3 Project Control 

10.3.1Project Control Objectives 

10.3.2Project Breakdown Structures 

10.4 Schedule Control 

10.4.1Baseline Master Schedule 

10.4.2Schedule Monitoring 

10.4.3Schedule Reporting 

10.5 Configuration Management 

10.5.1Objectives 

10.5.2Responsibilities 

10.5.3Configuration Identification 

10.6 Configuration Control

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10.6.1Instrument Internal Configuration Control 

10.6.2IID Configuration Control 

10.7 Configuration Status Accounting 

10.8 Reviews and reporting 

10.8.1General 

10.8.2Instrument Reviews 

10.9 Instrument Progress Meetings 

10.10 Reporting 

10.11 Deliverable Items 

10.11.1 Mathematical Models 

10.11.2 Instrument Models 

10.12 Review Data Packages 

10.13 Baseline schedule 

10.13.1 Overall Herschel/Planck Baseline Schedule 

10.13.2 Baseline Schedule of Deliverables 

Annex 1 Herschel Alignment Plan 

Annex 2 Planck Scanning Strategy (from SRS) 

Annex 3 Planck Alignment Plan 

Annex 4 Herschel Pointing Modes (from SRS) 

Annex 5: Interface control drawings SVM 

Annex 6: Interface control drawings Herschel PLM 

Annex 7: Interface control drawings Planck PLM 

Annex 8 Herschel Cryoharness Interfaces. 

Annex 9: System ICD 

Annex 10: WIH ICD 

Annex 11: Herschel telescope mechanical & optical ICD’s

1 INTRODUCTION 

IID-A SECTION 1 


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The purpose of the Instrument Interface Documents (IID’s) is to define and control the overall interface 

between each of the Herschel/Planck scientific instruments and the Herschel/Planck spacecraft. 

The IID’s consist of two parts, IID-A and IID-B. There is one part A, covering the interfaces to all 

Herschel and Planck instruments, and one IID-B per instrument: 

The IID-A describes the implementation of the instrument requirements in the design of the spacecraft 

and will be a result of the spacecraft design activities performed by the Contractor. 

Each IID-B defines in its ‘interface’ section (chapter 5) the requirements of the instrument and the 

resources to be provided by the spacecraft. In its ‘performance’ section (last section of chapter 4) it 

defines the scientific performance requirements of the instrument as part of the scientific mission 

requirements and as agreed between the Principal Investigators and ESA. 

After issue 2/0 by ESA the Contractor will be responsible for maintenance and configuration control of 

the IID’s in agreement with, and after approval by, the Instruments Principal Investigators and ESA. 

In case of conflict between the contents of the IID-A and the IID-Bs, the agreement or definition in the 

IID-B shall take precedence. 

The IID’s will not cover any of the interfaces of the Instrument Control Centres (ICC’s for Herschel), the 

Data Processing Centres (DPC’s for Planck) or the Herschel Science Centre (HSC).

IID-A Section 2 

2 APPLICABLE/REFERENCE DOCUMENTS 

2.1 APPLICABLE DOCUMENTS 

Reference : SCI-PT-IIDA-04624 

Date : 12/02/2004 

Issue : 3.1 PAGE : 2-1/9 

These documents contain requirements, specifications and rules imposed on the project in addition to 

the contents of the present document. 

type Ref. title ref Issue Date 

IID 

AD 1-1 IID-B SPIRE SCI-PT-IIDB-02124 3.11 07/01/2004 

AD 1-2 IID-B HIFI SCI-PT-IIDB-02125 3.1 13/01/2004 

AD 1-3 IID-B PACS SCI-PT-IIDB-02126 3.1 20/01/2004 

AD 1-4 IID-B HFI SCI-PT-IIDB-04141 3.0 03/10/2003 

AD 1-5 IID-B LFI SCI-PT-IIDB-04142 3.0 TBI 

AD 1-6 Sorption Cooler ICD (Annex to LFI IID-B) 3.0 TBI 

ESA ITT Documents 

Additional 

AD2 Product Assurance Requirements for 

Herschel/Planck Scientific Instruments 

AD3 OIRD - Herschel-Planck Operations 

Interface Requirements Document - 

AD4-1 SIRD-Herschel Science-operations 

Implementation Requirements 

Document 

AD4-2 SIRD - Planck Science-operations 

Implementation Requirements 

Document 

AD5 Herschel/Planck Packet Structure 

Interface Control Document - PSICD 

SCI-PT-RQ-04410 2.0 01/08/00 

SCI-PT-RS-07360 2.2 31/09/03 

SCI-PT-03646 1.2 17/03/03 

SCI-PT-08584 1.2 17/02/03 

SCI-PT-ICD-07527 4.0 02/04/03 

AD6-1 Herschel telescope Specification SCI-PT-RS 04671 6.0 22/10/02 

AD6-2 Planck telescope Specification H-P-3-ASPI-SP-0004 2.0 04/02/03 

AD7-1 Herschel Alignment Concept HP-2-ASED-TN-0002 2.0 17/06/02 

AD7-2 Planck Alignment Plan H-P-3-ASPI-PL-0078_2_0 2.0 26/06/02 

AD8 Software standard (*) ECSS E 40 B draft 28/07/00 

AD9 Naming convention specification H-P-1-ASPI-SP-0141 2.0 8/09/02 

AD10_1 CSG Safety regulation Vol 1-General 

Rules. 

AD10_2 CSG Safety regulation Vol 2 Part 1 - 

Specific rules Ground installations 

CSG-RS-10A-CN 5_3 03/06/02 

CSG-RS-21A-CN 5_3 02/12/02



Date : 12/02/2004 

Issue : 3.1 PAGE : 2-2/9 


AD10_3 - CSG Safety regulation Vol 2 Part 2 - 

Specific rules Spacecraft 

CSG-RS-22A-CN 5_4 2/12/02 

AD11 SCOS-2000 Import ICD s2k-mcs-icd-0001-tos-gci 5.1 26/10/01 

Rem: for software standard AD8, PSS05 can also be used. 

2.2 REFERENCE DOCUMENTS 

These documents contain additional or background information 


Requirements / Specifications 

RD1 General Design & Interface Requirements H-P-1-ASPI-SP-0027 4.2 25/11/03 

RD2 Environment & Tests Requirements H-P-1-ASPI-SP-0030 4.2 08/12/03 

RD3 EGSE Interfaces Requirements 

Specification 

H-P-1-ASPI-IS-0121 4.0 08/04/03 

RD4 Safety requirements for subcontractors H-P-1-ASPI-SP-0029 2.1 26/04/02 

RD5 EMC Specification H-P-1-ASPI-SP-0037 3.1 22/11/02 

RD6 System Operational and FDIR 

Requirements 

H-P-1-ASPI-SP-0209 4.3 27/11/03 

RD7 Cleanliness Requirements Specification H-P-1-ASPI-SP-0035 2.2 26/09/03 

RD8 EGSE General Requirements 

Specification 

RD9 Telescope optical & RF system 

specification 

H-P-1-ASPI-SP-0045 3.0 10/06/02 

H-P-3-ASPI-SP-0274 1.0 01/07/02 

RD10 H-PLM Electrical ICD PFM HP-2-ASED-IC-0001 1.0 15/05/02 

RD11 H-PLM Electrical ICD EQM HP-2-ASED-IC-0004 1.0 15/05/02 

Plans (incl. Tree) 

RD21 Contamination control plan H-P-1-ASPI-PL-0253 1.0 15/06/02 

RD22 EMC/ESD control plan H-P-1-ASPI-PL-0038 3.0 27/05/02 

RD23 PLM EMC Control & Verification Plan HP-2-ASED-PL-0013 2.0 04/11/02 

RD24 Herschel System alignment plan H-P-2-ASPI-PL-0276 1.0 26/06/02 

RD25 HP design & development Plan H-P-1-ASPI-PL-0009 2.1 01/10/02 

RD26 Planck AIT Plan H-P-3-ASPI-PL-0208 1.1 29/11/02 

RD27 Planck RF Verification Control for Planck 

Telescope 

H-P-3-ASPI-PL-0137 2.0 25/06/02 

RD28 Herschel PLM/EQM AIT Plan HP-2-ASED-PL-0022 1.0 12/03/02 

RD29 Herschel AIT Plan - Part 2 EPLM & S/C- 

PFM Acceptance Phase 

HP-2-ASED-PL-0026 1.0 30/05/02



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RD30 Herschel Instrument testing on PLM EQM 

level 

RD31 Herschel Instrument Testing on PLM PFM 

and Satellite level 

HP-2-ASED-PL-0021 2.0 06/06/03 

HP-2-ASED-PL-0031 1.0 30/06/02 

RD32 Satellite AIT Software Management Plan H-P-1-ASP-PL-0420 2.0 15/04/03 

Design descriptions / reports / drawings 

RD41 System Design Report (PDR) H-P-1-ASPI-RP-0312 1.0 01/07/02 

RD42 Herschel grounding diagram H-P-2-ASPI-TN-0199 1.0 25/06/02 

RD43 Herschel PLM Grounding Scheme HP-2-ASED-DW-0001 1.0 22/04/02 

RD44 Planck grounding diagram H-P-3-ASPI-TN-0200 1.0 14/06/02 

RD45 H/P frequency plan H-P-1-ASPI-PL-0201 1.0 03/05/02 

RD46 SVM Design Report H-P-RP-AI-0005 2.0 28/06/02 

RD47 PPLM Design Report H-P-3-ASPI-RP-0313 1.0 01/07/02 

RD48 H-EPLM Design Description HP-2-ASED-RP-0003 2.0 14/06/02 

RD49 EQM Design Description HP-2-ASED-RP-0028 1.1 17/06/02 

RD50 Cleanliness Team Report H-P-1-ASPI-RP-0314 1.1 08/11/02 

Operations 

RD61 Operation Concept H-P-1-ASPI-TD-0263 1.0 15/06/02 

Analyses & technical notes 

RD71 (System) Thermal analysis report H-P-1-ASPI-RP-0266 1.0 27/06/02 

RD72 Herschel/Planck EMC analyses H-P-1-ASPI-AN-0202 1.0 03/05/02 

RD73 ESD analyses H-P-1-ASPI-AN-0268 1.0 21/06/02 

RD74 Time adjustment H-P-1-ASPI-TN-0153 1.0 28/11/01 

RD75 Instruments Data Rates Allocation H-P-1-ASPI-TN-0204 2.0 25/06/02 

RD76 SVM Thermal analyses report H-P-TN-AI-0005 2.0 14/06/02 

RD77 SVM TCS Thermal analysis report H-P-TN-AI-0040 1.0 13/11/02 

RD78 PPLM Thermal analyses H-P-3-ASPI-AN-0330 1.0 01/07/02 

RD79 RFDM modelling & analyses H-P-3-ASPI-AN-0324 1.0 19/06/02 

RD80 EMC Analysis (HPLM Internal RS test 

option) 

HP-2-ASED-AN-0001 1.0 22/04/02 

RD81 H-PLM Thermal model & Analysis PFM HP-2-ASED-RP-0011 3.0 9/09/03 

RD82 H-PLM Thermal model & Analysis EQM HP-2-ASED-TN-0041 2.0 10/06/02 

RD83 HPLM Straylight Calculation Results HP-2-ASED-TN-0023 2.0 21/10/02 

RD84 PPLM RF Analysis H-P-3-ASPI-AN-0323 1.0 01/07/02



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RD85 PPLM Optical Analysis H-P-3-ASPI-AN-0331 1.0 28/06/02 

RD86 CAD Data Exchange rules H-P-1-ASPI-TN-0211 1.0 30/01/02 

RD87 Mechanical Mathematical Model 

Specification 

RD88 Reduced Thermal Models requirements 

for Coupled Load Analysis 

H-P-1-ASPI-SP-0014 1.0 07/06/01 

H-P-1-ASP-SP-0515 1.0 30/04/03 

RD89 End of Life Cleanliness Analysis H-P-1-ASP-AN-0269 3.0 26/11/03 

Management 

RD91 Organisation of the Herschel-Planck 

Instrument interface management 

H-P-1-ASPI-RP-0122 1.4 30/11/03 

Note: Most of the industry reference documents are available on the instrument ftp site 

ftp://ftp.hp-instruments.as-b2b.com/industry_to_instruments/IID’s/IID-A/Applicable and Reference 

documents/

2.3 LIST OF ACRONYMS 



Date : 12/02/2004 

Issue : 3.1 PAGE : 2-5/9 

ABCL As-Built Configuration List 

ACC Attitude Control computer 

ACMS Attitude Control and Measurement Subsystem 

AD Applicable Document 

AIV Assembly, Integration and Verification 

ALS Alenia Spazio 

APE Absolute Pointing Error 

ARE Absolute Rate Error 

ASED Astrium Space Earth Division 

ASP Alcatel SPace 

AVM Avionics Verification Model 

BEM Front End Modumes (LFI) 

BEU Back End Unit (LFI) 

BOLC Bolometer Control (PACS Photometer) 

CCB Configuration Control Board 

CCE Central Check-out Equipment 

CCS Central Check-out System 

CCU Cryostat Control Unit (Herschel PLM control electronics) 

CDMS Command and Data Management Subsystem 

CDMU Central Data Management Unit 

CE Conducted Emission 

CIDL Configuration Item Data List 

CoG Centre of Gravity 

Co-I Co-Investigator 

CQM Cryogenic Qualification Model 

CS Conducted Susceptibility 

CVV Cryostat Vacuum Vessel 

DC Direct Current 

DAE Data Acquisition Electronics (LFI) 

DCE Dilution Cooler Electronics (HFI) 

DCPU Dilution Cooler Pneumatic Unit 

DCCU Dilution Cooler Control Unit 

DCU Detector Control Unit (SPIRE) 

DDVP Design, Development and Verification Plan 

DECMEC DEtector (photometer) control / MEchanisms Control (PACS) 

DPC Data Processing Centre 

DPOP Daily Prime Operational Period 

DPU (Data (or Digital) processing Unit 

DTCP Daily Tele-Communication Period 

DSPG Distributed Single Point Grounding 

ECR Engineering Change Request 

EGSE Electrical Ground Support Equipment 

EM Engineering Model 

EMC Electro-Magnetic Compatibility 

EMI Electro-Magnetic Interference 

EQM Engineering-Qualification Model 

ESA European Space Agency 

ESD Electro Static Discharge 

ESOC European Space Operations Centre 

ESTEC European Space Research and Technology Centre



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FCS Flight Control System 

FDIR Failure Detection Isolation and Recovery 

FCU Focal Plane Control Unit (SPIRE) 

FEU Front End Unit (LFI) 

FEM Front End Modules (LFI) 

FHFCU Herschel HIFI Focal Plane Control Unit 

FHFPU Herschel HIFI Focal Plane Unit 

FHIFH Herschel HIFI IF up-converter Horizontal 

FHIFV Herschel HIFI IF up-converter Vertical 

FHHRH Herschel HIFI HRS ACS Horizontal polarisation 

FHHRV Herschel HIFI HRS ACS Vertical polarisation 

FHICU Herschel HIFI Instrument Control Unit 

FHLCU Herschel HIFI Local Oscillator Control 

FHLOR Herschel HIFI Local Oscillator Radiator 

FHLOU Herschel HIFI Local Oscillator Unit 

FHLSU Herschel HIFI Local Oscillator Source Unit 

FHWEH Herschel HIFI WBS Electronics for Horizontal Polarisation 

FHWEV Herschel HIFI WBS Electronic for Vertical Polarisation 

FHWOH Herschel HIFI WBS Optic for Horizontal Polarisation 

FHWOV Herschel HIFI WBS Optic for Vertical Polarisation 

FMECA Failure-Modes, Effects and Criticality Analysis 

FOV Field Of View 

FPBOLA Herschel PACS Bolometer Buffer Amplifier 

FPBOLC Herschel PACS Bolometer Cooler Control unit 

FPDECMEC Herschel PACS Detector & Mechanism Control (DEC/MEC) 

FPDPU Herschel PACS Data Processing Unit 

FPFPU Herschel PACS Focal Plane Unit 

FPSPU1 Herschel PACS Signal processing unit Nominal 

FPSPU2 Herschel PACS Signal processing unit Redundant 

FPU Focal Plane Unit 

FS Flight Spare 

GSE Ground Support Equipment 

He I Normal Fluid Helium 

He II Helium II (Superfluid Helium) 

He3 Helium 3 (Isotope used in HFI dilution cooler) 

He4 Helium 4 (natural isotope of Helium) 

HFI High Frequency Instrument (Planck) 

HIFI Heterodyne Instrument for the Far Infrared 

HK House Keeping 

HOB Herschel Optical Bench 

HPLM Herschel Payload Module 

HRS Herschel HIFI High Resolution Spectrometer 

HSC Herschel Science Centre 

HSDCU Herschel SPIRE Detector Control unit 

HSDPU Herschel SPIRE Digital Processing Unit 

HSEC Herschel Science Evaluation Committee 

HSFCU Herschel SPIRE Focal Plane Control unit 

HSFPU Herschel SPIRE Focal Plane Unit 

HSJFP Herschel SPIRE JFET (Spectrometer) 

HSJFS Herschel SPIRE JFET (Photometer) 

HSVM Herschel Service Module 

IAR Instrument Acceptance Review 

IBDR Instrument Baseline Design Review 

IHDR Instrument Hardware Design Review 

ICC Instrument Control Centre



Date : 12/02/2004 

Issue : 3.1 PAGE : 2-7/9 

ICD Interface Control Document 

ICDR Instrument Critical Design Review 

IFAR Instrument Flight Acceptance Review 

IID Instrument Interface Document 

IIDR Instrument Intermediate Design Review 

ILT Instrument Level Test 

IST Integrated Satellite Test 

ISVR Instrument Science Verification Review 

ITT Invitation To Tender 

JFET Junction Field Effect Transistor, Preampli (SPIRE, HFI) 

LCL Latch Current Limiter 

JFET Junction Field Effect Transistor 

LEOP Launch and Early Orbit Phase 

LISN Line Impedance Stabilisation Network 

LO Local Oscillator (HIFI) 

LOU Local Oscillator (HIFI) 

LoS Line Of Sight 

LOU Local Oscillator Unit (HIFI) 

LVDE Low Vibration Drive Electronics 

MGSE Mechanical Ground Support Equipment 

MLI Multilayer Insulation 

MOC Mission Operations Centre 

MoI Moment of Inertia 

MOS Margin Of Safety 

MPS Mission Planning Subsystem 

NCR Non Conformance Report 

OIRD Operations Interface Requirements Document 

OP Observation Period 

PACE Sorption cooler Pipes Assembly & Cold End 

PACS Photodetector Array Camera and Spectrometer 

PCS Power Control Subsystem 

PCDU Power Control & Distribution Unit 

PDE Pointing Drift Error 

PFM Proto Flight Model 

PHA Planck HFI Focal Plane Unit (FPU) 

PHBA-N Planck HFI Data Processing Unit (DPU) Nominal 

PHBA-N Planck HFI Data Processing Unit (DPU) Redundant 

PHCA Planck HFI JFET Box 

PHCBA Planck HFI Pre-Amplifier Unit (PAU) 

PHCBC Planck HFI Readout Electronics Unit (REU) 

PHDA Planck HFI 4K Cooler Compressor Unit (CCU) 

PHDB Planck HFI 4K Cooler Ancillary Unit (CAU) 

PHDC Planck HFI 4K Cooler Electronics Unit (4K-CDE) 

PHDD Planck HFI 4K Cooler Cold End (CCE) 

PHDJ Planck HFI 4K Cooler Current Regulator (CCR) 

PHEAAA Planck HFI 0.1K Dilution Cooler 3He Tank (D3T) 

PHEAAB Planck HFI 0.1K Dilution Cooler 4He Tank (D4T) #1 

PHEAAC Planck HFI 0.1K Dilution Cooler 4He Tank (D4T) #2 

PHEAAD Planck HFI 0.1K Dilution Cooler 4He Tank (D4T) #3 

PHEB Planck HFI 0.1K Dilution Cooler Control Unit (0.1K-DCCU) 

PI Principal Investigator 

PL4K Planck LFI 4K Reference load (Mounted on HFI) 

PLA10 Planck LFI Heat switch 

PLBEU Planck LFI DAE Back End Unit (BEU) 

PLCB Planck LFI DAE Power Box



Date : 12/02/2004 

PLFEU Planck LFI Front End Unit (FEU) 

PLM Payload Module 

PLREN Planck LFI REBA Nominal 

PLRER Planck LFI REBA Redundant 

PLWG Planck LFI Wave Guides (WG) 

PM Project Manager 

PPLM Planck Payload Module 

PSEC Plank Science Evaluation Committee 

PSF Point Spread Function 

PSVM Planck Service Module 

PT Product Tree 

QLA Quick Look Analysis (software) 

RAA Radiometer Array Assembly (LFI) 

RAM Random Access Memory 

RCS Reaction Control Subsystem 

RD Reference Document 

RE Radiated Emission 

REBA Radiometer Electric Box Assembly (LFI) 

REU REad-out Electronics (HFI) 

RF Radio Frequency 

RFW Request for Waiver 

RH Reference Hole 

RPE Relative Pointing Error 

RTA Real Time Assessment (software) 

RS Radiated Susceptibility 

S/C Spacecraft 

SCC Sorption cooler compressor 

SCCE Sorption Cooler Cold End 

SCE Sorption Cooler Electronics 

SCS Sorption Cooler Subsystem 

SCOS Spacecraft Control and Operations System 

SCP Sorption Cooler Pipes 

SFT Short Functional Test 

SIN Straylight Induced Noise 

SIRD Science Implementation Requirements Document 

SIST Short Integrated Satellite Test 

SLE Standard Laboratory Equipment 

SPIRE Spectral and Photometric Imaging Receiver 

SPU Signal processing Unit (PACS) 

SRPE Spatial Relative Pointing Error 

SSR Solid State Recorder 

SST Stainless Steel 

STM Structural/Thermal Model 

STMM Simplified Thermal Model 

SVM Service Module 

TBC To be confirmed 

TBD To be determined 

TCS Thermal Control System 

TM Telemetry 

TMM Thermal Mathematical Model 

TMU Thermo Mechanical Unit (Sorption cooler) 

TT&C Telemetry, Tracking and Command 

TTC Telemetry, Tracking and Command 

VSWR Voltage Standing Wave Ratio 

WBS Work Breakdown Structure 

Issue : 3.1 PAGE : 2-8/9


WBS Herschel HIFI Wide Band Spectrometer 

WFE Wave Front Error 

WU Warm Units 


Date : 12/02/2004 

Issue : 3.1 PAGE : 2-9/9


Date : 12/02/2004 

IID-A Section 3 Issue : 3.1 PAGE :3-1/4 

3 KEY PERSONNEL AND RESPONSIBILITIES 

3.1 ESA PERSONNEL 

Address 

ESTEC PO Box 299 

2200 AG Noordwijk 

The Netherlands 

Switchboard +31 71 565 6555 

project fax +31 71 565 5244 

Secretary phone number +31 71 565 3473 

project mail herschel.planck@esa.int 

generic e.mail FirstName.FamilyName@esa.int 

NAME RESPONSIBILITY TELEPHONE 

FAX 

Thomas. Paßvogel Herschel-Planck Project 

Manager 

Gerald Crone Herschel-Planck Payload 

Manager 

Astrid. Heske Herschel PACS and Planck 

Sorption cooler payload engineer 

Carsten Scharmberg Herschel HIFI & SPIRE payload 

engineer 

Javier Marti-Canales Planck HFI & LFI Payload 

engineer 

EMAIL 

Tel: 

+31-(0)71-565 5962 

Fax: 

+31-(0)71-565 5244 

Email: Thomas.passvogel@esa.int 

Tel: 

+31-(0)71-565 3934 

Mobile: 

Fax: 

+31-(0)71-5655244 

Email: Gerald.Crone@esa.int 

Tel: 

+31-(0)71-565 5467 

Fax:: 

+31-(0)71-565 5244 

Email: Astrid.Heske@esa.int 

Tel: 

+31-(0)71-565 5786 

Fax:: 

+31-(0)71-565 5244 

Email: Carsten.Scharmberg@esa.int 

Tel: 

+31-(0)71-565 4532 

Fax:: 

+31-(0)71-565 5244 

Email: Javier.marti.canales@esa.int

3.2 CONTRACTOR PERSONNEL 

3.2.1 Alcatel 

Prime contractor. 

Address: 

Alcatel Space Industries 

100, Bd du Midi, BP 99, 

06156 Cannes La Bocca Cedex 

France 


Date : 12/02/2004 


Switchboard +33 04 92 92 70 00 

Project fax +33 04 92 92 30 10 

Secretary phone number +33 04 92 92 30 85 

Project e-mail address Herschel.Planck@space.alcatel.fr 

generic e.mail FirstName.FamilyName@space.alcatel.fr 


FAX 

EMAIL 

Jean-Jacques Juillet Project Manager Tel:+33 49292 3423 

Fax:+33492923010 

Email:jeanjacques.juillet@space.alcatel.fr 

Bernard Collaudin Instrument Interface Manager Tel:+33 4 9292 3021 

Fax:+33 4 9292 3010 

Email:bernard.Collaudin@space.alcate 

l.fr 

Jean-Philippe 

Chambelland 

Planck Instrument engineer Tel:+33 4 9292 7448 

Fax:+33 4 9292 3010 

Email:jeanphilippe.chambelland@space.alcatel.fr 

Guy Doubrovick Herschel Instrument engineer Tel:+33 4 9292 6927 

Fax:+33 4 9292 3010 

Email:guy.doubrovik@space.alcatel.fr

3.2.2 Astrium 

Herschel PLM and Herschel AIT contractor 

Address: 

• ASTRIUM GmbH 

• 88039 Friedrichshafen 

• GERMANY 


Date : 12/02/2004 


Switchboard +49 7545 80 

project fax +49 7545 8 42 43 

Secretary phone number +49 7545 8 42 40 

project mail Herschel.Project.ED@astrium.eads.net 

generic e.mail FirstName.FamilyName@astrium.eads.net 


FAX 

EMAIL 

Wolfgang Ruehe Herschel PLM Project Manager Tel: +49 7545 8 3058 

Fax: +49 7545 8 42 43 

Email: 

Wolfgang.Ruehe@astrium.eads.net 

Juerhen Kroeker Payload Engineering Manager & 

Telescope I/F Engineer 

Siegmund Idler HIFI FPU engineer 

+ ASED Instruments Interface 

coordination 

Tel: +49 7545 8 3 9984 

Fax: +49 7545 8 42 43 

Email: 

Juergen.kreoker@astrium.eads.net 

Tel: +49 7545 8 4671 

Fax: +49 7545 8 42 43 

Email: 

Siegmund.Idler@astrium.eads.net 

Horst Faas SPIRE FPU engineer Tel: +49 7545 8 3990 

Fax: +49 7545 8 42 43 

Email: Horst.Faas@astrium.eads.net 

Dietmar Schink PACS FPU engineer Tel: +49 7545 8 9414 

Fax: +49 7545 8 42 43 

Email: 

Dietmar.Schink@astrium.eads.net

3.2.3 : Alenia 

SVM contractor 

Address: 

ALENIA SPAZIO 

Strada Antica di Collegno, 253 

10146 Torino 

ITALY 


Date : 12/02/2004 


Switchboard +39 01171801 

project fax +39 0117180637 

Secretary phone number +39 0117180581 

project mail 

generic e.mail [1st Letter of FirstName][up to 7 first Letters of FamilyName]@to.alespazio.it 


FAX 

EMAIL 

Paolo Musi SVM Project Manager Tel: +39 011 7180 916 

Fax: +39 0117180 637 

Email:pmusi@to.alespazio.it 

Marco Sias SVM System Engineer Tel: +39 011 7180 697 

Fax: +39 0117180 637 

Email:msias@to.alespazio.it 

Marco Cesa Instrument engineer Tel: +39 011 7180 934 (alenia) 

Tel: +39 011 440 5708 (sofiter) 

Fax: +39 0117180 637 (alenia) 

Email: marco.cesa@sofiter.it

4 SATELLITE DESCRIPTION 



Date : 12/02/2004 

Issue : 3.1 PAGE : 4-1/29 

This chapter contains descriptive information and background data necessary to fully and mutually 

understand the interface constraints imposed by spacecraft. It is not to be considered as containing any 

requirement, nor to imply any particular interpretation or meaning other than the one explicitly stated in 

the other chapters of this document and is therefore not applicable in contractual sense. 

4.1 INTRODUCTION 

The Herschel/Planck programme combines two missions of the ESA Horizon 2000 Science Programme 

within one project. 

Both missions perform astronomical investigations in the infrared, sub-millimetre and millimetre 

wavelength range: 

- Herschel Space Observatory (Herschel), formerly known as the Far InfraRed and Submillimetre 

Telescope (FIRST), is a multi user observatory type mission; 

- Planck (previously named COBRAS/SAMBA), is a Principal Investigator survey mission. 

Both missions will be carried out with their specific spacecraft, and will be operated in a similar orbit 

around the second Lagrangian point L2. The present concept is to have the two spacecraft launched on 

a single ARIANE 5 ESV-type launcher. 

For the Herschel payload, composed of three instruments and mounted in the Herschel Payload module 

(HPLM), the Herschel spacecraft provides the environment for astronomical observations in the infrared 

wavelength range from 60 to 670 micron (480 GHz – 5 THz). 

For the Planck payload, composed of two instruments and mounted in the Planck Payload Module 

(PPLM), the Planck spacecraft provides the environment for full sky surveys in the frequency range from 

25 to 1000 GHz. 

4.2 SYSTEM DESCRIPTION 

The Herschel satellite configuration is completely modular and is made up of: 

- the Herschel Payload Module (HPLM) which comprises the 3.5 meter Herschel telescope, the 

cryostat, the Herschel focal plane units inside the cryostat and the instrument units mounted 

externally on the cryostat 

- the Herschel Service Module (HSVM) which comprises the conventional spacecraft subsystems, 

the “warm” instrument units and the sunshield. 

The Planck satellite configuration shows a lower level of modularity due to the various connections 

between the cryogenic payload module and the units mounted on the payload module. However one 

can clearly distinguish 

- the Planck Payload Module (PPLM) which comprises the Planck optical bench with the offset 

Aplanatic telescope and the two instruments focal plane unit, the SVM upper platform with the 

LFI Backend Unit and the HFI Readout Unit. The compressors of the sorption coolers, 4 K 

coolers and further cooler equipment is mounted on the PSVM radiator. 

- the Planck Service Module (PSVM) which comprises, aside the conventional spacecraft 

subsystems and the “warm” instrument units and the solar array. 

Figure 4.3.1-1 through figure 4.3.1-4 show the general configurations of the Herschel and Planck 

satellites in the dual launch configuration.



Date : 12/02/2004 

Issue : 3.1 PAGE : 4-2/29 

The selected satellite operational orbits are different Lissajous orbits around the second Lagrangian 

Libration Point (L2) in the Earth/Moon - Sun system. This point lies approximately on the Earth-Sun line 

at 1.5 × 106 km from the Earth in anti-Sun direction. Planck, due to stringent requirements on 

straylight, will be injected into a Lissajous orbit with a maximum sun-s/c-earth angle of 10°. Herschel 

will be sent into a larger Lissajous orbit. 

Herschel will have a nominal lifetime of 3.5yrs from launch until end of mission, where the duration 

includes a maximum of 6 months for transfer to the operational orbit around L2. Planck will have a 

lifetime which allows to carry out two full sky surveys (at least 95% of the whole sky) in the operational 

orbit around L2., plus a maximum of 6 months for the transfer to the operational orbit. 

The prime ground station is the 35 m station at Perth. The Kourou station may be used as emergency 

station. During normal operations the prime ground station will receive the spacecraft telemetry and uplink 

the telecommands during a period of 3 hours per day for each spacecraft (the Daily 

Telecommunications Period, DTCP). 

Two different operation scenarios are foreseen: 

- During the Herschel observation period of 21 hours per day the spacecraft will collect scientific 

data which will be stored in an on-board mass memory for transmission towards the ground 

station during the subsequent telecommunications phase. “Limited” scientific observations could 

also be conducted during the telecommunications period. 

- For the Planck operation, the spacecraft will collect the scientific data 24 hours per day, which 

means that the observation phase will continue during the telecommunications period. 

The telecommunications period will be used for up-linking the commands for later execution and 

dumping of the stored data. 

The data acquired at the ground station(s) from both spacecraft will be routed through ESA’s 

operational communications network to the Mission Operations Centre (MOC) at ESOC for subsequent 

storing and distribution to the Herschel Science Centre (HSC) and the Instrument Control Centres 

(ICC’s) or to the Planck Data Processing Centres (DPC). 

Conversely, the HSC, ICC’s and DPC’s will provide the MOC with observation schedules and instrument 

information, which inputs will be used by the Mission Planning System (MPS) at the MOC to prepare the 

command sequence to be up-linked to both spacecraft.


Figure 4.2-1: Herschel satellite 


Date : 12/02/2004 

Issue : 3.1 PAGE : 4-3/29


Figure 4.2-2: Planck Satellite. 


Date : 12/02/2004 

Issue : 3.1 PAGE : 4-4/29



Date : 12/02/2004 

Issue : 3.1 PAGE : 4-5/29 

Figure 4.2-3: Herschel/Planck Satellites in stacked Launch Configuration


4.3 Herschel PAYLOAD MODULE (HPLM) 


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Issue : 3.1 PAGE : 4-6/29 

The HPLM will accommodate all cold Herschel instrument units supplied by the Principal Investigators. 

The HPLM comprises the following two major elements, described in more detail below: 

- the 3.5 m Herschel Telescope 

- the Helium Cryostat. 

The Herschel payload module configuration is shown in Figure 4.3-1 

Figure 4.3-1: Herschel Payload Module.

4.3.1 Herschel Telescope 



Date : 12/02/2004 

Issue : 3.1 PAGE : 4-7/29 

The telescope is an axi-symmetric, 3.5 m diameter Cassegrain telescope consisting of (RD 01): 

- a primary reflector 

- a secondary reflector 

- a reflector support structure (tripod, bipods etc.) 

- an interface triangle (tbc) and mechanical fixation devices to the primary reflector 

- baffles as necessary 

A telescope heating system will be included for in-orbit contamination release from optical surfaces and 

for bake-out of the telescope. 

The Sunshield, which is functionally part of the SVM, protects the telescope from direct solar radiation 

and provides a stable thermal environment, which minimise temperature variations across the 

telescope. 

The opto-mechanical dimensions of the Herschel optical system are given in Table 4.3.1-1 and the 

configuration shown in Figure 4.3-2. The position of the telescope with respect to the satellite is shown 

in Figure 4.3-3. 

Herschel Telescope Optical Axi-symmetric 3.5 m Specified tolerance or 

Parameters 

diameter Cassegrain 

telescope 

comment 

Operating wavelength 80-670 µm 

Focal length 28500 mm Tolerance 150 mm 

Entrance pupil diameter Deff 

3283 mm 

f-number f/8.68 Tolerance 0.02 

Primary vertex to best focus 1050 mm Tolerance 10 mm 

Primary vertex to fixation plane 250 mm Tolerance 1 mm 

Aperture stop on M2 

Field of View ±0.25 deg 

Area obscuration ratio (tripod + M2) 7.7% 

Overall WFE < 6 µm (rms) 

Relative spectral transmission > 0.97 BOL 

> 0.98 BOL (goal) 

> 0.95 EOL 

Non uniformity of relative 

spectral transmission 

< 0.01 

Primary reflector 

Vertex to telescope interface plane (tv) 250 mm 1mm 

Vertex to paraxial focal plane (tf) 1050.16 mm 10 mm 

Distance M1 to M2 1588 mm 

Radius of curvature 3500 mm 2 mm 

Conic constant -1 

f-number f/0.5 

(Free) diameter 3500 mm Tolerance 0, +2 mm 

Useful diameter 3470 mm 

Central hole diameter 560 mm 

Distance of best focus from mechanical 

interface 

800 mm

Herschel Telescope Optical 

Parameters 


Axi-symmetric 3.5 m 

diameter Cassegrain 

telescope 


Date : 12/02/2004 

Issue : 3.1 PAGE : 4-8/29 

Specified tolerance or 

comment 

Secondary reflector 

Radius of curvature 345.2 mm 0.4 mm 

Conic constant -1.279 

Diameter 308.1 mm Tolerance ±0.2 mm 

Scattering cone diameter 33mm Small scatter 

Image surface 

Radius of curvature - 165 mm 

Conic constant -1 

Diameter 246 mm Corresponds to 0.25 deg 

Distance from M1 -1050 mm 

Height above optical bench 202 mm Tolerance (2 sigma) for 

Telescope/PLM/Instruments 

± 7.1mm (PACS) 

± 7.7mm (SPIRE) 

± 8.5mm (HIFI) 

Table 4.3.1-1: Herschel Telescope Opto-mechanical Dimensions (at operating 

temperature) 

The central hole diameter and the position of the hexapod interface points and the M2 support structure 

dimensions will be given after the preliminary design activities.


Date : 12/02/2004 


Issue : 3.1 PAGE : 4-9/29 

Figure 4.3-2: Telescope configuration (see complete telescope ICD in annex 11)



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Issue : 3.1 PAGE : 4-10/29 

Figure 4.3-3: Herschel Telescope positions with respect of the satellite

4.3.2 Helium Cryostat 



Date : 12/02/2004 

Issue : 3.1 PAGE : 4-11/29 

The Helium Cryostat of the HPLM accommodates the Herschel focal plane units (FPU) of the three 

scientific instruments: 

- the Heterodyne Instrument for the Far Infrared (HIFI) 

- the Photodetector Array Camera and Spectrometer Instrument (PACS) 

- the Spectral and Photometric Imaging Receiver (SPIRE). 

The cryostat provides an adequate thermal environment to these focal plane units and provides the 

optical interface between the focal plane units and the telescope. 

The Helium cryostat also provides interfaces with the HSVM, the Herschel Telescope, the sunshield. 

The cryostat consists of: 

- Structural and insulation components featuring an outer vessel, a suspension system to 

minimise heat conduction from outer vessel to the cryogenically cooled elements and the 

adequate shielding and thermal insulation to minimise the heat radiation from the outer vessel 

to the cooled elements 

- A helium subsystem to provide the adequate cryogenic environment. This passive, single 

cryogen, cooling system features a main He tank, containing superfluid helium, a passive 

phase separator and the cryogenic components to operate it. It also features an additional 

helium tank designed to provide the required autonomy of the cryogenic system on the 

launcher. 

- The Herschel Optical Bench (HOB), which accommodates the instrument Focal Plane Units in 

the Focal Plane Assembly (FPA) and provides the necessary thermal and structural interfaces. 

- A cryo cover which closes the cryostat on ground and preserves the sensitive optical 

components inside the cryostat from contamination during the first days on orbit. 

The Cryostat also accommodates the following payload equipment: 

- the Local Oscillator Unit (LOU) of the HIFI, its beam injection optics and the LOU waveguides 

to the SVM 

The PLM electrical subsystem harness provides all electrical connections between all electrical equipment 

in the Payload Module and between the Focal Plane Units and the warm electronics of the payload 

instruments. 

The Helium Cryostat configuration is shown in Figure 4.3-4


Figure 4.3-4: Herschel Payload Module (to be updated 3.1) 

A schematic view of the He control subsystem is shown in Figure 4.3-5 


Date : 12/02/2004 

Issue : 3.1 PAGE : 4-12/29

S101 

SV121 

SV922 

Filling port 

V102 

T103 

L101 

A101 - A1XX 

L701 

T701, 704 

P102 

RD124 

V702 

P101 

SV123 

V104 

HTT 

T101 T102 

T105 T104 


T111 

H101 H102 

PPS111 

H103 H104 

HOT 

H701 H702 

SV921 

T112 

T702, 703 

RD724 

L102 

L702 

V103 

V106 

T106,107 

SV723 

E101 

V701 

E601 

OBA 

E201 

P701 

V105 


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Issue : 3.1 PAGE : 4-13/29 

CVV 

E421 E441 E461 

HS1 HS2 HS3 

Non-CCU components 

VG901 

VG902 

Figure 4.3-5: Schematic view of Helium Control System 

4.3.3 Herschel PLM Cryo Cover 

T503 

T501 

H502/ 

H503 

S501 

H501 

V502 

V506 

T502 

P501 

P502 

V501 

SV521 

V505 

T504 

T505 

V504 

N513 N514 

V503 

T506 

N511 N512 

Legend: 

A adsorber 

E heat exchanger 

H heater 

HS heat shield 

L liquid level probe 

N exhaust nozzle 

P pressure sensor 

PPS passive phase separator 

RD rupture disc 

S filter 

SV safety valve 

T temperature sensor 

V valve 

VG vacuum gauge 

The Herschel cryostat cover (shown in Figure 4.3-6) together with its shielding serves for following 

main cryogenic purposes. 

• Close and tighten the CVV during ground and launch operations to maintain the insulation vacuum 

• Safe single opening in orbit to provide sufficient free entrance for the telescope beam into cryostat 

• Provide an internal temperature as low as possible on ground, by a passive shielding 

• Provide a low thermal background for instrument testing on ground by active cooling 

The cryostat cover assembly consists of: 

A dome shaped aluminium part closing the CVV vacuum tight with an o-ring containing electrical and 

fluid feed throughs and supports for the inner shielding 

A cover opening mechanism supported of the CVV outside 

A thermal shield assembly consisting of piping, an active cooled plate with a heat exchanger facing the 

focal plane and a passive shielding behind it

4.3.3.1 Passive shielding 



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Issue : 3.1 PAGE : 4-14/29 

In order to minimize the heat load on ground the surface of the cover shields towards the inside (focal 

plane) should be as cold as possible and should have a low emissivity, while for instrument testing and 

calibration some kind of a black or absorbing surface finish would be preferred. A careful design of the 

fringes from the cryostat thermal shields together with the cover shield will minimize direct and reflected 

radiation from warm surfaces (CVV) to the field of view of the FPUs. The equilibrium temperature of the 

cover shield, when not cooled (this is the normal ground case) is expected to be around 240K. In this 

case most of the FPU temperature requirements for check-out/testing cannot be fulfilled. In Table 2 the 

main FPU and cryostat temperatures for different helium flow rates and scenarios on ground are 

summarized. 

Node Level Label G 

21 mg/s 

P 

60mg/s 

P 

100mg/s 

P 

1000mg/s 

P 

100mg/s 

cover 

cooled 

PI 

100mg/s 

cover 

cooled 

811 0 SPIRE SM Detector en 2,06 1,86 1,84 1,80 1,73 1,88 

819 0 SPIRE Cooler pump HS 1,82 1,75 1,75 1,74 1,72 1,91 

820 0 SPIRE Cooler evap HS 1,83 1,76 1,75 1,74 1,72 1,87 

760 0 PACS-Red Detector 1,76 1,74 1,74 1,73 1,71 1,86 

765 0 PACS-Blue Detector 1,91 1,86 1,84 1,82 1,74 1,90 

781 0 PACS-Photometer CooPu 1,78 1,76 1,75 1,75 1,72 1,94 

912 0 HIFI L0 boundary node 2,05 1,79 1,77 1,75 1,73 1,90 

803 1 SPIRE Optical Bench 14,73 10,25 9,54 8,14 4,38 4,66 

720 1 PACS-Spectrometer 7,69 6,76 6,48 6,07 4,27 4,36 

725 1 PACS-Collimator 7,69 6,76 6,48 6,08 4,27 4,36 

730 1 PACS-Photometer Optic 7,69 6,76 6,48 6,08 4,27 4,36 

913 1 HIFI L1 boundary node 7,81 5,07 4,71 4,27 4,22 4,27 

801 2 SPIRE PM JFET ENCL 22,04 7,35 6,63 5,71 5,00 5,27 

802 2 SPIRE SM JFET ENCL 21,83 7,21 6,52 5,60 4,95 5,18 

910 2 HIFI FPU Structure 21,69 7,53 6,84 5,96 5,14 5,41 

10 HTT 1,70 1,70 1,70 1,70 1,70 1,85 

376 Opt. Bench centre 21,61 7,40 6,72 5,84 5,06 5,30 

311 Instr. Shield Top 23,94 9,48 8,82 8,12 5,61 5,81 

4061 Cryostat Cover Shield 233,94 232,43 232,25 232,19 80,00 80,00 

Cases Legend: 

G GHe mass flow from HTT, Instruments off 

P GHe mass flow from HOT, Instruments off 

PI GHe mass flow from HOT, Instruments in average dissipation mode 

Temperature [K] 

Table 2: Overview of main FPU and cryostat temperatures 

Listed in Table 2 are the main instrument thermal nodes and their temperatures for several cases on 

ground: 

G: the nominal thermal equilibrium on ground achieved by pumping at the HTT and instruments 

off 

P: HTT closed with 1.7K and cooling with several mass flow rates out of the HOT, in order to 

subcool the optical bench and the thermal shields, and instruments off 

PI: helium flow from the HOT together with the cover shield cooled with LN 2 and instruments on. 

The values given in the last two columns are based on a cover shield temperature of 80K.

4.3.3.2 Active cooling 



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Issue : 3.1 PAGE : 4-15/29 

For instrument testing the cover shield (Figure 4.3-6) can be cooled with different cryogenic media as 

LNe, LHe, LN 2 . A heat exchanger at the backside of the shield is connected via thin tubes to small 

Johnston coupling devices with integrated back-flow valves flanged to the cover. 

Cryogenic (vacuum isolated) cool and vent lines have to be inserted and fixed through dedicated 

openings in the cover cavity. They will be tightened to the inside cooling loop by the squeezed 

connectors of the Johnston couplings and will open the inner backflow valves when further fed in. Prior 

to flushing with the cryogenic coolant a quick leak check (overpressure hold test) of the assembled 

piping will be performed to prevent icing. Fluid flow and hence cover shield temperature will be 

controlled by pressure and needle valves located at the supply dewar. After each cooling cycle the cover 

shield nominal temperature will be achieved by flushing with warm gas to the cooling lines are 

removed. Four temperature sensors (2 PT 1000 and 2 C100) are located at the backside of the shield 

connected to a vacuum feed through in the cover itself. 

Cryo cover outside view with cooling I/F Cryo cover heat exchanger shown without shield 

Figure 4.3-6: Design of the cryo cover (Note: mirrors missing)


4.4 Planck PAYLOAD MODULE (PPLM) 


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Issue : 3.1 PAGE : 4-16/29 

The Planck Payload Module (PPLM) will accommodate the Planck instrument units supplied by the 

Principal Investigators. The Planck instruments are split into a common Focal Plane Unit (FPU) and HFI 

JFET box that shall be located close to the FPU, mounted to the Planck Telescope Support at 50-60K 

and ambient temperature units, mounted to the SVM panels. 

The instruments elements mounted into the PPLM are directly and permanently connected to their 

counterparts in the PSVM and a clean separation is not possible. However, considering the mounting 

panels of the PSVM that carry these units as part of an extended Payload module, one can minimise the 

set of interfaces and achieve a nearly independent module. This can be integrated and tested separately 

from the rest of the spacecraft. It comprises the following major elements, described in more detail 

below: 

- The Planck Telescope and the V-groove insulation system 

- The PSVM upper Platform 

- The PSVM Radiators panels, carrying the Sorption Cooler Compressors. 

The “extended” PPLM exhibits the following external interfaces 

• Mounting interfaces to the SVM 

• Electrical interfaces between the electronic units mounted on the equipment platform and the 

corresponding units on the SVM panel. 

The extended PPLM configuration is shown in Figure 4.4-1 below.


4.4.1 Planck Telescope and FPU 

Figure 4.4-1: Planck Payload Module 


Date : 12/02/2004 

Issue : 3.1 PAGE : 4-17/29 

The Planck Telescope Support Structure is the mounting base for the common Planck instrument FPU, 

HFI JFET box and the reflectors of the telescope. 

The main parameters of the Planck telescope are given in Figure 4.4-2 below and in Table 4.4.1-1 (RD 

02).



Date : 12/02/2004 

Issue : 3.1 PAGE : 4-18/29 

Figure 4.4-2: Definition of design parameters of the Planck telescope 

Figure 4.4-3: Planck Telescope: Structure (upper) and conceptual view of PPLM including 

V-Grooves (lower)


Telescope Angle of centre of FOV (line of sight) 

with ZM1 

Field of view 

Primary mirror Surface shape 

Radius of curvature 

Circular projected aperture 1,3 

Real aperture dimensions in the rim 

plane 3 

Conic constant 

Offset distance at centre 

Secondary mirror Surface shape 

Radius of curvature 

Conic constant 

Major axis of projected contour 3 

in the YM2 direction) 

Minor axis of projected contour 3 

(in the XM2 direction) 

Aperture dimensions in the rim 

plane 3 

Relative position of 

primary and 

secondary mirrors 

Position of reference 

detector plane with 

respect to the 

secondary axis system 

M2 (see Figure 4.4.1- 

3) 

offset distance at centre 

Angle between major axes (Θ1) 

Ztop 

Zbot 

Position of centre of detector plane 

Angle between ZRDP and Zm2 (Θ2) 

1 in a plane perpendicular to the major axis of the primary ellipsoid 

2 See figure for a sketch on how to derive the secondary mirror surface 


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Issue : 3.1 PAGE : 4-19/29 

-3.751° 

± 5° 

Ellipsoid 

1,440 mm 

1,500 mm 

1555.98 mm x 1886.79 mm 

-0.869417 

1,038.85 mm 

Ellipsoid 

643.972 mm 

-0.215424 

1,018.6 mm 

780.6 mm 

1,018.6mmx1,043.23 mm 

XcM2 = -328.15 mm 

10.1° 

481.737 mm 

706.027 mm 

X = -108.42 mm Y = 0 mm 

Z = -1,026.83 mm 

-21.27° 

3 

Dimensions of apertures and contours are the optical definition. Physical dimensions of mirror shall 

take into account possible misalignments 

Table 4.4.1-1: Opto-mechanical Definition of the Planck Telescope 

In order to provide the required temperatures at the Focal Plane Unit active cooling is implemented as 

part of the instruments. The active cooling units are mounted on dedicated PSVM radiator panels, and 

need a number of interfaces to the intermediate V-groove insulation system. These interfaces are 

thermal interfaces used for pre-cooling / thermalisation of the cooler pipes, harness and wave-guides 

and serve also as mechanical interfaces. The detailed interfaces are described in the respective chapter 

below. 

4.4.2 PSVM Units 

The PSVM Upper Platform carries those ambient temperature units of the Planck instruments that are 

either required to be nearby the focal plane unit or that should not be disconnected after initial



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Issue : 3.1 PAGE : 4-20/29 

integration. Those units are the back-end unit of the LFI instrument and the Read-Out Unit of the HFI 

instrument. 

Active cooling is required for both instruments and comprises the following sets of coolers: 

- Sorption cooler (1 nominal and 1 cold redundant) for LFI cooling and HFI pre-cooling 

- 4 K mechanical cooler for HFI and pre-cooling of dilution cooler 

- HFI dilution cooler. 

The sorption cooler compressors require a maximum temperature of 270 K and need dedicated 

radiator area. SVM panels are foreseen as Radiator. 

The further units of the Planck instruments are placed mainly on other SVM panels (see Figure 4.4-1). 

4.5 SERVICE MODULES (SVM) 

Both Herschel and Planck SVM are under the responsibility of Alenia. 

A common modular architecture has been followed for the Herschel and Planck SVM. The core of the 

avionics is similar, with dedicated plug-in for specific functions (Instruments, ACMS sensors). 

4.5.1 Herschel Service Module 

The Herschel Service Module (HSVM) consists of the following elements: 

• a primary load carrying structure (Cone carrying the interface structure to Launcher on one side, 

and PLM on the other side) 

• a secondary structure carrying warm units and parts of the subsystems necessary for the Herschel 

mission (Instrument warm units, and avionics) 

(See Figure 4.5-3) 

4.5.2 Planck Service Module 

The Planck Service Module (PSVM) consists of the following elements: 

• a load carrying primary structure 

• a secondary structure carrying the units and parts of the subsystems necessary for the Planck 

mission. 

The PSVM provides the interface to the ARIANE V launcher. 

Figure 4.5-4) 

4.5.3 SVM’s Subsystems 

(see 

There are 4 major SVM subsystems (covered by a specification and a specific subcontractor):

• Structure 

• Thermal control 

• ACMS 

• Propulsion 


In addition, 4 subsystems are directly managed by the SVM contractor Alenia: 

• Power distribution (PCDU, Batteries and solar array) 

• TTC Telemetry/Tracking and Command 

• On-board Data management (ACC, CDMU computers) 

• Harness 


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The overall avionics architecture is described in the 2 following figures (Figure 4.5-1 and Figure 4.5-2). 

The part common to both spacecraft is inside the blue delimited surface.


Date : 12/02/2004 


Issue : 3.1 PAGE : 4-22/29 

Figure 4.5-1 Herschel Avionics organisation chart


Date : 12/02/2004 


Issue : 3.1 PAGE : 4-23/29 

Figure 4.5-2: Planck Avionics organisation chard

4.5.3.1 Structure Subsystem 



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The structure subsystems of the SVM supports the SVM units, carries the PLM’s, and provide interface to 

the launcher. 

A modular approach is also used for the accommodation of units on the lateral panels: the avionics is 

concentrated on 2 of the 8 panels almost identical for both spacecraft. The instrument warm units have 

dedicated panel(s) per instrument (sharing the 6 remaining panels). 

4.5.3.2 Thermal Control Subsystem 

The thermal control subsystem (TCS) maintains the required SVM and PPLM thermal environment for 

proper operations of equipment, taking into account the different environmental conditions. 

4.5.3.3 Attitude Control and Measurement Subsystem 

The Attitude Control and Measurement Subsystem (ACMS) provides the hardware and associated onboard 

software to acquire, control and measure the attitude of the satellite during all mission phases 

and modes according to the system requirements. The attitude and orbit control thrusters, used as 

actuators, are part of the Reaction Control Subsystem (RCS), but their operation is controlled by the 

ACMS. 

The ACMS comprises the following elements: 

- attitude sensors for attitude measurement during all mission phases 

- actuators to generate control torques for attitude manoeuvres and for compensation of perturbing 

torques 

- electronics and software to manage the attitude measurement and control functions, to detect and 

isolate failures and reconfigure if necessary, and to provide the interfaces with the CDMS and 

TT&C subsystems. 

4.5.3.4 Propulsion Subsystem 

The propulsion subsystem comprises the propellant storage tanks, pipes, necessary valves and pressure 

transducers and the thrusters. The thrusters are commanded by the ACMS. 

4.5.3.5 Telemetry, Tracking and Command Subsystem 

The Telemetry, Tracking and Command (TT&C) subsystems manage the reception and transmission of 

radio frequency signals for science and housekeeping data telemetry, telecommand and tracking. It is 

able to operate in both ways (up-link and down-link) during all mission phases when there is ground 

station contact. The frequencies are in the X-band frequency range. 

4.5.3.6 Command and Data Management Subsystem 

The Command and Data management Subsystem (CDMS) collects all telemetry data from the satellite. 

These data include the scientific data, the science instrument housekeeping (HK) and the spacecraft 

housekeeping data. The data will be conditioned, digitised and encoded for transmission to ground via 

the TT&C subsystem. The CDMS will also process the up-link command signals received by the TT&C



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subsystem and decode, validate and distribute the commands to the users for execution. During the 

observation period (OP) the collected telemetry data will be stored in a Solid State Recorder (SSR). 

During the Daily Telecommunications Phase (DTCP) the stored data, together with real time data, will 

be transmitted to ground. 

The CDMS will be the source for: 

• Telemetry and telecommand services to and from the ground station 

• On-board timing and synchronisation 

• Autonomous satellite monitoring and recovery 

• Ground satellite checkout. 

The CDMS supports an average bit rate of the instruments during scientific observations as defined in 

5.11. 

4.5.3.7 Power Control Subsystem 

The Power Control Subsystem (PCS) conditions, controls and distributes the electrical power generated 

by the solar array to all payload instruments and spacecraft subsystems/units. 

4.5.3.8 Solar Array and Sunshield 

The combined sunshield/solar array provides the necessary electrical power via a solar cell network and 

protects the payload module from direct solar radiation. For Herschel it is mounted on one side of the 

spacecraft. For Planck it is attached to the lower end of the PSVM. 

4.5.3.9 Harness 

The SVM harness provides all electrical connections between all electrical equipment in the service 

module. It includes harnesses for power supplies, signals and pyrotechnic pulses. It includes also 

harnesses for connections with the PPLM, the HPLM, the umbilical and test connectors. 

Figure 4.5-4. 

The layout of the Herschel and the Planck SVM are given in Figure 4.5-3 and

PACS 

SPIRE 

Power, 

ACC, Skin 


HIFI Vertical 

Polarization 

RF panel 

Figure 4.5-3: Herschel Service Module 


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Issue : 3.1 PAGE : 26/29 

HIFI Horizontal 

Polarization 

+Z 

Panel 

Reaction 

Weels 

panel

4K CRU 

on shear 

web 

SCC R 

SCC panels 

SCE 

HFI (4K panel 

+ REU) 


SCC N 

Figure 4.5-4: Planck Instrument deployment on SVM 


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Upper Plateform (LFI BEU, DAE Pwr Box, 

HFI PAU 

HFI DDCU & & LFI REBA 

RF panel 

Power, 

ACC, CDMU 

HFI DPU’s 

Skin

4.6 OPERATING MODES 


The following modes are defined for the Herschel & Planck Spacecraft: 

the launch mode identifies the S/C state until separation from the launcher 


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the Sun Acq Mode is first reached after separation, then reached in case of ACC or ACMS level 

failure 

the Nominal Mode is the normal mode of operation during science observations and 

commissioning 

the Earth acquisition mode is reached in case of CDMU anomaly 

the Survival Mode is reached in case of major power problem 

the following diagram give the mode transition 

CDMS 

Level 4 

Ground TC 

ACC (Level 3) 

or ACMS alarm (Level 4) 

Earth Acq 

Mode 

TC 

CDMU alarm (level 3) 

To survival 

Mode 

Ground TC 

launch 

Mode 

Ground TC 

ACC (Level 3) or 

ACMS alarm (Level 4) 

TC 

Sun Acq 

Mode 

TC 

Ground TC 

Separation from the Launcher 

From Earth Acq 

Mode 

TC 

Ground TC 

Nominal 

Mode 

TC 

CDMS 

Level 4 

Ground TC 

Ground TC 

Survival 

Mode 

CDMS 

Level 4 

ground TC 

Figure 4.6-1: Satellite Modes transition logic 

TC 

TC

4.6.1 Launch 



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During Launch of the two satellites the scientific instruments will be switched off. 

If required, power will be provided to the active coolers of the Planck instruments for the launch lock 

mode. 

Currently, only the Planck 4K Cooler is in Launch lock Mode, and the Herschel Cryostat Control Unit is 

ON. 

4.6.2 Herschel 

The Herschel spacecraft will be three axes stabilised. The instantaneous sky coverage is defined by the 

allowed sun aspect angles of ±30° in the x-z plane and ±1° in the y-z plane. 

The orbit operation is characterised by the observation time and the down-link time. The duration of 

the Observation Periods will be 21 hours during which the scientific data will be stored on-board. 

Limited scientific observations will also be conducted during the telecommunications periods, subject to 

restrictions imposed by the telecommunications and other spacecraft maintenance activities. 

During the DPOP the spacecraft will support a number of scientific pointing modes, such as fine 

pointing, raster scanning and line scanning modes (see annex 4). 

The spacecraft supports the Herschel instrument operation with any instrument in prime mode. Both 

PACS and SPIRE will operate in a coordinated way such that they share the available science data rate. 

At the end of the Observation Period the stored data will be sent to ground and the 

observation/schedule parameters for the next 48 hrs will be up-linked. Within this period also spacecraft 

operations like reaction wheel unloading and star-tracker calibration checks will be performed. The 

spacecraft can support, during this time period, limited instrument operations. In addition, a serendipity 

mode could be defined, where SPIRE will be operated in a fixed configuration during a slew from one 

target to the next. 

4.6.3 Planck 

The Planck observation programme basically consists of two scans of the full sky each carried out over 

the period of half an orbit around the sun and as such covering the full sky. The satellite is spinning 

with one revolution per minute around the –x-axis that is pointing continually to the sun. In order to 

properly cover the full sky, the spin axis is repointed to up to 10° from the sun direction 

The instruments will take data for the full 24-hour period and the data will be stored on-board. As for 

the Herschel spacecraft the data will be sent to ground within a period of nominally 3 hours, the downlink 

time. The spacecraft will support, during this time period, full instrument operations. 

The spacecraft supports the Planck instruments being operated simultaneously. However, it is also 

possible to operate only one instrument. In this case, the operating instrument may be allocated the 

sum of the data rates of LFI and HFI nominal allocation.

IIDA - SECTION 5 

5. INTERFACE WITH INSTRUMENTS 


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Spacecraft resource allocations, as specified for the scientific instruments in this chapter, are based 

on present knowledge. 

5.1 IDENTIFICATION AND LABELLING 

Each instrument unit is required to bear a unit identification label containing the following information: 

− Project code 

− Unit identification code 

− Model (e.g. AVM, CQM, PFM, FS) 

The identification label shall be attached to each instrument unit at a location that guarantees maximum 

visibility. 

The location and content of the instrument unit’s identification label shall be shown on the external 

configuration drawing(s) of the respective unit. 

The identification label shall be clearly legible. 

5.1.1 Project code 

For each instrument the Project code, which is the normal reference used for routine identification in 

correspondence and technical descriptive material, is defined in chapter 5.1 of the IID’s part B (AD 1-1, 1-2, 

1-3, 1-4, 1-5 for respectively SPIRE, HIFI, PACS, HFI, LFI). 

5.1.2 Unit identification code 

The unit Identification code is allocated in accordance with a computerised configuration control system and 

also for connector and harness identification purposes. The first 5 characters of this code are the allocated 

Project code. 

The unit identification code is composed of 3 parts: 

− 2 characters for instrument identification, i.e. FH, FP and HS for the Herschel instruments HIFI, 

PACS and SPIRE respectively, PH and PL for the Planck instruments HFI and LFI respectively 

− 3 characters for unit identification, e.g. FPU, FCU, DPU, SPU 

− 2 characters for model identification, i.e. AV for Avionics Model, CQ for Cryo-Qualification Model, PF 

for Proto-Flight Model, FS for Flight Spare Model. 

For connector and harness this code is limited to the characters up to unit identification, followed by the 

connector identification (see below) 

For information, for H-PLM items, the code consists of six digits. The first three digits identify the subsystem 

(e.g. PLM, Instruments, etc.), the last three digits identify the item within the subsystem. This includes all 

mechanical and electrical items in a subsystem (Self-standing parts like Electronic Boxes, brackets, harness, 

etc). For instance, the harness identification code will be attached to the unit and corresponding harness. 

5.1.3 Connector identification 

Each equipment box is required to bear visible connector identification labels closely adjacent to the 

appropriate connector. Spacecraft philosophy is to locate a «J» character to all units fixed (hard mounted) 

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connectors and a «P» character to all harness mounted connectors, followed by a 2 or 3 digits number. Each 

unit is treated individually in this respect, starting at «J01"for unit fixed connectors. 

For full connector identification these three alphanumeric characters are preceded by the S/C identification 

code of the instrument unit, e.g. connector «J03"on box the SPIRE FPU will have the full reference 

«HSFPUJ03", the mating harness connector will have the reference «HSFPUP03". 

Since the S/C identification code already appears on the unit identification label however, unit fixed 

connectors are not required to bear the full connector identification code; in the example above «J03" would 

suffice. The same rules apply for supplied instrument interconnect harnesses, and harness from an 

instrument EGSE if it requires connection to test connectors on an instrument unit. 

The location and content of the above described identification labels shall be included in the external 

configuration drawing. 

Herschel Cryoharness connector identification relies on Product tree Identifier, followed by Connector 

identification label as decribed here. Refers to H-PLM Electrical ICD RD 10 (QM) and RD11 (FM) 

5.2 COORDINATE SYSTEM 

5.2.1 Spacecraft Coordinate system 

The basic co-ordinate system shall be a right-handed Cartesian system with its origin located at the point of 

intersection of the longitudinal launcher axis and the satellite/launcher (for Planck), and the satellite to 

satellite (for Herschel) separation plane. 

For Herschel the positive X-axis shall be along the nominal optical axis of the Herschel telescope, towards 

the target source. The Z-axis is in the plane normal to the X-axis such that nominally the Sun will lie in the 

XZ-plane (zero roll angle with respect to the Sun), positive towards the Sun. The Y-axis completes the righthanded 

orthogonal reference frame. 

Figure 5.2.1-1: Definition of Herschel spacecraft axes 





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The basic coordinate system is a right handed orthogonal system with its origin loacated at the intersection 

point of the longitudinal launcher axis and the separation plane of the Herschel satellite. 

− the positive XHSC-axis is perpendicular to the separation plane and nominally coincides with the 

longitudinal launcher axis. 

− the ZHSC-axis is in a plane through the XHSC-axis and perpendicular to the separation plane such, that 

nominally the Sun will lie in the XZ-plane (zero roll angle with respect to the Sun), positive towards 

the Sun. 

− the YHSC-axis completes the right handed orthogonal reference frame. 

The Herschel PLM Coordinate System (HPLM) is defined as follows: 

The positive XHPLM-axis coincides with the nominal optical axis (line of sight) of the Herschel Telescope, and 

points towards the target source. 

The direction of the HPLM Coordinate System axis YHPLM and ZHPLM coincides with the HSC Coordinate 

Systems axis YHSC and ZHSC. 

The origin of the HPLM coordinate system is derived by the shift of the HSC to XHSC=946,5mm, 

YHSC=0,0mm, ZHSC=-60mm. 

The Service Module coordinate system (HSVM) is identical to the Herschel spacecraft Coordinate System 

(HSC). 

For Planck the Spacecraft X-axis is the nominal anti-sun direction, i.e. the spin axis. 

The Planck telescope line of sight, which is defined as the direction in which the projection of the main mirror 

rim is circular, is tilted 85° from the X-axis in the Z direction. 

The Z-axis is in the plane normal to the X-axis such that nominally the telescope line of sight will lie in the 

XZ-plane, positive towards the target source. The Y-axis completes the right-handed orthogonal reference 

frame. 

There are 3 additional frames associated to the PPLM, to the Telescope, and to the FPU, which are defined 

in annex 7, chapter 2, having their origins respectively in Opplm, Otel, and Ordp. 

Figure 5.2.1-2: Definition of Planck spacecraft axes 

The X-axes of both satellites nominally coincide with the longitudinal launcher axis. 

5.2.2 Instrument unit co-ordinate system 

In order to provide a reference for the Instrument Focus (Focal Plane Units), Centre of Gravity (CoG) and 

(possibly) Moment of Inertia (MoI) measurements, each instrument unit is required to have a right-handed 





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Cartesian system as described in 5.2.1. Its origin shall be in a reference hole (RH) in the unit mounting 

plane, which is the attachment to the S/C. The RH is defined as one of the unit fixation holes. 

The principal axis of the instrument units shall be parallel to those of the S/C co-ordinate system, as far as 

practical 

The instrument unit co-ordinate system and the RH location shall be defined in the unit’s external 

configuration drawing. 

5.3 LOCATION AND ALIGNMENT 

5.3.1 Instrument location 

5.3.1.1 Herschel Instruments 

The Herschel instruments are located in the cryostat on the optical bench (Focal Plane Units, SPIRE JFET 

boxes), mounted to the cryostat (PACS Bolometer Amplifier Unit (BOLA) and the HIFI Local Oscillator Unit 

and Wave-guides) and on the SVM (Electronic units). 

The instrument units shall be compatible with maximum instrument envelopes as defined in Figure 5.3.1-1 to 

5.3.1-2 and in Table 5.3.1-1 

Interface Max. envelope Remarks 

Optical Bench Non symmetric 

See Figure 5.3.1-1, 2 

Cryostat LOU, including LOU radiator 

(see Figure 5.3.1-3) 

SVM As defined in ICD's attached 

to IID-B's 

All FPU’s (including SPIRE JFET boxes) 

LOU has 2 baseplates: "HIFI LOU baseplate" (=LOU 

optical bench) provided by HIFI, and "CVV LOU 

baseplate" attached to the CVV via struts, and supporting 

the HIFI LOU baseplate, and the radiator 

To be agreed upon on a case by case basis 

Table 5.3.1-1: Maximum allocated envelope for Herschel instruments 




HIFI 

+Z 


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PACS 

SPIRE 

Figure 5.3.1-1: Herschel Optical Bench with Instrument FPU's (+Z view (top) and +X view) 


+X 

+Y 




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Figure 5.3.1-2: :Herschel Optical Bench equipped with instruments and Cryoharness (PACS front left, 

HIFI front right and SPIRE in the back). 





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Figure 5.3.1-3:LOU CVV support frame (see interface drawing in annex 6) 

The LOU interfaces with the spacecraft via a specific mounting structure (plate & support provided by 

industry), which shall also carry the LOU radiator. The LOU mounting structure forms part of the thermal path 

between LOU and LOU radiator (incl. its supports/thermal links). 




The LOU delivered by HIFI includes a baseplate (optical bench) 


DATE : 12/02/2004 

The LOU radiator and its supports/thermal links will be provided byHIFI (see IID-B) 

The LOU wave-guides are provided by the spacecraft. 

5.3.1.2 Planck Instruments 

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The Planck instruments are treated in a slightly different way to the Herschel instrument units. The combined 

HFI and LFI Focal Plane Unit is mechanically mounted to the Planck telescope structure. Connected to the 

FPU via wave-guides and cooling lines are the ambient temperature elements of the instrument coolers and 

the LFI Backend Unit. There is a predefined maximum distance between the FPU and the HFI JFET box and 

Readout Electronics. 

All the above units, as they are strongly linked to the FPU, are treated in a dedicated way, different to 

«normal» warm boxes. Although they are physically mounted to the SVM they are logically considered part 

of the PPLM, i.e. they are discussed as «PPLM warm units». 

The «normal» electronic boxes are treated in a more general way as SVM units. 

The instruments shall be compatible with maximum instrument envelopes as defined in Table 5.3.1-2. 

Interface Max. envelope Remarks 

FPU See Radiometer allocated volume 

drawing in annex 7 

HFI/LFI merged FPU* 

Wave guides See Radiometer allocated volume 


Wave guide and harness support 

structure 

See Wave guide and cables 

supports allowed volume in annex 

7 

Wave guide thermal hardware See Radiometer allocated volume 


BEU See Radiometer allocated volume 


Jfet – Bellow - PAU See Jfet and bellow IF drawing in 

annex 7 

PPLM 0.1 K cooler piping See 0.1 K cooler drawing in annex 

7 

PPLM 4 K cooler piping See 4 K cooler drawing in annex 7 

PPLM 18-20 K cooler piping See 18-20 K sorption cooler 



Reproduction interdite © ALCATEL SPACE Company confidential 

It includes the upper and lower 

parts of the wave guide support 

structure 

The wave guide thermal 

hardware** includes the thermal 

link and thermal screens 

implemented between the wave 

guide and the grooves 1, 2 and 3. 

SVM Units See annex 5 To be agreed upon on a case by 

case basis 

Table 5.3.1-2: Maximum allocated envelope for Planck instruments 

Note: * the mounting struts from the telescope structure to the FPU are included in the RAA allocated 

volume. They are part of the FPU and are delivered by the instrument.



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** The wave guide thermal hardware allocated volume is included in the RAA one. It is part of the instrument 

and is delivered by the instrument. 

5.3.2 Instrument alignment 

5.3.2.1 Herschel Focal Plane Units 

The alignment of the Herschel telescope to the Herschel Optical Bench reference is defined in the Herschel 

Alignment Plan (AD 7.1 , see Annex 1). 

The requirements for the FPU’s are included in the Herschel alignment plan, where references are required 

on the outer surface of the box. The positions of the focal plane units will be measured w.r.t. a reference 

point on the Herschel CVV during integration of the unit. Due to the use of dowel pins only a correction in xdirection 

will be possible using shimming plates (see annex 1) 

After telescope integration the telescope reference will be measured to the same reference point on the 

CVV. 

5.3.2.2 Local Oscillator Alignment 

To align the HIFI Focal Plane Unit with the local oscillator with the required precision will need two visiblelight 

windows in the Herschel cryostat. The positions for these two windows are adjacent to the first and last 

of the seven sub-millimetre windows, in positions 0 and 8. Alignment devices, mounted on the +Z and –Z 

faces of the LOU and of the FPU, shall be used.. If the devices on the LOU are partially transparent then the 

alignment can also be checked after integration by measurements along the Y-axis through the devices on 

the LOU and through the two alignment ports. However, in cryogenic instrument-level tests, with the FPU at 

15K and with the LOU at a temperature, as defined in the HIFI IID-B, it will be very difficult to check the 

alignment of the two units. 

For that measurement a special camera system to monitor the alignment of the two units will be used. It is 

planned to monitor the alignment of the LOU with the FPU at various stages of ground testing. The camera 

system will consist of two pieces of special ground support equipment mounted temporarily on the LOU. 

The FPU-LOU alignment requirements specified in the HIFI IID-B are assumed to be applicable for the inorbit 

operation only. I. e. during on-ground tests (outside the TV chamber) the alignment may deviate from 

the in-orbit alignment by about 5 mm due to thermal shrinkage of the CVV. 

5.3.2.3 Planck Focal Plane Unit 

The alignment between the FPU and the telescope along Xrdp and Yrdp, at ambient will be obtained by 

design (without adjustment) with 2 calibrated pins on telescope side and 1 calibrated hole plus 1 calibrated 

extended hole one FPU side. 

The alignment between the FPU and the telescope along Zrdp at operational temperature will be done 

through a shimming operation at ambient on the basis of the knowledge of the telescope and FPU actual 

focal surface position at operational temperature. 

The position of the Ordp at operational is defined in annex 7. 

The actual average FPU focal surface is defined in §5.8 and in AD 7-2. 

The position of actual average FPU focal surface wrt the FPU/telescope mechanical interface at operational 

temperature will be provided by the instrument with accuracy as defined in the Planck alignment plan AD 7-2. 

The stability of the horn position and orientation (or of the actual FPU focal surface) wrt the FPU/telescope 

mechanical interface shall be as defined in AD 7-2 when the environment and interfaces instabilities defined 

in the chapter 9 are applied. 




5.4 EXTERNAL CONFIGURATION DRAWINGS 


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For each instrument unit, a configuration drawing is required to establish the mechanical interfaces with the 

spacecraft structure, harnesses and thermal hardware. 

These drawings shall contain the following information: 

− Dimensions and associated tolerances (at ambient temperatures), including feet, internal connectors 

and their dedicated clearance 

− Focus position w.r.t. instrument coordinate system (dimensions and tolerances at operational 

temperatures) 

− Identification of a reference hole 

− Mounting hole pattern dimensions and hole patterns 

− Dimensions of mounting feet and contact area (base-plate and mounting feet) 

− Spot-faced area for seating of the mounting screw washers (if and where applicable) 

− Dimensions and location of dowel pins (where applicable) 

− Mass and associated tolerances (precise if estimated, calculated or weighted) 

− Location, naming, type and function of all connectors 

− Connector key shape orientation, the identification of connector contact «1», showing connector in 

front view and the connector center line 

− Information about connector fixation 

− Identification of bonding studs 

− Identification of non-flight items 

− Location of unit and connector identification labels 

− Details of instrument provided mounting hardware, thermal/electrical isolation provisions 

− Location and routing of any harness interconnecting modules of a «stacked» box configuration 

− Harness interface filler 

− Identification of areas of harness fixation 

− Location of cold strap interfaces to Helium tank, level 1 and level 2 (Table 5.7.1-1) 

− Calculated Centre of Gravity location in instrument unit co-ordinate system and Moments of Inertia 

and its co-ordinate system if different from instrument unit co-ordinate system 

− Location of transport/storage purging connections (if applicable) 

− Material of housing and surface finish 

− Flatnes and roughness of contact area 

− Eigen-frequency if below 140 Hz (warm units only) 

− Base plate material and surface treatment 

− Surface coating (IR Emissivity and Solar absorptance if external location) 

− Specific heat (J/Kg/K) (calculated or measured) 

− Design and location of handling points 

− Location dimensions of bonding stub (see §5.10.4 for specifications) 





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Drawings shall clearly specify the unit they represent and the responsible design authority; they shall be 

subject to a properly controlled numbering and revision updating system. Each revision of a drawing shall be 

accompanied by a list detailing all changes that have been incorporated since the previous revision on the 

drawing itself. 

2D Drawings shall be submitted to the Project as computer readable and editable files, preferably in a 

vectorial file format ( .hgl, .drw or .cgm (compatible MS word) , or pdf avoid definition loss) together with one 

hard copy of each file. 

CAD drawings shall be submitted to the project according to RD86 (CAD Data Exchange rules) 

The Metric Standard (SI-SYSTEM INTERNATIONAL) shall be used for design and manufacturing of all 

instruments. For components and equipment, the dimensions shall be given in millimetres and the angles in 

degrees. 

5.5 SIZES AND MASS PROPERTIES 

5.5.1 Mass tolerances 

− Cryogenic Qualification Model (CQM): The mass of each of the CQM units shall be within 1% or 100 

grams (whichever is less) for unit weighing less than 20 kg and within 0.5% for unit weighing more 

than 20 kg of the estimated mass for that unit. On no account shall the instrument unit mass exceed 

the Project agreed maximum for that unit, current at the time of delivery to the Project. 

− Proto-Flight Model (PFM): The mass of each of the PFM units shall be within 1% or 100 grams 

(whichever is less) for unit weighing less than 20 kg and within 0.5% for unit weighing more than 20 

kg of the estimated mass for that unit. On no account shall the instrument unit mass exceed the 

Project agreed maximum for that unit, current at the time of delivery to the Project. 

− Flight Spare (FS): In order to ensure free interchangeability of PFM and FS units the mass of each of 

the FS units shall be within 1% or 100 grams (whichever is less) for unit weighing less than 20 kg 

and within 0.5% for unit weighing more than 20 kg of the mass measured for the equivalent PFM 

units. 

5.5.2 Centre of Gravity Location and Tolerances 

In interpreting the figures below, the Centre of Gravity (CoG) should be taken not to include any external 

harness or connectors other than those hard-mounted on the unit. 

− Cryogenic Qualification Model (CQM): The CoG of each unit shall be within a sphere of 1.0 mm 

radius around the best estimated location given in the unit’s external configuration drawing and 

Interface Data Sheet, current at the time of delivery to the Project. Following delivery of the CQM 

units to the Project, the external configuration drawings of the unit shall be updated to show the 

actual CoG location based on QM experience. 

− Proto-Flight Model (PFM): The CoG of each unit shall be within a sphere of 1.0 mm radius around 

the best estimated location given in the unit’s external configuration drawing and Interface Data 

Sheet, current at the time of delivery to the Project. These shall be the drawings updated from CQM 

experience. 

− Flight Spare (FS): In order to allow free interchangeability of PFM, or CQM, and FS units, the CoG of 

the FS shall be within a sphere of 1.0 mm radius around the CoG measured for the other models. 

The centre of mass location shall be measured with an accuracy of 0.5 mm. 

5.5.3 Moments of Inertia and Tolerances 

Nominal Moments of Inertia (MoI) of each unit are recorded in the IID’s part B (AD 1-1 to 1-6) 





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The MoI of all instrument models must not deviate from the nominal value by more than 10 %. Calculated 

values may be supplied for units for which the MoI is lower than 0.1 kg m 2 . 

The MoI must be measured to an accuracy of ±5 %. 

5.5.4 Overall Instrument Mass Allocation 

Depending on the development status of the instrument the following mass margin philosophy shall apply: 

− Completely new developments 20 % 

− New developments derived from existing hardware 15 % 

− Existing units requiring minor/medium modification 10 % 

− Existing units 5 % 

5.5.4.1 Herschel Instruments 

The maximum allocated mass for the Herschel Instruments is 415 kg. 

This total mass is distributed to the three Herschel instruments with the following allocations: 

− HIFI: 189 kg (allocation of 3 kg for waveguides are subtracted, since wave-guides are no more 

under HIFI responsibility) 

− PACS: 133 kg 

− SPIRE: 90 kg. 

The present distribution of the instrument mass to the different interfaces in the system is as given in Table 

5.5.4-1 

Interface Max. allocated 

Mass 

[kg] 

Remarks 

Optical Bench 175.5 All FPU’s (including SPIRE JFETs) 

Cryostat 39.6 Includes the HIFI Local Oscillator Unit (with radiator) 

SVM 196.9 Warm units of all three instruments 

Total 412 

Table 5.5.4-1: Distribution of Herschel Instrument Mass 

The margin philosophy to be applied by the instruments is outlined in paragraph 5.5.4. The instruments shall 

provide in the IID-B the instrument current estimated mass per unit and the related margin. 

5.5.4.2 Planck Instruments 

The maximum allocated mass for the Planck Instruments is 445 kg. 

This total mass is distributed to the two Planck instruments and the sorption cooler with the following 

allocations: 

− LFI: 89 kg 

− HFI: 244 kg 





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− Sorption cooler: 112 kg. 

The present distribution of the instrument and cooler mass to the different interfaces in the system is as 

given in Table 5.5.4-2 

Interface Max. allocated Mass 

[kg] 

Remarks 

Planck Telescope 

Structure 

PPLM and SVM 

Warm Units 

62 HFI/LFI merged FPU, incl. HFI JFET 

383 

Total 445 

Table 5.5.4-2: Distribution of Planck Instrument Mass 

The margin philosophy to be applied by the instruments is outlined in paragraph 5.5.4. The instruments shall 

provide in the IID-B the instrument current estimated mass (nominal mass) per unit and the related margin. 

5.6 MECHANICAL INTERFACES 

Mechanical interfaces are described in formal ICD's (Interface control drawings), included in annexes of this 

document. 

The following ICD's shall be applicable for instrument: 

− Annex 5: SVM to Warm Unit Interface Control Drawings 

− Annex 6: H-PLM to Herschel instruments FPU & LOU Interface Control Drawings 

− Annex 7: P-PLM to Planck instruments FPU, JFET, & wave-guides Interface Control Drawings 

− Annex 9: System Interface Control Drawings (missing warm units ICD's, Plank cooler pipes on 

SVM). 

− Annex 10: Warm Interconnecting Harness interface 

− Annex 11: Herschel Telescope ICD's 


The following mechanical interfaces of the Herschel Payload Module (HPLM) to the instruments are 

discussed: 

− SPIRE, PACS & HIFI Focal plane units to Herschel optical bench 

− SPIRE JFET boxes to optical bench 

− HIFI LOU to cryostat vacuum vessel 

− HIFI LOU wave-guides fixed to cryostat vacuum vessel, interface with HIFI LSU in SVM on one side, 

and LOU on the cryostat, both on the -Y side. 

5.6.1.1 Herschel Focal Plane Units 

The focal plane units of the Herschel instruments shall exhibit a standard mechanical interface to the 

Herschel optical bench. 





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The Instrument shall provide a hole in the instrument mounting foot and for a dowel pin. The diameters of 

these are to be specified in the dedicated Instrument Interface Drawings. 

The number of fixation points is different for each experiment: PACS 3, HIFI 4 and SPIRE 3. They shall be 

identified in the dedicated Instrument Interface Drawings. 

The reference plane for fixation interface is at the upper surface of the Optical Bench. 

For each instrument one reference hole has to be defined from y =0 and z =0, where it is recommended to 

have the reference hole as close as possible to the centre of the OB (y=0, z=0) and on the y or z-axis. All 

other fixation points shall be located w.r.t the instrument reference point. 

The fixation principle shall be similar for all three instruments. 

All holes on OB are fixed –there will be no provisions for compensation of thermal displacements. 

Provisions for alignment adjustment and thermal displacements shall be done on instrument side. 

The thermal contact conductivity to the Optical Bench is defined in chapter 5.7. 

Standard mounting hardware (i.e. only bolts and washers) will be provided by the spacecraft for the 

integration of the focal plane units on the Herschel optical bench. For instance, no thermal and electrical 

isolation parts and material will be provided. 

The fixation of the instruments shall be accessible from the +x side. It shall be possible to mount and 

dismount each focal plane unit independently from the other ones. 

The position of the holes of the FPU shall be within a tolerance of Ø 0.1mm between different models (CQM, 

PFM and FS). 

The co-planarity of the interfaces to the FPU’s on the optical bench will be within less than 0.1 mm between 

any two mounting interfaces of all three FPU’s and betweenØ 0.1 mm between two mounting interfaces of 

each individual FPU under all conditions. 

The Herschel Optical Bench Plate will provide a position tolerance of Ø 0.1mm for HIFI and PACS and Ø 

0.08mm for SPIRE- The Herschel Optical Bench flatness of the mounting interface is 0.05mm or better. The 

instrument mounting interface flexibility shall cope with the defined Herschel Optical Bench Plate and 

instrument mounting point tolerance and flatness. 

Therefore no additional forces due to thermal expansion shall be applied to the optical bench. To avoid such 

additional forces, e.g. struts or sliding bolts can be used. 

The co-planarity of the interfaces of one FPU shall be lower than 0.05 mm(applicable to the HIFI FPU only). 

The co-planarity requirements hold for room as well as for cryogenic temperatures. 

5.6.1.2 SPIRE JFET boxes 

The SPIRE Photometer and Spectrometer JFET box need a dedicated interface to the Herschel Optical 

Bench Plate. The design of the unit has been selected such as to minimise the impact on the cryostat 

design. The units are mechanically attached to the Herschel Optical Bench Plate at the outer rim of the units 

(vial electrically insulated SPIRE provided legs). They are thermally insulated from the optical benche, and 

connected to the vent line (level 3). An electrical insulation by means of kapton foil is foreseen at the level 3 

thermal interface. 

The concept is shown in Figure 5.6.1-1. and in annex6. 





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Figure 5.6.1-1: Mechanical Interface of SPIRE JFET boxes to Optical Bench 

The mounting interface shall provide for mechanical and thermal interface. 

The differential thermal expansion of the unit compared to the mounting interface, the optical bench, shall be 

considered in the design of the unit. 

The SPIRE JFET boxes shall provide 4 mounting holes. 

Standard mounting hardware (i.e. only bolts and washers) will be provided by the spacecraft for the 

integration of the focal plane units on the Herschel optical bench. For instance, no thermal and electrical 

isolation parts and material will be provided. 

The position of the holes of the SPIRE JFET boxes shall be within a 0.1 mm tolerance between different 

models (CQM, PFM and FS). 

The interfaces to the electrical connectors shall be accessible when all FPU units are integrated. No special 

mechanical fixations of the connectors, except mounting screws, are required. 

5.6.1.3 HIFI Local Oscillator Unit 

The LOU and the LOU radiator shall interface with the spacecraft via the LOU mounting structure as per 

Figure 5.6.1-3, and annex 6. 

The LOU mounting surface and the radiator mounting surface, which interfaces to the LOU support plate, 

shall have a flatness of better than 25 µm (LOU mounting surface), respectively 50 µm (radiator mounting 

surface).The LOU support plate surface, which interfaces to the LOU and LOU radiator, shall have a flatness 

of better than 50 µm. 





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The LOU radiator shall be provided by the instrument. 

The allowed volume of the radiator incl. its supports is as per Figure 5.3.1-6, above 

The allowed mass of the radiator incl. its supports shall not exceed 6 kg (TBC) 

The LOU mounting structure shall be provided by the spacecraft. 

The LOU shall include a base plate (Optical bench) allowing to align the LOA's with respect to each other, 

and to keep this relative alignment. 

The LOU mounting structure shall form part of the thermal path between LOU and LOU radiator. Details 

need to be agreed between instrument and spacecraft. 

The wave-guide assembly shall be directly mounted on the wave-guide flanges on the LOU base-plate. I. e. 

all related loads in x-direction are imposed on the LOU base-plate (lateral wave-guide supports on CVV are 

flexible in x-direction in order to allow compensation of thermal shrinkage). 

The LOU shall allow the arrangement of alignment cameras. The alignment cameras are needed during onground 

tests and will be removed during vibration tests and prior to launch. Details need to be agreed 

between instrument and spacecraft. 

Figure 5.6.1-2: Layout of Local Oscillator Unit 





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Figure 5.6.1-3:LOU Radiator allocated Volume 

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5.6.1.4 Bolometer Amplifier Unit 

(removed) 

5.6.1.5 HIFI LOU Wave-guides 

The wave-guide design is as shown in Figure 5.6.1-4. 


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The position of the LSU in the SVM and the LSU wave-guide interface arrangement shall be such, that the 

wave-guides can be routed in parallel to the xy-plane, i. e. without the need of bends in +/-z-direction or 

twists. 

On the SVM side, the LOU wave-guides will be interfaced on the LSU, according to the position agreed with 

HIFI (see annex 9, Alcatel version of the LSU ICD). Bridging waveguides between this interface and the LSU 

are of the responsibility of HIFI. 


Figure 5.6.1-4: LOU Wave-guide implementation 

The following mechanical interfaces are discussed in this paragraph to the Planck instruments: 

− Focal Plane Unit to Planck Telescope Structure 

− PPLM warm units 

− Pipes/wave-guides. 




5.6.2.1 Planck Focal Plane Unit 


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The Planck focal plane unit is mounted to the Planck Telescope structure via a set of 6 CFRP struts, being 

part of the FPU. This mounting concept is designed to: 

− Mechanically hold the FPU, achieving the proper eigen-frequency 

− Thermally isolate the FPU from the Telescope support structure 

− Allow for differential expansion between the focal plane unit and the Planck Telescope Structure, e.g. 

during cool-down. 

− Guarantee the position and stability of the actual FPU focal surface wrt the FPU/telescope 

mechanical interface 

The FPU/telescope interface is composed of 6 contact areas. The fixation is made of 4 M8 screws for each 

strut and calibrated pins. This interface concept is designed to guarantee: 

− The alignment of the global FPU position wrt the telescope 

− The stability of the global FPU position wrt the telescope 

The position of the FPU interface struts on the Planck Telescope structure is sown on Figure 5.6.2-1, and IF 

drawings are available in annex 7 (PLAFPUIS8000A (5 sheets)). 





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Figure 5.6.2-1: Interface position of the Planck FPU Interface Supports, and RAA allocated Volume 

(see complete IF drawing in annex 7, ref. PLAFPUIS8000 A, 5 sheets) 





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Two calibrated pins on telescope side and 1 calibrated hole plus 1 calibrated extended hole one FPU side 

will be used to align the FPU wrt the telescope in the instrument reference frame Xrdp and Yrdp (see annex 

7 for axe definition)) directions at ambient. 

Shims between the telescope interface plane and the 6 FPU struts will be introduced to align the FPU and 

the telescope along Zrdp at operational temperature (± 3mm telescope + instruments). 

The mounting hardware to the Planck Telescope Structure, i.e. screws/bolts/washers will be furnished by the 

spacecraft for the integration of the focal plane unit. 

The complete definition of the FPU/Telescope interface (geometry, local flatness, global flatness…) at 

ambient and operational is described in annex 7 

The different models of the FPU (CQM and FM) shall be compatible with the interface definition. 

To guarantee the telescope assembly performance, the FPU shall be design to minimise the load introduced 

on to the telescope structure. The maximum loads at each of FPU struts/telescope interface when the FPU is 

cooled down from 293 K to 40 K and taking into account the following boundary conditions shall be lower 

than the following values: 

− F radial < 1050 N 

− Tangential torque < 102 N.m< 

Boundary conditions : 

− the FPU shall be hardly mounted on an infinite rigid support 

− the CTE of the support will be < 0.1 10 -6 K -1 

To be compatible with the spacecraft integration sequence, the FPU design shall be such that the lower 

bipod assembly is removable. 

5.6.2.2 LFI backend unit and PAU 

The LFI backend unit is connected via the wave-guides with the LFI part of the FPU. The spacecraft has 

defined the position of the backend unit on the PPLM sub-platform of the SVM. The location w.r.t. the FPU is 

given in Annex 7. The wave-guide routing is treated in a dedicated way and defined in paragraph 5.6.2.4 

below. 

The mechanical fixation will follow the rules as for SVM units and no special thermal interface requirements 

are considered on the PPLM sub-platform. The fixation hardware will be provided by the spacecraft. 

The BEU shall be equipped of elongated holes as defined in Annex 7 (see fig 5.6.2-2 below) to allow the 

FPU alignment on to the telescope 





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Figure 5.6.2-2:BEU interfaces ( from annex 7, ref. PLAFPU.IS.8000 A_D, sheet 3) 

The different models of the BEU (CQM and FM) shall be compatible with the interfaces as defined in Annex 

7. 

The accommodation of BEU and PAU on upper platform are described also at the end of annex 9 (system 

ICD's), drawings PLA.PLM.0.S.1000A. 

5.6.2.3 JFET box PAU & bellows 

The JFET box is required to be at a maximum distance of 0.5 m from the FPU. The spacecraft has defined 

the position of the JFET box on the PLM. The location w.r.t. the FPU is given on Figure 5.6.2-3. 

For the mechanical fixation will follow the rules as for SVM units and no special thermal interface 

requirements are considered on the SVM platform. The fixation hardware will be provided by the spacecraft. 





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Figure 5.6.2-3: Location of HFI JFET box, PAU, and routing of the HFI Harness (bellow Diam. 25mm) 

See annex 7, drawing PLAJFETS1000C (2 sheets) 

The different models of the JFET – Bellow - PAU (CQM and FM) shall be compatible with the interfaces as 

defined in Annex 7. 

The estimated bellow length are given here after: 

− Length between the intersection point PAU external volume/neutral fibre of the bellow and the 

intersection point Jfet external volume/neutral fibre of the bellow : 2206 mm 

− Length between the intersection point JFET external volume/neutral fibre of the bellow and the 

intersection point FPU connector external volume/neutral fibre of the bellow : 486 mm 

To guarantee the telescope assembly performance, the Jfet shall be design to minimise the load introduced 

on to the telescope structure. The maximum loads at each of Jfet legs/telescope interface when the Jfet is 

cooled down from 293 K to 40 K and taking into account the following boundary conditions shall be lower 

than the following values: 

− F radial < 180 N 

Boundary conditions : 

− the Jfet shall be hardly mounted on an infinite rigid support 

− the CTE of the support will be < 0.1 10-6 K-1 




5.6.2.4 Pipes / Wave-guides 


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This paragraph defines the mechanical interfaces of the instrument hardware other than harness that has to 

be routed from the PPLM warm units to the Planck FPU. 

− Sorption cooler pipes (nominal & redundant) 

− 4K cooler pipes 

− 0.1K cooler pipes 

Detailed ICD's are in annex 7 for the part in the PPLM, and annex 9 for the part in the SVM. 

5.6.2.4.1 Sorption cooler pipes 

The pipes of the sorption cooler starts at the compressor assembly on the SVM radiator and is routed from 

this platform via the SVM upper platform to the V-groove shields and finally to the Planck FPU. 

The routing and the position of the routing is defined by the spacecraft and shown in Figure 5.6.2-4. The 

length of this pipes as defined in the IID B (AD 1-6) is followed. 

The mounting interfaces for the routing are standard interfaces not defined separately. The thermal 

interfaces at the V-groove shields that form also the mechanical interface are defined in paragraph 5.7 

below. 

The design of the mechanical support of the pipe on the PPLM and SVM is under instrument responsibility. 

The different models of the Sorption cooler pipes (CQM and FM) shall be compatible with the interfaces as 


It is not planned to support the pipes mechanically between the thermal fixation at the shields. 

Figure 5.6.2-4: Routing of the Sorption Cooler Pipes from Compressor Assembly to the FPU ref 

Annex 7 drawing ref PLAPIP2S0000A (8 sheets) 



5.6.2.4.2 4K cooler 



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The pipes of the 4 K cooler starts at the compressors, mounted to the SVM radiator, is routed to the cooler’s 

ancillary unit from where it is routed via the shear web to the SVM central cone where a disconnecting 

bracket is located. Then it is routed via the V-groove shields (with heat exchanger on the 3 rd V-groove only) 

to the FPU. The routing and the position of the routing are defined by the spacecraft (See Annex 7 / annex 

7). The maximum length of this part of the line is defined in the IID B (AD 1-4). The mounting interfaces for 

the routing are standard interfaces not defined separately. The thermal interfaces at the V-groove shields 

that form also the mechanical interface are defined in paragraph 5.7 below. 


The design of the mechanical support of the pipe on the PPLM and SVM if they are necessary, is under 

instrument responsibility. 

The different models of the 4K cooler pipes (CQM and FM) shall be compatible with the interfaces as defined 

in Annex 7. 

Figure 5.6.2-6: 4K cooler Pipes routing on the V-Groove Shields. Ref annex 7, IF drawing 

PLAPIP4S1000A. (2 sheets) 

5.6.2.4.3 Dilution cooler 

The pipes of the dilution starts at the supply bottles on the Planck equipment platform, is routed to the 

dilution cooler control unit from where it is routed via the V-groove shields to the FPU. The routing and the 

position of the routing are defined by the spacecraft. The design of the pipe includes an connector at the 

PPLM sub-platform level. The maximum length of this part of the line is defined in the IID B (AD 1-4). The 

mounting interfaces for the routing are standard interfaces not defined separately. The thermal interfaces at 

the V-groove shields that form also the mechanical interface are defined in paragraph 5.7 below. 






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The different models of the 0.1K cooler pipes (CQM and FM) shall be compatible with the interfaces as 


Figure 5.6.2-7: Dilution cooler pipes routing on V-Groove Shields (see IF drawing, in annex 7 

PLAPIP1S1000C (3 sheets) 

5.6.2.4.4 LFI wave-guides 

The wave-guides are 2 bundles and start at the back end unit on the SVM upper platform and are directly 

routed to the FPU unit. The routing is illustrated in Figure 5.6.2-8 and interface drawing is shown on Figure 

5.6.2-9 below. Forbidden areas (stay-out zones) are shown on Figure 5.6.2-10. The routing and positioning 

are defined by the instrument. The maximum length of this part of the line is defined in the IID B (AD 1-5). 

The spacecraft will provide mounting interfaces for the wave-guides structure on the primary reflector panel, 

and on the telescope frame. The different models of the wave guide (CQM and FM) shall be compatible with 

the interfaces as defined in Annex 7. 




Figure 5.6.2-8: Routing of the wave-guides 


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Figure 5.6.2-9: Wave guides and Cables Allocated Volume (See annex 7 drawing PLAFPUIS8400A (3 

sheets)). 

For all above described elements it has to be noted that the spacecraft provides a mechanical stability such 

that differential movement of below 3 mm in any direction between the FPU and the BEU will be guaranteed 

when the PPLM is cooled from 293 K down to 40 K. 

5.6.2.5 HFI pipes and bellow I/F limit loads with the PPLM 

The following design limit values shall not be exceeded while : 

− applying the dynamic mechanical environment at the pipe (or bellow) interfaces when hard mounted 

: Q.S, sine, random input combined to the ''Intergration Displacement'' load case. 





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− applying the ''Thermoelastic Displacement'' load case combined with the ''Intergration 

Displacement'' load case. 

Note : Those load cases are described in the current version of the IIDA. 

Design limit loads : 

Attachment points on Groove shields, Telescope Frame and PR Panel : for 1 single insert, Shurlok type 

I/F allowable load In Plane Out of Plane Comment 

(N) (N) 

Grooves 300 107 for 1 insert 

Tel. Frame 300 300 for 1 I/F plate 

(4 screws) 

Tel. Lower Beam (frame side) 300 27 for 1 I/F plate 

(3 screws) 

Tel. Lower Beam with tria stiffener (FPU side) 300 43 for 1 I/F plate 

(3 screws) 

These values already include the safety margin for the margin computation at system level. 

The Instruments shall cover their analyses inaccuracies (FEM, material, computation assumptions) by 

additional necessary margins. 


5.6.3.1 Functional requirements: 

Attachment points shall provide a controlled contact between the unit and the structure for the purpose of 

mechanical fixation and thermal control as well as electrical bonding of the unit. 

5.6.3.2 Design requirements: 

The attachment points shall be designed according to Figure 5.6.3-1. Boxes with a mass less than 1.5 kg 

shall not have more than 4 attachment points. For boxes with a mass above 1.5 kg and a structural and 

dynamic requirement for more than 4 points, the number of attachment points has to be approved by the 

Project. 

The number and location of attachment points shall be based on following mechanical considerations: 

− boxes with a mass < 1.5 kg shall not have more than 4 attachment points 

− ratio (equipment / number of mounting feet) shall be < 1.5 Kg as preliminary check 

− equipment loads shall be compatible with fixation points capabilities on satellite as defined hereafter 

The definition of the boxes attachment points shall comply with the following mechanical requirements, under 

application of the worst case of mechanical and thermal environments: 

− no sliding at support structure interface, according to the following criteria: 

where, 

(( + ( Q / ρ)) 

/ P ) × SF × 1. 

2 ≤1 

P t 

• P and Q are the actual values of axial and lateral loads applied to the attachment bolt (P shall 

also include axial loads generated by lateral acceleration) 

• Pt is available bolt tension per fixation point, with Pt min. = 4000N for M4, 6200N for M5 and 

8500N for M6 (Bolts tensions are to be provided/confirmed by ALS. Current values are based 

on ASPI RSAT screws). 




• SF is safety factors for bolts connection = 1.5, 

• coefficient of 1.2 to cover Instrument potential growth, 


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• ρ is the friction coefficient between the box and its support structure, as defined in Table 5.6.3- 

1. 

support structure Aluminium box 

material at box contact with alodine 1200S coating plated A5 

aluminium with alodine 1200S 

coating 

ρ max = 0.23 ρ max = 0.23 

aluminium plated A5 ρ max = 0.23 ρ max = 0.23 

CFRP ρ max = 0.2 ρ max = 0.2 

Table 5.6.3-1: Friction coefficient values 

− The preferred way for fixation of boxes is using M4 screws. Deviations shall be negotiated with 

Alcatel on a case by case basis. 

− design loads at attachment points compatible with inserts loads capabilities as defined in §4.8.4, 

according to the following criteria: 

where, 

• P is tension load per fixation point 

• Q is shear load per fixation point 

• SF is safety factors for joints (SF=2), 

2 

2 

( ( P / Pm 

) + ( Q / Qm 

) ) × SF × 1. 

2 ≤1 

• coefficient of 1.2 to cover Instrument potential growth, 

• -P and Q are the actual values of axial and lateral loads applied to the attachment bolt (P shall 

also include axial loads generated by lateral acceleration) 

• Pm and Qm are the typical insert strength capability specified in Table 5.6.3-2. 

• Pm in tension or compression to be used, depending of the equipment feet design, to check 

compatibility with inserts loads capabilities. 

Herschel – Planck M4, M5 inserts capability (N) M6, M8 inserts capability (N) 

structure Tension Compression Shear Tension Compression Shear 

Lateral panels 

(reinforced core) 

3120 3120 3620 3505 3505 4344 

Shear webs 2742 2365 1596 NC NC NC 

Cone 1900 1800 945 NC NC NC 

Upper closure panels 858.4 858.4 2247 958 958 2696 

Planck subplatform 841.6 841.6 3620 939 939 4344 

Herschel subplatform 787.6 787.6 1874 886 886 2249 

Table 5.6.3-2: Insert Strength capability for Herschel an Planck SVM 

The equipment design shall prevent single inserts loading in bending and torsion (



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For highly dissipative units the number and location of attachment points shall be based on thermal 

considerations. 

Each attachment point shall have a fixation hole and one of these holes shall be identified as the Reference 

Hole, it shall be marked with a capital R in the configuration drawing. The box co-ordinates and the centre of 

mass co-ordinates shall be related to this reference hole. The positive X-axes of the unit and the S/C shall be 

parallel and in the same orientation as far as reasonable. 

The distance D between two adjacent attachment points shall be 300 > D > 30 mm. 

The distance of each attachment hole centre w.r.t. the Reference Hole, shall be within a 0.2 mm diameter 

circle centred on the theoretical position. 

The attachment points and the clearance for mounting shall be dimensioned as shown in Figure 5.6.3-1. No 

part of the box shall be in the volume above the attachment points indicated as «free access required». The 

contact area shall be specified in the configuration drawing for each attachment point. The attachment point 

edge shall be rounded-off to a minimum radius of 0.2 mm to avoid structural damage. 

The co-planarity of the attachment points shall be within 0.1 mm/100 mm. 

Each box on the SVM shall have an eigen-frequency of > 140 Hz. 

Figure 5.6.3-1: Definition of attachment points of SVM mounted units and dimensioning 

requirements 

5.1.1.3 Herschel SVM Warm Units configuration 

This paragraph describes the mechanical interfaces of the HPLM warm units set in the Herschel SVM. 

More detailed drawings and position of inserts can be found in annex 5. 



PACS 

SPIRE 

Power, ACC, 

CDMU panel Skin 


The following units are to be considered. 

5.1.1.3.1 HIFI warm units 

HIFI Vertical 

Polarization 

RF panel 


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ISSUE : 3.1 PAGE :5-32/136 

HIFI 

Horizontal 

Polarization 

Figure 5.6.3-2: Herschel SVM and HPLM warm units 



+Z 

Panel 

Reaction 

Weels 

panel 

HIFI warm units are accommodated on two lateral radiative panels (-Y and –Y-Z panels); the assumptions 

made are: 

− the 3db coupler has beenrecently updated to IF uploaders 

− All Horizontal polarisation units on the -Y panel 

− All Vertical polarisation units on the –Y/-Z panel 

− A Connector Bracket to support the semirigid cables which link the HRH to the HRV has been 

defined on both panels (bottom); the allocated area/volume on the Upper PLT for the cable jumpers 

has also been defined. 

− LSU: The LSU ICD proposed by Alcatel (covering envelope volume, footprint, and position of 

connectors (including wave-guides) is applicable both for HIFI and the satellite (see annex 9, 

drawing ME.HES.114F.S.002SA). A braket supports the wave-guides flanges at the interface (distant



DATE : 12/02/2004 

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of about 10cm from the LSU). Flexible bridging wave-guides Interface to LSU unit are assumed to be 

delivered by HIFI. 

Figure 5.6.3-3: HIFI SVM Units layout: 

Upper: -Y-Z panel HIFI Vertical polarisation units 

Lower: -Y panel, HIFI Horizontal polarisation units 




5.1.1.3.2 SPIRE Warm units 


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SPIRE warm units are accommodated on .-Z. panel with the CCU unit.The two Star Trackers and one LGA 

are accommodated on the outside of the panel. 

The following assumptions have made for the configuration: 

− CCU (not part of SPIRE WUs) dimensions, connectors list and location are still to be confirmed by 

Alcatel/Astrium 

− FCU: unit's dimensions utilised for the accommodation exercise are i.a.w.mech. I/F dwg provided by 

SPIRE/ASPI. Confirmation of updated about DCU and FCU mechanical I/F drawings is awaited from 

SPIRE/ASPI side. 

5.1.1.3.3 PACS Warm units 

Figure 5.6.3-4: SPIRE SVM Units layout 

PACS warm units are accommodated on .+Y -Z. lateral radiative panel. 

The following assumptions have made for the configuration: 

− DECMEC max dim = 560mm. Details relevant to the DECMEC unit are not present, being the 

relevant Interface Control Drawing not still not available from PACS, therefore Alcatel issued an ICD 

of the DECMEC (see annex 9 drawing ref ME.HES.114P.S.001SA) to freeze the volume, footprint 

and connector location, applicable both to PACS and to the satellite. 

− SPUs are stacked, as a single box with nominal and redundant units inside and one single thermal 

I/F to the SVM panel.. 




Figure 5.6.3-5: PACS SVM Units layout 

5.1.1.4 Planck SVM Warm Units configuration 


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This paragraph describes the mechanical interfaces of the PPLM warm units set in the Planck SVM. 

More detailed drawings can be found in annex 5. 



4K CRU 

on shear 

web 

SCC 


SCC panels 

SCE 

HFI (4K 

panel + REU) 


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Upper Plateform (LFI BEU, DAE Pwr 

Box, HFI PAU 

SCC N 

Power, ACC, 

RF panel CDMU panel 

HFI DDCU & & LFI REBA 

Figure 5.6.3-6: SVM and PPLM warm units (to be updated Alcatel) 

The following units are to be considered: 

5.1.1.4.1 Sorption coolers Compressors 



Skin 

HFI DPU’s 

The sorption cooler compressor assemblies are two cold redundant, sets of units that exhibit mechanical 

interfaces to the main Planck spacecraft radiators located on +Y-Z and –Y-Z side of the SVM. The 

mechanical mounting requirements are defined here after, whereas specific thermal mounting requirements 

are defined in Figure 5.6.3-7 to guarantee good units power dissipation towards space.



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Figure 5.6.3-7: Mounting for Sorption Coolers compressors and Electronics (to be updated Alenia) 

5.1.1.4.1.1 Compressor description 

Compressors are understood to be a set of individual sorption beds, Low and high pressure stabilization 

beds, valves, pressure transducers,…, attached together by a network of pipes, and also connected to the 

low temperature pipes, heat exchangers, liquid reservoirs, and harnesses. A Handling frame is used to 

transport and integrate on the spacecraft. The Compressors elements are individually connected to the 

radiator. 

The compressor will be covered by MLI (need support frame) after being attached to the Radiator 

5.1.1.4.1.2 Location / Orientation 

On lateral radiator panels, located on faces +Y-Z and -Y-Z 

FM1 Cooler is on SVM panel -Y -Z 

FM2 Cooler is on SVM panel +Y-Z 

The Philosophy for location is the following: 

The FM2 compressor, pipes and heat exchangers are located on the same side as dilution & 4 K Cooler heat 

exchangers on 60K V-Groove shield. This is proposed because the proximity of these heat exchangers will 

slightly increase the temperature of the Sorption Cooler 60K interface, and this reducing the performances of 

this redundant unit. The FM1 should have slightly better performances. 

5.1.1.4.1.3 Mechanical fixation 

Compressor delivered with handling frame, aimed to manipulate the compressor as a unit (together with 

pipes) and compatible with positioning the compressor on the radiator. Each compressor fixed independently 

on the radiator. Probably similar for other components. Base-plate required for other components. 

5.1.1.4.1.4 Screws 

Currently 257 screws M4 per compressor (including 2x15 Screws per Sorption bed, distance 25mm). 

Screws are provided by Alenia. 

Torque/tension in bolt : TBD by Alenia 



5.1.1.4.1.5 Interface drawings 



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The Sorption Cooler Compressors and Electronics are mounted to the SVM panels over the Heat Pipes 

network. 

The attachment solution proposed by Alenia (aiming to reduce the number of I/F points and to de-couple the 

I/Fs to the SCC) is as follows: 

− the horizontal heat pipes will be directly fixed to the SVM panels, by making use of a limited number 

of inserts by and leaving a number of through inserts free 

− then the vertical heat pipes and the spacer panels will be mounted onto the SCC 

− finally the SCC plus heat pipes and spacers assembly, will be connected to the SVM panels by 

means of screws mounted from the external side through the through inserts. 

Figure 5.6.3-8: Sorption cooler Radiator +Y-Z with Heat pipes network (to be updated Alenia) 

5.1.1.4.1.5.1 Sorption cooler fixation on SVM pannel 

The fixation of the sorption cooler on SVM is still under evaluation. The following will be updated soon. 

The current baseline is based on stilts to connect structurally the sorption cooler to the panel through the 

heat pipe network, a 1mm baseplate between the compressor and the compressor to keep lateral stiffness, 

and thermal bolts to guarantee the contact between the compressor and the heat pipes. 




C D E G H 

150,4 

mm 

150,4 

mm 

150,4 

mm 

150,4 

mm 

150,4 

mm 

Red dots = structural bolts (type H). 

Green dots = thermal bolts (type G). 


DATE : 12/02/2004 

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150,4 

mm 

TBD 

40m 

m 


TBD 

40m 

m TBD 

Figure 5.6.3-9: Sorption cooler fixation scheme on +Y-Z (-Y-Z is symmetric) (TBC Alenia) 

Figure 5.6.3-10: Sorption cooler Attachment scheme on the heat pipe network (out of date, to be 

updated (Alenia)) 

Typical "A" connections are proposed without spacers, if and where spacers will be needed they will be 

added.



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The solution presented allows reducing the total number of panel connections to 110 type A, 178 type B, 140 

type C, 18 type E and 64 type F. 

The SCC beds are connected to the vertical heat pipe network via a large number of type C connections. 

The SCC plus heat pipes and spacers assembly is attached to the panel (on top of the horizontal heat pipes 

network) by means of type A connections. The number of type A connection seems great enough and placed 

in such a way that no big loads are foreseen for the heat pipes network and the thermal coupling can be 

assured. 

It is assumed that both SCC and SCE provides threaded holes M4 with a minimum depth of 9 mm. 

During the integration phase, the mechanical compatibility between 

− the Sorption Cooler Compressors / Electronics 

− the Heat Pipes network 

− the SVM -Y-Z/-Z/+Y-Z panels 

will be granted by designing very carefully the tolerances chain. 

In order to prevent any integration risk, the through holes on the heat pipes will be drilled/milled with 

sufficiently loose tolerances (φTBD) and/or will be slotted. The same shall apply for the through inserts on 

the SVM panels (φTBD tolerance). On the other hand, the SCC/SCE mounting holes pattern will need to be 

drilled to comply with a 0.2 mm tolerance - as a minimum. 

5.1.1.1.1.6 Assumed dimensions for Compressor 

− Individual sorption bed element base-plate footprint: 374.6 mm * 50.8 mm 

− Individual sorption bed element base-plate flatness: < 0.05 mm over 100 mm 

− interface global flatness : < 0.1 mm / 100 mm 

− interface roughness: < 3.2 m (this is what we expect on both side of the network. 

− distance between fixation holes in the sorption bed length direction : 25 mm 

− distance between fixation holes perpendicular to the bed length direction : 41 mm 

Compatibility of dissipative element base-plate material with thermal filler DC 93500 (Dow Corning) and 

Grafoil 

5.1.1.1.1.7 Open point: 

− MGSE (responsibility JPL), 

− Fixation of SCC on SVM, 

5.1.1.1.2 Sorption cooler electronics 

The SCE units are two identical boxes, proposed by LFI to be located on the upper platform of the SVM, 

adjacent to the sorption cooler compressor assemblies to minimise the lengths of interconnecting cables. 

The SCE have no special thermal interface requirements. The SCE units are set on the SVM keeping a 

sufficient clearance with regard to the nearby Helium tank, drawing is given in Figure 5.6.3-7. The 

mechanical fixation will follow the same rules as SVM units. The fixation hardware will be provided by the 

spacecraft. 

Refer to §5.6.3.4.1 for details about SCE accommodation and interfaces on SCC radiators. 




Figure 5.6.3-11: SCE interface 


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Refer to §5.6.3.4.1 for details about SCE attachments and interfaces on SCC radiators. (to be updated 

alenia) 

5.1.1.1.3 4K cooler 

The 4 K cooler is a set of units that exhibit standard mechanical interfaces to the spacecraft. The units are 

mounted on the spacecraft radiator. Mounting rules as for SVM units apply. No specific thermal interface 

requirements are necessary to evacuate the dissipated power from the unit. 

The pipes from/to the 4K cooler compressors is treated like harness, i.e. mechanical fixation will follow 

those rules, no special thermal interface requirements are considered on the spacecraft radiator. The 

spacecraft defines the routing of the lines. The lines and thermalisation devices are provided by the 

instrument. The fixation hardware is provided by the spacecraft. The spacecraft will not provide any further 

mechanical interface/fixation to the 4 K cooler. The spacecraft will define the exact position of the cooler on 

the spacecraft radiator. 

The 4K cooler is a set of panel mounted units (4CCU, 4CAU, 4KCDE and 4K Current Pre-Regulator). 

The following Figure 5.6.3-12 show the 4K panel with 4CCU, 4CAU, 4KCDE and the 4K Current Pre- 

Regulator. 

4CCU (compressor) to 4CAU (Ancillary unit) connection pipes are defined by the Instrument, while other 

pipes/harness routing is defined by ALS on the basis of the information provided by ASPI. 

Access to the connector used to lock the compressor during transportation has been taken into account 

A recent change in the SVM configuration, necessary to balance the Planck spacecraft (for inertia ratio and 

spin stability) required the displacement of the REU on the 4K panel. 




The 4K current regulator moves on the shear web. 

Thermal and EMC impacts are still under evaluation. 


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The contact area on the panel of Thermal strap of the 4K compressor has been increased to reduce the 

compressor temperature. 

A mu metal shield (provided by ASP) has to be implemented around the 4K compressor near the REU. 

Figure 5.6.3-12: Interface drawing for the 4K Cooler units on the SVM panel. 


The dilution cooler consists of the 3He and 4He tanks, the necessary valves and pipes. The tanks are 

mounted to the spacecraft via balls bearing. The spacecraft s defines the position of the tanks. The pipes 

and valves from the bottles are treated like harness, i.e. mechanical fixation follow those rules, and no 

special thermal interface requirements are considered on the equipment platform. The spacecraft defines 

the routing of the lines. The lines and thermalisation devices are provided by the instrument. The fixation 

hardware is provided by the spacecraft. The spacecraft will not provide any further mechanical 

interface/fixation to the dilution cooler. 

The DCCU is connected to the PLM by means of 5 pipes and to the He-Tanks by means of 4 pipes. 

Accessibility to a number of valves/connectors must be guaranteed at all times (also with the upper closure 

PLT closed) 

An exhaust pipe will be mounted to the DCCU base-plate, through a dedicated cut-out on the +Y/+Z panel 

(approximatively in the centre of the panel, see annex 9, drawing PLS.140.010SA,Planck 0.1K 

accomodation & access) 





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Figure 5.6.3-13: Interface drawing for Dilution units on SVM 0.1K Dilution panel (view from inside 

SVM) Also shown the LFI REBA. 

5.1.1.1.5 LFI REBA 

The LFI REBAs are set inside the SVM on the «+Y +Z» panel with DCCU. (see Figure 5.6.3-13 above) 

The mechanical fixation will follow the rules as for SVM units and no special thermal interface requirements 

are considered on the SVM platform. The fixation hardware will be provided by the spacecraft. 

5.1.1.1.6 HFI Readout Electronics 

On this panel there are the two Star Trackers and two DPU (nom + red); the DPU are located as in Figure 

5.6.3-14 where DPU (nom) is accommodated on the panel, while DPU (red) is accommodated on the shear 

panel. 

For the mechanical fixation will follow the rules as for SVM units and no special thermal interface 

requirements are considered on the SVM platform. The fixation hardware will be provided by the 

spacecraft. 





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Figure 5.6.3-14:HFI panel: Location of DPU (seen from inside SVM) (To be updated, as REU moved 

to the 4K panel) 

5.1.1.1.7 DAE Power Box 

The DAE Power Box is accommodated below the sub-platform on .+Z. side. The DAE Control Box is 

connected to the BEU which is located on top of the sub-platform,+Z. side. For the mechanical fixation will 

follow the rules as for SVM units and no special thermal interface requirements are considered on the 

SVM platform. The fixation hardware will be provided by the spacecraft. 

Figure 5.6.3-15: View P/M sub Platform with LFI DAE Control Box (see appendix 6 for more details) 



5.1.1.1.8 REU and PAU 



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The PAU and REU are connected and the length of their harness shall not exceed 5000 mm. 

5.1.1.5 Planck cooler pipes on the SVM. 

The Planck cooler pipes are routed on the SVM between the cooler warm unit to a dedicated connector 

bracket located on the upper platform (except for the soption cooler). 

− Sorption cooler pipes (nominal & redundant) between SCC and FPU. 

− 4K cooler pipes between 4K ancillary panel and the connector bracket. 

− 0.1K cooler pipes between the DCCU and the connector bracket. 

Routing of the pipes on the SVM has been made by Alcatel. 

Detailed ICD's of the pipes routing on the SVM can be found in Annex 9 

The spacecraft will provide the inserts for the fixation of the pipes on the panels. 

The following table give the responsibility sharing for pipes routing and fixation hardware 

ITEM 

Planck 

Instrument 

coolers pipes on 

the SVM 

Routing on SVM (pipes 

routing, length, attachment 

pitch & support definition). 

Routing on PPLM (pipes 

routing, length, attachment 

pitch & support definition). 

Fixation of pipes: Attachment 

part on SVM (inserts, paint 

free areas) 


part on PPLM (inserts, paint 

Preliminar 

y Definition 

ALS 

Approval 

of prelim. 

Def. 

ASPI / 

Instrum 

Detailed 

definition 

ASPI Instrum ASPI 

ALS 

ASPI / 

Instrum 

Approval 

before 

procureme 

nt 

Instrum ASPI 

Procureme 

nt 

Pipes 

:Instrum 

Pipes : 

Instrum 


ALS 

ASPI / 

Instrum 


Integration Integration 

Herschel Planck 

ASPI 

ASPI 

ALS ALS 

ASPI Instrum ASPI Instrum ASPI 

free areas) 


part on the pipe and support 

Instrum 

ASPI/Instru 

m 

Instrum N/A Instrum ASPI 

Pipes hardware Instrum. ASPI Instrum N/A Instrum. ASPI 

Table 5.6.2-1: Planck instruments pipes fixations responsibilities 

5.1.1.6 Fixation hardware for warm units on the SVM 

The following table gives the responsibility sharing for the definition and procurement of the fixation hardware 

of warm units on the SVM

ITEM 

Warm unit 

external 

Interfaces 

(fixation & 

grounding) 


Preliminar 

y Definition 

Approval 

of prelim. 

Def. 

Detailed 

definition 


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ISSUE : 3.1 PAGE :5-46/136 

Approval 

before 

procureme 

nt 

Procureme 

nt 





Bonding stud (M4*6) 

Washer, nut & max torke value 

Instrum. ALS / ASPI Instrum. ALS / ASPI Instrum. N/A N/A 

on bonding stud (warm unit 

side) 

Instrum ALS / ASPI Instrum. ALS/ASPI Instrum. ASED ASPI 

Bonding strap and fixation on 

SVM (insert + screw) for WU 

grounding. 

WU fixation screws and inserts 

on SVM, paint-free areas. 

Paint, surface treatment of WU, 

paint-free areas. 

Paint-free areas for MLI 

attachment points on WU 

Paint-free areas for MLI 

attachment points on SVM 

MLI (including attachment 

points) 

ALS N/A ALS N/A ALS 

ALS ASPI ALS ASPI ALS 

ALS for ALS for 

SVM SVM 

inserts, inserts, 

ASED for ASPI for WU 

WU bonding bonding 

strap. strap. 

ASED, for 

fixation 

screws. 

ASPI, for 

fixation 

screws. 

Instrum. ALS / ASPI Instrum. ALS / ASPI Instrum. N/A N/A 

ALS Instrum 

ALS / 

Instrum. for 

paint-free 

areas 

ASPI/Instru 

m 

Instrum 

ASED for 

MLI 

attachment 

points. 

ASPI for MLI 

attachment 

points. 

ALS ALS ALS N/A ALS ALS ALS 

ALS Instrum ALS 

ASPI/Instru 

m 

Table 5.6.2-2: Warm units fixations and grounding responsibilities 

5.7 THERMAL INTERFACES 


ALS ASED ASPI 

The resources provided by the cryostat and the details of the interfaces are defined below for the different 

thermal interfaces to the instruments: 

− PACS, SPIRE & HIFI Focal Plane Unitsand SPIRE FFETs boxes on Optical Bench of Herschel 

cryostat 

− HIFI Local Oscillator Unit to cryostat vacuum vessel 

− All Herschel instruments thermal mathematical models are annexed to the instruments IID-B's, 

including typical transient dissipation timelines. These are the base of the coupled thermal analysis 

Instruments + Cryostat performed at H-PLM level. The assumption and results are presented in the 

H-PLM Thermal model and Analysis, ref RD81. 

5.7.1.1 Focal Plane Units 

The focal plane units of the Herschel instruments are mechanically mounted to the Herschel optical 

bench and shall exhibit standardised thermal interfaces. 

Three different thermal interface levels have been defined (see table 5.7.1-1), where for each instrument the 

maximum temperature at the respective interface unit is identified. 

Thermal Interface 

Maximum temperature 

at Thermal Interface 

[K] 

HIFI PACS SPIRE 

Description

Thermal Interface 


Maximum temperature 

at Thermal Interface 


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[K] 

HIFI PACS SPIRE 


Description 

Level 0 2 2 / 1.75 (*) 2 Thermal interface to the He II tank : 

Sorption coolers pump & 

evaporator, PACS red & blue 

photodetectors, SPIRE detector 

enclosure, HIFI mixers 

Level 1 

Level 2 

6 5 6 

15 n.a. 15 

First thermal interface to the He II 

vent-lines: PACS and SPIRE FPU 

enclosure, FIFI mixers (4K box) 

Level 2 vent line is bolted to the 

Optical Bench: HIFI FPU 

enclosure. PACS & SPIRE 

insulated by carbon fivre 

coumpund feet. 

Level 3 na na 15 Level 3 added for SPIRE JFET 

boxes (P&S), now thermally 

insulated from OBA, to allow a 

reduction of the temperature of the 

Optical Bench 

Table 5.7.1-1: Definition of thermal interface levels (*) Note: 1.75K is applicable for the PACS red 

detector only 

The instrument thermal requirement at the thermal interface (temperature, and relevant heat flows to size the 

thermal straps have been clarified (now included in IID-B's section 5.7). 

In case electrical insulation of the thermal connection from the structure is required, this shall be 

implemented as part of the Instrument. 

One exception is the Level 3 connection to the SPIRE JPET, where electrical insulation (kapton sheet) will 

be inserted at the vent line interface



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Figure 5.7.1-1: Herschel Level 0 and Level 1 thermal interfaces: 

Top Level 0: Most interface are external pods, except PACS & SPIRE cooler evaporator where an 

open pod is implemented 





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Bottom: Level 1 (upper loop), Level 2 (attached to OBA), level 3 (SPIRE JFET). 

ref annex 6 for details 

5.7.1.1.1 Mounting interface of the focal plane unit to the optical bench 

The optical bench will be thermally linked to level 2. The primary thermal links of the instruments are at Level 

0 and Level 1 and will be implemented by means of thermal straps . 

The instruments FPU are mounted on the optical bench by means of 3 fixations. 

HIFI FPU has conductive feet to get good thermal contact between FPU and OBA. 

PACS and SPIRE FPU's are thermal insulated from the optical bench by means of instrument provided 

carbon fibre feets, in order to get an FPUinsulated from OBA, at a temperature close to the one of level 1. 

5.7.1.1.2 Interface to He tank: Level 0 

The requirement of this temperature to be below the maximum temperature given in Table 5.7.1-1 is valid for 

instrument dissipation as given in paragraph 5.9.1. 

The interface of the instrument to the level 0 is a direct interface with a thermal link to the Helium II tank of 

the cryostat. The thermal contact at interface is included in the industry part of the strap 

The thermal contact at interface is included in the industry part of the strap 

Implementation of the industry part of the thermal straps to level 0 is as follows: 

− PACS red & Blue detector, SPIRE detector box, HIFI mixers : A thermal strap with a conductance of 

> 50mW/K between helium and interface will be provided 

− PACS & SPIRE Sorption cooler Pump: A thermal strap with a conductance of > 50mW/K between 

helium and interface will be provided 

− PACS & SPIRE evaporator strap: A conical cavity flanged on the tank (open tank option) (in parallele 

with a thermal strap with a conductance of > 50mW/) K will be provided 

The details of the level 1 interfaces are described in annex 6 (HPLM drawings), HP-2-ASED-ID-0042 (Optical 

Bench assembly IF drawings, sheet 7). 





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Figure 5.7.1-2 -Typical level 0 thermal 0 strap PACS red detector, cut on left, and detail of the 

interface on right (ref annex 6, HP-2-ASED-ID-0042 sheet 7 and 9) 

5.7.1.1.3 Interface to Vent Line: Levels 1, 2, & 3 

The levels 1, 2, 3 are provided via thermal straps between the instruments and the vent line (mass flow rate 

2.1mg/s) 

The sequence of connection of the instruments interfaces to the vent line are as follows: 

Level 1: PACS photometer --> PACS colimator --> PACS Spectrometer --> SPIRE Photometer --> SPIRE 

Spectrometer level -->HIFI level 1 --> 

--> Level 2 : Optical Bench & instrument shield--> 

--> Level 3: SPIRE SM JFET --> SPIRE PM JFET 

This is illustrated by the following figure 5.7.1-2. 

HTT 

5000 

510 511 512 513 

5010 

5011 

5012 

5092 

5013 

PACS 

Photometer 

[781] 

514 520 521 

5091 

5014 

5020 

5021 

5090 

PACS 

Collimator 

[782] 

526 

PACS 

Spectrometer 

[783] 

Optical Bench Plate(L2) 

SPIRE SPIRE HIFI 

522 523 524 525 527 528 529 530 532 533 534 535 536 538 539 540 542 543 544 546 

5022 

5086 

5023 

5085 

5084 

585 

SM JFET 

[832] 

5083 

5024 

5025 

5026 

5082 

5027 

5081 

5080 

592 591 590 586 584 583 582 580 

581 

PM JFET 

[831] 

5071 

5028 

571 

5029 

5070 



531 

5030 

5031 

5032 

5063 

5033 

563 

5034 

5035 

[800] 

537 

[371-381] 

5062 

Ventline Wall Node 

Gaseous Helium Node 

5036 

5037 

562 

5038 

5061 

[Instrument / Optical Bench Node] 

Figure 5.7.1-3 -Sequence of connection of instruments levels 1, 2, and 3 on Vent line 

Typical thermal interface is shown on the following figure, details in annex 6 

570 

5039 

561 

[830] 

541 

5040 

5041 

5060 

5042 

5043 

560 

[939] 

545 

5044 

5045 

5054 

5046 

554 

550 

5053 

5050 

5051 

5052 

553 

551 

552



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Figure 5.7.1-4 -Typical level 1 thermal strap : SPIRE levels 1 (ref annex 6, HP-2-ASED-ID-0042 sheet 

9) 

5.7.1.1.4 Thermal contact at Herschel instruments FPU thermal interfaces 

For the Herschel FPU's, it has been agreed that the thermal interfaces conductance between the Herschel 

spacecraft, and the thermal interfaces (for levels 0, 1, 2, and 3) shall include the thermal contact (on the 

industry side). 

In order to guarantee that the conductance of the contact, on various models are similar to the tests, the 

contact area shall respects some constrains, given in the list below: 

− Surface roughness < 0.4 micron 

− Surface Flatness < 0.05 mm (over the strap contact area). 

− Gold coating > 10 microns on both sided of the coating 

− Mounting / dismounting at least 6 times (for System level integration and tests) 

5.7.1.1.5 Radiative Environment tof the FPU's 

The radiative environment temperature of the focal plane units is defined by the temperature of the 

surrounding instrument shield (maximum 2 K above the optical bench temperature and emissivity of 0.05), 

the optical channel from the telescope to the instruments and the optical channels from the LOU windows to 

the HIFI FPU. These optical channels will be designed to fulfil the straylight requirements, but no thermal 

load requirements are placed on their design except that the above temperature levels are fulfilled including 

the thermal load from these interfaces. 




5.7.1.2 SPIRE JFET boxes 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-52/136 

The SPIRE JFET boxes is now insulated from the Optical Bench (via SPIRE provided supports), and 

connected to the Vent Line Level 3 via Thermal straps (provided by Astrium). 

The design of the Thermal strap interface on the Vent line includes electrical isolation by means of a Kapton 

sheet. 

To achieve a good enough thermal isolation (and reduce the Optical Bench temperature), the thermal 

conductance between the JFET box and the Optical Bench shall be below 0.005W/K (goal 0.002W/K). 

5.7.1.3 Local Oscillator Unit 

The responsibility of the Thermal control of the LOU is shared between HIFI (providing the LOU with its HIFI 

LOU baseplate, and the LOU radiator), and Industry (providing the CVV LOU baseplate, LOU support struts, 

the LOU harness and LOU wave-guides, and defining the thermal radiative environment). 

The LOU radiator is fixed on the CVV LOU baseplate (which is then part of the Thermal path). The thermal 

conductance through the CVV LOU baseplate (between HIFI LOU baseplate interface and radiator interface) 

is TDB W/K at operating temperature. 

The Envelope Volume for the LOU radiator is defined in figure 5.6.1-3. 

The CVV LOU baseplate is thermally isolated from the colder CVV by means of the glass fibre struts. 

The LOU temperature control (incl. recovery after safe mode) shall be under the responsibility of the 

instrument. No spacecraft controlled heaters are foreseen. 

For the design of the LOU radiator the spacecraft thermal environment (average shield backside and CVV 

temperature) are provided by the spacecraft (see RD.81) 

5.7.1.4 PACS Bolometer Amplifier Unit 

Removed 

5.7.1.5 HIFI LOU Wave-guides 

NA 

5.7.1.6 Expected temperature environment in Herschel PLM 

The following figures give the temperature environment expected in the Herschel PLM (from RD 84): 

Cryostat external surfaces (applicable for the LOU) (fig 5.7.1-5) and cryostat internal thermal environment 

and heat flows for nominal life-time conditions (fig 5.7.1-6) 



LOU Radiator 

133K 

LOU Baseplate 

140K 

CVV Main 

Radiator 67K 

-Y Radiator 66K 


182K 

189K 

245K 

200K 

257K 

258K 

192K 

194K 

86K 

SVM 293K 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-53/136 


182K 


CVV Upper Bulk MLI 

81K-132K 

+Y Radiator 66K 

-Z Radiator 65 K 

SVM Thermal 

Shield MLI 

92K-114K 

SVM Thermal Shield 

129K-134K 

SVM Top MLI 

230K 

Figure 5.7.1-5 Temperatures of the Herschel-PLM external surfaces during steady state hots case in 

L2

LO Wd. 67 K 

0.2 

33 

0.1 

8 

0 

0 

HTT MLI (up) 8 K 

0.1* 

1 

Beam Entr. 

17 


6.8 2.1 4.3 19 

Optical Bench & Instr. Shield 10 K 

Fill. tubes 

2.5 

0.5 

0.2* 

L0 links 

12.2 

3 

4.5 

70 

39 

34 

28 

CVV 67 K 

Heat Shield 0.50 3 52 W K 

143 

Heat Shield 2 43K 

harn. 

47 

Heat Shield 1 34K 

2.2 up Susp. lo Susp. 

0.5 

10 

11 

1.7 

up SFW 10K 

lo SFW 16K 

5.5 

MLI 

He II Tank (HTT) 1.8 K 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-54/136 

Fill. tubes 192 

1 

Harness 

13 13 TSS 1.5 

11 

0.1* 


215 


75 

12.7 

TSS 

HOT 16K 

0.2 

1 

HOT MLI 20K 

2 

9 

5 

2 

178 

HTT MLI 11K 

14.1 

104 

94 

239 

106 

2.07 mg/s 

Figure 5.7.1-6 HPLM internal temperatures and Heat Flow Chart for Average Instrument Dissipation 

(as specified here) and Hot Case Environment at L2 


The resources provided by the Planck Payload Module and the details of the interfaces are defined below for 

the different thermal interfaces to the instruments: 

− Focal Plane Unit to Inner Baffle 

− Sorption Cooler to spacecraft radiator 

− 4 K Cooler interfaces to spacecraft radiator 

− Dilution Cooler He bottle interfaces to spacecraft 

− Sorption cooler pipes to V-groove shields 

− 4 K cooler pipes to V-groove shields 

− Dilution Cooler pipes to V-groove shields 

− Wave-guides to V-groove shields 

An overview of the thermal design and interfaces is given in Figure 5.7.2-1. 

GHe Ventline

Sorption Cooler 

2 redundant units 

➦ ➦ 

485K 

80b 

➦ 

280K 

0.4b 

LFI 

5.7.2.1 Focal Plane Unit 

➦ 

1. 

➦ 

➦ 

➦ 


2 

4K Cooler 

➦ 

➦ 

➦ 

➦ 

HFI 

4He tank 

20K stage 

4K Stage 

1.6K Stage 

0.1K Stage 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-55/136 

Dilution cooler 

3He tank 

Radiator 

Figure 5.7.2-1: Planck PLM Thermal Interfaces Schematic 



SVM 

(room 

Temperature) 

V-Groove 

Shields 

50K Radiator 

Cold Payload 

The combined focal plane unit of LFI and HFI is mechanically mounted to the Planck telescope support 

structure. The thermal interface parameters of this mechanical interface to the Planck telescope support 

structure is shown in Figure 5.7.2-1. 

The thermal interface of the FPU with the PPLM is the same that the mechanical interface (Figure 5.6.2-1). 

The LFI heat switch between the PPLM and the LFI FPU has been removed from the FM (will be 

implemented on LFI STM to reduce test duration). 

Another thermal interface of the FPU to the optical bench is thermal connection of the HFI JFET unit. This 

unit is mounted as well to the back of the Primary reflector panel. It needs to be thermally coupled to the 

radiator and mechanically isolated from the spacecraft. The JFET box is mounted by means of 4 flexible 

metallic blades (part of JFET box) to provide sufficient thermal contact and avoid deformation of the Primary 

Reflector (optical) panel. The maximum supported heat load is given in paragraph 5.9. 

The environment/radiative thermal interface to the focal plane is given by the surface properties and the 

temperature of the inner enclosure of the Planck Telescope Baffles bench. The details of these parameters 

are given in Figure 5.7.2-2



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-56/136 

Figure 5.7.2-2: Temperature distribution for Planck (ref RD78) 

The thermal interface of the FPU with the PPLM is the same that the mechanical interface (Figure 5.6.2-1). 





DATE : 12/02/2004 

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PPLM COATING 

________: Low emissivity 0.02 

Polished Aluminium 

--------------: High Emissivity 0.9 

Black painted open honeycomb 

Figure 5.7.2-3: Thermal environment of PPLM Baffles to FPU (continuous red line is low emissivity 

(Polished Al coating), Dashed blue line is radiator Area (Black open honeycomb) 

5.7.2.2 Planck Instrument Units on Spacecraft Radiators 

In this paragraph the thermal interfaces of the units mounted on the s/c radiator are discussed. 

The following units are to be considered: 

5.7.2.2.1 Sorption cooler Compressor 

The sorption cooler compressor dissipates 520W average (1.2kW peak) and needs a specific thermal 

interface (heat pipes) to evacuate the dissipated power from the unit and spread it on the whole radiator 

area.. The mounting interface is defined in section 5.6. and the thermal dissipation is listed in section 5.9. 

5.7.2.2.2 4 K cooler warm units 

The 4 K cooler compressor, ancillary panel, and electronics are directly hard mounted on a dedicated 

radiator (see figure 5.6.3-12.), allowing to evacuate directly the heat to space. 


The dilution cooler consists of the 3 He and 4 He tanks, the DCCU, and the pipes to the tanks, and to the cold 

end. Only the DCCU is mounted on tha radiator 




5.7.2.3 Pipes / Wave-guides / Harness 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-58/136 

This paragraph defines the thermal interfaces of the instrument hardware other than harness, that has to be 

routed from the Planck SVM radiator equipment, respectively the SVM upper platform to the Planck FPUand 

have thermal interfaces (heat exchangers for coolers, thermal anchoring for wave-guides and harnesses) to 

the V-grooves and the PPLM. 

The routing of the pipes and interface of the heat exchangers is described in annex 7 in the PPLM and 

annex 9 in the SVM. 

5.7.2.3.1 Sorption cooler pipes 

At the level of the v-groove shields, the instrument will provide heat exchangers for the sorption cooler pipes. 

The thermal interface of the heat exchanger is defined by the spacecraft and described in details in annex 7. 

The spacecraft does not provide any further thermal interface to the pipes. Mechanical interfaces are 

proposed. 

5.7.2.3.2 4 K cooler pipes 

At the level of the v-groove shields, the instrument will provide heat exchangers for the 4 K cooler pipes. The 

pipes are currently thermally connected only on the 50 K Shield (Figure 5.6.2-6). There are mechanical 

interfaces on the other shield, which could be used to reduce the thermal load on the 50K shield 


At the level of the v-groove shields, the instrument will provide heat exchangers for the dilution cooler pipes. 

The dilution cooler pipes are heat sunk on each V-Groove shields (see Figure 5.6.2-7). 

5.7.2.3.4 Wave-guides 

Each of the bundles of 4 wave-guides has a dedicated thermal strap to the v-groove shields, leading to 23 

thermal straps for the Wave guides. The thermal interface of the heat exchangers is defined by the 

spacecraft, as shown on the figure below, and detailed in the Annex 7 (drawing PLA-FPUIS8000A sheet 4). 

Typical interface is shown on figure 5.7.2.-4. refere to annex 7, drawing PLA-FPUI-S8000-A - Radiometer 

Allocated Volume sheet 4 for more details 



5.7.2.3.5 Harness 



DATE : 12/02/2004 

Figure 5.7.2-4 Thermal interface for wave guide 

ISSUE : 3.1 PAGE :5-59/136 

Thermal 

interfaces for WG 

The Planck instrument cryo-harness is of the responsibility of the instruments. It is desirable to have heat 

intercept of the cryo-harness at each V-groove. 

The HFI bellow between PAU and JFET is routed along a SVM-PLM strut through the 3 shields, attached to 

the frame, and to the JFET box. 




Figure 5.7.2-5 : routing of the HFI bellow 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-60/136 

The LFI harness is routed and fixed on the Waveguide support structure. Thermal interfaces to the 

intermediate V-Grooves is TBD. 

5.7.2.4 Planck Telescope 

The qualification temperature range for the Planck telescope is: 40K to 325K. 

In orbit theoperating range is 40K to 65K 


The nominal temperature range for units mounted onto the Herschel or Planck SVM as required by 

instruments are defined in Table 5.7.3-1. Acceptance temperatures are 5°C below minimum and 5°C above 

maximum operating temperatures. Qualification temperatures are 10°C below minimum and 10°C above 

maximum operating temperatures. Instrument units that are not compliant with the nominal temperature 

ranges shall be clearly identified in the IID-B 



Satellite 

Herschel 

Planck 

Instrument 

HFI HIFI 

PACS SPIRE 

LFI 

SCS 

Project 

code 


Instrument 

Unit 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-61/136 

Temperature required by Instrument 

Operating 

Stabili 

ty 

(slope) 

StartSwitchupoff Nonoperating 



T Guaranteed by TCS 

Operatin 

g 

T Stability 

Min Max DT/dt Min Max Min Max DT/dt 

°C °C K/h °C °C °C °C °C °C K/h 

HSDPU Digital Processing Unit -15 45 N/A -30 50 -35 60 -15 45 N/A 

HSFCU FPU Control Unit -15 45 N/A -30 50 -35 60 -15 45 N/A 

HSDCU Detector Control Unit -15 45 N/A -30 50 -35 60 -15 45 N/A 

FPDECMEC Detector (spectro) & Mechanism Control -15 45 N/A -30 50 -30 60 -15 45 N/A 

FPBOLC Bolometer (photometer)&Cooler Control -15 45 N/A -30 50 -30 60 -15 45 N/A 

FPDPU Data processing Unit -15 45 N/A -30 50 -30 60 -15 45 N/A 

FPSPU1/2 Signal Processing Unit (stacked) -15 45 N/A -30 50 -30 60 -15 45 N/A 

FPWIH Warm Intercinnecting Harness 

FHFCU FPU Control Unit -10 40 5.0 -25 40 -25 55 -10 40 5.0 (slope,TBC) 

FHLCU Local Oscillator Control Unit -10 40 1.1 -25 40 -25 55 -10 40 1.1 (slope,TBC) 

FHIFH IF up-converter Horizontal -10 40 1.1 -25 40 -25 55 -10 40 1.1 (slope,TBC) 

FHIFV IF up-converter Vertical -10 40 1.1 -25 40 -25 55 -10 40 1.1 (slope,TBC) 

FHLSU Local Oscillator Source Unit 10 40 1.1 -25 40 -25 55 10 40 1.1 (slope,TBC) 

FHHRV High Resolution Spectometer - Vertical Polarisation -10 40 1.1 -25 40 -25 55 -10 40 1.1 (slope,TBC) 

FHHRH High Resolution Spectometer - Horizontal Polarisation -10 40 1.1 -25 40 -25 55 -10 40 1.1 (slope,TBC) 

FHWEV 

FHWEH 

FHWOV 

Wide Band Spectrometer Electronics - Vertical Polarisation 

Wide Band Spectrometer Electronics - Horizontal 

Polarisation 

Wide Band Spectrometer Optics - Vertical Polarisation 

0 

0 

5 

30 

30 

15 

1.1 

1.1 

1.1 

-25 

-25 

-25 

40 

40 

30 

-25 

-25 

-25 

55 

55 

55 

0 

0 

5 

30 

30 

15 

1.1 (slope,TBC) 



FHWOH Wide Band Spectrometer Optics - Horizontal Polarisation 5 15 1.1 -25 30 -25 55 5 15 1.1 (slope,TBC) 

FHICU Instrument Control Unit -25 40 5.0 -30 50 -30 60 -25 40 5.0 (slope,TBC) 

FHWIH Warm interconnecting Harness -10 40 5.0 na na -25 55 

FHLWU LOU wave-guides (LSU side) -10 40 1,1 na na na na N/A 

PHBA-N DPU N (Data processing Unit - Nominal) -10 40 -20 -20 50 -10 40 

PHBA-R DPU R (Data processing Uni - Redundantt) -10 40 N/A -20 -20 50 -10 40 N/A 

PHCBC REU (Read Out Electronics) -10 40 N/A -20 -20 50 -10 40 N/A 

PHCBA PAU (Power Amplifier Unit) -10 30 1,1 -20 -20 50 -10 40 1.1 

PHDA 4KCU (4K Compressor Unit) -10 40 N/A -20 -20 40 -10 40 N/A 

PHDB 4KAU (4K Ancillary Unit) -10 40 N/A -20 -20 50 -10 40 N/A 

PHDC 4KCDE (Cooler Drive Electronics) -10 40 N/A -20 -20 50 -10 40 N/A 

PHDJ 4K current regulator -10 40 N/A -20 -20 50 -10 40 N/A 

PHEAA He3 Tank (+Z) -10 40 N/A N/A -20 50 -10 40 N/A 

PHEAB1 He4 Tank +Y -10 40 N/A N/A -20 50 -10 40 N/A 

PHEAB2 He4 Tank -Z -10 40 N/A N/A -20 50 -10 40 N/A 

PHEAB3 He4 Tank -Y -10 40 N/A N/A -20 50 -10 40 N/A 

PHEC DCCU (Dilution Cooler Control Unit) -10 40 N/A -20 -20 50 -10 40 N/A 

Cables and Pipes -10 40 N/A N/A -20 50 N/A 

PLREN REBA Nominal -20 50 N/A -30 -30 50 -20 50 N/A 

PLRER REBA Redundant -20 50 N/A -30 -30 50 -20 50 N/A 

PLAEF DAE Power box (Data acquisition Electronics -20 50 N/A -30 -30 50 -20 50 N/A 

PLBEU BEU (Back end Unit) -20 40 0,2 -30 -30 50 -20 40 0.2 

PSM3 SCC (Sorption Cooler Compressor Nominal) -13 7 3, 1, 0.5K -20 -20 60 -13 7 +/-3K 

PSR3 SCC (Sorption Cooler Compressor Redundant) -13 7 3, 1, 0.5K -20 -20 60 -13 7 +/-3K 

PSM4 SCE (Sorption cooler Electronics Nominal) -10 40 N/A -10 -20 60 -10 40 N/A 

PSM4 SCE (Sorption cooler Electronics Redundant) -10 40 N/A -10 -20 60 -10 40 N/A 

Table 5.7.3-1: Summary of Instrument temperature requirements, versus industry proposed 

commitments 

The thermal control subsystem is design in such a way to guarantee these requirements, except for 

HERSCHEL HIFI boxe FHICU ( +45°C), and Planck units on the upper platform: Planck PAU (-20,+40°C). 

Where difference is identified, the instrument requirements are considered as a goal for the TCS.

Units 

Units 

FHLWU 

FHWIH 

FHICU 

FHWOH 

FHWOV 

FHWEH 

FHWEV 

FHHRH 

FHHRV 

FHLSU 

FHLCU 

FHFCU 

FPWIH 

FPSPU1/2 

FPDPU 

FPBOLC 

FPDECMEC 

HSDCU 

HSFCU 

HSDPU 


Herschel 

Instrument warm units T requirement 

FHIFV 

FHIFH 

-40 -20 0 20 40 60 

Temperature (°C) 

Planck 

Instrument warm units T requirement 

SCE (Sorption cooler Electronics Redundant) 

SCE (Sorption cooler Electronics Nominal) 

SCC (Sorption Cooler Compressor Redundant) 

SCC (Sorption Cooler Compressor Nominal) 

BEU (Back end Unit) 

DAE Power box (Data acquisition Electronics 

REBA Redundant 

REBA Nominal 

Cables and Pipes 

DCCU (Dilution Cooler Control Unit) 

He4 Tank -Y 

He4 Tank -Z 

He4 Tank +Y 

He3 Tank (+Z) 

4K current regulator 

4KCDE (Cooler Drive Electronics) 

4KAU (4K Ancillary Unit) 

4KCU (4K Compressor Unit) 

PAU (Power Amplifier Unit) 

REU (Read Out Electronics) 

DPU R (Data processing Uni - Redundantt) 

DPU N (Data processing Unit - Nominal) 

-30 -20 -10 0 10 20 30 40 50 60 



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ISSUE : 3.1 PAGE :5-62/136 

Figure 5.7.2-6 :Operating temperature requirement for instruments warm units on SVM 





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The contact area between boxes and structure shall be at the area of the mounting feet. This area shall be 

flat with no protrusion below the mounting plate. 

All units operating in the 270-350K range shall have a flat base-plate contact: these are all the dissipating 

units i.e. those where the skin dissipated power of faces not in contact with support structure is more than 

50W/m 2 . 

In the case of a flat base-plate contact area, this area must meet the following requirements for warm units 

on SVM: 

− Flatness of 0.1mm/100mm (for mounted box and structure) 

− Overall flatness < 0.2mm 

− Roughness < 3.2micron 

− Use of an thermal -filler or equivalent 

For improving radiatve exchange with the SVM environment, all warm unit boxes (except the Planck 

sorption cooler) will have to be coated with high emissivity coating. Emissivity shall be > 0.8 

HIFI units will be will be covered with MLI (baseline). High emissivity is however also required on HIFI in 

case adjustments would have to be made later. 

5.7.3.1 Thermal stability 

Temperature stability requirements from instruments on SVM are summarised in Table 5.7.3-1. 

5.7.3.1.1 Herschel 

SVM 

The temperature stability requirement on Herschel SVM and PLM are expressed by HIFI only. 

A temperature drift lower than 30mK/100s (1K/h) is required on the spectrometers (HRS & WBS), and Local 

oscillator units (LCU, LSU), and 140mK/100s (5K/h) for the other units (ICU, FCU). 

The current worst case for temperature stability is the maximum tilt of the satellite when the Solar Aspect 

angle moves from +30° to –30° (End of life conditions) and the solar radiation illuminates the back of the 

SVM. 

An active thermal control system (based on adjustemnt of the duty cycle for cycles of 10s) has been 

implemented for the HIFI units to reach the temperature stability requirement. 

PLM 

The requirements expressed by HIFI are 

− 15mK/100s on level 2 

− 6mK/100s on levels 1 and 0. 

Level 0 is a direct connection to the He tank, which can be considered as a very stable buffer. 

However, level 1 & 2 are cooled by the gas, with very little heat capacitance. Therefore the temperature 

stability on these levels can be guarantees only if the power dissipation on these levels are stable. 

Results of thermal analysis on the Herschel cryostat, base on the simplified thermal model of the instruments 

(including the dissipation timeline), showing in details the temperature evolution, stability, and heat flows at 

each of the individual interfaces can be found on RD81, section 7.4 (7.4.1 for PACS, 7.4.2 for SPIRE, and 

7.4.3 for HIFI). 

Overall effects of the instrument (typical) dissipation timeline on the tank temperature and He mass flow rate 

is reported in section 7.4.4 





DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-64/136 

For HIFI, the temperature stability expressed can be considered as fullfiled, except during the sharp HIFI 

heat peaks (magnets heaters) 

5.7.3.1.2 Planck 

SVM: 

The temperature stability required by Planck instruments are both related to the equipment's mounted on the 

SVM sub-platform: 

− HFI PAU requires 1.1K/h 

− LFI BEU requires 0.2K/h. 

− SCS requires +/-3K/1K/0.5K (or 6K/2K/1K peak-peak) for the next beds adjacent to the cooling bed 

(ie this concerns the 3 first beds which are adsorbing H2, and which drive the pressure/temperature 

stability of the 20K levels). 

These stability requirements from instrumentshave been included in IID-B 2.1 and are not formally accepted 

as requirements but as goals, as no specific temperature stabilisation is feasible given the amplitude of the 

equipment dissipation. Originally 3K/h were proposed in the TCS subsystem (before the expression of 

theses new requirements). 

The main perturbation on Planck is the operation of the sorption cooler, with heat peaks of the order of 

1.2kW, on the nearby lateral panels. 

However, SVM thermal analysis shows that the goals can be respected for the units on the subplatform, but 

not for the sorption cooler compressor (6K peak peak for the 1st adjecent cooler after the cooling bed, 4.5K 

peak-peak for the other beds). 



temperature (°C) 


25 

20 

15 

10 

5 

0 


Sorption cooler permanent regime 

Temperature evolution on the beds (EOL 8) 

-5 

0 1000 2000 3000 4000 

8 

7 

6 

5 

4 

3 

2 

1 

0 

-1 

Time (s) 

Sorption cooler permanent regime 

Temperature evolution on the beds (EOL 8) 

1st adjacent to cooling 

bed 

2nd adjacent to cooling 

bed 

3rd adjacent to cooling 

bed 

Crossing Heat pipes 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-65/136 



cooling bed 

1st adjacent to 

cooling bed 

2nd adjacent to 

cooling bed 

3rd adjacent to 

cooling bed 

4th Adjacent to 

cooling bed 

5th Adjacent to 

cooling bed 

Crossing Heat 

pipes 

-2 

0 100 200 300 400 500 600 700 

Time (s) 

Figure 5.7.2-7 : Expected temperature fluctuations for Planck Sorption cooler, at interface beds/heat 

pipes: 1st adjacent 7K peak to peak, other: 4.7 K peak to peak (data from Planck SVM Thermal 

control analysis, taking into account 10% margin on mass x heat capacitance)



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-66/136 

PLM: 

There are no temperature stability requirements for the PPLM, but internal straylight requirements. 

The temperature fluctuation results are therefore processed to evaluate their impacts on the straylight. 

The sources of fluctuation which are analysed are: 

− the temperature fluctuation of the SVM (from Sorption cooler compressor cycle, 667s/4000s cycle), 

highly damped in the PPLM by the thermal insulation. 

− The fluctuation of the heat loads of the sorption cooler on the V-grooves, induced by the mass flow 

variations (period 667s/4000s). 

− The fluctuations of the illumination of the upper part of the primary reflector by the moon (at spin 

frequency) 

The current estimated temperature fluctuations on the PPLM are as follows: 

PPLM 

thermal stability 

study 

results 

1: SVM 

Shield 3 internal negligible - 

Shield 3 external negligible - 

Perturbation source 

2; Sorption Cooler 

JPL 2002 data 



3: Moon illumination 

Amplitude Period Amplitude Period Amplitude Period 

Sec. Reflector negligible - 

Prim. Reflector negligible - 

Baffle internal negligible - 

5.7.4 Temperature monitoring 

7880 µK 

4088 µK 

1200 µK 

# 100 µK 

# 0.4 µK 

negligible 

# 0.2 µK 

negligible 

400 µK 

# 30 µK 

# 4000 s 

# 667 s 

# 4000 s 

# 667 s 

# 4000 s 

# 667 s 

# 4000 s 

# 667 s 

# 4000 s 

# 667 s 

- - 

- - 

- - 

0.1 µK 1 

30 µK 2 

The instrument require temperature monitoring from the spacecraft at some of the thermal interfaces. 

The following Table 5.7.4-1 summarises the need from instruments, expressed in IID-B's. 

For Herschel PLM, the CCU will monitor all thermal interfaces (FPU feet, thermal straps, MOLA & LOU 

interfaces, in a similar way for all 3 Herschel instruments. The request expressed only by SPITRE in IID-B is 

extended to other instruments. This information will be available in the TM. 

For SVM's, and Planck PLM, the temperatures will be monitored by the CDMU 

The temperature monitoring requests expressed by instrument will be satisfied. In addition, the thermal 

control subsystem will have a certain number of sensors for temperature control and temperature monitoring 

used to guarantee that the temperature is in the required range. These temperature information will be 

available in the TM. 

60 s 

60 s

Herschel 

Planck 

HIF 

I 

SPIRE 

PACS 

HFI 

LFI 

Sorption cooler 



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-67/136 

S/C EGSE Instr Location Unit 

Powered by Temp. Range 

min max 

Resolutio 

n 

Accurac 

y 

To be 

meas 

ured 

Acro 

nym 

H-PLM not specified 

H-SVM not specified 

PFU thermal 

On Instrument Shield, close to SPIRE 

I/F 

L0; Cooling Strap 5; to 

PFU thermal 

"SPIRE SM Detector enclosure" I/F 

1 

1 

3.0K 

1.6K 

20.0K 

2.0K 

± 0.1K 

± < 

0.001K 

CCU 

CCU 

T213 

T225 

L0; Cooling Strap 6; to PFU thermal 1 2.0K 10.0K ± 0.01K CCU T226 

L0; Cooling Strap 7; to 

PFU thermal 

"SPIRE Cooler Evaporator HS" I/F 

1 1.5K 2.2K 

± < 

0.01K 

CCU T227 

L1; on Ventline upstream strap 4 to 

"SPIRE Optical Bench" 

PFU thermal 

I/F 

1 2.0K 10.0K ± 0.01K CCU T235 

L1; on Ventline downstream strap 4 

to "SPIRE Optical Bench" 

PFU thermal 

I/F 

1 2.0K 10.0K ± 0.01K CCU T236 

L3; on Ventline to JFET-Phot PFU thermal 1 3.0K 20.0K ± 0.1K CCU T246 

L3; on Ventline to JFET-Spec PFU thermal 1 3.0K 20.0K ± 0.1K CCU T247 

L1; on Strap 4 on SPIRE FPU side PFU thermal 1 2.0K 10.0K ± 0.01K CCU T248 

On Spire JFET-Spec 

PFU thermal 

(Pos on Structure or L3 strap) I/F 

1 13.0K 370.0K ± 1K egse T249 

On Spire JFET-Spec 

PFU thermal 


1 3.0K 20.0K ± 0.1K CCU T250 

On Spire JFET-Phot 

PFU thermal 


1 13.0K 370.0K ± 1K egse T251 

On Spire JFET-Phot 

PFU thermal 


1 3.0K 20.0K ± 0.1K CCU T252 

OB Plate near SPIRE foot (center) PFU thermal 1 13.0K 370.0K ± 1K egse T253 

OB Plate near SPIRE foot (center) PFU thermal 1 3.0K 20.0K ± 0.1K CCU T254 

OB Plate near SPIRE foot (-z+y) PFU thermal 1 13.0K 370.0K ± 1K egse T255 

OB Plate near SPIRE foot (-z+y) PFU thermal 1 3.0K 20.0K ± 0.1K CCU T256 

OB Plate near SPIRE foot (-y-z) PFU thermal 1 3.0K 20.0K ± 0.1K CCU T258 

H-SVM not specified CDMU 

H-PLM FPFPU 0 14 1.5K 30.0K TBD 

FPDECMEC 2 0 -40°C +70°C CDMU TBD 

FPBOLC 2 0 -40°C +70°C CDMU TBD 

FPDPU 2 0 -40°C +70°C CDMU TBD 

FPSPU1 2 0 -40°C' +70°C CDMU TBD 

FPSPU2 2 0 -40°C +70°C CDMU TBD 

FPU PHA 1 Adjust Adjust 

JFET PHCA 1 1 40.0K70.0K CDMU TBD 

Primary reflector 1 40.0K70.0K CDMU TBD 

Primary reflector 1 40.0K350.0K CDMU TBD 

secondary reflector 1 40.0K 70.0K CDMU TBD 

secondary reflector 1 40.0K 350.0K CDMU TBD 

SC baffle 1 40.0K 70.0K CDMU TBD 

SC baffle 1 40.0K 350.0K CDMU TBD 

DPUs PHBA 1 1 -30°C 70°C CDMU TBD 

PAU PHCBA 1 12 -30°C 70°C CDMU TBD 

REU PHCBC 1 14 -30°C 70°C CDMU TBD 

4K Compressor Unit PHDA 1 1 -30°C 70°C CDMU TBD 

4K Ancillary Unit PHDB 1 1 -30°C 70°C CDMU TBD 

4KCDE PHDC 1 1 -30°C 70°C CDMU TBD 

4K Cold End PHDD 1 -269°C 27°C TBD 

4K regulator PHDJ 1 1 -30°C 70°C CDMU TBD 

He3 Tank PHEAA 1 1 -30°C 70°C CDMU TBD 

He4 Tanks PHEAB 3 1 -30°C 70°C CDMU TBD 

0.1K Control Unit PHEC 1 1 -30°C 70°C CDMU TBD 

PPLM “Cold” – FEU Interface PLFEU 1 40.0K 353.0K CDMU TBD 

FEU PLFEU 1 18.0K 353.0K TBD 

Waveguide Interfaces PLFEU 1 20.0K 353.0K TBD 

PPLM “Warm” - WG (*) Interface PLWG 1 40.0K 353.0K CDMU TBD 

PPLM “Warm” – BEU Interface PLBEU 1 240.0K 353.0K CDMU TBD 

SVM – REBA Nom. PLREN 1 240.0K 353.0K TBD 

SVM – REBA Red. PLRER 1 240.0K 353.0K TBD 

PPLM “Warm” – BEU/DAE PLBEU 1 240.0K 353.0K TBD 

DAE Power box PLAEF 1 1 240.0K 353.0K CDMU TBD 

SCCE-HFI Interface PSM/R1 1 17K 24K TBD 

SCCE- LFI Interface PSM/R1 1 17K 24K TBD 

SCP - Coldest Shield PSM/R2 1 1 40K 70K CDMU TBD 

SCP – Intermediate Shield PSM/R2 1 1 80K 150K CDMU TBD 

SCP – Warmest Shield PSM/R2 1 1 140K 190K CDMU TBD 

SCC Radiator 

P-SVM 

SCE 

PSM/R3 

PSM/R4 

1 

1 

220K 

250K 

350K 

350K 

TBD 

TBD 

H-PLM 

HSVM 

P-PLM 

P-SVM 

P-PLM 

P-SVM 

P-PLM 





DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-68/136 

Table 5.7.4-1 : Temperature monitoring required by instruments (from IID-B's) 

In the following table, the temperature monitoring that will be implemented in the spacecraft, together with 

the reference TM: 

For the Warm units in the SVM, the measurement will be performed by the CDMU. 

For the Planck PLM, the measurement will be performed also by the CDMU. 

For the Herschel PLM, the measurement will be performed by the CCU 

Instr 

ume 

nt 

description code code TM 

id 


TM 

id 

TM 

id 


Tmin Tmax monitore 

d by 

HIFI Focal Plane Control Unit FH FCU -40 80 CDMU 

HIFI Instrument Control Unit FH ICU -40 80 CDMU 

HIFI IF upconverter Horizontal FH IFH -40 80 CDMU 

HIFI IF up converter Vertical FH IFV -40 80 CDMU 

HIFI Local Oscillator Control Unit FH LCU -40 80 CDMU 

HIFI Local Oscillator Source Unit FH LSU 73 121 169 -40 80 CDMU 

HIFI HRS ACS Horizontal polarisation FH HRH 74 122 170 -40 80 CDMU 

HIFI HRS ACS Vertical polarisation FH HRV 71 119 167 -40 80 CDMU 

HIFI WBS Electronics for Horizontal Polarisation FH WEH 76 124 172 -40 80 CDMU 

HIFI WBS Electronic for Vertical Polarisation FH WEV 70 118 166 -40 80 CDMU 

HIFI WBS Optic for Horizontal Polarisation FH WOH 72 120 168 -40 80 CDMU 

HIFI WBS Optic for Vertical Polarisation FH WOV 69 117 165 -40 80 CDMU 

SPIRE Focal Plane Control unit HS FCU 67 115 163 -40 80 CDMU 

SPIRE Detector Control unit HS DCU 68 116 164 -40 80 CDMU 

SPIRE Digital Processing Unit HS DPU 66 114 162 -40 80 CDMU 

PACS Detector & Mechanism Control (DEC/MEC) FP DECM 63 111 159 -40 80 CDMU 

PACS Bolometer Cooler Control unit FP BOLC 62 110 158 -40 80 CDMU 

PACS Data Processing Unit FP DPU 60 108 156 -40 80 CDMU 

PACS Signal processing unit Nominal (stacked wit FP SPU1 96 144 -40 80 CDMU 

PACS Signal processing unit Redundant FP SPU2 CDMU 

LFI DAE Back End Unit (BEU) PL BEU 70 118 166 -40 80 CDMU 

LFI DAE Power Box PL CB 63 -40 80 CDMU 

LFI REBA Nominal PL REN 65 113 161 -40 80 CDMU 

LFI REBA Redundant PL RER -40 80 CDMU 

LFI SC Compressor (SCC) Nominal PS M3 -40 80 CDMU 

LFI SC Electronics (SCE) Nominal PS M4 53 101 149 -40 80 CDMU 

LFI SC Compressor (SCC) Redundant PS R3 -40 80 CDMU 

LFI SC Electronics (SCE) Redundant PS R4 55 103 151 -40 80 CDMU 

HFI Data Processing Unit (DPU) Nominal PH BA-N 49 97 145 -40 80 CDMU 

HFI Data Processing Unit (DPU) Redundant PH BA-R 92 140 -40 80 CDMU 

HFI Pre-Amplifier Unit (PAU) PH CBA 90 138 -40 80 CDMU 

HFI Readout Electronics Unit (REU) PH CBC 50 98 146 -40 80 CDMU 

HFI 4K Cooler Compressor Unit (CCU) PH DA 91 139 -40 80 CDMU 

HFI 4K Cooler Ancillary Unit (CAU) PH DB 51 99 147 -40 80 CDMU 

HFI 4K Cooler Electronics Unit (4K-CDE) PH DC 93 141 -40 80 CDMU 

HFI 4K Cooler Current Regulator (CCR) PH DJ 52 100 148 -40 80 CDMU 

HFI 0.1K Dilution Cooler Control Unit (0.1K-DC PH EB 89 137 -40 80 CDMU 

HFI 0.1K Dilution Cooler GSU 3He Tank (D3T) PH EAAA 64 112 -40 80 CDMU 

HFI 0.1K Dilution Cooler GSU 4He Tank (D4T) PH EAAB 94 142 -40 80 CDMU 

HFI 0.1K Dilution Cooler GSU 4He Tank (D4T) PH EAAC 95 143 -40 80 CDMU 

HFI 0.1K Dilution Cooler GSU 4He Tank (D4T) PH EAAD 96 144 -40 80 CDMU 

Table 5.7.4-2 :Instrument warm units Temperature monitoring provided by CDMU



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-69/136 

Location Description Quantity ID Type Nominal T Range Accuracy (1) 

Groove 1 SC heat exchanger 1 1 1 N 135K 40-350K ±2.5 K 

Groove 1 1 101 R 135K 40-350K ±2.5 K 


Groove 1 1 102 R 135K 40-350K ±2.5 K 

Groove 1 +Z External edge 1 3 N 113K 40-350K ±2.5 K 

Groove 1 1 103 R 113K 40-350K ±2.5 K 


Groove 2 1 104 R 80K 40-350K ±2.5 K 


Groove 2 1 105 R 80K 40-350K ±2.5 K 

Groove 3 SC heat exchanger 1 1 6 N 50K 40-70K ± 1K 

Groove 3 1 106 R 50K 40-70K ± 1K 

Groove 3 SC heat exchanger 2 1 7 N 50K 40-70K ± 1K 

Groove 3 1 107 R 50K 40-350K ±2.5 K 

Groove 3 Wave Guides Interface1 1 8 N 50K 40-70K ± 1K 

Groove 3 1 108 R 50K 40-350K ±2.5 K 

Groove 3 Wave Guides Interface2 1 9 N 50K 40-70K ± 1K 

Groove 3 1 109 R 50K 40-350K ±2.5 K 

Groove 3 Optical cavity 1 10 N 50K 40-70K ± 1K 

Groove 3 1 110 R 50K 40-350K ±2.5 K 

PR panel JFET interfaces 1 11 N 40K 40-70K ± 1K 

PR panel 1 111 R 40K 40-70K ± 1K 

PR panel FPU interface 1(lower beam) 1 12 N 40K 40-70K ± 1K 

PR panel 1 112 R 40K 40-350K ±2.5 K 

PR panel FPU interface2 (+Y) 1 13 N 40K 40-70K ± 1K 

PR panel 1 113 R 40K 40-70K ± 1K 

PR panel FPU interface3 (-Y) 1 14 N 40K 40-70K ± 1K 

PR panel 1 114 R 40K 40-350K ±2.5 K 

Baffle Baffle 1 (Front face) 1 15 N 40K 40-70K ± 1K 

Baffle 1 115 R 40K 40-350K ±2.5K 

Baffle Baffle 2 (Lateral face medium) 1 16 N 40K 40-70K ± 1K 

Baffle 1 116 R 40K 40-350K ±2.5K 

Baffle Baffle 3 (Lateral face upper pos 1 17 N 40K 40-70K ± 1K 

Baffle 1 117 R 40K 40-350K ±2.5K 

Baffle Baffle 3 (Rear face) 1 18 N 40K 40-70K ± 1K 

Baffle 1 118 R 40K 40-350K ±2.5K 

Reflectors PR1 1 19 N 40K 40-70K ± 1K 

Reflectors 1 119 R 40K 40-70K ± 1K 

Reflectors PR2 1 20 N 40K 40-70K ± 1K 


Reflectors SR1 1 21 N 40K 40-70K ± 1K 


Reflectors SR2 1 22 N 40K 40-70K ± 1K 


Table 5.7.4-3 :PPLM Temperature monitoring provided bu CDMU 





DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-70/136 

ORBIT 

range Accuracy range Accuracy 

He tank All DLCM 1 tank lower side -X-Y, Integrated in DLCM housing C100 T101 1 1 1,5K - 2,2K ± 0,01K 1,5K - 2,2K ± 0,01K 

He tank All DLCM 2 tank lower side -X+Y, Integrated in DLCM housing C100 T102 1 1 1,5K - 2,2K ± 0,01K 1,5K - 2,2K ± 0,01K 

He tank All Tank upper side+x-z+y nearby outlet C100 T107 1 1 1,5K - 2,2K ± 0,01K 1,5K - 15.0K ± 0,01K 

He tank All Tank upper side +x-y-z integrated int PPS housing C100 T111 1 1 1,5K - 2,2K ± 0,01K 1,5K - 15.0K ± 0,01K 

He tank All Tank upper side +x-y-z integrated int PPS housing C100 T112 1 1 1,5K - 2,2K ± 0,01K 1,5K - 2,2K ± 0,01K 

OB PACS OB Plate near PACS mounting foot (+z) C100 T202 1 1 3,0K - 20,0K ± 0,1K 3,0K - 20,0K ± 0,1K 

OB HIFI OB Plate near HIFI mounting foot (+z/-y) PT1000 T207 1 13K - 370K ± 1K 

OB HIFI OB Plate near HIFI mounting foot (+z/-y) C100 T208 1 1 3,0K - 20,0K ± 0,1K 3,0K - 20,0K ± 0,1K 

OB HIFI On Instrument Shield, close to HIFI PT1000 T211 1 13K - 370K ± 1K 

OB PACS On Instrument Shield, close to PACS C100 T212 1 1 3,0K - 20,0K ± 0,1K 3,0K - 20,0K ± 0,1K 

OB SPIRE On Instrument Shield, close to SPIRE C100 T213 1 1 3,0K - 20,0K ± 0,1K 3,0K - 20,0K 

0,004K < 

± 0,1K 

0,004K < 

L0 PACS L0; Cooling Strap 1; to "PACS RED Detector" C100 T221 1 1 1,6K - 2,0K < 0,008K 1,6K - 2,0K < 0,008K 

L0 PACS L0; Cooling Strap 2; to "PACS Sorption Cooler Evaporator" C100 T222 1 1 1,5K - 2,2K 

TBC 

± 0,01K 1,5K - 2,2K 

TBC 

± 0,01K TBC 

L0 PACS L0; Cooling Strap 3; to "PACS Sorption Cooler Pump" C100 T223 1 1 2,0K - 10,0K ± 0,01K 2,0K - 10,0K ± 0,01K TBC 

0,004K < 

0,004K < 

L0 PACS L0; Cooling Strap 4; to "PACS BLUE Detector" C100 T224 1 1 1,6K - 2,0K < 0,008K 1,6K - 2,0K < 0,008K 

0,004K TBC < 

0,004K TBC < 

L0 SPIRE L0; Cooling Strap 5; to "SPIRE SM Detector enclosure" C100 T225 1 1 1,6K - 2,0K < 0,008K 1,6K - 2,0K < 0,008K 

L0 SPIRE L0; Cooling Strap 6; to "SPIRE Cooler Pump HS" C100 T226 1 1 2,0K - 10,0K 

TBC 

± 0,01K 

TBC 

2,0K - 10,0K ± 0,01K TBC 

L0 SPIRE L0; Cooling Strap 7; to "SPIRE Cooler Evaporator HS" C100 T227 1 1 1,5K - 2,2K ± 0,01K TBC 1,5K - 2,2K ± 0,01K TBC 

L0 HIFI L0; Cooling Strap 8; to "HIFI L0" C100 T228 1 1 1,5K - 2,2K ± 0,01K 1,5K - 2,2K ± 0,01K 

L1 PACS L1; on Ventline upstream strap 1 to “PACS Photometer Optics" L1 Inlet C100 T231 1 1 1,5K - 2,2K ± 0,01K 1,5K - 2,2K ± 0,01K 

L1 PACS L1; on Ventline downstream strap 1 to "PACS Photometer Optics" C100 T232 1 1 1,5K - 2,2K ± 0,01K 1,5K - 2,2K ± 0,01K 

L1 PACS L1; on Ventline downstream strap 2 to "PACS Collimator" C100 T233 1 1 2,0K - 10,0K ± 0,01K 2,0K - 10,0K ± 0,01K 

L1 PACS L1; on Ventline downstream strap 3 to "PACS Spectrometer Housing" C100 T234 1 1 2,0K - 10,0K ± 0,01K 2,0K - 10,0K ± 0,01K 

L1 SPIRE L1; on Ventline upstream strap 4 to "SPIRE Optical Bench" C100 T235 1 1 2,0K - 10,0K ± 0,01K 2,0K - 10,0K ± 0,01K 

L1 SPIRE L1; on Ventline downstream strap 4 to "SPIRE Optical Bench" C100 T236 1 1 2,0K - 10,0K ± 0,01K 2,0K - 10,0K ± 0,01K 

L1 HIFI L1; on Ventline downstream strap 5 to "HIFI L1-interface C100 T237 1 1 2,0K - 10,0K ± 0,01K 2,0K - 10,0K ± 0,01K 

L1 PACS L1; on Strap 1 on PACS FPU Side C100 T242 1 1 2,0K - 10,0K ± 0,01K 2,0K - 10,0K ± 0,01K 

L1 HIFI L1, on Strap 5 on HIFI FPU side C100 T244 1 1 2,0K - 10,0K ± 0,01K 2,0K - 10,0K ± 0,01K 

L3 SPIRE L3; on Ventline to 6-JFET (JFET-Phot) C100 T246 1 1 3,0K - 20,0K ± 0,1K 3,0K - 20,0K ± 0,1K 

L3 SPIRE L3; on Ventline to 2-JFET (JFET-Spec) C100 T247 1 1 3,0K - 20,0K ± 0,1K 3,0K - 20,0K ± 0,1K 

L1 SPIRE L1; on Strap 4 on SPIRE FPU side C100 T248 1 1 2,0K - 10,0K ± 0,01K 2,0K - 10,0K ± 0,01K 

OB SPIRE On Spire 2-JFET (JFET-Spec) PT1000 T249 1 13K - 370K ± 1K 

OB SPIRE On Spire 2-JFET (JFET-Spec) C100 T250 1 1 3,0K - 20,0K ± 0,1K 3,0K - 20,0K ± 0,1K 

OB SPIRE On Spire 6-JFET (JFET-Phot) PT1000 T251 1 13K - 370K ± 1K 

OB SPIRE On Spire 6-JFET (JFET-Phot) C100 T252 1 1 3,0K - 20,0K ± 0,1K 3,0K - 20,0K ± 0,1K 

OB SPIRE OB Plate near SPIRE foot (center) PT1000 T253 1 13K - 370K ± 1K 

OB SPIRE OB Plate near SPIRE foot (center) C100 T254 1 1 3,0K - 20,0K ± 0,1K 3,0K - 20,0K ± 0,1K 

OB SPIRE OB Plate near SPIRE foot (-z+y) PT1000 T255 1 13K - 370K ± 1K 

OB SPIRE OB Plate near SPIRE foot (-z+y) C100 T256 1 1 3,0K - 20,0K ± 0,1K 3,0K - 20,0K ± 0,1K 

OB SPIRE OB Plate near SPIRE foot (-y-z) C100 T258 1 1 3,0K - 20,0K ± 0,1K 3,0K - 20,0K ± 0,1K 

Telescope All on telescope M1, exact position TBD PT1000 T331 to 1 1 50K - 370K ± 1K 50K - 370K ± 1K 

Telescope All on telescope M2, exact position TBD PT1000 T340 to 1 1 50K - 370K ± 1K 50K - 370K ± 1K 

Heat shields All Heat shield 1 Outside, on upper cone close to beam entrance under PT1000 T424 1 1 13K, 370K ± 1K 13K, 370K ± 1K 



Cover All On Cover heat shield PT1000 T601 1 TBD TBD 

Cover All On Cover heat shield C100 T602 1 13K, 370K ± 1K 

Cover All On Cover heat shield PT1000 T603 1 TBD TBD 

Cover All On Cover heat shield C100 T604 1 13K, 370K ± 1K 

baffle All On CVV telescope Baffle, Outer cylindre -Z PT1000 T651 1 1 13K, 370K ± 1K 13K, 370K ± 1K 

baffle All On CVV telescope Baffle, Outer cylindre +Z PT1000 T652 1 1 13K, 370K ± 1K 13K, 370K ± 1K 

CVV All CVV Outside PT1000 T901 to 1 1 13K, 370K ± 1K 13K, 370K ± 1K 

CVV HIFI LOU baseplate PT1000 T931 1 1 13K, 370K ± 1K 13K, 370K ± 1K 

CVV HIFI LOU Radiator PT1000 T932 1 1 13K, 370K ± 1K 13K, 370K ± 1K 

CVV HIFI LOU Radiator PT1000 T933 1 1 13K, 370K ± 1K 13K, 370K ± 1K 

CVV HIFI LOU WG near LOU PT1000 T934 1 1 13K, 370K ± 1K 13K, 370K ± 1K 

CVV HIFI LOU WG near LOU PT1000 T935 1 1 13K, 370K ± 1K 13K, 370K ± 1K 

GRO 

Functional Measurement Table 

Cryostat Instrum 

component ent 

Mounting Position 

Sensor 

Type 

Acronym 

UND 

CCU Measurement EGSE Measurement 

Table 5.7.4-4 :HPLM temperatures relevant to Instruments monitored by CCU 

5.8 OPTICAL INTERFACES 

5.8.1 Herschel Instruments 

5.8.1.1 Herschel Telescope Interfaces 

The Herschel telescope is described in chapter 4.3.1, and the telescope Mechanical and optical ICD is now 

included in Annex 11. 





DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-71/136 

The optical interfaces are controlled via a set of mechanical interfaces defined w.r.t. spacecraft co-ordinates. 

The focal plane units will be mechanically mounted to the Herschel optical bench. This optical bench is 

aligned to the telescope in accordance with the alignment requirements as defined in Annex 1. Optical bench 

and telescope will be aligned to the same reference cube, mounted at the CVV. 

5.8.1.1.1 Optical Interface Requirements 

The following optical interface requirements will be fulfilled by the telescope: 

− pupil: limited by the secondary reflector 

− aperture stop: at the secondary mirror 

− unvignetted telescope field of view: +/- 0.25° 

− linear central obscuration: about 8.7% (Eliptical hexapod legs & small scatter cone) 

− system f/D (D = effective aperture): 8.68 

− diffraction limits of telescope: at 150 microns (goal: 80 microns) 

− relative spectral transmission: 97% at BOL 

− maximum operational temperature: 70K



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-72/136 

Over the entire FOV at angular distances 3' from the peak of the point-spread-function (PSF), the straylight 

will be: < 1.10 -4 of PSF peak irradiance (in addition to level given by diffraction). 

Self-emission 

The straylight level, received at the defined detector element location of the PLM/Focal Plane Unit Straylight 

model by self emission (with «cold» stops in front of PACS and SPIRE instrument detectors), not including 

the self emission of the telescope reflectors alone, should be < 10 % of the background induced by selfemission 

of the telescope reflectors. 

However the Herschel straylight requirement of 10% will not be fullfilled (see rd83) PACS: 25.3% SPIRE: 

13.1% (worst case temperatures & emissivities). 

5.8.1.3 CVV Windows 

The CVV will provide seven optical windows with 34 mm free aperture for the LOU beams to the HIFI FPU 

(see figure below, and annex 6 for ICD). 

In addition two optical windows with 34 mm free aperture will be provided in order to allow LOU-FPU 

alignment measurements. 

Figure 5.8.1-1: Design and layout of cryostat vacuum feedthroughs 

The LOU windows spacing is designed to be 50mm at operating temperature. 

This valid for LOU, LOU base plate (both with a spacing of 50.168mm at room temperature, giving 50mm @ 

130K) , and CVV (spacing of 50.2mm at room temperature, giving 50mm @ 70K). 

The HIFI FPU has a spacing of 50mm at room temperature, however, it is 

fully compatible with the interface definition at operating temperature. 

This mismatch is identified by both parties and is taken into account with the following: 

− The misalignment at FPU level will be compensated by adjustments of parts inside the FPU. 





DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-73/136 

− the position of the LO optical alignment devices on the FPU are compliant with the 50mm spacing at 

operating temperature (location 200mm each from the centre, at operating temperature)." 

In addition, The diameter of the CVV windows is now 34mm, to cope with CVV manufacturing tolerances, 

and LOU unit alignment, and guarantee a 30mm LO beam 

5.8.2 Planck Instruments 

5.8.2.1 Planck Telescope Interfaces 

The Planck telescope is described in chapter 4.4.1. Further interface relevant characteristics are: 

The telescope operates at a temperature between 45K and 60K. 

The Planck telescope is an offset Aplanatic telescope. Its main characteristics are: 

− focal length: 1800 mm 

− maximum field of view: ±5° 

− optical quality: tbd variation w.r.t. the ideal 

− positioning of optical elements: 

• the position of the optical elements especially the secondary versus primary and the focus 

position are given in Figure 5.8.2-1 below 

The telescope LOS will remain within 0.5° of the nominal direction considering the mechanical, thermal and 

radiation environment. 

The optical interfaces are controlled via a set of mechanical interfaces defined w.r.t. spacecraft co-ordinates. 

The focal plane unit will be mechanically mounted to the Planck telescope support. 

The FPU actual average focal surface - with regards to which the FPU alignment at telescope focus will be 

made - is the surface which: 

has the same shape than the theoretical one 

is shifted along ZRDP of the distance D, D being defined hereafter: 

D = 

 

1 

horn hi 

i 


 

di 

α 

horn i 

where the weighting factor α i is the optical system WFE degradation requirement: 

Horn frequency Weighting factor 

LFI-30 GHz 119 

LFI-44 GHz 92 

LFI-70 GHz 92 

LFI-100 GHz (deleted) 83 

HFI-100 GHz 72 






1 

α


Horn frequency Weighting factor 



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-74/136 

Figure 5.8.2-1: Planck Telescope Positioning of Optical Elements 

di is the difference between the actual (focal surface for a given environment) horn hi phase centre Zrdp coordinate 

and its theoretical Zrdp co-ordinate 




FPU average 

focal surface 

horn h 1 phase center 

horn h 2 phase center 

horn h i phase center 

Zrdp 

d 2 

D 

d i 

d 1 

FPU theoretical 

focal surface 


DATE : 12/02/2004 

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The required position and knowledge of the horns with regards to this surface, and the maximum distance D 

allowed, are given in the Planck Alignment Plan (cf AD 7-2) 

Each horn shall be manufactured such that the WFE induced by the difference between actual far field 

pattern and the theoretical one, is lower than requested by the following table: 

Horn frequency Maximum degradation due to horn manufacturing 

WFE (microns) Gain (via Ruze formula) (1.E-2) 

LFI-30 GHz 16 (TBC) 0.04 

LFI-44 GHz 13 (TBC) 0.05 

LFI-70 GHz 13 (TBC) 0.08 

LFI-100 GHz (deleted) 10 (TBC) 0.09 

HFI-100 GHz 10 (TBC) 0.09 

HFI-143 GHz 8 (TBC) 0.1 

HFI-217 GHz 8 (TBC) 0.16 

HFI-353 GHz 5 (TBC) 0.16 

HFI-545 GHz 5 (TBC) 0.248 

HFI-857 GHz 5 (TBC) 0.39 

5.1.1.2 Planck Straylight 

The Straylight is defined for the Planck instruments as the radiative power that reaches a detector within its 

RF bandwidth, and that does not originate from sources close to the main beam. 

For Planck, the detectors consist of either bolometers or HEMT amplifiers. Straylight induces a signal in the 

detector that is indistinguishable from signals induced by sources close to the far field of the main beam. 

Variations in straylight are a source of noise in the detector (the Straylight Induced Noise, or SIN) that cannot 





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be separated from intrinsic detector noise or from variations in the sources of interest (those in the main 

beam). 

Straylight coming into the focal plane can have two distinct origins: 

Sources external to the spacecraft in the far-field of the telescope 

Spacecraft self emission sources 

Sources external to the spacecraft in the far field of the telescope 

External straylight in the millimetre and sub-millimetre wave range is dominated by four extremely bright 

sources: the Sun, the Earth, the Moon and the Milky Way. Large angle off-axis rejection is determined mainly 

by the telescope shield’s shape and size. 

The system rejection at the detectors for Sun, Earth, Moon at worst case locations will be , at least : 

− 30 GHz : -91 dB , -78 dB and -71 dB respectively. 

− 100 GHz ( HFI ) : -91.5 dB ( -99 dB ), -78.5 dB ( -86 dB ) and -71.5 dB ( -73 db ) respectively 

− 353 GHz : -92 dB ( -108 dB ), -79 dB ( -95 dB ) and -72 dB ( -81 dB ) respectively. 

− 857 GHz : -98 dB ( -122 dB ), -85 dB ( -109 dB ) and -78 dB ( -95 dB ) respectively. 

Note: 1 ) The requirement for the Milky Way is of order –65 dB from peak but is driven by the telescope in 

free-standing configuration. 

2 ) The values between brackets shall be taken as goals 

The telescope free standing configuration shall be clearly defined. 

To cover the rejection specification, the following activities are planned at ASPI : 

- Computation of the radiation pattern over all directions with an adequate meshing for each frequencies for 

the telescope associated to the baffle, the 3 grooves, the SVM panels and the solar area 

- RF measurements of the radiation pattern over all directions with an adequate meshing, up to 353 GHz 

(and higher if feasible) for the telescope associated to the baffle and the groove 3. 

Spacecraft self emission sources 

Thermal emission from all components of the spacecraft (including telescope, FPU, shield, SVM, baffles etc.) 

produces a signal which is not easily distinguishable from signals due to sources in the main beam. The time 

variation of the straylight signal from these sources is due to fluctuations in the temperature of emissive 

components. 

The Amplitude Spectral Density ( ASD ) at the bolometer ( HFI ) or cold LNA ( LFI ) of any signal due to 

fluctuating thermal emission from a S/C element that couples radiatively into payload detectors , shall be as 

specified below for each of the five defined individual frequencies , taking into account the power transfer 

function between the radiating source and the detectors . 

The ASD ( in Watts / Hz ) of each frequency component between 0.01 Hz and 100 Hz shall be such that : 

Note : 

Frequency [ GHz ] ASD [ Watt / Hz ] 

30 < 3.4 E-18 X 

100 ( LFI ) (deleted) < 1.1 E-17 X 

100 ( HFI ) < 2.1 E-18 X 

353 < 1.8 E-18 X 

857 < 2.2 E-17 X 

X is equal to one for any frequency component fo of the fluctuation source synchronous with the Planck 

S/C spinning rate ( i.e. multiple of f.spin = 1 / 60 Hz ). 





DATE : 12/02/2004 

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Otherwise , X = ( B * t.obs * Delta.f ) , where Delta.f = fo – k * f.spin and k is chosen to minimise Delta.f . 

t.obs = 3600 * FWHM / 2.5 arcmin , and FWHM is the angular resolution of the antenna radiation pattern in 

arc minutes . 

In order to enable calculation of the straylight, the position, orientation and beam characteristics of the five 

horns in the focal plane at 30 ,100 , 353 and 857 GHz, together with their frequency bandwidth are as 

follows 

Parameters defining the horns: 

The tables below give the characteristics of the realistic corrugated Horns that will be used for the verification 

of the Planck straylight analysis. 

horn-identifier x (mm) y (mm) z (mm) phi (deg) theta (deg) psi (deg) 

HFI 857 0 0 0 0 0 0 

HFI 353 -2.74E+01 -5.99E+01 1.50E+02 165.70 30.57093 -1.92 

LFI 100 

(deleted) 

-8.97E+01 8.07E+01 1.18E+02 -156.24 23.90021 1.84 

LFI 30 -1.25E+02 1.23E+02 9.08E+01 -141.78 22.32231 2.15 

Positions of the horns in the global coordinate system 

Horn-identifier taper 

(db @22 deg) 

aperture D (mm) Beamwidth (deg) 

HFI 857 -36 8.2 3.5 

HFI 353 -36 8.2 8.4 

LFI 100 

(deleted) 

-30 19.5 11.4 

LFI 30 -30 51 15.5 

Electromagnetic parameters defining the horns 

5.9 POWER 

5.9.1 Thermal Dissipation on Herschel Payload Module interfaces. 

The average thermal dissipation requirement) supported by the spacecraft at the different interface levels of 

the Herschel Payload module are defined in the tables below. A distinction is made between lifetime 

calculations and thermal link design. 

The averaging shall be made over instruments observing time sharing and instrument modes. 

It shall correspond to the heat leak from an instrument thermal interface to the corresponding spacecraft 

interface level (0, 1, 2, or 3), taking into account an average for all 3 instruments (~1/3 of the proposed 

budget can be allocated per instrument, exact duty cycle in table 5.9.1-2), and average over instrument 

modes and dissipation timelines) 

The following average dissipation values will be used for lifetime predictions only. 




Level Average dissipation [mW] 

Level 0 10 

Level 1 25 

Level 2 35 

Level 3 15 


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Table 5.9.1-1 :Power dissipation alloawed on HerschelOBA thermal interfaces 

The instruments modes are averaged using the following assumptions: 

Instrument usage 

SPIRE PACS HIFI 

status ON Stdby Total ON Stdby Total ON 

Stdby Total 

duty cycle 1/3 

2/3 # 1/3 

2/3 1 

1/3 

Mode PHOT SPEC PARALLEL OFF Total PHOT SPEC PARALLEL OFF Total Chan 1 Chan 2 Chan 3 Chan 4 Chan 5 Chan 6 OFF Total 

duty cycle 7/48 7/48 1/24 2/3 # 7/48 7/48 1/24 2/3 1 1/21 1/21 1/21 1/21 1/21 2/21 2/3 1 

Astrium Modes 

Assumption: 

3 4 6 2 1 6 5 5 5 5 5 5 

Even distribution for the 3 instruments (1/3 each) 

Even distribution between instruments modes (Spetrometer / Photometer mode for PACS & SPIRE, Chanels 1..6 for HIFI) 

3 months allocated to parallel mode (PACS + SPIRE, ie 1/12 of the mission, as part of PACS & SPIRE time (ie 1/24 taken from each of their allocation) 

HIFI Channel 6 is composed of 2 sub-channels, so there are effectively 7 channels 

Table 5.9.1-2 :Estimation of instruments and modes duty cycles, based on equal distribution between 

instruments, then between instruments modes, and assuming a total of 3 months in PACS/SPIRE 

parallele mode. 

The dissipation of the Herschel instrument FPU on various levels is estimated via the instrument FPU 

thermal models (annexed in each IID-B), using the Herschel H-PLM thermal model (ref RD 81 (PFM) & 

RD82 (EQM). 

The average dissipation on interfaces levels &, 2, and 3 have been estimated based on the typical transient 

dissipation of each instrument, and a (typical) timeline and sequencing of the instruments (ref RD 81, section 

7.4.4). This is the sum of all contributions (dissipation on each levels + conductance between levels). 

Level Average Instrument heat 

flow on level [mW] 

Level 0 12.2 

Level 1 34.3 

Level 2 -1.4 

Level 3 10.6 

Table 5.9.1-3 :Estimation of instrument average power dissipation on levels 0, 1, 2, 3, based on 

typical timeline. 

5.9.2 Thermal Dissipation on Planck Payload Module 

The maximum thermal dissipations supported by the spacecraft at the different interface level of the Planck 

Payload module are defined in the table below. 

Guaranteed temperatures range on shield (in operating mode) 




3rd V-Groove 2nd V-Groove 1st V-groove 

Min 45 100 150 

Max 60 120 170 


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Table 5.9.2-1 :Temperature range requirements for V-Grooves 1, 2, and 3. 

Temperature to be used for instrument heat load estimation (boundary) 

Design 

temperatures: 

3rd V-Groove 2nd V-Groove 1st V-groove 

LFI 52 106 166 

HFI 50 110 165 

SCS 52 108 158 

Table 5.9.2-2 :Typical Temperature to be used for heat exchangers heat load estimation V-Grooves 1, 

2, and 3. 

Heat Load Allocation on 3rd V-Groove estimated for above temperatures 

Heat Loads 3rd V-Groove 2nd V-Groove 1st V-groove Desig margin 

margin (**) 

HFI 620 20 50 20% 

LFI 710 560 5370 20% 

SCS 1175 453 581 10% 

Total 2505 1033 6001 

(**) Margin used by Alcatel on instrument heat loads to estimate prediction error) 

Table 5.9.2-3: Maximum thermal dissipation on the Planck Payload Module 

These Heat losses allocations are Maximum Values acceptable by the Planck Payload. 

This mean that the instrument estimated dissipations or losses should include 20% of design margin before 

reaching these values. 

With these allocations, the calculated temperature at the sorption cooler interface is 52K ±7K 

5.9.3 Thermal Dissipation on Herschel Service Module 

The maximum and minimum thermal dissipations supported by the Herschel spacecraft at the interface level 

of the warm boxes to the HSVM are defined in the table below. 

Instrument 

Maximum 

Average load 

[W] 

Maximum 

Peak load 

[W] 

Maximum 

Peak Energy 

[Ws] 

HIFI 315 NA NA NA 



Stability of Load 

[W/s] Remarks

Instrument 


Maximum 

Average load 

[W] 

Maximum 

Peak load 

[W] 

Maximum 

Peak Energy 

[Ws] 

PACS 125 NA NA NA 

SPIRE 110 NA NA NA 

Total 550 


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[W/s] Remarks 

Table 5.9.3-1: Maximum and minimum thermal dissipation of warm boxes on HSVM. 

5.9.4 Thermal Dissipation on Planck Service Module 

The maximum and minimum thermal dissipations supported by the Planck spacecraft at the interface level of 

the warm boxes to the PSVM are defined in the table below. 

Instrument 

Maximum 

Average load 

[W] 

Maximum 

Peak load 

[W] 

Maximum 

Peak Energy 

[Ws] 

LFI 120 NA NA NA 


[W/s] Remarks 

Sorption Cooler 570 1200 NA NA Thermal design 

is based on 

620W 

dissipation 

HFI 310 NA NA NA 

1000 

Table 5.9.4-1: Maximum and minimum thermal dissipation of warm boxes on PSVM 

5.9.5 Power Supply - Load on main-bus 

The total electrical power provided by the spacecraft to the instruments will be limited as in the following 

Table 5.9.5-1: 

Spacecraft Instrument 

Maximum 

Power 

[W] 

Herschel SPIRE 110 

Herschel PACS 125 

Herschel HIFI 315 

Total 550 

Planck LFI 120 

Planck Sorption Cooler 570


Spacecraft Instrument 


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Maximum 

Power 

[W] 

Planck HFI 310 

Total 1000 

Table 5.9.5-1: Loads on Main Bus 

Peak power, as defined in 5.9.1.6 below, shall be given in the IID-Bs.The Power lines between the PCDU 

and the instrument warm units will be implemented according to the following scheme. The definition of the 

LCL classes are defined below in section 5.9.5.4. More information about LCL's can be found in the GDIR 

(RD 1) 

Planck Allocation To Type Protected Class 

LFI DAE Nom PLBEU LCL YES III 

LFI DAE Red PLBEU LCL YES III 

LFI REBA Nom PLREN LCL YES II 

LFI REBA Red PLRER LCL YES II 

HFI DCE DCE LCL NO II 

HFI DPU Nom (PHBA-N) PHBAN LCL YES II 

HFI DPU Red (PHBA-R) PHBAR LCL YES II 

HFI REU belts group 0&1 PHBAR LCL NO II 



HFI REU belts group 6&7 PHBAN LCL NO II 



HFI REU Proc Nom PHCBC LCL YES I 

HFI REU Proc Red PHCBC LCL YES I 

HFI 4KC Drive bus Nom PHDC 10A-LCL YES 10A 

HFI 4KC Drive bus Nom PHDC 10A-LCL YES 10A 

HFI 4KCDE Nom (PHDC) PHDC LCL NO II 

HFI 4KCDE Red (PHDC) PHDC LCL NO II 

Sorption Cooler Compressor Nom PSM4 20A-LCL YES 20A 

Sorption Cooler Compressor Red PSR4 20A-LCL YES 20A 

Sorption Cooler Electronics Nom PSM4 LCL YES III 

Sorption Cooler Electronics Red PSR4 LCL YES III 

Table 5.9.5-2: List of Planck Instruments LCL's. 





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Herschel Allocation To Type Protected Class 

HIFI HRH FHHRH LCL YES III 

HIFI HRV FHHRV LCL YES III 

HIFI ICU Nom FHICU LCL YES III 

HIFI ICU Red FHICU LCL YES III 

HIFI LCU Nom FHLCU LCL YES III 

HIFI LCU Red FHLCU LCL YES III 

HIFI WEH FHWEH LCL NO II 

HIFI WEV FHWEV LCL NO II 

PACS BOLC Nom FPBOLC LCL YES II 

PACS BOLC Red FPBOLC LCL YES II 

PACS DPU Nom FPDPU LCL NO II 

PACS DPU Red FPDPU LCL NO II 

PACS MEC1 FPMEC1 LCL YES II 

PACS MEC2 FPMEC2 LCL YES II 

PACS SPU Nom FPSPU1 LCL NO II 

PACS SPU Red FPSPU2 LCL NO II 

SPIRE HSDPU Nom FSDPU LCL YES I 

SPIRE HSDPU Red FSDPU LCL YES I 

SPIRE HSFCU Nom FSFCU LCL YES III 

SPIRE HSFCU Red FSFCU LCL YES III 

Table 5.9.5-3: List of Herschel Instruments LCL's. 

Note 1 : Protected LCL's are protected against failure ON (includes double switch to switch off in any case) 

Note 2: 10A (resp. 20A) LCL's are obtained by combining 2 (resp 4) LCL's inside the PCDU 

5.9.5.1 Bus voltage 

The spacecraft power supply subsystem will provide: The distribution, protection and switching of a 28V DC 

main power bus to the users. 

Each of the scientific instruments will have to incorporate its own converter(s) (compatible with the main bus 

characteristics) to generate the required secondary voltages. 

5.9.5.2 Main Bus characteristics 

The instruments shall be designed to operate with nominal performance within the following steady state 

voltage limits: 

Line Minimum Voltage Maximum Voltage 





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Line Minimum Voltage Maximum Voltage 

Power Bus 26 V 29 V 

Table 5.9.5-4: Bus Voltage 

For the Planck sorption cooler 20A LCL, this range can be reduced to 26V to 27.5V. 

In addition, all the users of these power lines shall safely survive any standing or fluctuating voltage in the full 

range 0 V to 35V (failure case, less than 1mn TBC). 

5.9.5.3 Dynamic behaviour 

5.9.5.3.1 Transient 

The equipment shall operate with nominal performance when subject to a transient superimposed on the 

steady state bus as described in paragraph 5.14.3.8. This requirement accounts for potential transients 

caused by remote equipment's (susceptibility). 

5.9.5.3.2 Ripple and Spikes 

The ripple and spikes shall be less than (at Distribution Unit output connectors): 

300 mV peak to peak on 28 V lines. 

This peak to peak value is defined in a 50 MHz bandwidth 

This should be regarded as information of the PCDU power outputs CE, not as a CS requirement. The CS 

requirements on the power lines are defined in § 5.14. 

5.9.5.4 Power Distribution 

Power is switched and distributed to instruments on protected output lines by means of Latching Current 

Limiters [LCL’s]. 

If the LCL limitation level is exceeded the LCL will limit the current and reduce the voltage at that user’s 

input. Therefore, except for the inrush, the user’s instantaneous current demand shall never exceed the 

limitation level of the related LCL. If the limitation extends beyond the LCL trip-off time, the LCL will trip off 

and power will be disconnected from that user. 

Use of fuses shall be avoided. If absolutely needed, use of fuses shall be justified and request submitted to 

ESA for approval. 

LCL Type Iclass Ilimit min = 1.2 Iclass Ilimit max = 1.5 Iclass Iover-shoot Ttrip min Ttrip max 

Class I 1 A 1.2 A 1.5 A 2.25 A 10 ms 12 ms 

Class II 2.5 A 3.0 A 3.75 A 5.63 A 10 ms 12 ms 

Class III 5 A 6.0 A 7.5 A 11.25 A 10 ms 12 ms 

Table 5.9.5-5: Definition of the LCL classes 



5.9.5.5 Bus Impedance 


The bus impedance mask at the user interface is: 

Ohms 

100E+0 

10E+0 

1E+0 

100E-3 

110 mΩ 

2 kHz 

130 mΩ 


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ISSUE : 3.1 PAGE :5-84/136 

1E+0 10E+0 100E+0 1E+3 

Frequency (Hz) 

10E+3 100E+3 1E+6 

Figure 5.9.5-1: Bus impedance vs. Frequency 

+20 dB/decade 

(10 µH) 

Each instrument shall not be susceptible to voltage transients induced by its own current transitions, when 

connected to a 28Vdc voltage source (+2%, -1%) with the output impedance reported above. This 

requirement shall be verified during the electrical functional testing. 

5.9.5.6 Power Demand 

5.9.5.6.1 Average 

The average power is defined for an equipment as the maximum average power drawn from its dedicated 

power lines in the worst case conditions. 

The maximum average is defined as the average during a period of 5 minutes shifted to any point in time 

where this average will yield a maximum and does not include peak power defined hereafter. 

5.9.5.6.2 Long Peak 

To be defined as a long peak, the power demand shall last less than 5 minutes per 24 h (cumulated duration 

of individual peaks if any) and more than 100 ms. 

The peak value is defined as the integral mean during a period of 100 ms shifted to any point in time where 

the integral will yield a maximum. 



5.9.5.6.3 Short Peak 



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To be defined as a short peak, the power demand shall last less than 100 ms. 

The peak value is defined as the integral mean during a period of 1 ms shifted to any point in time where the 

integral will yield the maximum. 

5.9.5.6.4 Inrush Current 

The LCLs used in the power subsystem (equipments and instruments power supply lines) shall have the 

following characteristics: 

− Except during the first 50 ms of operation (ie switch on or entry into protection mode), the current 

limitation shall be set at a value Ilimit in the range Ilimit min < Ilimit < Ilimit max . Class of the LCL, 

corresponding Iclass , Ilimit min and Ilimit max are defined in Table 5.9.5-5 

− If the current exceeds Ilimit for a time greater than Ttrip , then the LCL will automatically switch-off . 

− During the first 50 ms of operation (ie switch on or entry into protection mode), the overshoot current 

Iovershoot shall not exceed Ilimit by more than 50% (see Figure 5.9.5-2). 

− The LCL shall have a power bus under-voltage detector. 

− The LCL under-voltage threshold shall be settable during manufacture between 21 and 26 V with an 

accuracy better than ± 0.25 V. 

− If the power bus voltage falls below the under-voltage threshold for more than 50 ms, then the LCL 

shall be latched off. 

− It shall be possible to determine the status of each LCL via the 1553 data bus, including ON/OFF 

condition, latch status and output current (accuracy ± 5%). 

Figure 5.9.5-2 gives the nominal current envelope. 



CURRENT 



DATE : 12/02/2004 

Normal switch ON characteristic Failure handling characteristics 

50 µs 

T trip 

ISSUE : 3.1 PAGE :5-86/136 


50 µs 

Figure 5.9.5-2: nominal current envelope for LCL switching 

T trip 


I limit 

I nom 

I overshoot 

I limit max 

I limit min 

The inrush current requirements applicable to the Instruments in terms of test conditions and success criteria 

are specified in § 5.14.7. 

5.9.5.6.5 Load Current Transitions 

The instantaneous rate of change (dI/dt) shall not exceed 5.10 4 A/s. Pulse repetition frequency shall not 

exceed 1 Hz unless confined to the limits of admissible ripple current. 

5.9.5.6.6 Initial Electrical Status 

After being switched OFF for a minimum period of 10 sec and when switched on, equipments shall have an 

initial electrical status (except for latching relays if used), which is reproducible and identified 

This status shall be safe; i.e. no degradation of nominal performance shall be caused if this initial status is 

kept for an unlimited time. 

5.9.5.6.7 Interface Circuits 

NA 

I class 

TIME


5.9.5.7 Instrument Converter Synchronisation 


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The converters shall be free running at nominal frequency 131kHz +/-10%, except for HIFI (550kHz, ref HP- 

HIFI-CR-0055).. 

5.9.5.8 Pyrotechnic Devices 

NA 

5.10 CONNECTORS, HARNESS, GROUNDING, BONDING 

5.10.1 Connectors 

Connectors provide a low-impedance path for all wires and a low-impedance bond when an outer shell is 

used. The demating of any connector shall not cause the loss of the mission (exceptions, if any, have to be 

agreed with Alcatel). 

5.10.1.1 Connector types 

5.10.1.1.1 Warm connectors 

For non-coaxial signal connections at non-cryogenic temperatures SCC 3401 connectors of type DxMA are 

defined. (x = A, B, C, D or E). If the use of these connectors cause volume and mass constraints then Hidensity 

type connectors could be used after agreement with Alcatel 

Power connections can use either the CANNON-ITT connectors of type DxMA (x = A, B, C, D or E) or 

circular connectors e.g. type 38999 series II. 

5.10.1.1.2 Herschel cryo-harness connectors 

At cryogenic temperatures micro-connectors SCC 3401-02923 (cannon) will be used on instrument side and 

mated to MWDM connectors (Glenair) on spacecraft harness side. 

It is understood that only for micro-connectors the pin-type is the protected one instead of the socket. 

A qualification program in running to qualify the connection "MWDM Glenair" to "MDM Cannon" at cryogenic 

temperature. 

For coaxial connections on the FPU (HIFI IF coax cables), 50 ohms Male SMA coax connectors are used 

5.10.1.2 Connector characteristics 

The following connector characteristics shall apply: 

− Connectors shall be clearly identified to prevent incorrect mating. 

− The housing of connectors shall be electrically connected to the connector shell. 

− Flight-quality connectors shall be protected against frequent mating/demating operations by 

connector savers. These savers shall be supplied with the instrument. 

− Connectors shall be mechanically locked to prevent inadvertent disconnection as part of the final 

integration process. 





DATE : 12/02/2004 

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− All units shall use dedicated connectors for the different signal categories as defined in chapter 

5.10.2.4 

− Separate connectors shall be used for each of the redundant system, subsystem or unit branches. 

− Cross-strapping shall be allowed 

5.10.1.3 Connector mounting 

Equipment and bracket mounted connectors shall be located in easily accessible positions. 

The physical position is to be indicated on the External Configuration Drawings and must be compliant with 

the minimum distances between connectors and mounting plane as given in Figure 5.10.1-1. 

Any additional specific requirements (e.g. minimum distance between two units facing each other) shall be 

identified in the IID-B by the instrument. 

Note : It is recommended that a 16mm clearance between baseplate and lower edge of the connector is 

maintained to ease accessibility during instrument integration activities. 

Connector pitches shall be designed to accommodate connector backshells. 

Figure 5.10.1-1: Minimum distances between connectors 

Note 1: 7mm spacing is generic for all connectors (to allow screw driver access. These dimensions are 

compatible with backshells. 

Note 2: Not applicable for microconnectors. 



5.10.2 Harness 

5.10.2.1 Harness types 


Harness interfacing the instruments and the spacecraft can be of 3 types: 


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− Spacecraft harness, connecting the instruments warm units to the spacecraft power and data buses 

− Instrument Warm Interconnecting Harness (WIH), connecting instrument warm units together 

− Cryoharness, connecting warm units to FPU, or cold units (Herschel HIFI LOU, PACS BOLA, Planck 

HFI JFET) 

5.10.2.2 Harnesses responsibilities 

The responsibility for procurement of the harness is as follows: 

Item Procurement Responsible Routing 

Spacecraft Harness Alenia Alenia (Nexans) 

Instrument Warm Interconnecting 

Harness (WIH) 

Instruments Alenia (Nexans) 

Cryoharness Herschel Astrium Astrium 

Planck Instruments Instruments 

Table 5.10.2-1: Harnesses responsibilities 

Concerning the design , routing and attachment, the routing of the harness routed in the SVM (S/C harness 

and WIH) is proposed by the SVM architect Alenia. 

The design and routing of the Herschel cryoharness is made by Astrium. The interface between cryoharness 

and warm units is at the warm unit connector. 

The following tables give the detailed responibilities for each parts related to Harnesses. 

ITEM 

purposes 

Preliminar 

y Definition 

Approval 

of prelim. 

Def. 

Detailed 

definition 

Approval 

before 

procureme 

nt 

Instrum.+AS 

PI 

Procureme 

nt 



Integration 

Herschel 

Integration 

Planck 

Routing (harness routing, 

length & support definition). 

ALS 

ASPI / 

Instrum 

ALS. 

Harness : 

Instrum 

ASED ASPI 

WIH connectors to WUs Instrum. N/A Instrum. N/A Instrum. ASED ASPI 

Attachment part on SVM 

(paint free areas, tie-bases, 

insert, support, screw). 

ALS 

ASPI / 

Instrum 

ALS N/A ALS ALS ALS 

Attachment part on WIH (tie- 

WIH - 

wraps). 

Instrument 

Warm Harness supports on WU. 

Interconne 

ct Paint free areas on WU 

Harnesses 

ALS 

ALS 

ALS 

ASPI/Instru 

m 

ASPI/Instru 

m 

ASPI/Instru 

m 

ALS 

ALS 

ALS 

ASPI/Instru 

m 

ALS 

ALS 

Instrum 

ASED 

ASED 

N/A 

ASPI 

ASPI 

NA 

(procured 

Brackets (including brackets 

by 

grounding) for instruments 

Instrument 

panels dismountability 

s) 

ALS 

ASPI/Instru 

m 

ALS N/A ALS ALS ALS 

WIH intermediate connectors 

on brackets (disconnection 

needed for handling of panels). 

Instrum Instrum Instrum N/A Instrum ASED ASPI 

Brackets fixation screws. N/A N/A ALS N/A ALS ALS ALS 

Brackets fixation inserts on 

SVM. 

N/A N/A ALS N/A ALS ALS ALS

ITEM 


Table 5.10.2-2: WIH detailed responsibilities 

Preliminar 

y Definition 

Routing ALS 

Approval 

of prelim. 

Def. 

ASPI/Instru 

m 


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ISSUE : 3.1 PAGE :5-90/136 

Detailed 

definition 

Approval 

before 

procureme 

nt 

ALS N/A 



Procureme 

nt 

Harness : 

ALS 

Integration 

Herschel 

SVM 

Connecting brackets on SVM lower 

harness, 

platform (including brackets 

ALS ALS ALS N/A ALS ALS 

(procured 

grounding). 

by ALENIA) 

ASPI/Instru 

ASPI/Instru 

: Power WU Connectors. ALS 

ALS 

ALS ALS 

m 

m 

and 1553 

Fixation of harness on SVM 

Harnesses 

(inserts, paint-free areas support, ALS ASPI ALS N/A ALS ALS 

from 

screw, tie-wraps & tie-bases). 

PCDU/CDM 

SVM harness supports on WU and 

ASPI/Instru 

U up to 

ALS 

ALS N/A ALS ASED 

paint-free areas (if necessary) 

m 

Warm 

Brackets fixation screws. N/A N/A ALS N/A ALS ALS 

Units 

ITEM 

Brackets fixation inserts on SVM. N/A N/A ALS N/A ALS ALS 

Routing 

Table 5.10.2-3: SVM Harnesses detailed responsibilities 

SVM-PLM Connectors on Cryo 

brackets on SVM upper closure 

panels (including brackets 

grounding). 

Preliminar 

y Definition 

ASED 

(including I/F 

definition) 

ASED 

Approval 

of prelim. 

Def. 

Detailed 

definition 

Approval 

before 

procureme 

nt 

ALS/ASPI ASED N/A 

ASPI/Instru 

m 

Procureme 

nt 

Harness : 

ASED 

ALS 

Integration 

Herschel 

ASED 

N/A N/A ASED ASED 

Cryo-brackets on SVM upper 

Herschel Cryoclosure 

panels. 

Harnesses 

Cryo-brackets fixation screws 

(procured by 

Astrium) WU connectors. 

(including coax 

between HIFI WU connector backshells. 

3dB coupler 

and FPU) : 

Harness and Cryo Brackets 

Attachment part on SVM (inserts) 

ASED 

ASED 

ASED 

Instrum. 

ALS (after 

detailed 

routing of 

ASED) 

ALS / ASPI 

ALS / ASPI 

ASPI/Instru 

m 

ASED & 

ALS 

ALS 

ASED 

ASED 

N/A 

N/A 

ALS 

ALS / ASPI 

ALS / ASPI 

ASPI/Instru 

m 

ASED & 

ALS 

N/A 

ASED 

ALS 

ASED 

ASED 

ALS 

ASED 

ASED 

ASED 

ASED 

ALS 

Harness Attachment part on CVV ASED ASED ASED ASED ASED ASED 

Attachment part on harness 

(support, screw, tie-wraps & tiebases, 

paint free areas). 

ASED 

Instrum. & 

ALS 

ASED 

Instrum. & 

ALS 

ASED ASED 

Table 5.10.2-4: Herschel Cryo-Harnesses responsibilities

ITEM ITEM 

Planck 

Cryoharness 


Preliminar 

y Definition 

Approval 

of prelim. 

Def. 

Detailed 

definition 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-91/136 

Approval 

before 

procureme 

nt 

Procureme 

nt 





HFI Bellow routing ASPI HFI ASPI HFI ASP 

HFI bellow fixation on 

PPLM 

20K cooler harness from 

SCC (on pipes) 

20K cooler harness drom 

SCE 

4K cooler harness (on 

pipes) 

0.1K cooler harness (on 

pipes) 

5.10.2.3 S/C harness 

HFI ASPI HFI HFI ASP 

Instrum ASPI Instrum Instrum 




harness fixation on pipes Instrum Instrum Instrum 

harness connectors Instrum Instrum Instrum 

LFI cryoharness LFI ASPI LFI LFI 

LFI Wave-guides LFI ASPI LFI/ASPI LFI 

Table 5.10.2-6: Planck Cryo-Harnesses responsibilities 

Instrum. 

(integ on 

pipes) 

ASP (on 

brackets) 

Instrum. 

(integ on 

pipes) 

Instrum. 

(integ on 

pipes) 

Instrum. 

(integ on 

pipes) 

ASP (on 

brackets) 

LFI (on RAA 

& WG 

brackets) 

LFI (on RAA 

& WG 

brackets) 

The S/C harness provides the interconnection between the instruments and two other subsystems, i.e. the 

Power subsystem and the Data-handling subsystem. 

The harness will be part of the SVM, delivered through the S/C contractor, manufactured to agreed 

standards and specifications, compatible with the characteristics of the source and destination. A so-called 

harness list specifies source and destination to the level of unit, connector and pin. 

Instrument teams will have to provide their inputs to the harness list by pin function definitions for instrument 

connectors to the Power and the Data Handling subsystems. 

Pin functions will be defined in part B of the IID’s (AD 1-1 to 1-6). 

Some general design criteria are given in 5.10.2.4 

5.10.2.4 Instrument harness 

The Instruments «warm Interconnecting Harness» (WIH), i.e. the interconnect harness between the various 

«warm» instrument units will be delivered by the instrument teams, manufactured to agreed standards and 

specifications, compatible with the characteristics of the source and destination. 

Instrument teams will have to provide a harness list, which specifies source and destination to the level of 

unit, connector and pin. These harness lists including the relevant requirements are defined in part B of the 

IID’s (AD 1-1, 1-2, 1-3). 

WIH routing will be provided by industry. 

Instrument WIH routing is included in annex 10.



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-92/136 

Instrument will have to manufacture WIH according to this definition. CAD models are delivered together with 

this definition. 

For instrument whose units are on a single panel, the warm interconnecting harness is in one piece. 

For instruments having units on several panels, connected together with WIH (HIFI, HFI, and LFI), the WIH 

will have to be split into 3 parts to allow integration of the fully equipped panel: 

− 1 piece routed on each panel from warm units to a connector bracket located on the SVM lower 

platform. 

− 1 piece routed on the SVM lower platform. 

WIH fixation on warm units is described (Tie raps) as a result of an agreement with instruments. 

These devices will have to be glued on Warm units. Therefore non painted areas have to be foreseen on 

these locations. 

The wave-guides between the Herschel HIFI LOU unit at the Herschel CVV and Local Oscillator Source Unit 

on the SVM are part of the spacecraft (cryoharness) and are defined in the relevant section of this document. 

(see annex 6 HPLM ICD's). 

5.10.2.5 Cryo harness 

5.10.2.5.1 Herschel Cryoharness 

For Herschel, the interconnect cryoharness harness between the cold units (FPU’s, JFET modules, Herschel 

CVV mounted units) and the «warm» SVM units of the instruments, the cryo harness, will be manufactured 

and delivered through the Contractor, based on the requirements in chapter 5.10 of the IID-B’s (AD 1-1 to 1- 

3 ). 

The main reason is that it needs to be integrated much earlier than the instruments in the cryostat. 

This includes FPU cryoharness, LOU harness and LOU wave-guides. 

Provisions by instrument teams may be agreed on a case-by-case basis. 

Refere to annex 8 (cryoharness) for a summary of the cryoharness implementation, and to RD10 (PFM) and 

RD11 (EQM) for detail pin allocations. 

5.10.2.5.2 Planck Cryoharness 

ForPlanck, the cryoharness harness is delivered by the instrument. It consists in: 

− For HFI: the "bellow" between the PAU in the upper platform, and the JFET on the primary reflector 

panel (60K), and then the FPU (20K). Refere to fig 5.7.2-5 for routing of the bellow. 

− For LFI, a dedicated ribbon cable connecting the BEU to the FPU. This harness is routed together 

with the waveguides, on the waveguide structure, as an integrated package of the RAA. 

5.10.2.6 Design criteria 

Design criteria for the instrument and the cryo-harness are given in the following. 

Signals between subsystems can be divided into the following categories: 

− Supply lines from power source to the users. 

− Digital signals. 

− Signals sensitive with respect to EMC (analogue signals) 




− RF signals (HIFI coaxial) 

Signals of each of these categories shall be handled as follows: 


DATE : 12/02/2004 

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− Separation of categories shall be retained up to and inclusive of the interface connector 

− Separation of harness branches will be performed according to exp. signal classification 

− Separate bundles will be used for each of the redundant systems, subsystems and unit branches 

(not applicable for CVV internal harness) and on CVV external structures (Note: There is not enough 

space on the CVV stiffening rips to separate the C/H branches 

− All individual wires of one cable will be routed through adjacent connector contacts 

− For the cryoharness, each harness bundle is routed via a separate CVV Feedthrough connector 

− Twisted wires shall be routed through a connector on adjacent pins 

The number of different types of cables shall be minimised For Herschel, cable types used for the ISO 

mission shall be used as a baseline. 

Instruments shall provide free areas for fixation and routing of harness on instruments. The information shall 

be part of the unit configuration drawings. Forbidden areas shal be also identified. 

Instruments shall identify harness bundles to be separated , and critical connections shall clearly be 

identified: 

− signal 

− power 

− redundancy for harness routing 

− optical bench connectors and low number of CVV connectors 

The instruments shall identify harness bundle groups and EMC classes. 

The distance between the MDM connectors and space for mounting/dismounting, when it is still on the 

spacecraft, has to be taken into account. 

The harness requirements shall be provided in the format as shown in the table below gives the format for 

the harness specification (minimum information required). 

Id Name No. of 

wires 

No. of 

shields 

Max. 

Resistan 

ce 

Max 

capacita 

nce 

Max 

inductan 

ce 

Max 

Current 



Typical 

current 

Ohm F H A A 

Table 5.10.2-1: Cable requirement definition 

Duty 

Cycle 

Remark 

s 

Refer to annex 8, electrical & thermal performance tables to check this implementation of the cryoharness, 

as specified in IID-B's 

5.10.3 Grounding and Isolation 

5.10.3.1 Grounding Concept 

The local grounding concept of the Subsystem shall be «Distributed Single Point Grounding» (DSPG) 

system. As a consequence of this grounding philosophy one secondary power output shall not be distributed 

to more than one unit.

5.10.3.2 Return Path 



DATE : 12/02/2004 

The spacecraft structure shall not be used as return path for power and signals. 

5.10.3.3 Grounding to Structure 

ISSUE : 3.1 PAGE :5-94/136 

The grounding to structure shall not depend on the configuration of the electrical design. 

Commentary: The principle here is to realise a single point grounding of each independent power network 

and galvanic isolation between those networks. 

5.1.1.4 Isolation between Primary Power lines and the Structure of the Hosting 

Spacecraft 

Equipment using primary DC power shall maintain at least 1 MΩ DC isolation shunted by not more than 50 

nF between: 

− Primary power high line and structure. 

− Primary power return line and structure. 

before any grounding of the primary reference is made. 

5.1.1.5 Isolation between Primary Power lines and Secondary Power Lines 

Secondary power lines, inherently galvanic-isolated from the primary power by DC-to-DC converters or 

isolation transformers, shall maintain an isolation of at least 1 MΩ shunted with a capacity less than 50 nF 

between the primary power return lines and the secondary reference, before any grounding of the secondary 

reference is made. 

Commentary: In case DC-to-DC converters are manufactured «ad hoc» for specific applications, it is 

recommended to use static shields between primary and secondary windings of the transformer. It would 

reduce the capacitive coupling between primary and secondary side. This static shield should be connected 

to the chassis via a low inductance strap. 

5.1.1.6 Secondary Power Grounding 

Each user secondary power return shall be connected to a single ground (ground point/ground plane). This 

ground point/ground plane shall be connected to chassis. 

5.1.1.7 Grounding for Equipment Distributing Secondary Power 

When a single converter via multiple windings supplies one or more equipments, the secondary power 

network shall be grounded to a single location within the supplied unit(s). One secondary power output shall 

not be distributed to more than one unit. 

Deviation from the above requirement shall be assessed on a case by case basis and approved by the ESA. 




OK : 

NOT OK : 


DATE : 12/02/2004 

Figure 5.10.3-1: Secondary power output grounding rules. 

5.1.1.8 Secondary Power Reference Separation 

Deleted 

5.1.1.9 Secondary Power Lines Isolations 

ISSUE : 3.1 PAGE :5-95/136 

When the secondary power return is disconnected from the chassis, the isolation between the secondary 

power return and the equipment chassis shall be at least 1 MΩ shunted by not more than 50 nF. 

5.1.4 Bonding 

The bonding rules given below are fully applicable to the instrument units mounted on the SVM. For 

cryogenic units the rules given below shall be used as a reference, however, specific solutions can be 

implemented on a case by case basis. 

5.1.1.1 Fault Current 

Bonding provisions and bonding interfaces shall be designed to carry fault currents of 1.5 times the 

subsystem equipment protection device rating for an infinite time without damage and thermal hazard. 

Magnesium shall not be used as path for fault currents. 



5.1.1.2 Lifetime 



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Bonding provisions and bonding interfaces shall be designed to be corrosion resistant, i.e. to maintain their 

performance in the specified environment and operations for the specified lifetime. Bonding of dissimilar 

materials shall be avoided (same group in the electrochemical series) unless special precautions are taken 

to avoid stress corrosion. 

5.1.1.3 Direct and Indirect Bonding 

The use of conductive mounting surfaces (i.e. direct metal-to-metal contact) is the preferred method of 

bonding. Use of bonding straps (indirect bonding) shall be implemented in addition to the direct contact. 

5.1.1.4 Bonding of Equipment to Structure 

Instrument Warm Units cases shall be bonded to the structure of the hosting spacecraft via the equipment 

mounting feet. The contact area of the bottom side of each foot shall not be less than 1 cm2. The DC 

resistance between the equipment chassis and the hosting spacecraft structure shall not exceed 10mΩ. 

This level applies for both directions of polarity across the bond. 

5.1.1.5 Bonding of Equipment Thermally Insulated from the Structure. 

Equipment that must be thermally isolated from the spacecraft structure shall be equipped with a bonding 

strap as described in previous paragraph. 

The FHLOU is thermally isolated from the CVV. But electrically grounded to the SVM via the waveguides and 

cryo-harness shields. Bonding strap may not be used. 

5.1.1.6 Characteristics of the Bonding Surfaces 

Flat, clean and conductive surfaces shall be used for bonding. The permitted surface finishes are: 

− Clean metal (except magnesium) 

− Gold plate on the base metal 

− Alodine 1200 or similar according to MIL-C-5541 

Any other anti-corrosion finish (e.g. anodic film), grease, paint, lacquer and other high resistance properties 

shall be removed from the facing surfaces before bonding. 

Abrasives that may cause corrosion if embedded in the metal or that may damage the internal structure of 

the material and degrade its structural integrity shall not be used. 

5.1.1.7 Unstable bonding 

Anti-friction bearings, wire-mesh vibration cushion mounts, lubricated bushing etc. shall not be used to 

implement bonding. Bolts and screws shall not be used as intentional grounding path. 

5.1.1.8 Compression Fasteners 

Bonding connection shall not be compression fastened through non-metallic materials. 





DATE : 12/02/2004 

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5.1.1.9 DC Resistance between Adjacent Faces of Equipment Chassis 

The DC resistance between any two adjacent faces of the equipment chassis shall not exceed 2.5 mΩ. This 

level applies for both directions of polarity across the bond. 

5.1.1.10 Bonding Stud 

To allow bonding each unit shall provide a bonding stud. This shall consist of a stud M4 x 6 located close to 

the mounting plane. The bonding lug shall be easily accessible when the unit is integrated on the spacecraft 

and shall be clearly marked on the mechanical interface drawings. The DC resistance between this stud and 

the underside of the mounting feet shall not exceed 2.5 mΩ for both directions of polarity. 

5.1.1.11 Serial Connection of Bonding Strap 

Serial connection of two or more bonding straps is not permitted (except MLI).. 

5.1.1.12 Secondary Power Reference 

The impedance between the unique secondary power reference inside the equipment and the bonding lug 

shall be less than 5 mΩ DC and shall have a low inductance. 

5.1.1.13 Bonding of Equipment not performing electrical functions. 

Devices not performing any electrical function shall be bonded to the spacecraft structure via a DC 

resistance not exceeding 10k Ω. 

5.1.1.14 Bonding Strap Characteristics. 

The bonding strap will be provided by the contractor doing integration of the unit on the structure. 

− Bonds shall be as direct and short as possible (different length can be used to cope with all situation, 

maintaining length to width ratio lower or equal to 5:1. The minimal width to be used is 8 mm width) 

− Each bond shall have a resistance < 2.5 mOhms 

− Bonds shall be adequate in cross-sectional areas to carry fault currents where applicable, without 

fusing, burning or arcing (150 % of circuit protection device rating) with a temperature limit of 50°C 

max for an indefinite time 

− Each bond shall be sufficiently robust to withstand vibration, expansion, contraction or relative 

movement of parts incident to normal service without breaking or loosening the bond or causing a 

change in contact resistance 

− Weakening of vital structures shall not occur as a result of bond application 

− Self-tapping screws shall not be used for bonding purposes. 

− Bonding connections shall be installed in such a manner as not to interfere in any way with the 

operation of movable components 

− Bonding of tubular members or conduits, if not inherently bonded shall be achieved by means of a 

plain metallic clamp and jumper without crimping or damaging the member 

− Outer and inner metalled layers of thermal insulation shall both be bonded to the structure 

− Where dissimilar metals are to be bonded, the elements of the bonding connections shall be 

selected to minimise the possibility of corrosion, and to assure that if corrosion occurred, it would be 





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in replaceable elements, such as washers, jumpers or separators, rather than in the system basic 

structure. 

5.11 DATA HANDLING 

The Command Data Management Subsystem (CDMS) is organised around the Central Data Management 

Unit (CDMU) and terminals. 

On one hand the CDMU interfaces with the telecommunication subsystem and is in charge of ground 

command decoding, validation reporting and distribution, and payload science data and housekeeping 

telemetry emission (including data acquisition, encoding and formatting). On the other hand the CDMU 

interfaces with the remaining of the satellite via terminals connected to a Mil Std 1553B dual redundant 

communication bus. 

The type of terminal is defined in paragraph 5.11.6. 

The overall satellite operations in flight are organized into satellite modes. Each mode is defined by a set of 

subsystems and instruments modes and configuration. Correspondence between the defined modes and the 

various phases of the mission is presented in the table 5.11-1 hereunder and show that all the mission 

phases are properly covered. The tables 5.11-2 and 5.11-3 describe the subsystems and instruments modes 

associated to each satellite mode. 

As it clearly appears : 

− the instruments science activities can happen only when the spacecraft is in Nominal Mode 

− When the satellite is in Launch Mode, only the 4K cooler electronics is ON, in Launch Lock 

− When the satellite is in SM all the instruments are turned OFF 

− When the satellite is in SAM or EAM, the instruments can be OFF, or are commanded in a mode 

consistent with a suspension of science activities and a reduced TM collection (see 5.11.1); this 

mode is called «Standby» in the tables. 

The Figure 5.6-1 shows the conditions for Satellite Modes transitions. 

The consequences from instruments operation point of view are : 

− The transition to Earth Acquisition Mode is accompanied by a loss of all CDMU functions during up 

to 1 minute (TBC); no TM acquisition, TC distribution, time distribution will be performed during this 

time. The Science Mission cannot be continued . At return from this «dead time», in EAM the 

instruments will be polled in «HK only» mode (see 5.11.1), and could therefore be commanded in 

«standby». 

− In case of transition from Nominal Mode to Sun Acquisition Mode, the Science Mission cannot be 

continued, and at entry into SAM, the instruments will be polled in «HK only» mode (see 5.11.1), and 

could therefore be commanded in «standby». 

− In case of transition to Survival Mode, all instruments are switched OFF by an Hardware mechanism. 

Table 5.11-1: Operational life phase vs. System modes. 



Spacecraft 

Mode 


Antennae 

Configuration : 

Nominal branch 

(backup branch) 

TM/TC Configuration MTL 

Mode 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :5-99/136 

ACMS 

Mode 



EPS Mode Instrument 

s Mode 

Launch Mode Rx : LGA +Z Low rate Disabled SBM Battery OFF 

(MGA) 

Discharge 

Tx : LGA +Z OFF 

Sun Acquisition Rx : LGA +Z Low rate (Nominal rate after Disabled SAM or 

Mode (SAM) (MGA) separation) 

SM Battery Charge OFF or 

or SA 

Standby 

Tx : LGA +Z Low rate (500bps) (5kbps 

after separation) 

Nominal Mode Rx : MGA 

Nominal rate Enabled NOM,OC Battery 

(NM) 

(LGA+Z) 

M Charge/dischar OFF, Standby 

ge or SA or Science 

Tx : MGA Medium rate (transition to 

high rate by ground TC) 

Earth 

- Rx MGA 

Nominal rate Disabled NOM Battery 

Acquisition (LGA+Z) 

Charge/dischar OFF or 

Mode (EAM) 

ge or SA Standby 

- Tx MGA Medium rate 

Survival Mode - Rx : LGA+Z Low rate Disabled SAM, SM Battery OFF 

(SM) 

(LGA-Z) 

Charge/dischar 

ge or SA 

- Tx : LGA+Z Low rate (500bps) 

Table 5.11-2 : Herschel Modes links and transitions

Spacecraft 

Mode 


Antennae 

Configuration 

: 

Nominal 

branch 

(backup 

branch) 

Launch Mode Rx : LGA -X 

(MGA) 

Sun 

Acquisition 

Mode (SAM 

Nominal 

Mode (NM) 

Earth 

Acquisition 

Mode (EAM) 

Survival 

Mode (SM) 

Tx : LGA -X OFF 

Rx : LGA -X 

(MGA) 

TM/TC 

Configuration 

MTL 

Mode 


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100/136 

ACMS 

Mode 

Low rate Disabled SBM Battery 

Discharge 

Low rate 

(Nominal rate 


Tx : LGA -X Low rate 

(500bps) (5kbps 


Rx : MGA 

(LGA -X) 

Tx : MGA Medium rate 

(transition to high 

rate by ground 

TC) 

- Rx: MGA 

(LGA -X) 

- Tx: MGA Medium rate 

- Rx : LGA -X 

(LGA +Z/-Z) 

- Tx : LGA -X Low rate 

(500bps) 

Disabled SAM or SM Battery 

Charge or 

SA 

Nominal rate Enabled SCM, HCM, 

OCM 

Nominal rate Disabled OCM, HCM, 

SAM 

Low rate Disabled SAM, SM, 

OCM, HCM 

Table 5.11-3 : Planck Modes links and transitions 



EPS Mode Instrument 

s Mode 

Battery 

Charge/disc 

harge or SA 

Battery 

Charge/disc 

harge or SA 

Battery 

Charge/disc 

harge or SA 

OFF except 

4K cooler in 

Launch Lock 

OFF or 

Standby 

OFF, Standby 

or Science 

OFF or 

Standby 

NOM : Normal Mode – SAM : Sun Acquisition Mode – SM : Survival Mode – SBM : Stand By Mode – OCM : 

Orbit Correction Mode, SCM : Science Mode – HCM : Angular Momentum Correction Mode 

NB : the tables specifiy the status at entry or re-entry into the mode. It remains possible, via relevant 

telecommand, to individually change the subsystems or instrument mode while in any of the S/C mode. 

5.11.1 Telemetry 

The data of the instruments will be categorized in science data and instrument housekeeping data. The 

science data will not be processed by the Mission Operation Centre (MOC) but will be stored and made 

available to the Instruments Control Centres (ICC’s) for Herschel and Data Processing Centres (DPC’s) for 

Planck. The instrument housekeeping data will be processed by the MOC to ensure the health and safety of 

the instruments. The science and instrument housekeeping data must be formatted following the Packet 

Telemetry Standard (ESA-PSS-04-106) and comply with the H/P Packet Structure ICD (AD05) which defines 

all the packet services applicable to H/P, and specifies their design rules. 

The CDMS shall hence has the capability to: 

− acquire experiment data from instruments 

− store experiment data during non visibility period and visibility period 

− transmit the stored data and real time ones to the ground. 

OFF



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The total instrument average data rate over 24hrs must not exceed 130kbits/s for Herschel and for the 

Planck missions. 

Burst Data rate up to 300kbps can be handled during a pre-defined time range, for a pre-defined time 

duration. 

These allocations are for all instruments and inclusive of all the telemetry packets types with TM formatting 

overheads. 

The PS ICD (AD05) defines the temporal organization of the transfer layer over the MIL 1553 Bus into 

frames, subframes and slots. 

Each intelligent MIL 1553 Bus user, and especially the instruments, will be allocated a number of subframes 

per second dedicated to TM packets acquisition. This allocation depends on the Satellite Mode and on the 

instrument operating mode (Prime, Non Prime, Parallel, …). 

The detailed allocation, on a frame basis, of each slot of a frame, defines a Bus Profile. It will be possible, in 

flight, to switch from one Bus profile to another, upon specific TC. 

A subframe shall be able to transport up to 1 max length TM packet. 

A dedicated Failures Detection Isolation and Recovery procedure guarantees the single failure tolerance of 

the 1553 Data Link Layer. The 1553 Bus DLL FDIR is described in RDxx, section 3.2.2. A recovery from Mil 

1553 Bus A to Bus B can last up to 250ms. In order to avoid the loss of any TM Packet, the Instrument 

should be able to buffer a minimum of 250ms of data. If the spacecraft finds that the Bus anomaly is with one 

Instrument only, and if the Bus switch over does not help, a dedicated Instrument FDIR procedure may be 

started if it is requested by the instrument. The Instrument detailed definition of this recovery procedure shall 

then be performed by the instrument. 

NB : the total number of allocated subframes in satellite Nominal Mode, and TM normal mode will allow an 

instantaneous TM acquisition rate higher than 130kbps if only long TM packets are transported. It shall 

however be the instruments responsibility to ensure that the max authorized average rate of 130kbps is not 

exceeded. The spacecraft does not guarantee the storage nor the real time transmission of the acquired 

data beyond this limit. 

For Planck Satellite instruments in normal mode of operation, a total of 32 subframes is allocated ; this 

allocation is inclusive of ALL telemetry packets generated by Planck instruments, ie : 

− HFI+LFI Science data 

− LFI, HFI & Sorption cooler Housekeeping data (all HK packets + event Packets + TC verification 

reports, time verification TM, ...) 

PLANCK SUBFRAME ALLOCATION 

Launch 

Mode 

S/C Sun 

Acquisition 



Nominal 

Normal 

S/C Earth 

Acquisition 

LFI TM 0 3 15 3 0 

HFI TM 0 3 15 3 0 

Sorption Cooler HK TM 0 2 2 2 0 

Total number of subframes allocated 0 8 32 8 0 

For Herschel Satellite instruments in normal mode of operation, a total of 33 subframes is allocated ; this 

allocation is inclusive of ALL telemetry packets generated by Herschel instruments, ie : 

− PACS, SPIRE & HIFI Science data 

− PACS, HIFI & SPIRE Housekeeping data (HK packets + event Packets + TC verification reports, 

time verification TM, ...) 

Survival



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For Herschel Satellite in TM Burst Mode of operation, a total of 46 subframes is allocated, among which 40 

subframes are allocated to the instrument in Burst Mode ; this allocation is inclusive of ALL telemetry packets 

generated by Herschel instruments. 

The detailed allocation per satellite Mode, is provided in Table hereafter. 

HERSCHEL SUBFRAME ALLOCATION 

Launch 

Mode 

S/C Sun 

Acquisition 

Nominal 

Normal Burst Mode 

Prime Instrument TM 0 3 27 40 3 0 

Non-Prime1 Instrument TM 0 3 3 3 3 0 

Non-Prime2 Instrument TM 0 3 3 3 3 0 

Total number of subframes allocated 0 9 33 46 9 0 



S/C Earth 

Acquisition 

Survival 

The science and housekeeping data are acquired continuously and down-linked during the visibility periods 

(DTCP). 

During non-visibility periods, TM packets from instruments and platform are transmitted to a storage unit. 

During visibility periods, data from the instruments S/C are always stored in the storage unit and are 

transmitted in real time multiplexed with dumped data from storage unit. 

The downlink rates associated with the different link conditions, and identified in the TM/TC configuration for 

the satellite modes (tables 5.11-2 and 5.11-3) are : 

− Low Rate 1 : 500bps with Kourou Ground Station on LGA’s 

− Low Rate 2 : 5kbps with New Norcia Ground Station on LGA’s 

− Medium Rate 150kbps (TBC) with Kourou Ground Station on MGA 

− High Rate : 1.5Mbps with New Norcia Ground Station on MGA 

In order to be inserted into the real time TM flow in case of transition to satellite modes associated to Low TM 

Rate 1 and 2 TM/TC modes, each instrument shall define one Essential HK Packet, which permits to 

unambiguously monitor the instrument status. 

For each instrument, the average Critical HK rate shall represent 330bps max , at assembled packet level. 2 

solutions are acceptable : 

− a dedicated Essential HK TM packet is created by the instrument 

− a subsampling of an already existing packets is identified as a « Essential HK» packet. 

Whatever the solution, this Essential HK packet shall be generated with a specific Base APID, in line with 

AD5 appendix 3, in order to be recognized/routed correctly by the spacecraft data handling system. 

In case Low TM rate 1 TM/TC mode is used, only 1 over 11 Essential TM packets will be downlinked. 

5.11.2 SSR Mass Memory 

The Solid State Recorder (SSR) can store instrument science and housekeeping data of 48 hrs. 

The storage unit will have the capability to support simultaneous read and write operations during visibility 

periods. 

The storage unit is organized in packet stores (partitions). Different options are possible as far as the stores 

allocation per instruments is concerned. One option is to allocate 2 stores per instrument, one for HK and 

one for science. Another option is to allocate one single store to all instruments science and one single store 

for all instruments HK. Since it shall be possible to redefine the Packets stores size and/or their TM 

allocation, at each ground contact, any combination is actually possible.



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The stores are sized to record the expected TM packets production rate over 48 hours of operation. 

Event telemetry packets from all instruments and spacecraft are stored in a dedicated packet store (TBC). 

5.11.3 Timing 

A unique on-board time, the Central Time Reference ( CTR ) is maintained at spacecraft level and 

distributed to the instruments in order to time-tag their data, which will be embedded in their telemetry 

packets (see RD 74 for more detailed information about time adjustment). 

The distribution of the CTR to the instruments is performed in 2 ways : 

− via the time-message on the 1553 data bus, as described in AD5, Appendix 9 

− by means of the Packet service 9 time setting mechanism, as described in AD5 

The instruments time verification is performed using the Packet service 9 relevant mechanism, as described 

in AD5. 

In addition, in order to maintain the time synchronization with the CTR, the instruments may use the 

distributed 131072 Hz clock described in §5.11.6.1. 

As specified in AD5, it is recalled that TM non synchronized with CTR shall be specifically flagged by the 

instrument. 

5.11.4 Telecommands 

As far as telecommanding is concerned the instruments shall interface with the spacecraft via 2 means: 

− Packet telecommands formatted according to the ESA Packet Telecommand Standard (ESA-PSS- 

04-107) and compliant with the rules of the Packet Structure ICD (AD5). This is the main 

commanding path. 

− MiL Std 1553 Mode commands as specified in AD5 appendix 9. 

NB : The Commands can be received from different sources where the source is indicated in the TC header, 

as described in AD5 : 

− Ground 

− Mission Timeline 

− On Board Control Procedures 

− FDIR procedures 

The total telecommand rate will be shared between spacecraft and instruments commanding. The maximum 

telecommand rate will be 4 kbits/s. The maximum command rate to the instrument will be 2 TC packets per 

second. 

In addition to the sub-frames allocated for the TM, sub-frames are also allocated for packet telecommands. A 

total of 4 subframes are allocated for the whole spacecraft nominal packet telecommanding in all spacecraft 

modes, each subframe being able to transport up to 3 max length TC packets. 

As far as telecommanding is concerned, the instruments shall comply with the following rules: 

− A maximum of 4 TC packets per seconds can be transmitted to all the instruments together 

− A maximum of 2 TC packets per second can be transmitted to any givenPrime instrument. These 

TC packets will be transmitted in different subframes. 

− A maximum of 1 TC packets per second will be transmitted to any given Non-Prime instrument. 



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The Packet TM and TC transfer on the Mil Std 1553 Bus shall follow the Transfer Layer protocol specified in 

the PS ICD (AD5) appendix 9. 

The protocol is driven by 

− the allocation of the 1553 Subaddresses to well identified message types 

− The time breakdown of each subframe into 24 slots, each slot range being allocated a defined role in 

the data transfer : Synchronization, Command/Acquisition, Data Transfer, Packet Control, 

Regulation. 

− the exchange of handshake messages between the Bus Controller (CDMU) and the intelligent 

Remote Terminals, especially the instruments. The exchange will take place at defined 

subaddresses and during defined slots. 

Telecommand 

The telecommand distribution protocol is described in AD05 appendix 9. The CDMU first transfers the TC 

packet to the RT (Instrument) input buffer, at the subaddresses SA11 to SA26. SA27R is allocated to the 

exchange of the TC transfer description (TC PTD) which happens in the slots 21, 22 or 23 of the subframe 

where the TC packet transfer has occurred. The RT is requested to poll SA27R every subframe. The TC 

PTD shall then be evaluated by the RT at the subsequent subframe. After valid acquisition of the TC Packet, 

the RT shall move the TC PTD to SA27T to become the TC packet confirmation (TC PTC). 

The CDMU shall evaluates the success of the TC transfer by acquiring the TC PTC message at SA27T not 

earlier than 3 subframes after the TC transfer, during the slot 21, 22 or 23. 

FDIR: 

A specific Failures Detection Isolation and Recovery procedure is applied on the Telecommand distribution 

process. The FDIR for TC transmission protocol is described in RD6, section 3.3.2. 

It offers the possibility to re-send TC Packet which TC PTC evaluation has failed during the next subframe 

allocated to TC transfer. Should the retry fail again, for a single Instrument, the instrument operation is 

considered unsafe and a dedicated Instrument FDIR procedure may be started if the instrument request it. 

The detailed definition of this FDIR procedure shall then be performed by the instrument. 

Telemetry 

As far as the TM packets acquisition is concerned, it has been necessary to define 2 different protocols to 

support the 2 TM packets acquisition modes : the Normal Mode and the Burst Mode. 

Nominal Mode: 

With reference to AD5, SA10T is allocated to the exchange of the TM Transfer Request message (TM PTR), 

and as illustrated in Figure 5.11.5-1 the actual polling of this message happens in the Slot number 21 to 23 

(Slot 21 in the Fig.) . If the instrument has data to be retrieved then it shall write to SA10T. the CDMU will poll 

this SA during the slot 21 on a periodic basis, and if it finds that the instrument needs servicing it will access 

the data output register of the instrument Remote Terminal from SA11T, and take the data stored there in a 

subsequent sub-frame, during the Slots 6 to 20. Note that the baseline is to have the polling and data 

retrieval in subsequent sub-frames, however there are no requirement that forbids that one or more subframes 

are in between polling and retrieval. If the Transfer request is not set by the instrument the CDMU will 

not access the data output register of the instrument Remote Terminal, there will be no data transfer during 

the sub-frame associated to the polled terminal. 

The CDMU will then check the validity of the received data and if found to be correct will send a TM 

confirmation message at SA10R (TM PTC) in slot 22 or 23 (22 in the Fig.) of the subframe during when the 

TM transfer has occurred. Upon receipt of this confirmation the Remote Terminal shall prepare for the next 

transfer. 

If the CDMU finds that a data transfer was not successful then this confirmation message (TM PTC) will not 

be sent and the instrument shall leave the data ready for the next acquisition attempt (transfer request will 





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have to be kept set). If the subsequent data transfer is still not successful, then the confirmation message is 

sent in order to avoid dead lock situation. 

It should be noted that it is required that the user has all the data ready for transfer within 2mS from the start 

of the sub-frame allocated for that transfer . 

In this mode it is not intended to have consecutive sub-frames allocated for the same user. 

Burst Mode: 

This mode aims to optimize the use of the data Bus bandwidth and thus permits a higher TM rate for one 

selected instrument. It is principally the same as the nominal mode except that the same user (the user 

having requested a Burst Mode Transfer) is polled in consecutive sub-frames. In this mode the CDMU will 

always send the confirmation message that TM data has been received correctly (there will be no checking). 

For a Burst TM acquisition to be performed from a dedicated instrument N, the here below steps are followed 

: 

− 1- the Bus Profile on RT side is set to a Burst Mode Profile (with polling in consecutive subframes of 

N) 

− 2- the relevant instrument N is commanded by TC to switch to Burst Mode 

− 3- the instrument N shall set the Burst Mode flag in the TM PTR message for the «Burst transfer» to 

occur. 

Burst transfer mechanism is shown in Figure 5.11.5-2. 

Notes: 

In non-burst mode the same user 

cannot have consecutive subframes 

If Poll is not set by user then the 

CDMU will not access User data 

register, the bus will be idle for that 

subframe user data time 

If Poll is set then the CDMU will 

access the user data register 

If the Confirm data is set by the 

CDMU then the dataregister can be 

cleared/updated by the User 

If the Confirm data is not set by the 

CDMU then the data transfer has 

failed and the data register should 

not be cleared /updated by the User 

2mS 

User A Subframe User B Subframe 

User A Data to 

be ready by this 

time 

USER A 

DATA 

Poll A Poll B 

Confirm A 

data is OK 

from 

CDMU 

Nominal Mode Polling 

(No interlacing) 


2mS 

User B Data to 


time 


USER B 

DATA 

Figure 5.11.5-1: Nominal Mode TM transfer Mechanism 

Poll C 

Confirm B 

data is OK 

from 

CDMU

Notes: 

In burst mode the same user can 

have consecutive subframes 

If Poll is not set by user then the 

CDMU will not access User data 

register, the bus will be idle for that 

subframe user data time 

If Poll is set then the CDMU will 

access the user data register 

When the Confirm data is set by the 

CDMU then the dataregister can be 

cleared/updated by the User 

The Confirm data is always set by 

the CDMU, no check performed in 

burst mode 

FDIR: 


2mS 



time 

USER A 

DATA 

Poll A Poll A 


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User A SubframeN User A Subframe N+1 

Confirm A 

data is 

always set 

by CDMU 

Burst Mode Polling 


2mS 

Figure 5.11.5-2: Burst Mode TM transfer mechanism 




time 

USER A 

DATA 

Poll A 

Confirm A 

data is 

always set 

by CDMU 

A specific Failures Detection Isolation and Recovery procedure is applied to the Telemetry acquisition 

process. The FDIR for TM acquisition protocol is described in RD6, section 3.3.3. 

It offers, as described above, a «one retry capability» for the Nominal TM Mode in case one packet 

acquisition has failed. This feature is not available in case of Burst TM Mode. 

In addition, the number of acquired TM packets over a given time will be monitored and used as a criterion to 

identify an Instrument RT anomaly. In case of an acquired TM packet number, counted over a certain time, is 

lower than an expected number, the Instrument operation is declared unsafe and a dedicated Instrument 

FDIR procedure may be started if it is requested by the instrument. The detailed definition of this FDIR 

procedure shall then be performed by the instrument. 

Especially, the instrument shall define, in each mode :


− the period over which the TM packet must be counted 

− the minimum number of expected packets 


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In order, if needed, to support the TM packet acquisition failure analysis, the Instrument shall report the last 

«Invalid» TM PTC and the corresponding subframe count, in the Status Data stored at SA1T. This report 

shall be cleared every one second at the subframe 2. 

5.11.6 Special signals 

5.11.6.1 Synchronisation Signal 

A redundant, electrically isolated synchronisation signal with a frequency of 131072Hz and an overall stability 

of better than 1*10 -6 shall be delivered to each instrument. 

This signal shall be synchronized with the Central Time Reference clock 

5.11.6.2 Herschel Mission 

On Target Flag: 

Attitude information including an «On Target Flag» will be provided in the spacecraft HK TM. 

Start of Scan 

A dedicated TC packet is e sent to SPIRE instrument to indicate the start of the scan mode. The time stamp 

accuracy is better than 5ms. This start of scan indication shall be sent through the Mission Timeline (1s 

resolution). 

Peak up 

refer to section 5.12.5.1: Herschel Pointing calibration 

5.11.6.3 Planck Mission 

The spacecraft ACMS providse the reference event (±1.5ms) at which the phase of the spin can be 

referenced in inertial space. This event will be available in the spacecraft HK TM. 

In addition, an indication of the Start of slew time, and of the estimated slew duration will be sent to the 

instruments (HFI) by the spacecraft CDMU as a dedicated TC packet, through the Mission Timeline. 

5.11.7 Interface circuits 

The instruments interface circuits with the spacecraft data bus shall be defined according to MIL 1553 B , as 

specified in AD5. 

The Bus users shall use the long stub configuration (transformer coupled to the Bus). 

5.11.8 Application Process Identifiers 

A range of typically 8 Application Process Identifiers (APID’s) will be allocated to each instrument to support 

its TM/TC communication needs. The exact range is specified for each instrument in the Packet Structure 

ICD (AD 5). Different APID’s are allocated for Housekeeping and Science TM packets. Details of the APID 

allocation shall be specified in the IID-Bs. 



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Observation Identifiers are used for separating/identification of observation phases/executions and therefore 

are also supporting instrument TM/TC communication needs. 

5.11.10 Addresses on 1553 bus 

The 1553 busses addresses for instrument data processing units or instrument control units shall be the 

following: 

Instrument unit or connection 1553 

Address 

Planck 

Herschel 

HFI A HFI DPU nominal unit 16 

HFI B HFI DPU Redundant unit 17 

LFI A LFI REBA Nominal unit 18 

LFI B LFI REBA Redundant unit 19 

SCE A LFI SCE Nominal unit 20 

SCE B LFI SCE Redundant unit 21 

HIFI A HIFI ICU Nominal side 16 

HIFI B HIFI ICU Redundant side 19 

SPIRE A SPIRE DPU Nominal side 21 

SPIRE B SPIRE DPU Redundant side 22 

PACS A PACS DPU Nominal side 25 

PACS B PACS DPU Redundant side 26 

5.12 ATTITUDE AND ORBIT CONTROL/POINTING 

5.12.1 Terminology 

The following terminology is used: 

5.12.1.1 Herschel Pointing Terminology: 

− Attitude Measurement Error (AME): AME is the instantaneous angular separation between the actual 

LoS direction and the estimated LoS direction. This is referred to as ‘a posteriori knowledge’. 

− Absolute Pointing Error (APE): is the angular separation between the desired LoS direction, and the 

instantaneous actual LoS direction. 

− Relative Pointing Error (RPE): is the angular separation between the instantaneous LoS direction 

and the short time average LoS direction during some time interval. This is also known as the 

pointing stability 





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− Pointing Drift Error (PDE): is the angular separation between the short time average LoS direction 

during some time interval and a similar average LoS direction at a later time. 

− Absolute Rate Error (ARE): is the difference between the actual and the desired angular rate about 

the eigen axis of the manoeuvre. This applies only for line scanning. 

− Spatial Relative Pointing Error (SRPE): is the angular separation between the average actual LoS 

direction and a desired LoS direction which is defined relative to an initial reference direction. 

5.12.1.2 Planck Pointing Terminology: 

Jitter strip: The jitter strip is defined as the band between the two planes which just encompasses the path 

swept out by the LoS, in any full number of rotations on the celestial sphere. 

Jitter strip average: The jitter strip average is the average (best least-square fitting) plane of the jitter strip. 

Reference circle: The reference circle is defined on the celestial sphere as the desired circle, which LoS 

nominally should sweep through. Note that the reference does not consider the phase of the LoS pointing. 

Scan direction : the instantaneous time derivative of LoS w.r.t. an inertial frame. 

(the scan direction can be understood as: at a given time, one considers that the inertial direction determines 

the LoS. A short time later, this inertial direction has changed. The direction of variation is the scan direction) 

Planck Pointing Error Definitions: 

Line of Sight Pointing 

− Attitude Measurement Error (AME): is the instantaneous angular separation between the actual 

pointing direction and the estimated pointing direction . This is referred to as ‘a posteriori knowledge’. 

− Absolute Pointing Error (APE): is the instantaneous minimum angular separation of the actual LoS 

direction and the desired reference circle. 

− Relative Pointing Error (RPE): is half the maximum angular width of the jitter strip over a specified 

time period (nominally 55 minutes). RPE is also known as the pointing stability. 

− Pointing Drift Error (PDE): is the angular separation between the jitter-strip average during some 

time interval (nominally over 55 minutes) and a similar average at a later time (nominally 24 hours), 

but excluding the deterministic part originating from spin axis reorientation manoeuvres. 

− Absolute Rate Error (ARE): is the difference between the actual and the desired angular rate about 

the spin axis. 

− Pointing Reproducibility Error (PRE): is the angular separation between the 2 jitter-strip averages 

(nominally over 55 minutes) obtained by commanding two identical reference circles at 2 different 

times (nominally separated by 20 days). 

Around Line of Sight Pointing 

The pointing error around LoS is the angle between the scan direction and the plane containing Yfocal_plane 

and the LoS, Yfocal_plane being a parallel vector to YSC. 

APE around LoS is the instantaneous pointing error around LoS. 

− RPE around LoS is the instantaneous difference between pointing error around LoS and its average 

over 55 minutes. 

− PDE around LoS is the angular separation between the short time average pointing error around LoS 

during some time interval (nominally 55 minutes) and a similar average pointing at a later time 

(nominally 24 hours), but excluding the deterministic part originating from spin axis reorientation 

manoeuvres. 



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A slew is a manoeuvre of the spacecraft from one pointing direction to another without specific requirement 

on the path. 

A scan is a manoeuvre of the spacecraft along a specified path with a specified rate along this path. 

Unless otherwise specified, the pointing error specifications are expressed as half-cone angles of the optical 

axis and half-angles around the optical axis. They are specified at a temporal probability level of 68%, which 

implies that error will be better than the requirements for 68 % of the time. 

5.12.2 Herschel Pointing Requirements 

During all scientific observation modes requiring periods of stable pointing, the pointing requirements with the 

goals as specified in the Table 5.12.2-1 below will be met with a single calibration once per month (TBC). 

The LoS of an instrument is defined as the direction on the observed sky of the geometric centre of an FPU 

entry beam’s far field pattern as projected by the telescope. 

Note that the definition applied to requirements and goals is: 

− Requirement performance to be satisfied under all applicable conditions and margins 

− Goals: performance to be satisfied under restricted, but realistic and specified, conditions 

and without margins 

ERROR Line of sight 

(arcsec) 

Around line of 

sight 

(arcmin) 

Goals for line of 

sight 

(arcsec) 



Goals around line 

of sight 

(arcmin) 

APE < 3.7 3.0 < 1.5 3.0 

APE scanning < 3.7 + 0.05 w n.a. < 1.5 + 0.03 w n.a. 

PDE(24 hours) < 1.2 3.0 n.a. n.a. 

RPE (1 min) 

pointing 

RPE (1 min) 

scanning 

< 0.3 1.5 < 0.3 1.5 

< 1.2 1.5 < 0.8 1.5 

AME pointing < 3.1 3.0 < 1.2 3.0 

AME scanning < 3.1 + 0.03*w 3.0 < 1.2 + 0.02*w 3.0 

AME slew < 10 3.0 < 5 3.0 

Note: w is the scan rate in arcsecond/second. APE scanning mode requirements and goals around LOS are 

covered in the section describing Herschel slews performances. 

Table 5.12.2-1: Herschel Pointing requirements 

In consecutive pointings within 4 x 4 degrees spherical area, the SRPE of all pointings following the initial 

pointing, as referred to the average (barycentre) pointing direction of the first pointing will be less than 

1arcsec (68% probability level). 

The initial reference direction is the average direction of the first pointing. The actual direction of the first 

pointing will lie within a cone of half angle RPE around this reference direction. The pointing reference axes 

for all consecutive pointings are specified as angular co-ordinates with respect to the initial reference 

direction.



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(SPIRE and HIFI peak up procedure accuracy shall be better than 1 arcsec around the spacecraft Y and Z 

axes). 

To meet the line of Sight pointing requirements, the long term error between the LOS reference and the 

scientific mode attitude sensors will be-calibrated and if necessary, compensated by target attitude 

generation (bias compensation). 

All instrument LOS will be calibrated versus ACMS sensors LOS. For that purpose, all instrument shall 

provide to ground, the information for knowledge of its detector LOS attitude with an accuracy better than 1 

arcsec (goal : 0.6 arcsec) in Earth Centered Inertial J2000 frame. 

Long term and short term parts of that accuracy shall be negligible (


5.12.4 Herschel Scientific Pointing modes 

For Herschel the following scientific pointing modes will be provided: 

− Fine Pointing 

− Raster Pointing 

− Line Scanning 

− Tracking of Solar System Objects 

− Position Switching 


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− Nodding 

These modes are described in the document: Herschel Scientific Pointing Modes, in the annex to this 

document. 

5.12.5 Calibration 

5.12.5.1 Herschel Calibration - Star Tracker 

To establish the offset angle between the Herschel star tracker and the lines of sight of the instruments, the 

spacecraft will perform a calibration of not longer than 10 min every 24 hours. 

The spacecraft will perform a pointing calibration every month (duration 40mn). There will be daily calibration 

check (few mn). Initial full calibration will be performed during spacecraft commisioning phase (duration 

3h15). 

For peak up procedure, the spacecraft will communicate, on-board and to ground, a request for pointing 

correction from the prime instrument per single observation. After the reception of pointing correction from 

the instrument (correction performed using instrument internal movable mirrors), the spacecraft will 

autonomously readjust its position accordingly. The correction will only be allowed within predefined 

boundaries,(< 10 arcsec around satellite Y and Z axis). 

The peak up procedure shall be implemented as follows: 

Format of peak-up event packet to be generated by HIFI and SPIRE 

HIFI and SPIRE shall use event packet (service 5 type) to inform the spacecraft about a new pointing target 

based on: 

− the previous inertial target (inertial pointing only) 

− two µ-rotation angles (



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The commanded µ-rotation angles correspond to the desired translation of the image inside the instrument 

focal plane frame. Note that with this convention, θY (resp. θZ) does not represent the rotation around Y 

(resp. Z). 

The signs shall follow this convention: 

BEFORE 

Zfocal plane 

Absolute value convention: 

Y focal plane 

µ-rotations angles 

θY and θZ are both positive 

in this example: 

θY = 3 × (Y units) 

θZ = 2 × (Z units) 

The absolute value of both µ-rotation angles shall be given as 16-bit signed integers. 

In accordance with the PS-ICD: 

− bit 0 shall be the most significant bit 

− bit 15 shall be the least significant bit 

Bit 0 shall be used as the sign bit (0 for plus, 1 for minus) 

Format of HIFI packet parameters: 



AFTER 

Zfocal plane 

HIFI identifier µ-rotation angle Y µ-rotation angle Z 

Y focal plane 

0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 M . . . . . . . . . . . . . . LM . . . . . . . . . . . . . . L 

Format of SPIRE packet parameters: 

SPIRE identifier µ-rotation angle Y µ-rotation angle Z 

0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 M . . . . . . . . . . . . . . LM . . . . . . . . . . . . . . L 

Additional information required from instruments: 

Some data are needed by the spacecraft to transform the peak-up parameters into attitude angles. They may 

be reprocessed by the ground after in-flight calibration. 

The following set shall be provided for each instrument. 

− YFP = 3 components of Yfocal plane in satellite frame 

− ZFP = 3 components of Zfocal plane in satellite frame 

− kY = value of low significant bit used for µ-rotation angle Y, to transform integer θY into radians. 

Angle [in rad] = k × integer. 

− kZ = value of low significant bit used for µ-rotation angle Z, to transform integer θZ into radians. Angle 

[in rad] = k × integer.

5.1.1.2 Planck calibration 



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The Planck Instrument LOS will be aligned with the ACMS LOS with an accuracy of 1.5° maximum (including 

ground error sources, and in-orbit effects (gravity release, launcher effects, cooling). 

5.1.6 On-Target Flag 

Ref 5.11.6.2 (special signals) 

5.1.7 Planck Reference Star Pulse 

See section 5.11.6.3 (special signals for Planck) 

5.1.8 Herschel Slews 

The maximum slew rate will be 7 degrees/min (or larger) when the slew angle is large enough to permit full 

angular velocity. For slews smaller than 16 arcmin (φ in arcsec), the time to acquire the target will be: 

− maximum: 10+sqrt(2φ) sec 

− goal: 5+sqrt(φ) sec 

It will be possible to change via command the slew rate between 0.1 arcmin/s and 1 arcmin/s with a 

resolution of 0.1 arcmin/s. 

The Absolute Rate Error about the scan axis will be better than 1% of the demanded rate but not less than 

0.1 arcsec/s. 

It will be possible to complete a slew of at least 90 degrees in 15 min, including settling time. It will be 

possible to execute each 22 hours, 2 of such slews without the necessity of wheel-momentum off-loading. 

Attitude constraints defined in section 5.12.10 apply during slews. 

5.1.9 Planck Slews 

The spacecraft will be capable (nominal slew planning) of re-orienting the Spin-axis in accordance with the 

following requirements: 

− frequency: one manoeuvre every 45 min throughout nominal lifetime (on average), the maximum 

reorientation frequency is a rate of once per 30 minutes. 

− amplitude: 3 arcmin with a resolution of 0.1 arcmin in any direction 

− relative accuracy: The spacecraft will be capable of reorienting the jitter strip average for up to 3 

arcmin with an accuracy of 0.4 arcmin relative to the previous orientation (68% probability level). 

The duration of a 3 arcmin amplitude spin axis reorientation, including the settling time, will be 5 min or less 

(elapsed time during which pointing requirements cannot be met). 

For a spin axis reorientation not part of the Planck scanning law (up to 20°), the rate of such a reorientation 

will be at least 0.5 arcmin/s. 

To meet the Planck APE and PDE requirements (for instance to kill nutation, or compensate drifts) the 

spacecraft design will utilise a maximum of +/-10% tuning of the amplitude of the manoeuvre needed to 

execute the nominal sky scanning law; i.e. no dedicated slew manoeuvres will be required. 



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Herschel will be compatible with an operational (resp. allowed for attitude control clearance) sun direction at 

less than 30° (resp. 30.3° TBC) from YZ plane, and its projection onto YZ plane at less than 1° (resp. 5° 

TBC) from Z. 

In contingency cases, Herschel will not allow a transient outside the allowed attitude defined above for more 

than 1 minute (TBC), and the sun direction shall be kept at less than 35° from (TBC) YZ plane, and its 

projection onto YZ plane at less than 10° (TBC) from Z. 

Figure 5.12.10-1 Herschel Sun pointing zones 

Planck will be compatible with an operational (resp. allowed for attitude ACMS control clearance) sun 

direction at less than 10° (resp. 10.6°) from the –X axis of the satellite frame. 

In contingency cases, Planck will not allow a transient outside the operational attitude defined above for 

more than 1 minute (TBC), and this transient shall not exceed 2° (TBC). 

5.13 ON-BOARD HARDWARE/SOFTWARE AND AUTONOMY FUNCTIONS 

5.13.1 On-board hardware 

NA 



5.13.2 On-board software 



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Instrument on-board software shall comply with the ECSS software standard ECSS-E 40B and amended by 

the «Guide to applying the ESA software engineering standards to small software projects» BSSC(96)2. 

After launch on-board software maintenance is a possible tool to overcome unforeseen situations or failures 

of the instruments. Commonality and standardisation of on-board software and its development and 

verification tools, in particular also with other PI’s developing instruments for the same satellite, will 

significantly ease the in-flight maintenance. The PI is therefore requested to: 

− use a preferred language (C or ADA) for on-board software coding 

− standardise the software and development and verification tools 

− be in close contact with other PI’s 

− use common SW modules/routines (e.g. libraries) for common functionality, e.g. on-board memory 

loading/dumping 

In-flight maintenance furthermore requires that functionally distinct areas of memory shall be assigned to: 

− programme code 

− fixed constants 

− variable parameters 

It shall be possible to modify individual software parameters or constants by command from the ground. 

Information to indicate all actions of operational significance taken by on-board software in a complete, 

unambiguous and timely manner shall be available in the telemetry. 

5.13.2.1 Software interfaces 

The sole instrument on-board software interface with the spacecraft is through the software of the Central 

Data Management Unit (CDMU) 

5.13.2.2 Process control 

The control processes managed by an on-board application are defined in the OIRD (AD 3). 

5.13.2.3 On-board memory loading 

It shall be possible to load any memory area from the ground. 

Any telecommand packet needed to up-link any area of memory shall be self-consistent in that: 

− a successful load shall not depend on previous packets 

− if a packet is rejected, it may be up linked on its own at a later time (seeAD 3) 

5.13.2.4 On-board memory dumping 

Any memory area shall be accessible for dumping on ground request. 

The dump request shall specify the start address and length of the dump 

Only a single command packet shall be required, even if several telemetry packets are required to convey 

the dumped area to the ground (see AD 3). 




5.13.2.5 Autonomy and FDIR functions 


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During all mission phases, the spacecraft including instruments will be capable of operating nominally 

without ground contact for a period of 2 days without interrupting the planned operations. If no ground 

command has been received by the spacecraft since more than a ground programmable time, the spacecraft 

will go into a safe mode. It will be possible to exit from autonomy mode by ground command. 

The more general autonomy requirements is given in the OIRD (AD 3). 

Satellites modes definition, and FDIR and operation overall requirements are stated in RD 6. 

A survival mode is defined, which purpose is to maintain a safe spacecraft including instruments after a 

major on-board failure or a violation of the attitude constraints or loss of ground contact. 

Once activated, the survival mode will maintain a safe attitude within the constraints allowing a continuous 

supply of power, maintaining a stable thermal environment compatible with the spacecraft and instrument 

requirements and ensure a two way communication link with the ground station when coverage is available 

for at least housekeeping telemetry data and commanding and the spacecraft and instruments in safe 

conditions. 

It shall be possible to exit the survival mode only by ground command. 

It will be possible that the survival mode is initiated automatically on-board on System Level alarm detection, 

and is maintained without any ground contact for at least seven days. The survival mode will rely on a 

context stored in protected memory. 

The instruments shall define a safe configuration for the stand-by and survival mode. 

5.14 EMC 

The extremely low detector output voltages and the complexity of the spacecraft necessitate a careful design 

of the grounding, electrical interfaces and other EMC related parameters to assure mutual compatibility 

between instruments and the rest of the spacecraft. 

To achieve this compatibility, the following preliminary guidelines have been established: 

− separate power and data connectors 

− separate interconnecting harnesses where required 

− separate signal and primary power (28 Volt) ground 

− use filters to reduce conducted emission and susceptibility levels 

− isolate detector housing and electronics boxes from electrical signals 

− twist and shield wires in the interconnect harness 

− provide good and reliable bonds between the various parts of an electronics box and also to the 

mounting platform 

− select power converter frequency outside detector-signal bandwidth 

At the moment no detailed requirements have been established for DC magnetic requirements, however the 

following measures should be taken: 

− local strong (> 10 Oersted) DC hard-magnetic fields should be avoided or compensated by proper 

component arrangement to achieve self-cancellation. 

− the use of very soft magnetic materials with high permeability should be avoided as far as possible 

and practicable 

Exact values for the various parameters are currently being defined. To this effect it is planned to set-up a 

so-called frequency plan. 



5.14.1 Electrical Interfaces 



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This section provides the EMC/EMI requirements for the Subsystem electrical interfaces to accomplish 

grounding requirements, to enhance Electromagnetic Compatibility and to maintain the necessary common 

methodology and implementation within the Project. 

The internal interface arrangement (i.e. the interfaces inside the same equipment) shall follow the rules 

established for external interfaces (i.e. interfaces between different equipment) to the maximum extent 

possible. 

5.14.1.1 Signal Interface Grounding 

For external interfaces, all the signal driver outputs shall be referenced to the signal ground and all the input 

terminals of the signal receivers shall be isolated from the ground. Only exceptions are the RF interfaces 

using coaxial cables and the low-level telemetry and telecommand lines that are permitted to have 

single/ended-single/ended interface (as dictated by the PSS). 

5.14.1.2 Signal Isolation (Common Mode Isolation) 

The receiver interface circuitry shall be designed to provide isolation between its input terminals and the 

receiver grounding reference that shall not be less than the mask given in Figure 5.14.1-1. 

IMPEDANCE - [OHM] 

10000 

1000 

100 

Common Mode Signal Isolation 

7000 


200 

1,E+01 1,E+02 1,E+03 1,E+04 1,E+05 1,E+06 1,E+07 1,E+08 

5.14.1.3 Signal Reference 

Frequency - [Hz] 

Figure 5.14.1-1: Common mode Signal Isolation versus frequency 

Signals shall never use the primary power ground as reference. The secondary power reference shall 

constitute the user signal reference unless a further galvanic isolation stage is implemented. 



5.14.1.4 Allowed Interface Topologies 


DATE : 12/02/2004 

The allowed interface topologies are listed in Table 5.14.1-1: 

TYPE OF INTERFACE TRANSMITTER RECEIVER 


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Analogue, Unit /Subsystem, ext. Balanced Differential 

Digital, Unit/Subsystem, ext. Single-ended Differential 

Single-ended Opto-coupler 

Single-ended Isolation Transformer 

Digital, unit/subsystem, Balanced Differential 

Sync & clock signals, unit, ext. Balanced Differential 

RF Transmission (coaxial cable) Single Ended Single ended 

Table 5.14.1-1: Allowed interface topologies. 

Exception to the above Table 5.14.1-1 is the low-level telemetry and telecommand lines (as specified in the 

PSS), that are permitted to have the single-ended /single-ended topology. 

5.14.1.5 Noise Immunity 

Discrete and digital interfaces shall be designed for noise immunity with both level and time discrimination. 

5.14.1.6 In Band Response 

Analogue and digital circuits shall be designed to not respond to signals out of their own intentional 

frequency bandwidths. 

5.14.1.7 In Band Transmission 

The transmission bandwidths shall be limited to the minimum extent possible. 

5.14.1.8 Filter Location 

Filters shall be placed at the source end of the interface if it is dictated so by the receiver time response or if 

additional noise suppression is required. 

5.14.2 Harness, Connectors and Shielding 

5.14.2.1 Definition of EMC Classes 

Power and signal lines shall be grouped into the following EMC classes: 

− Class 1: Primary/Secondary Power 

− Class 2: Digital Signals 

− High Level Analogue Signals 




− Class 3: Low Level Sensitive Analogue Signals 


DATE : 12/02/2004 

− Class 4: RF Signals (via coaxial cables, tri-axial cables, etc). 

5.14.2.2 Wire/Bundle Coding 


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Wires/Cables belonging to the same EMC class can be assembled together in a bundle. In any case cable 

bundles or separate wires shall be coded reporting the EMC classes of the circuits which it contains. The 

wire type, twisting, shielding and shield grounding requirements shall be reflected on all the schematics, 

wiring diagrams and Interface Control Documents in which the circuit appears. 

5.14.2.3 Cable Separation of Different EMC Classes 

Bundles belonging to different EMC Classes shall be routed separately. 

Bundles belonging to class 2, 3 and 4 shall be shielded and separated by metallic barriers. The height of 

those barriers shall not be less than the largest cable bundle diameter requiring separation. If separation 

barriers are not practical, the bundles shall be separated by at least 10 cm. This requirement is not 

applicable to the subsystem equipment internal cabling or close to connector brackets. 

Note: Aluminium shielding is considered as metallic barrier. 

5.14.2.4 Harness Routing and Crossing 

All cable bundles shall be routed as close as possible to the hosting Spacecraft structure, which constitutes 

the ground plane. Where bundle must cross each other, the crossing angle between different categories 

shall be as close as possible to 90 o (not applicable for solid wire harness and in connector bracket areas.). 

5.14.2.5 Twisting 

Twisting of the active wire around its relevant return wire shall be used in order to reduce magnetic 

susceptibility and emission. In case several lines share the same return line they shall be twisted with the 

return line. The minimum twist rate shall be as specified in Table 5.14.2-1: 

AWG Size Number Minimum Twist/meter 

8 8 

10 9 

12 10 

14 12 

16 14 

18 16 

20 19 

22 23 

24 26 

26 30 

28 35 

Note: One twist is a full rotation around the cable axis. 




Table 5.14.2-1: Minimum Twist Rate 


DATE : 12/02/2004 


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If different AWG (> 28) are used that are not reported in the above Table 5.14.2-1, they shall be twisted in 

such a way to preserve the mechanical characteristics of the wires. 

5.14.2.6 Pin Allocation on Connectors 

Allocation of wires with different EMC Classes to the same connector shall be avoided to the maximum 

possible extent. When wires with different EMC Classes have to be allocated to the same connector, they 

shall be physically separated as much as possible within the connector. 

5.14.2.7 Twisted Wire Allocation 

Covered by Section 5.10.2.4 

5.14.2.8 Tri-axial Cable 

Tri-axial cables, if any, shall use the centre and the inner shield conductor for unbalanced transmission, 

referenced to the ground plane at a single point with the outer shield multiple-point grounded as a overshield. 

The PACS triax cable shield (outer) is routed isolated through SVM and CVV I/F connectors. 

5.14.2.9 Shield Coverage 

Uninterrupted shields, unless at connector location, with at least 85% optical coverage shall be used. The 

maximum unshielded length of wire at the connectors shall not exceed 8 cm. Shields shall not intentionally 

carry current (i.e. they shall not be the return path for power and signal) except for coaxial cables used with 

RF and PACS triax. 

5.14.2.10 Cable Shield Terminations 

Cable shield shall be grounded at both the ends to the equipment case at each end. The preferred method of 

grounding shields is through a conductive backshell that makes good electrical contact to the equipment 

case. 

5.14.2.11 DC Resistance between Cable Shield and Connector Back-shell 

The DC resistance between any shield and the connector backshell shall be less than 5 mΩ. 

5.1.1.12 DC Resistance between the Back-shell and the Structure 

The DC resistance between the plug connector backshell and the structure in the vicinity of the equipment 

shall be less than 10 mΩ. 

5.1.1.13 Cable Shield Insulation 

Individual cable shields shall be insulated to prevent uncontrolled grounding. 




5.1.1.14 Shield Termination of Overall Shield 


DATE : 12/02/2004 


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Overall shield shall always be circularly terminated or shield terminations shall be at the connector backshell. 

5.1.1.15 DC Resistance between Shield Ground Pin and Equipment Chassis 

If the shielding ground is implemented via dedicated pin, the DC resistance between any shield ground pin 

and the equipment chassis shall not exceed 2.5 mΩ. The connection of the shield ground pin to case shall 

be as short as possible. The maximum allowable length is 8 cm. 

5.1.1.16 Non-RF Shield Termination of individual Wire Shields 

Where dictated for practical reasons, up to 4 (four) shield may be grouped together on one ground wire for 

termination. The shielding termination shall be as low inductive as possible, however not exceeding 8 cm in 

length. 

RFI backshells with individual shield ground provisions shall be used for multiple RF shield terminations, with 

the maximum termination length not exceeding 8 cm. 

5.1.1.17 Shielding through Intermediate Connectors 

When intermediate connectors are used, shields shall be individually continued via the intermediate 

connector pins while shielding for RF wires or overall shields shall be circularly terminated to the RFI 

backshells. 

5.1.1.18 Conductive Caps 

All electrical connectors not engaged shall be covered with a conductive cap.. 

5.1.1.19 Equipment Chassis Apertures 

The equipment case shall not contain any apertures other than those that are essential for connectors, 

sensor viewing or out-gassing vents. If out-gassing vents are required, they shall be as small as possible 

(less than 5 mm diameter) and shall be located close to the equipment mounting plane, i.e. the spacecraft 

structure ground. 

5.1.1.20 Grounding Diagram 

Grounding diagrams shall be established at both Equipment and Subsystem level. The minimum extent of 

each diagram shall be: 

− Primary/secondary power grounding. 

− Interface circuit grounding. 

− EMI filters. 

− Shielding Grounding 

− Equipment Grounding 

− Principal Interface Circuit Diagram 




5.1.3 EMC Performance Requirements 


DATE : 12/02/2004 


123/136 

Commentary: Some EMC performance requirements depend strongly on both the power quality and on the 

power system architecture (e.g. protection provisions, power regulation, voltage etc.), especially as far as 

conducted requirements are concerned. Moreover, radiated EMC performance requirements need tailoring 

to particular frequency notches typical of the hosting spacecraft. This information may not be available at 

the time of the design. 

The EMC requirements specified in the following paragraphs have been derived and tailored to meet the 

demands of most spacecraft known to the writer that could accommodate the Subsystem. They also allow a 

strict control of the EMC quality of the Subsystem per se. 

Those requirements have been specified with the idea of avoiding unnecessary stringent demands that 

might impact costs and technical solutions. However, the requirements might be further refined as soon as 

information on the hosting spacecraft will be known. Presently, the ESA Power Standards are assumed as a 

reference. 

Specific requirements are made applicable to equipment or subsystem in order to enhance meeting the 

spacecraft overall compatibility requirement. These requirements are normally applicable at the equipment 

level, however they can be made applicable to a set of equipment which operates together (i.e. Subsystem 

level). When the following requirement state that they are applicable to subsystem equipment, it should be 

understood that the requirement could be applicable at either the equipment or subsystem level. The levels 

are applicable when the subsystem equipment is set to the operational condition yielding the maximum 

emission. 

5.1.3.1 Conducted Emission on Power Lines 

Conducted emissions on power lines generated by the subsystem equipment shall be controlled as follows: 

5.1.3.1.1 Conducted Emission on Primary Power Lines, Frequency Domain, 

Differential Mode, NB 

Narrow Band conducted emission Differential Mode in the frequency range 30 Hz to 50 MHz generated by 

the subsystem equipment on each primary power line shall not exceed the following adjustable limit: 

For nominal DC input current less than 1 A, use the curve of Figure 5.14.3-1as shown. 

For nominal DC input current greater than 1 A, the curve of Figure 5.14.3-1shall be relaxed by the factor 

10*log [I (A)]. I (A) is the nominal input current in Ampere. 



dBuA r.m.s 

100 

90 

80 

70 

60 

50 

40 

30 


NB CE Power Lines - Differential 

94 


DATE : 12/02/2004 


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20 

1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08 


Figure 5.14.3-1:Narrow Band Conducted Emission Current – Differential Mode 

5.1.3.1.2 Conducted Emission on Primary Power Lines, Frequency Domain, Common 

Mode, NB 

Narrow Band conducted emission Common Mode in the frequency range 10 kHz to 50 MHz generated by 

the subsystem equipment on the primary power lines shall not exceed the following adjustable limit: 

For nominal DC input current less than 1 A, use the curve of fig. 5.14.3-2 as shown. 

For nominal DC input current greater than 1 A, the curve of fig. 5.14.3-2 shall be relaxed by the factor 10*log 

[I (A)]. I (A) is the nominal input current in Ampere. 

Figure 5.14.3-2 Narrow Band Conducted Emission Current – Common Mode 

5.1.3.1.3 Current Ripple, Time Domain, Differential Mode 

Differential mode, time domain current ripple and spikes on the primary power bus of the subsystem 

equipment shall be: 

For nominal DC input current less than 1 A: 

Ripple: less than 20 mApp. 

Spikes, including ripple: less than 60 mApp. 

For nominal DC input current greater than 1 A: 

Ripple: relax 20 mApp by a factor √I (A), I (A) being the nominal input current in Ampere. 

Spikes, including ripple: relax 60 mApp by a factor √I (A), I (A) being the nominal input current in Ampere. 

Ripple and spikes shall be measured on both the primary and return lines with at least 50 MHz bandwidth. 


34 




DATE : 12/02/2004 


125/136 

5.1.1.2 Conducted Emission Common Mode Current on Signal Bundles 

The Conducted Emission Common Mode on individual Signal Bundles of the subsystem shall be measured 

from 10 kHz to 50 MHz. Measurement shall be used to establish the limits for Conducted Susceptibility 

Common Mode current injection on the same bundles. 

5.1.1.3 Conducted Susceptibility Power Lines – Differential Mode – Steady State 

The subsystem equipment shall not exhibit any malfunction, degradation of performance or deviation beyond 

the tolerance indicated in its specification when sinusoidal voltages with amplitude specified in Fig.5.14.3-3 is 

injected into the subsystem equipment power leads in the frequency range 30Hz-50MHz. The frequency 

sweep rate shall not be faster than 5 min/decade. 

Amplitude - Vrms 

Conducted Susceptibility Power - DM 

1.2 

1.1 

1 

0.9 

1 

0.8 

0.7 

0.6 

0.5 

0.5 

0.4 

0.3 

0.2 

1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08 


Figure 5.14.3-3:– Conducted Susceptibility Power Lines – Differential Mode 

In the frequency range 50 kHz – 50 MHz, the applied sinusoidal voltage shall be 1 kHz amplitude modulated 

(30% AM). 

The requirement shall be considered to have been met when: 

1) Frequency range 30 Hz – 50 kHz 

The specified test voltage level cannot be generated but the injected current has reached 1 Arms and the 

subsystem equipment is still operating without malfunctions within its specified tolerances. 

2) Frequency range 50 kHz – 50 MHz 

A power source of 1 Watt, 50 Ω impedance cannot develop the required voltage at the equipment power 

input terminals and the subsystem equipment is still operating without malfunctions within its specified 

tolerances. 





DATE : 12/02/2004 


126/136 

5.1.1.4 Conducted Susceptibility Power Lines – Common Mode – Steady State 


the tolerance indicated in its individual specification when a sinusoidal common mode signal from 10kHz to 

50MHz (30% AM modulated by 1kHz square wave between 50kHz and 50MHz) is injected in both the 

subsystem equipment power leads via Bulk Current Injection (BCI) until: 

− 2 Vpp is achieved between return line and chassis. 

− The injected current shall be monitored and limited to 1A peak. 

5.1.1.5 Conducted Susceptibility Common Mode Current on Signal Bundles 


the tolerance indicated in its individual specification when a sinusoidal common mode current of amplitude 6 

dB higher than the common mode measurement (specified in the paragraph 5.14.3.2) is injected into the 

signal bundles. 

5.1.1.6 Conducted Susceptibility Common Mode Voltage on Signal Reference – 

Steady State 


the tolerance indicated in its individual specification when sinusoidal voltages with 2 Vpp amplitude are 

applied between the subsystem equipment signal reference and the ground plane in the frequency range 50 

kHz – 50 MHz. The sweep rate shall not be faster than 5 min/decade. 

5.1.1.7 Conducted Susceptibility Common Mode Voltage on Signal Reference - 

Transient 


the tolerance indicated in its individual specification when transient voltages typically shaped as shown in fig 

5.14.3-5 are applied between the equipment signal reference and the ground plane. 

With reference to Fig. 5.14.3-5, the peak amplitude shall be calibrated to ± 3 V and Td shall be between 150 

ns and 250 ns when the source having output impedance of 50 Ω is connected to a 50 Ω resistor. Then the 

source is applied to the equipment after it is detached from the ground plane. The pulse repetition frequency 

of the waveform shall range from 5 Hz to 10 Hz and the test duration shall be at least 5 minutes 

5.1.1.8 Conducted Susceptibility on Power Lines – Transients 

5.1.1.8.1 Differential Mode 

The unit shall not exhibit any malfunction, degradation of performance or deviation beyond the tolerance 

indicated in its individual specification when transient voltages typically shaped as shown in Fig. 5.14.3-4 are 

superimposed on the steady state bus voltage at the unit input power leads. With reference to Fig. 5.14.3-4 

the peak amplitude shall be ±2.5V, the rise time between 10µs and 100µs, the flat portion of the pulse ~ 

300µs and the time constant 2ms. The pulse repetition frequency of the waveform shall range from 5 Hz to 

10 Hz and the test duration shall be at least 5 minutes. 



Voltage Transient (Volts) 



DATE : 12/02/2004 


127/136 

-2 0 2 4 6 8 10 

Time (msec) 

5.1.1.1.2 Common Mode 

Figure 5.14.3-4– Typical transient waveform for DM Transient on PL 



100% 


the tolerance indicated in its individual specification when transient voltages shaped as shown in Fig. 5.14.3- 

5 are applied between the power return line and the unit case. With reference to Fig. 5.14.3-5 the peak 

amplitude shall be 28 V, the rise time less than 100ns and the length (Td) at least 5µs. Repetition rate shall 

range from 5 Hz to 10 Hz and the test duration shall be at least 5 minutes 

Amplitude - V 

0 

Td 

Time 

Figure 5.14.3-5: Typical transient waveform for CM Transient 

80% 

60% 

40% 

20% 

0%


5.1.1.9 NB E-Field Radiated Emission 


DATE : 12/02/2004 


128/136 

Commentary: The following requirements assume that the instruments OFF when the spacecraft is 

connected to the launcher and therefore do not account for specific frequency notches that may be 

requested by the hosting spacecraft and launcher. 

The requirement is defined here for the frequency range 14 kHz – 18 GHz. 

If the instruments are ON then the requirements given the ARIANE 5 User Manual plus any requirements 

from the spacecraft shall be applicable. 

Narrow-band electric fields generated by the subsystem equipment and measured at 1 m distance shall not 

exceed the limits shown in Fig. 5.14.3-6 in the frequency range 14kHz – 18GHz: 

dBµV/m 

90 

80 

70 

60 

50 

40 

30 

20 

10 

0 

-10 

Radiated Emission - E Field 

50 

10E+3 100E+3 1E+6 10E+6 100E+6 1E+9 10E+9 100E+9 


Figure 5.14.3-6:Narrow-Band Radiated Emission Limit – E Field. 



74 

7.19 to 

7.235 GHz 

Around the spacecraft telecommand receive band, the electric field emitted by the subsystem equipment 

under test, including intentional and unitentional radiation from the test harness, shall not exceed the limits 

shown in Fig. 5.14.3-6b :

RE-E (dBµV/m) 

80 

70 

60 

50 

40 

30 

20 

10 

0 


Radiated Emission, E-field 


DATE : 12/02/2004 


129/136 

7133 7271 

7186 7218 

7193 7211 

7.10E+9 7.12E+9 7.14E+9 7.16E+9 7.18E+9 7.20E+9 7.22E+9 7.24E+9 7.26E+9 7.28E+9 7.30E+9 

Frequency(Hz) 

Figure 5.14.3-6b : Radiated Emission E-field limit, TC notch 

5.1.1.10 NB E-Field Radiated Susceptibility 

Commentary: The following requirement does not account for specific frequency notches that may be 

requested by the hosting spacecraft. This information will be unequivocally available when the launch 

opportunity will be defined. 


the tolerance indicated in its individual specification when it is irradiated with 2 V/m, 1 kHz amplitude 

modulated (30% AM), in the frequency range 14 kHz – 18 GHz. 

5.1.1.11 H Field Radiated Emission 

Narrow-band electric fields generated by the subsystem equipment and measured at 1 m distance shall not 

exceed the limits shown in Fig. 5.14.3-7 in the frequency range 30Hz – 50kHz. 



dBpT 

65 

60 

55 

50 

45 

40 

35 

30 

25 


NB Radiated Emission - H Field 

60 


DATE : 12/02/2004 


130/136 

20 

1.E+01 1.E+02 1.E+03 


1.E+04 1.E+05 

Figure 5.14.3-7– Narrow-Band Radiated Emission Limit – H Field. 

Commentary: Requirements on Pulsed Magnetic field are currently (TBC). If dictated so, they can be 

introduced at a later version of this document 

5.1.1.12 H Field Radiated Susceptibility 


the tolerance indicated in its individual specification when it is irradiated with a magnetic field of 140dBpT in 

the frequency range 30Hz–50kHz 

5.1.1.13 Arc Discharge Susceptibility 

The following statement is not applicable for Herschel cryogenic units as they are not directly exposed to 

ESD. 

No malfunction, degradation of performance or deviation beyond the tolerance indicated in its individual 

specification shall occur when the subsystem equipment and its interface lines are exposed to a repetitive 

electrostatic arc discharge of at least 15 mJ energy/ 15 kV. The current rise time shall be less than 10 ns. If 

damage risks are envisaged for interface circuits, the voltage can be reduced down to 4 kV but the energy 

shall remain 15mJ. 

5.1.4 Conducted Emission/Susceptibility 

(deleted) 

5.1.5 Radiated Emission/Susceptibility 

(deleted) 



5.1.6 Frequency Plan 

(deleted, see RD 45) 


5.1.7 Plug-in and Inrush current measurement 


DATE : 12/02/2004 


131/136 

The inrush current shall be measured on the positive power line of the user connected to its 28V power 

supply through the LISN defined in § 9.5.6.9, when switching it ON with an external bounce-free relay (e.g. 

laboratory mercury relay) installed between the LISN and the user on the positive power line. 

The recorded inrush current (measured with an oscilloscope in single shot mode) shall show the following 2 

distinct aspects : 

− A current transient corresponding to the charge of the primary filter capacitors 

− A DC/DC converter start current transient 

The primary filter charge current transient shall be compliant with the following requirements : 

− S(I*dt) < 2 mC 

− dI/dt < 2 A/µs 

− I peak < 30 A 

The DC/DC converter start current transient : 

− shall not exceed the user line LCL current limitation value for a total time higher than 5ms (TBC) 

− shall comply with : S(I*dt) < (LCL current limitation value)*5ms (TBC) 

The test shall be repeated with the unit nominally switched on by the LCL, and shall comply with the 

following mask : 

LCL I LIMIT 

I NOM 

50 µs 

dI/dt 

< 1A/µs 

5ms (TBC) 

Figure 5.14.7-1 inrush current template 

In the case, illustrated here-below, where the Instrument design is such that some 28 V power line user 

(Instrument unit or subsystem) can be switched on not only by the LCL but also by an additional switching 

function implemented in the unit/subsystem of interest or in another Instrument unit, the inrush current 

corresponding to this switch ON scenario shall be measured and shall comply with the same mask. 



PCDU 


LCL 

5.15 INSTRUMENT HANDLING 

5.15.1 Transport container 



DATE : 12/02/2004 


132/136 

Instrument 

For all deliverable units, transport containers shall be provided. 

The containers shall be vacuum tight, be purged and slightly over-pressurised with dry nitrogen gas. 

The containers shall be equipped with a mounting platform supported by a shock absorber. 

Shock recorders shall be mounted at a relevent location proposed by instruments. 

The containers shall be made of material compatible with cleanliness requirements of Section 5.15.2 and 

shall be equipped with witness devices. 

The units shall provide adequate hoisting provisions for crane suspension. Electrical grounding 

provision/bonding provisions from the units to the outside of the container (ESD protection) shall be available 

(tbc).Protections for unit openings, optical apertures and electrical connectors shall be provided. 

Protection for unit openings, optical apertures and electical connectors shall be provided. 

The IID-B (AD 1-1 to 1-6) shall list size and mass of the containers as well as the overall mass including the 

instrument package. 

5.15.1.2 Warm electronic units and interconnecting harness 

For all deliverable units, transport containers shall be provided. 

The containers shall be slightly over-pressurised with dry nitrogen gas, if necessary. 

Hygrometry will be recorded with witness devices. 

The containers shall be equipped with a mounting platform supported by a shock absorber. 

Shock recorders shall be mounted at a TBD location. 

The containers shall be made of material,compatible with cleaniness requirements of Section 5.15.2 and 

shall be equipped with witness devices. 

The IID-B (AD 1-1 to 1-6) shall list size and mass of the containers as well as the overall mass including the 

instrument package. 



load

5.15.2 Cleanliness 




DATE : 12/02/2004 


133/136 

Herschel FPU: The container opening will be performed in CR 100.000 with a relative humidity of 50% +/- 

10%. The Herschel FPU shall be double packed in suitable foil (e.g. Cleanliness, EMC antistatic, humidity, 

...). First foil removal will be performed in CR100.000 and the second foil in the CR100. 

For Planck FPU, the container opening will be performed in CR 100 000 with a relative humidity of 50% +/- 

10%. 

Any other requirements (including the expected level of contamination of the FPU at instrument delivery)shall 

be specified in the IID-B (AD 1-1 to 1-6). 

5.15.2.2 Warm electronic units and interconnecting harness 

The Warm Electronics container may only be opened in a clean room environment of class 100 000 with a 

relative humidity of 50 %. 

Any other requirements, including the expected level of contamination of the warm units at instrument 

delivery shall be specified in the IID-B (AD 1-1 to 1-6). 

5.15.2.3 Expected instrument cleanliness degradation during AIV and launch phases 

The expected Planck instrument cleanliness degradation during AIV and launch phases will be lower 

than: 

Particulate Molecular 

(ppm) (10-7 g/cm2) 

Phase FPU 

Reflectors 

(PR & SR) 

FPU 

Reflectors 

PR 

contributions at Delivery 300 900 30 5 SRS/IID-B's 

AIV 530 530 1.4 1.4 cleanliness control plan 

Bef Encapsul 1895 1895 cleanliness team 

Launch 2300 2300 4 4 Arianespace 

Orbit 0 5.05 52.7 EOL cleanliness analysis 

total EOL 5000 5000 60 63.1 =SRS when Summ is lower 

(assumes cleaning before bef) (only 5.8 on SR during orbit) 

The expected Herschel instrument FPU cleanliness degradation during AIV and launch phases will be 

lower than: 

Phase FPU LOU 

Particulate Molecular 

(ppm) (10-7 g/cm2) 

LOU 

windows 

reflectors FPU LOU 

LOU reflectors 

windows (same 

(int + ext) M1 & M2) 

contribution at delivery 300 300 300 300 40 40 2 2 SRS 

AIT 75 2060 2060 1600 42.5 14.6 51.2 0.87 

Cleanliness team annex 2-2 + 

permeation & on ground outgassing 

Launch 2300 2300 2300 4 4 4 Ariane, 2 weeks 

in orbit 5.7 0.7 0.7 0.7 0.3 5.0 495.3 7.0 EOL cleanliness analysis 

total EOL 1200 4660.7 4660.7 4500 82.8 63.6 552.5 40 




5.15.2.4 Outgassing properties of material 


DATE : 12/02/2004 


134/136 

The material used to build the instruments shall be below the following outgassing properties 

Part TML CVCM 

FPU

5.15.4 Purging 



DATE : 12/02/2004 


135/136 

If it is demonstrated that during system level ground tests purging is absolutely necessary the PI shall 

provide an instrument purging plan, to be part of the IID-B which shall establish 

− definition of purging connection 

− provision of purging equipment 

− detail purging requirements and procedures 

− assistance in commissioning purging procedures 

During the final phase of launch preparations the performance of purge operations on a regular basis may 

violate safety procedures and hence be impossible. 

It is currently foreseen to provide purging for the LOU, according to the need expressed in HIFI IID-B. 

5.15.5 Mechanism positions 

Sometimes mechanisms should be placed in a certain position, to avoid possible damage caused by 

vibration during transport. Should this be the case then this position shall be listed in the IID-B (AD 1-1 to 1- 

6) 

5.16 Environment requirements 

This section is added to include the environmental requirements not covered by the test requirements in 

chapter 9. 

More information is given in RD 2 (EVTR Environment & test requirements) 

5.16.1 Pressure environment 

5.16.1.1 During Launch phase: 

The typical pressure variation during launch is defined in Figure 5.16.1-1. Typical slope of pressure variation 

is 20 mbar/s during the launch vehicle ascent phase with locally 45 mbars/s during the transonic phase. 




5.16.1.2 During orbital phase 


DATE : 12/02/2004 

Figure 5.16.1-1: Variation of static pressure inside fairing 

During orbital life, the Satellite is exposed to free space vacuum (


6 GROUND SUPPORT EQUIPMENT 

6.1 Mechanical Ground Support Equipment 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :6-1/3 

Mechanical Ground Support Equipment (MGSE) is the total of the mechanical equipment or special 

tools necessary to support instrument (at system, subsystem, unit level) related activities, such as: 

• instrument handling and integration into the Payload Module (PLM) or parts thereof other than 

standard space industry equipment or tools) 

• instrument testing after its integration into the PLM and at level of the complete satellite 

• instrument protection against the environment at the various integration and test sites (normally 

class 100000 or class 100 clean room conditions) 

This MGSE shall be supplied in sufficient quantities (normally one per instrument model) to ensure 

efficient integration and testing of the various satellite models. 

6.2 Electrical Ground Support Equipment 

Electrical Ground Support Equipment (EGSE) is the total of the instrument specific electrical equipment 

necessary to support testing and operational activities of the instrument at various levels. 

The Herschel/Planck instrument teams have identified an EGSE implementation, which provides 

maximum reuse of resources (see below), since that system will also be used both during instrumentlevel 

testing, system level tests and in the operational phases of the mission (see IID-Bs). 

The EGSE shall be supplied with the instrument models. 

For Herschel, 2 sets of EGSE will be delivered for the 3 instruments: 

• One prime set (1 SCOS 2000 machine, 1 HCSS machine, 1 QLA machine) 

• One backup set (1 SCOS, 1 HCSS). 

The scope of Instrument EGSE is 

• to generate instrument command sequences (vs. Individuel commands) 

• to archive instrument TM for science or instrument purpose 

• to analyse instrument TM. 


Taking into account that it is a fundamental design goal of the Herschel/Planck mission that 

commonality should be pursued to the maximum extent possible, the Herschel instrument teams have 

been actively engaged in investigating such possibilities.

6.3.1 EGSE 



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :6-2/3 

It has been agreed that a common Herschel EGSE system could be developed as a collaborative effort 

between instrument groups. 

The common approach is, that 

different instrument groups use the same EGSE-ILT and 

all different EGSE’s for the different phases are based on the same system, i.e. SCOS 2000. 

In addition, it has been agreed that this system would be applicable at various times during all the 

phases of the mission listed below: 

• Subsystem Level Testing 

• Instrument Level Testing 

• Module and System Level Testing 

• In-orbit instrument commissioning 

• Performance Verification 

• Routine operations 

In the interests of minimising the cost and maximising the reliability of such a system through the 

different phases the EGSE will: 

be based on SCOS 2000 – this system will be used in the ground segment by the MOC for controlling 

the satellite. The cost of the system (essentially free), its proven use in similar situations for other space 

projects and the support provided by ESOC, contribute to a cheaper and more reliable system. 

use the same interfaces between the EGSE and other systems, in order to improve reliability through 

reuse throughout the mission. 

Provide a constant implementation of the 

• Man Machine Interfaces 

• Data Archiving and Distribution facilities 

• On-board Software Management 

• On-board Maintenance (e.g. Software Development Environment, Software Validation Facility) 

• Common User Language (for Test procedures and in-orbit operations) 

Although this approach is not used by Planck instruments, the Planck EGSE interface to the CCS (Central 

Checkout System) should be similar to the Herschel one.


6.3.2 Instrument Control and Data Handling 


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ISSUE : 3.1 PAGE :6-3/3 

All three Herschel instruments are using the same supplier (IFSI) for their on-board control and data 

handling hardware and software systems, which interface to the spacecraft. This has ensured 

commonality in the areas of: 

• on-board microprocessor 

• On-board Programming language 

• Software Development Environments 

• Software Validation Facilities 

6.3.3 Other Areas 

Other areas of possible commonality will be addressed by working groups set up as and when 

necessary. These may cover: 

Follow up on Herschel Common Science System data base activities 

A common approach to IA/QLA systems.


7. INTEGRATION, TESTING AND OPERATIONS 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE : 7-1/27 

Information in this chapter covers all instrument-related activities after the acceptance of the instruments by 

ESA and hand-over to the Contractor. 

7.1 AIV Sequence Overview 

7.1.1 Herschel/Planck Satellites Model Philosophy 

For Herschel and Planck the model philosophy at satellite level is: 

− A multipurpose Structural and Thermal Model (STM) 

− A single purpose Avionics Model (AVM) 

− A Proto-Flight Model (PFM) 

These models are completed by the followings PLM and Telescope development models: 

− an Engineering Qualification Model (EQM) and Proto-flight Model (PFM) of the Herschel E-PLM 

− a Cryogenic and RF Qualification Model (CQM/RFQM) and a Flight Model (FM) of the Planck PLM 

(PPLM) 

− a Radio Frequency Development Model (RFDM) of the Planck PLM 

− a Qualification Model (QM) and a Flight Model (FM) of the Planck Telescope. 

The main objectives of each model are given hereafter: 

7.1.1.1 AVM (Electrical Test Bench): 

− development model for functional design and S/S compatibility 

− Validation of Instrument warm units electrical interfaces (Power, data, synchro) 

− development model for on board software validation 

− EMC pre-qualification. 

7.1.1.2 Herschel STM and Planck STM: 

− development model for structure layout and certification 

− development model for thermal control certification 

− confirmation of mechanical and thermal environment before flight models testing. 

7.1.1.3 Herschel PFM and Planck PFM: 

− Proto-Flight Model for qualification completion in the areas where this qualification has not been 

completely achieved with the other models, and acceptance for flight. 

7.1.1.4 EQM of Herschel PLM (reuse of ISO cryostat): 

− development model for instruments compatibility and EMC at cryogenic temperature. 




7.1.1.5 PFM of Herschel E-PLM: 


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ISSUE : 3.1 PAGE : 7-2/27 

− Proto-Flight Model for mechanical and thermal qualification of the cryostat at Herschel STM level 

using instrument dummies and later on with the FM instruments used for acceptance testing of the 

PFM satellite. 

7.1.1.6 CQM/RFQM of Planck PLM: 

− development model for mechanical and cryogenic qualification (CQM) 

− instrument compatibility and EMC at cryogenic temperature 

− Radio Frequency a submillimetric performance certification (RFQM) 

7.1.1.7 RFDM of Planck PLM 

− specific model of telescope & baffles built around ARCHEOPS reflectors to validate and correlate the 

mathematical model. 

7.1.1.8 TTC RF Mock-up of Herschel and Planck Satellites 

− specific models to verify the RF pattern of the TTC antennas in both configurations. 

This approach is summarised by Figures 7.1.1-1 & 7.1.1-2. 

Development 

Models 

Qualification 

Models 

PFM 

SVM PLM Satellite 

Common SVM 

AVM 

Software validation 

Electrical compatibility test 

EGSE validation 

AIT proc edure validation 

SVM 

STM 

Structure qualification 

Thermal qualification 

Interface and lay-out 

verifications 

SVM 

PFM 

Functional/performance 

pre- EMC 

PLM 

EQM (cryostat ISO) 

Cool down 

functional test 

EMC 

EPLM 

STM/PFM 

Cool down 

Cryogenic & Thermal 

qualification 

Alignments 

EPLM 

PFM 

Cool down 

Functional test 

Alignments 

Herschel 

AVM (*) 




AIT procedure validation 

pre-Conducted EMC 

(*) Includes Herschel instruments 

AVM WU 

Herschel 

STM 

Interface and lay-out 

verifications 

Mechanical qualification 

Alignments 

Herschel 

PFM 


Mechanical acceptance 

Functional / performance 

Alignments 

EMC 

Figure 7.1.1-1: Model Philosophy for Herschel 




Development 

Models 

Qualification 

Models 

PFM 

SVM 

Common SVM 

AVM 





SVM 

STM 


Interfac es and la yout 

verifications 

SVM 

PFM 

Functional/performance 

pre- EMC 

7.1.2 Herschel AIV Sequence Overview 

PLM 

RFDM 

Math. Mod el validation 

RFQM 

RF performances 

PLM 

CQ M 

Interfac es and la yout 

verifications 

Alignments 


HFI Functio nal test 

PLM 

FM 

Functional test 

Alignments 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE : 7-3/27 

Satellite 

Planck 

AVM (*) 





pre-Cond ucted EMC 

(*) Includes Pl anck instruments 

AVM/CQM WU 

PLANCK 

STM 

Interfaces and layout 

verifications 

Mechanical qualification 

Alignments 

PLANCK 

PFM 

Thermal acceptance 

Mechanical Acceptance 

Functional / performance 

Alignments 

EMC 

Figure 7.1.1-2: Model Philosophy for PLanck 

The Herschel AIV sequence, as far as related to the instruments, consists of three separate test campaigns, two 

related to tests with the PLM, i.e. inside the cryostat and one separate for the AVM testing. This is directly 

reflected in the instrument hardware model philosophy including their respective EGSE and MGSE (refer to 

chapter 9.2.2). 

The two test campaigns identified w.r.t. the activities on the Herschel Instruments that will be in the Herschel 

PLM are summarised by: 

− Integration of the CQM units in the PLM EQM -> PLM compatibility test -> EMC testing 

− Integration of the PFM units in the PFM cryostat -> PLM PFM integration and tests -> Integration 

(mating) with complete PFM SVM and satellite integration-> System PFM tests 

Notes: 

− For the mechanical and thermal qualification (STM sequence) of the Herschel satellite, instruments will 

be simulated by Mass & Thermal Dummy (MTD) not part of the instruments delivery. 

− At the end of the PLM EQM test campaign, the FPU CQM LOU will be returned to the instrument 

teams.. The warm units will be sent to SVM contractor and will remain there until the launch. 

The test campaign identified w.r.t. the specific activities on the Herschel Instruments (i.e. warm units) that will 

be in the Satellite AVM is summarised by: 

Herschel AVM Instrument integration in the AVM satellite in Herschel configuration --> EMC Conducted test -- 

> Herschel AVM units electrical and software interface validation with system environment 

7.1.3 Planck AIV Sequence Overview 

The Planck AIV sequence, as far as related to the instruments, consists of three main test campaigns, two 

related to tests with PLM at satellite level and one separate for the AVM testing . This is directly reflected in the 

hardware model philosophy of instruments including their respective EGSE and MGSE (refer to chapter 9.2.2). 

There are two separate hardware models of the Planck Payload module (P-PLM): 





DATE : 12/02/2004 

ISSUE : 3.1 PAGE : 7-4/27 

− a Cryogenic Qualification Model (CQM) which accommodates the CQM instruments 

− a FM which accommodates PFM instruments, 

The PPLM are associated with relevant models of the SVM for system test purposes (SVM dummy or SVM 

STM for Planck QM, SVM FM for Planck FM). An SVM dummy is used for the Planck CQM thermal tests , 

and replaced later on with the SVM STM for the mechanical qualification (STM sequence) of the Planck 

Satellite. 

The two test campaigns identified w.r.t. the activities of the instruments on the Planck PLM are summarised by: 

− Planck instrument CQM and PLM CQM integration --> Integration (mating) with dummy SVM --> 

System Thermal/cryogenic testing --> Replacement SVM dummy by SVM STM --> System mechanical 

testing 

− Planck instrument PFM and PLM FM integration --> Integration (mating) with complete PFM SVM --> 

System PFM tests 

Notes: 

− For STM sequence, instruments not compatible of such testing will be simulated by Mass & Thermal 

Dummy (MTD) not part of the instruments delivery. The current situation is that all LFI units (warm & 

cold), Sorption cooler compressor, & HFI gas storage units are replaced by MTD for the thermal test. 

− At the end of the CQM/STM test campaign, the FPU CQM will returned to the instrument teams when 

the Warm Units CQM (or AVM) will be integrated on the AVM satellite in Planck configuration. 

The test campaign identified w.r.t. the specific activities on the Planck Instruments (i.e. warm units) that will be 

in the Satellite AVM is summarised by: 

− Planck AVM Instrument integration in the AVM satellite in Planck configuration --> EMC Conducted 

test --> Planck AVM units electrical and software interface validation with system environment 

7.1.4 Satellite Test Plans - Summary 


Test AVM STM PFM QM/STM PFM 

Static test - at Primary 

Structure level 



- - - 

Sine & acoustic - Q A Q A 

Shock test - X (**) - X (**) - 

Fit check - X X X X 

Mass properties - X X X X 

Alignments - X X X X 

Sun Simulation - at SVM STM 

level 

only 

Thermal Balance - at both modules 

level 

Simulated by 

skin heaters 

Delta Q on SVM 

A on PLM 

at SVM STM 

level Only 

at both modules 

level 

Simulated by 

skin heaters 

Delta Q on SVM 

A on PLM 

Thermal cycling - A A 

He Leak test X X X X 

Leak test - X X X X

Functional tests of 

instruments in 

Cryogenic env. 



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ISSUE : 3.1 PAGE : 7-5/27 


- On PLM EQM X On PLM CQM X 

ESD - - On equipment - On equipment 

EMC R - on PLM EQM 

(***) 



X - X 

EMC C X on PLM EQM X On PLM CQM 

(during cryo test) 

RF perfos. N/A N/A N/A On RFQM LFI low freq. 

TTC RF Diagram - on RF Mockup on RF Mockup on RF Mockup on RF Mockup 

IST X - X - X 

SFT - - X - X 

SW compatibility X - X - X 

SVT SVT 0 - SVT 1 &2 - SVT 1 &2 

X = test performed 

Q = at qualification level when relevant 

A = at acceptance level when relevant 

«-« = no test 

(**) Q on equipment and final qualification achieved by analysis 

(***) with external source 

7.2 Integration 

Procedures detailing the individual integration steps will be prepared and reviewed in due time. 

7.2.1 HPLM Integration 

7.2.1.1 HPLM CQM Integration 

The integration sequence summarised in this Section 7.2.1.1 is considered as information only. The exact 

integration sequence will be optimised by Astrium. All details are given in the EQM AIT plan (RD28) and will 

be updated following the optimisation of all integration steps 

This paragraph reflects the integration of the CQM instruments into the test cryostat. The Herschel EQM used 

for this test is based on the ISO QM cryostat. 

The integration of the CQM instruments into this test cryostat starts with the open cryostat that has been 

adapted to this test before. The interface for the optical bench is the same as for Herschel. The Herschel upper 

bulkhead has been reproduced for this test and will be mounted after integration of the FPU’s. 

The integration flow of the instruments starts with mounting of the FPU’s on the optical bench and is 

considered completed with the closure of the cryostat at ambient temperature. 

The major steps that can be identified are: 

X


− Integration of the WU AVM’s on dummy structures 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE : 7-6/27 

− Instrument FPU CQM’s integration on optical bench (mechanical/thermal and electrical) 

− Instrument FPU’s ambient temperature functional check using either the warm units or a specific FPU 

EGSE 

− Instrument FPU’s alignment check with respect to. HOB (Herschel Optical Bench) 

− Closure of optical bench (mechanical and straylight. 

− MLI closure for optical bench 

− Subsequent integration (shield by shield) 

− Integration of cryostat vacuum vessel outer shell upper part (connection of He filling/venting system, 

leak test of the He system after connection) 

− LOU CQM integration and LOU/CVV Alignment check with open cover 

− Closure of the cryostat with EQM cryostat cover and integral leak test of the cryostat vacuum vessel, 

pre-evacuation of the system 

− Transport of cryostat from integration area (clean-room class 100) to test area (clean-room class 

100.000) and preparation for CQM instrument testing. 

The integration is assumed to be similar to the final PFM integration sequence and is therefore not described 

in detail (see next paragraph). 

7.2.1.2 HPLM PFM Integration 

The integration sequence summarised in Section 7.2.1.2 is considered as information only. The exact 

integration sequence will be further optimised by Astrium. All details are given in the Herschel Satellite AIT 

plan (RD 29) and will be updated following the optimisation of all integration steps 

The integration of the instruments to the Herschel cryostat starts with the open cryostat at the completion of the 

earlier test phase, the STM programme, where instrument dummies are mounted in the PFM cryostat. The 

major tests completed at that point in time are: 

− cryostat thermal characterisation (lifetime, ground hold time) 

− cryogenic operations verification (cooling, filling, He II production and top-up, pressure drop, launch 

autonomy verification) 

− satellite structural qualification (sine vibration and acoustic noise) 

− alignment verification 

− procedure development (also on EQM and AVM) 

− warm up. 

The integration flow of the instruments starts after removal of the FPU MTD’s with mounting of the FPU PFM’s 

on the optical bench and is considered completed with the closure of the cryostat at ambient temperature. 

The major steps that can be identified are: 

− integration of the warm units on the FM SVM instrument panels 

− Instrument FPU PFM’s integration on optical bench (mechanical/thermal and electrical) 

− Instrument ambient temperature short functional test using the warm units or a specific FPU EGSE 

− Alignment check of the FPU PFM’s w.r.t. HOB 

− Closure of optical bench (mechanical and straylight) 




− MLI closure for optical bench 

− Subsequent integration (shield by shield) 

− Integration of cryostat vacuum vessel outer shell upper part 

− Alignment of the HOB w. r. t. CVV Windows 

− LOU PFM integration and LOU/CVV Alignment check with open cover 


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ISSUE : 3.1 PAGE : 7-7/27 

− Closure of the cryostat and integral leak test of the cryostat vacuum vessel, pre-evacuation of the 

system 

− Transport of cryostat from integration area (clean-room class 100) to test area (clean-room class 

100.000) and preparation for PLM testing. 

The sequence assumes the use of class 100 clean room and cleanliness control procedures similar to the 

integration of the ISO system. 

The following assumptions are used for the planning: 

7.2.1.2.1 Instrument integration to optical bench and Instrument Short Functional Test 

(SFT) at ambient temperature (functional check) 

Each instrument FPU is mounted separately to the optical bench. The integration is done according common 

practice on ESD protection in the class 100 clean-room. The thermal links are integrated from the tank, resp. 

the cooling loops. The harness is integrated from the CVV interface connectors to the FPU’s. Then it is foreseen 

to perform an Instrument SFT, instrument by instrument, at ambient temperature. Thus, the instrument Warm 

Units are needed for this test, the pre-integrated instrument panels have to be mounted together with a 

support structure onto the PLM. As an alternative, the short functional tests of the FPU’s can be done using a 

specific EGSE instead of the warm units. Herewith early delivery of the warm units could be avoided. An 

alignment check of the instruments FPU's w.r.t. the HOB has to be performed before closure of the HOB. 

Note: The instrument ambient temperature SFT shall clearly verify the integrity of the FPU’s. If this is not 

possible (e. g. due to limited operation of the FPU’s at ambient), dedicated contingency tests for the FPU’s 

have to be performed. If special test equipment is needed for such test (e. g. in order to avoid a potential 

damage of the FPU’s) , it shall be provided by the instruments. 

7.2.1.2.2 Closure of optical bench 

After completion of the above the optical bench can be closed. This is basically just putting the shield around 

the instruments. 

The validation of this integration approach is considered part of the CQM test sequence, so has been 

validated following the same lines. 

7.2.1.2.3 MLI closure for optical bench and subsequent shields integration 

The closure of the cryostat is systematic integration of the shields and closure of the MLI between the upper 

conical shield and the cylindrical part of the cryostat. One major element during the integration is the control 

and achievement of the cleanliness requirements. 

7.2.1.2.4 Integration of cryostat vacuum vessel outer shell upper part 

After integration of the insulation system the outer shell can be integrated. After that the LOU can be 

integrated. 




7.2.1.2.5 Integration of FM cryostat cover 


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The cryostat cover is mounted on top of the system with the opening mechanism. The integration is completed 

by a SFT at ambient temperatures. Upon completion of the cover integration the system is closed and ready 

for the integral leak test of the insulation system. The cryostat is pre evacuated and integral leak test 

performed. After that a (warm) alignment check is performed. The system is now ready for transport from the 

integration area to the test area and the start of the test sequence. 

7.2.2 PPLM Integration 

7.2.2.1 PPLM CQM Integration & tests 

This paragraph reflects the integration of the CQM instruments into the SVM dummy for thermal tests, and 

later on SVM STM for machanical tests 

The integration flow of the instruments starts with mounting the cryo structure. During the mating with the STM, 

all the WU’s will be mechanically and electrically integrated 

Note1: only HFI QM is present 

Note2: only nominal units iare used; redundant units will be replaced by MTD (Mechanical Thermal 

Dummies) for mechanical and thermal aspects (mass and dissipated power simulation) 

Note3: the SCC will not be mounted, the functionality will be insured by bottles (TBC). MTD of the compressor 

will be used for mechanical tests 

The major steps that can be identified are (following the chronology): 

− sorption cooler (SCC, SCE, harness, pipes) mechanical integration into theirs panels 

− cryo structure assembly (grooves) with the WU’s positioned on the sub platform ( HFI PAU, LFI FPU 

MTD (i.e FPU+WG+BEU) 

− WU’s integration on the STM panels: all the wu’s necessary for the STM/CQM tests will be 

mechanically and electrically integrated. 

− 0.1 K, 4 K pipes will be integrated 

− mating will be done after delivery from Alenia of the STM (including MTD for all the equipment's + 

partially RCS (tanks not mounted will be replaced by MTD) 

− after PPLM mated on the STM, the completion of the PPLM integration will be done with the telescope 

(mirrors and primary structure), JFET, 0.1 K pipes completion, FPU shims. 

− The completion of the STM/CQM will be done with the grooves extensions, STM upper panels, MLI…. 

Note: electrical integration means that AIT team will: 

− check the signals at harness level before connecting to the EQM WU’s 

− connect the harness to the EQM 

− perform UFT tests. 

All the SVM functionalities (all the SVM equipment's will be replaced by MTD) will be insured by a test 

equipment named PLM EGSE 




7.2.2.2 PPLM PFM Integration 


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ISSUE : 3.1 PAGE : 7-9/27 

For the AIT team, one of the aim of the STM/CQM will be to validate the AIT sequence. So, the integration 

flow of the PFM will be the same than the STM/CQM one. 

The major steps that can be identified are (following the chronology) 

− sorption cooler (SCC, SCE, harness, pipes) mechanical integration into theirs panels 

− cryo structure assembly (grooves) with the WU’s positioned on the sub platform (DAE ctrl box for LFI, 

PAU for HFI, FPU assembly (i.e FPU+WG+BEU) 

− WU’s integration on the SVM panels: all the wu’s will be mechanically and electrically integrated 

− 0.1 K, 4 K pipes will be integrated 

At this state, the PPLM is not completely integrated. The completion will be done at satellite level after the 

mating of the PPLM on the SVM. 

Note: electrical integration means that AIT team will: 

− check the signals at harness level before connecting to the WU’s 

− connect the harness to the EQM 

− perform UFT tests. 

7.2.3 HSVM Integration 

The HSVM integration will be defined in due course in line with the instrument definitions and needs given in 

the IID B’s and the progress of the spacecraft and HSVM design activities in the industrial phase B. 

7.2.4 PSVM Integration 

The PSVM integration will be defined in due course in line with the instrument definitions and needs given in 

the IID B’s and the progress of the spacecraft and PSVM design activities in the industrial phase B. 

7.2.5 Herschel S/C PFM Integration 

The items to be integrated can be listed as: 

− Service module with PLM. 

− External structures 

− Herschel telescope 

− Herschel Sunshield and Sunshade 

The complete integration is performed with the He tank of the cryostat in cold conditions (i.e. 4.2K) and at 

normal pressure conditions. One filling could be expected during the integration period. The total available 

time for integration without filling is about 2 months. 

Additional explanations for each of the major integration steps: 

7.2.5.1 Integration of the Service Module with PLM 

The PLM is on the MGSE. The SVM support structure and the instrument panels are mounted to the PLM. The 

first step is therefore to remove the instrument panels and the support structure from the PLM. The integration 





DATE : 12/02/2004 

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of the SVM includes the mechanical mounting and the electrical re-connection of the warm units to the PLM 

units. 

The warm units of the instruments as coming from the PLM PFM test sequence need to be mechanically and 

electrically (functionally) integrated to the Herschel SVM to be ready for the integration of the SVM to the PLM. 

It includes the integration and de-integration of the necessary MGSE for lifting. 

7.2.5.2 External structures 

The activities foreseen comprise among others the integration of the external insulation of the cryostat on the 

front side, i.e. the side facing the sunshield, the upper conical part and the lower interface to the SVM. This 

includes, to partially mount already now the interfaces to the supporting struts for the sunshield. 

During these activities the cryostat will be refilled to 100 % with He I. The activities include mounting of the 

cryogenic GSE, filling and partial removal of the GSE. During these times the system needs to be connected to 

EGSE for cryostat control and commanding. The instruments need not be connected during this period. The 

ambient temperature units of the instruments as coming from the PLM PFM test sequence need to be 

mechanically and electrically (functionally) integrated to the Herschel SVM to be ready for the integration of the 

SVM to the PLM. 

7.2.5.3 Integration of the telescope 

The PLM/SVM composite is mounted on the MPT (Multi-Purpose-Trolley). The telescope is mounted on the PLM 

via the telescope mounting structure (TMS). Some special protection is applied to the telescope to avoid 

contamination. The external references of the telescope will be adjusted to the PLM reference. The thermal 

insulation/heating of the telescope will be mounted now, after completion of the mechanical/optical 

integration. The telescope reference cube will now be measured with respect to the CVV cube. It is not planned 

to perform any real telescope performance measurements now, e.g. measurement of the WFE. 

7.2.5.4 Integration Herschel Sunshield/Sunshade 

The sunshield/sunshade fixation design has mechanical interfaces to the cryostat and the SVM 

7.2.6 Planck S/C Integration 

Mating will be done after delivery from Alenia of the SVM. The six panels involving the WU’s will be delivered 

earlier in order to start the integration in parallel with the completion of the SVM. The SVM will be delivered 

with the two panels involving the platform equipment's. 

− after PPLM mated on the SVM, the completion of the PPLM integration will be done with the telescope 

(mirrors and primary structure), JFET, 0.1 K pipes completion, FPU shims. 

− The completion of the PFM will be done with the grooves extensions, SVM upper panels, MLI…. 

One delicate point will be the BEU assembly shimming at sub platform level (assembly will be FPU+WG+BEU) 



SCC 

panels, heat 

pipes, 

WU panels 

PLM data 

base 

LFI (reba, 

harness) 

HFI(dpu, REU, 

harness) 

+ Z WU 

panel 

Sorption 

cooler 

(SCC,SCCE, 

harness) 

Sorption 

cooler 

integration 

AI 2 

WUs 

electrical 

integration 

AI 1 

0.1Kcooler 

(dcce, pipes 

harness) 

REBAs 

harness 

0.1/4 K 

panels 


0.1/4 K 

cooler 

panels 

assembly 

AI 4 

7.3 Herschel Testing 

DAE crt bx 

and harness 

subplatform 

Pwr 

interface 

harness 

4K cooler 

(ccu,cau,ceu, 

pipes harness, 

helium) 

Cryo. 

structure 

assembly 

AI 3 

Cryo. 

structure 

LFI (raa, 

harness) 

HFI(pau, 

harness) 

Grooves 

extentions, 

external MLI 

HFI(jfet) 

0.1 K cooler 

(pipes, 

helium) 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE : 7-11/27 


Mating 

AI 6 

Telescope 

adjustment 

AI 7 

Planck 

satellite 

integration 

completion 

AI 8 

Figure 7.2.6-1 Planck integration organisation chart. 


Telescope 

and baffle 

Focal plane 

shims 

BEU shim 

plate 

SVM 

upper 

panels, 

MLI 

"SVM" 

prepara 

tion 

AI 5 

SVM 

integrated 

SVM 

extentions 

(SA, 

antennas, 

baffle) 

Tanks, piping 

MLI 

After completion of the integration, be it at the level of the HPLM, PPLM, HSVM, PSVM, Herschel S/C or Planck 

S/C, a series of verification tests will be carried-out. 

Each test will be defined in detail in a test procedure to be written by the Contractor, based on instrument 

group inputs. It will be reviewed and approved by the Herschel/Planck project group. 

7.3.1 Herschel PLM EQM Testing 

The test configuration is defined in line with the integration sequence as given in paragraph 7.2.1.1 above, 

i.e.: 

The test cryostat is the ISO QM Cryostat. The dimensions allow to mount the Herschel optical bench on top of 

the ISO spatial framework. This optical bench is assumed to be the Herschel Optical bench, at least w.r.t. 

thermal, electrical and optical interfaces. The upper part of the Herschel cryostat will be copied for this test, i.e. 

it is assumed to get the optical bench shield, three conical shields and the outer bulkhead of Herschel. For the 

instruments there is no difference to the real Herschel cryostat. The harness would be the Herschel harness 

with feedthroughs at the same or nearly the same place. The LOU will be mounted to the outside with 

representative interfaces. The cryostat cover will be equipped with a mirror surface in the line of view of the 

instruments, which can be actively cooled in order to simulate the optical background conditions. The orbital 

mass flow rate of about 2.1mg/s is further assumed to be reached for this test (at least for the instrument test 

periods)



DATE : 12/02/2004 

ISSUE : 3.1 PAGE : 7-12/27 

The scientific part of the outer cryostat harness will be electrically representative to the «real» Herschel harness. 

The instrument warm units will be mounted on an electrically representative plate (grounding etc.). 

The instrument units will be connected to a functionally representative CDMS and Power interfaces, which is 

part of the PLM EGSE. 

The total system will be deployed in a clean-room class 100.000 and the test will be carried out with the CVV 

at ambient temperature. 

7.3.1.1 Herschel PLM EQM Test Sequence 

The test sequence below has been defined in co-operation with the Herschel instrument teams. It is only a 

summary for information only. The overall test sequence, the test objectives and estimated duration will be 

defined in the Instrument test plan. 

The test sequence consists of the following major steps: 

− Alignment check and Short Functional Check (SFT) after integration 

− Evacuation and cool-down 

− Alignment check and SFT cold after evacuation and cool-down 

− Instrument Integrated Module Tests (IMT’s) 

− EMC tests (conducted & radiated) 

One major objective of the CQM Test Sequence is the development and execution of Instrument IMT’s as a 

reference for PFM testing. 




Sequence Objective Remarks 

Warm units 

integration, optical 

bench integration 

Short functional test 

(SFT) warm 

Cryostat final 

integration and 

closing 

Cryostat evacuation 

and leak check 


SFT of instruments (HIFI, 

PACS and SPIRE) 


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ISSUE : 3.1 PAGE : 7-13/27 

At ambient 

condition 

SFT of instruments (HIFI, At ambient 

(SFT) warm 

PACS and SPIRE) condition 

Cool down and Cool down and filling of 

filling/cold alignment cryostat with He I. 

Functional tests at He I 

temperature, alignment 

measurements during cool 

down, alignment adjustment 

after cool down, global cold 

leak test 

Short functional test SFT of instruments (HIFI, At He I condition 

(SFT) cold 


He II production and He II production in AXT and 

top up 

He II top up of AXT 

Integration EQM CCU Integration of CCU to SVM 

dummy plate 

Integrated Module Test of CCU with cryo At He II condition 

Test (IMT) 

instrumentation. Functional 

and performance testing of 

instruments (HIFI, PACS 

and SPIRE), incl. cooler 

recycling and PACS/SPIRE 

parallel operation. 

EMC test Instrument CE, CS and RS 

tests (HIFI, PACS and 

SPIRE). Incl. cooler 

recycling. 

At He II condition 

Conversion to He I Conversion of He II to He I 

in AXT 

Depletion and warm Depletion of AXT and warm 

up 

up of cryostat 

Table 7.3.1-1:Herschel Payload CQM Test sequence (the test sequence is still under optimisation and 

will be updated in due time as per Herschel AIT Plan) 




7.3.2 Herschel S/C CQM Testing 

At present no test are defined on Herschel S/C level with the CQM instruments. 

7.3.3 Herschel PLM PFM Testing 

The test sequence in after integration considers the following major stages: 

− Alignment check and Short Functional Check (SFT) after integration 

− Alignment check and SFT cold after evacuation and cool-down 

− Integrated Module Test (IMT) 

− EMC test (conducted & radiated) 

Details see below: 


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ISSUE : 3.1 PAGE : 7-14/27 





DATE : 12/02/2004 


Warm units 

integration, optical 

bench integration 


(SFT 1) warm 

Cryostat final 

integration and 

closing 

Cryostat evacuation 

and leak check 

Cryostat bake out 

Cool down and 

filling/cold alignment 


(SFT 2) cold 

He II production and 

top up 


(SFT 3) cold 

Integrated Module 

Test (IMT) 

SFT of instruments (HIFI, 


Cool down and filling of 

cryostat with He I. 

Alignment measurements 

during cool down, alignment 

adjustment after cool down, 

global cold leak tests of He 

subsystem 

SFT of CCS, SFT of 


and SPIRE) 

He II production in main 

tank and He II top up of 

main tank 

SFT of CCS. SFT of 


and SPIRE). 

Test of CCU with cryo 

instrumentation. Functional 

and performance testing of 


and SPIRE), incl. cooler 

recycling, PACS/SPIRE 

parallel operation and 

SPIRE spectrometer test 

(PLM 90° tilted) 

EMC test Instrument CE test (HIFI, 

PACS and SPIRE). Incl. 

cooler recycling. 

Conversion to He I 

ISSUE : 3.1 PAGE : 7-15/27 

At warm condition 

At He I condition 




Table 7.3.1-2 : Herschel Payload PFM Test sequence (the test sequence is still under 

optimisation and will be updated in due time as per Herschel AIT Plan) 

As can be seen the test sequence is dominated by activities that are related to the payload. Since the same 

cryogenic system has already been verified in the STM sequence the task to do here for the cryostat is reduced 

to validating that the performance is the same, i.e. that there is no degradation. The telescope is not planned 





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ISSUE : 3.1 PAGE : 7-16/27 

to be mounted in this sequence, as part of the PLM activities, but as part of the system activities. As a 

performance test of the three instruments is foreseen, it is assumed that the LOU ( outside the cryostat) has 

been fully integrated, the control electronics are available and can be connected to appropriate EGSE. In this 

sequence there are a number of parallel activities, therefore further explanations are given for each step. 

7.3.3.1 Evacuation and bake out 

The cryostat is on its MGSE in the clean room and the vacuum pumps are finally connected (should be 

mounted already since needed for pre-evacuation) to evacuate the cryostat to reach high vacuum. The 

Helium venting system is connected to high temperature Nitrogen flow that increases the temperature of the 

Helium tank, piping HOB, and FPU's up to around 80°C during 3 days. Bakeout operation, including ramp-up 

& ramp down will take about 2 weeks. This is done in a controlled manner, to keep the instrument units 

always at the highest temperature (avoid to collect contamination). The purpose of the bake-out is twofold, on 

one side removal of contamination from the system on the other hand removal of water from the MLI to 

increase the later low temperature performance. 

7.3.3.2 Cool-down of the system and filling with He I 

After evacuation and leaktest, bake-out and a first alignment at warm conditions, the cryostat will be cooled 

down to He I temperatures (4.2K). This will be accompanied by alignment checks.. At this point the 

alignment of the LOU wrt. HIFI FPU will be checked. 

7.3.3.3 Alignment check after cooling 

The HOB position is now measured through the CVV windows. At this point the alignment of the local 

oscillator unit is performed, first via measurements of the HOB and LOU relative alignment through the 

dedicated alignment windows. The cryostat suspension pre-tensioning system (GSE) can now be removed. 

7.3.3.4 He II production and complete filling 

As a preparation of the integrated module test, the temperature of the Helium tank is reduced to 1.7 K and 

the tank filled up nearly completely. This is done in a sequential way, i.e. pumping the tank, filling, pumping, 

etc. The final condition is that the He II tank is filled with He at around 1.7 K to 1.8 K. Note: the thermal 

environment is not fully in-orbit representative since the CVV temperature is at ambient (see chapter 5.7).. 

During this time, as a parallel activity, the final electrical connection can be made to the warm electronic units. 

Necessary background temperatures will be ensur eby an actively cooled mirror, which is part of the cryostat 

cover. 

7.3.3.5 Integrated Module Test 

The integrated module test is the performance and functional test of the instruments, instrument by instrument 

and together. This includes the capability of the set-up to recycle the instrument sorption coolers. It has to be 

assumed that the procedures have already been validated with the CQM, so this test sequence is for validation 

and not procedure development. However, note that this is the first time that the PFM instruments are together. 

During this test some information is obtained on the performance of the cryostat, w.r.t. temperatures and 

lifetime, but this is gathered as a separate information and should not drive or dominate any of the sequences. 

At the end of the test sequence the He bath is heated to ambient pressure (He I). Latest, at the end of the 

sequence, the flight cavity is mounted to the cryostat. 




7.3.3.6 Transport to system AIV 


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The satellite has to be transported in cold and partly filled conditions to the system test facility. This means 

packing into the container and shipment. 

7.3.4 Herschel S/C PFM Testing 

After completion of the system integration the final test sequence can start. The sequence consists of all 

necessary major tests for system verification: 

− Integrated System Test 1 (IST1) 

The satellite has to be transported in cold and partly filled conditions to the system test facility. This means 

packing into the container and shipment. 

− System Validation Test 1 (ESOC Compatibility Test, SVT1) 

− EMC test 

− Sine Vibration test (acceptance level) 

− Thermal Vacuum and Thermal Balance test 

− Acoustic noise test 

− Alignment checks (telescope/spacecraft) 

− Integrated System Test 2 (IST2) 

− Mass properties 

− System Validation Test 2 (SVT2) 





DATE : 12/02/2004 

ISSUE : 3.1 PAGE : 7-18/27 


Satellite Integration 

Satellite alignment 

SVM mating, integration of sunshield/sunshade, 

integration telescope, completion of satellite 

He II production and top He II production in main tank and He II top up of 

up 

IST 1 (Integrated System 

Test) 

main tank 

Test of satellite bus. Test of CCU with cryo 

instrumentation. Functional and performance testing 

of instruments (HIFI, PACS and SPIRE), incl. cooler 

recycling, PACS/SPIRE parallel operation and 

SPIRE spectrometer test (PLM 90° tilted). 





Transport to Test Facility At He I condition 

He II production and top 

up 

SVT 1 (System Validation 

Test of satellite and instrument (HIFI, PACS and At He II condition 

Test) 

SPIRE) command and control. 

TV/TB Test Launch autonomy verification, launch simulation, 

alignment check during TV test. Test of instruments 

(HIFI, PACS and SPIRE). 


SFT after TV Test SFT of satellite bus and CCS. SFT of instruments 

(HIFI, PACS and SPIRE). 


EMC Test 


SFT cold 

At He II condition, 

conversion to He I after 

test 

Sine vibration test 

SFT cold 

Alignment check 

3 axis sine vibration test at acceptance level. At He I condition 

Acoustic noise test 

Alignment check 

SFT cold 

At He I condition 

IST 2 (Integrated System Functional testing of satellite bus. Test of CCU with At He I condition 

Test) 

Mass measurement 

cryo instrumentation. Functional and performance 

testing of instruments (HIFI, PACS and SPIRE), incl. 

cooler recycling, PACS/SPIRE parallel operation 

and SPIRE spectrometer test (PLM 90° tilted). 

SVT 2 (System Validation Test of satellite and instrument (HIFI, PACS and At He II condition 

Test) 

SPIRE) command and control. 

Details see below. 

Table 7.3.1-3:Herschel Satellite PFM Test sequence (the test sequence is still under optimisation 

and will be updated in due time as per Herschel AIT Plan) 

The main tests in this sequence are the integrated satellite test, the mechanical and the thermal tests. Some 

additional information to the different elements of the test flow are given below: 

7.3.4.1 Alignment and Cryostat refilling 

As a first step after system integration, the alignment of the different elements is verified and the system 

prepared for the integrated systeme test. This includes mounting of the cryogenic GSE, filling the system with



DATE : 12/02/2004 

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He I, He II production and He II top-up. At the completion of this activity, the system is ready for functional test 

of the integrated spacecraft. 

7.3.4.2 Integrated Systeme Test (IST) 

The integrated system test is, for the scientific instruments, similar to the previously performed integrated 

module test, however, possibly with different thermal background for the focal plane instruments. Further to 

the instrument tests, the total integrated spacecraft is tested at this stage. 

7.3.4.3 System Validation Test (ESOC Compatibility Test, SVT) 

This system validation test has been included at two stages of the Herschel System test phase. The main 

purpose of these tests is the verification of the ground segment operations with the real flight hardware system. 

7.3.4.4 Thermal Vacuum and Thermal Balance test 

During the thermal test sequence the cool-down of the system (CVV, telescope, …) shall be verified. Therefore 

the He II bath is re-pumped to launch conditions and the system brought to launch autonomy configuration. 

For the integration into the facility it is assumed that this can be done in the Herschel system configuration, i.e. 

no dismounting of any equipment is necessary. The spacecraft integration and removal into and out of the 

facility is considered one of the most complicated integration sequences and need proper and detailed 

preparation. The actual facility test duration is taken long enough to perform the electrical functional tests of 

the spacecraft, integrated system test for the instruments and to verify adequate cool-down/transient behavior 

of the cryostat and the telescope. It is not possible to open the cryostat cover during this test and also a cooling 

of the cover mirror is not possible, i.e. the thermal background from the thermal shield in the cover will be 

above the orbit conditions. At completion of the actual test the system is removed from the facility for the EMC 

test and the structural verification tests. 

7.3.4.5 EMC test 

The system test sequence assumes that the system radiative EMC test is conducted with He II conditions, 

however in a launch autonomy mode configuration. 

7.3.4.6 Vibration test and Acoustic noise test 

The mechanical system verification is performed through a three-axis sine vibration test and the acoustic noise 

test. The vibration test is performed with normal He I in the system. Consequently the He II conditions are 

given up and the system is heated to He I conditions and transported to the test facility. In order to achieve 

proper conditions the He II tank is filled prior to each run to the nominal launch conditions, i.e. > 98% filling 

level. After completion of each axis vibration and the acoustic test, short functional tests at He I conditions (4.2 

K) demonstrate the health of the system and the instruments. 

The mechanical test sequence is completed by alignment checks afterwards. These are alignment checks of 

the instruments to the telescope and the spacecraft elements to each other. The system is transported at 

completion of the sequence back to the main test room for He II production and filling. 



7.4 Planck testing 


7.4.1 Planck PLM CQM / Planck Spacecraft STM Testing 


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The test sequence after completion of the integration of the PLM CQM considers the following major test steps, 

with a change of configuration CQM --> STM (replacement SVM dummy by SVM STM). 

More, due to the late arrival of HFI, the CQM cryogenic test is split into 2 steps: Step 1 is performed during the 

facility blank test without HFI (validation of PPLM passive cooling), and step 2 is performed after HFI 

integration 

− Integration of Planck P-PLM (Cryo-structure, QM telescope, Pipes, RAA dummy) 

− Integration of SVM dummy 

− Mating Planck PLM on SVM dummy -> Planck PLM QM 

− Cryogenic test Step 1 (P-PLM passive cooling) 

− Integration of HFI 

− Functional check (IST) 

− Alignment check (FPU wrt PPLM) 

− Cryogenic Test Step 2 (Instruments tests: cooling and detection chains) 

− Demating, de-integration of warm units, integration on SVM STM, Mating --> Planck satellite STM 

− Functional check 

− Alignment check (FPU wrt PPLM) 

− Vibration Test (sinus, acoustic) and shock test 

− MCI - Balance test 

− Functional check 

− Satellite Alignment Check 

− Spacecraft and PPLM disassembly 

As can be seen the test sequence is dominated by activities that are related to the telescope and the payload. 

As a functional test of the two instruments is foreseen, it has been assumed that the control electronics are 

available and can be connected to appropriate EGSE. Further explanations are given for the above steps. 

7.4.1.1 Satellite Alignment Check 

The alignment of the telescope is measured w.r.t. a PLM fixed reference system after integration of the 

telescope with the SVM structure. The alignment to the FPU is measured via external references on the 

telescope, the PLM and the FPU. 

7.4.1.2 Instrument Integrated Satellite Tests (ambient) 

All instrument units that are mounted to the Payload module are properly integrated and connected. 

Instrument units, that are later mounted on the SVM, might be replaced by functional EM’s or the Avionics 

models (AVMs). The PLM is mounted in its MGSE in the clean-room. 

The integration of the PLM has been completed with all thermal and structural hardware of the PLM. 





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The IST of the instruments at this stage is limited by the instrument verification possibilities at ambient 

temperature. 

7.4.1.3 Vibration Test 

The complete Planck STM satellite assembly will be structurally tested, i.e. via 3-axis vibration test. A short 

version of the instrument IST’s as described above and the alignment checks are clearly verification elements. 

7.4.1.4 Cryogenic Test 

7.4.1.4.1 Cryogenic test step 1: P-PLM CQM test 

The objective of this test is to verify the passive cooling concept of the Planck PLM. 

The configuration is a complete Planck, with Cryostructure, QM telescope, LFI-RAA dummy, all cooler pipes 

(not active), all cryoharnesses or simulator, and the SVM dummy (equipped with BEU and PAU MTD's). 

This test will be performed together with the CSL facility blanck test 

Note: this test might be replaced by an early acoustic test. In that case, the Cryogenic test step 1 would be 

performed as originaly foreseen, with step 2. 

7.4.1.4.2 Cryogenic test step 2: Planck instruments CQM test 

The cryogenic qualification step is expected to be the most demanding test of the CQM sequence. The 

objectives of this test are the verification of the passive thermal concept of the PLM (incl. its sensitivity) and the 

verification of the performance of the active coolers of the instruments.. Once the proper temperatures at the 

FPU are achieved an extended instrument functional/performance test is performed. In order to achieve the 

test objectives it is expected that the facility provides adequately low background for the FPU. During this test a 

limited EMC test (limited by the capabilities inside a facility) is carried out. 

The expected overall configuration and an integration and test sequence is outlined below. This description is 

a result of a working group activity with ESA, LFI, HFI and facility representatives from CSL. The anticipated test 

sequence, with test objectives and estimated duration is outlined inthe table below. Information on details of 

the instrument test sequences and needs are given in corresponding paragraphs in the LFI and HFI IID-B’s. 

Original test objectives had to be reviewed to comply with the definition of the specimen: SVM replace by SVM 

dummy, LFI replaced by and MTD, no sorption cooler compressor (PACS & PGSE), HFI dilution gaz storage 

unit located outside (DCCU inside SVM dummy) 

It is assumed that all instrument coolers have passed successfully a leak test after completion of the PPLM 

CQM vibration test. The overall configuration includes the PPLM only, i.e. not the full SVM. The need to 

simulate for thermal reasons the «real» SVM structure is not clear at present and has to be evaluated from the 

detailed design of Planck in line with the objectives of the test. The instruments, consisting out of the CQM 

units and the corresponding AVM units to operate the CQM’s, are all compatible with the vacuum facility and 

mounted in an electrically representative manner to the PPLM. The interfacing spacecraft units, i.e. the CDMS 

and the power units are functionally representative to the Planck SVM units and could be located outside the 

facility. It is assumed that these units will be operated by a (reduced) version of the system EGSE and that the 

instrument EGSE will interface to this system EGSE in the same way as in the PFM program. The facility will 

provide a venting/collection system for the helium of the dilution cooler. This pipes will be routed from the 

PPLM to the outside of the facility and connected to a recollection system provided by HFI. The Helium tanks 

for the dilution cooler are inside the facility filled to a level necessary for the completion of this test (e.g. up to 

100 bars). 

A small shroud in front of the focal plane units and connected to a helium cooling loop is implemented to 

provide the cold background for the instrument performance test and form the inner, coldest part of the 

shroud system. This shroud is covered with a Flat coating of Ecosorb, providing 20dB absortance at 





DATE : 12/02/2004 

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instruments wavelength. A further shroud that will be during test at 20 K («20 K shroud») is mounted around 

the PPLM, starting at the level of the upper face of the SVM (some mm clearance only) and completely closing 

off all PPLM elements. A further shroud that is mounted around this 20 K shroud completes the shroud system 

for the test. 

7.4.1.4.3 Cryogenic Test – Sequence 

The test sequence below has been defined in co-operation with the Planck instrument teams. This paragraph 

in the IID A provides the overall test sequence, the test objectives, estimated durations, however, does not 

include details of the instruments. These details together with specific instrument test objectives and 

requirements are given in the corresponding paragraph in the IID-B’s 

Planck CQM step 2 test sequence 

Ambient phase: (37 working days) 

• Specimen instrumentation and preparation 

• Vacuum chamber preparation 

• Test set up installation 

• Specimen and GSE verification 

• Specimen cleaning 

• Ambient functional test 

• Last check before closure (thermocouples, test heaters check), last specimen control (photos…) 

• Shrouds closure 

Vacuum phase: (5 days) 

• Pumping 

• Ambient leak checks (Facility tight, instrument pipes/coolers leak tight) 

• Instrument vibration measurement in parallel with above 

• De-sorption of CFRP under vacuum at ambient temperature: 2 days (TBC), vacuum better than 10 -3 Pa 

• Temperature monitoring 

PLM cooling down and SVM thermal cycling (8 days) 

• Cooling down of cryogenic shrouds 

• Wait for reaching 60K on the coldest v-groove shield (shield 3) TBC. 

Instruments test phase: (25 days) 

• Switch-on the PACE GSE. 

• Switch-on the pre-cooling of the HFI by the ground He loop until a TBD temperature criterion is met 

on HFI FPU 

• Wait for reaching 20 K on the RAA I/F . 

• Switch-on the HFI 4 K cooler (HFI pre-cooling loop will be stopped) 

• Wait for reaching 4 K on the HFI FPU and stable condition on the optical cryogenic shield 

• HFI cool-down - Start the Dilution cooler 

• Wait for reaching 0.1 K on the HFI detectors 

• HFI functional test 

• HFI Electromagnetic compatibility tests 

• HFI stand alone test 

• Cooler failure tests (20K, 4K and 0.1K). 

Return to ambient: (3 days) 

• Instrument short ambient functional test. 

Shrouds removal: (3 working days) 

Table 7.4.1-1: Planck PLM CQM test sequence 



7.1.1.5 Ambient RF test 



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Ambient RF test is performed at Planck RFQM levels with telescope QM and instrument RF mock-ups (made by 

the prime). 

7.1.2 Planck S/C CQM Testing 

This is covered in the previous section. 

7.1.3 Planck PLM PFM Testing 

The PLM PFM test sequence is to a major extent a repeat of the CQM sequence, however, now with the Flight 

model instrument units. 

The test sequence after integration is identical to the CQM sequence and considers the following major test 

steps: 

− Satellite Alignment Check 

− Functional Test of the instruments 

EMC 

CE/CS 

tests 

IST 1.1 

S/C alignement after 

mechanical test 

SFT 1.1 

S/C functional test 

after mechanical test 

SFT 1.2 

S/C reference 

tests 

IST 1.2 

S/C set-up after 

mechanical test 

Environment 1 

S/C ground segment 

test 

SVT 1 

S/C balancing and 

MCI measurements 

IST 1.3 

Cannes 

Sine acoustic 

vibrations 

Environment 1 

Cannes 

S/C preparation 

before thermal 

vacuum test 

(outside chamber) 

Environment 2 

S/C alignement 

before environment 

test 

IST 1.4 


before mechanical 

test 

Environment 1 


before thermal 

vacuum test 

(inside chamber) 

Environment 3 

Cannes CSL 



EMC 

RE/RS 

tests 

Ambient LFI RF 

test 

IST 1.6 

Thermal 

vacuum tests 

Environment 4 

IST 1.5

S/C set-up after 

thermal vacuum test 

Environment 5 

S/C transportation 

to Kourou 


S/C functional test after 


(exept RCS) 

SFT 2.1 

S/C set-up for launch 

campaign 

Launch 1 


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ISSUE : 3.1 PAGE : 7-24/27 

S/C transfer CSL -> 

Cannes 

Environment 6 

CSL Cannes 

S/C reference tests 

after environmental 

tests 

IST 2.1 

Cannes 

Figure 7.4.3-1: Planck PFM test logic 

7.1.3.1 Functional Test of the instruments 



S/C alignement 

after thermal vacuum 

test 

SFT 2.2 

S/C functional test after 


(only RCS) 

SFT 2.3 

All instrument units that are mounted to the Payload module are properly integrated and connected. 

Instrument units that are later mounted on the SVM might be mounted on some MGSE, but are expected to be 

the real FM units. The PLM is mounted in its MGSE in the clean room. 

The integration of the PLM has been completed with all thermal and structural hardware of the PLM. 

The IST at this stage is limited by the instrument verification possibilities at ambient temperature. 

7.1.4 Planck S/C PFM Testing 

After completion of the PLM FM integration the Planck spacecraft will be fully integrated with the SVM PFM and 

the system tests will be carried out. Since this is the first fully representative Planck S/C system a number of 

system tests will be carried out for the first time. The test sequence envisaged is: 

− Integration of Planck S/C 

− Alignment Check 

− Integrated Satellite Test 

− EMC test 

− System Validation Test 

− Vibration Test 

− Acoustic Noise test 


− TV test 


− Integrated satellite test



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The test duration are adapted to the needs of a FM sequence, i.e. the objective is changed from qualification 

to acceptance. This means in some areas a reduction in duration since the demonstration can be limited. It 

has been assumed that control electronics are available and can be connected to appropriate EGSE. 

The main tests in this sequence are the integrated satellite test, the mechanical and the thermal tests. Some 

additional information to the different elements of the test flow are given below: 

7.1.4.1 Alignment 

As a first step after system integration, the alignment of the different elements is verified and the system 

prepared for the integrated satellite test. At the completion of this activity, the system is ready for functional test 

of the integrated spacecraft. 

7.1.4.2 Integrated Satellite Test 

The integrated satellite test is, for the scientific instruments, similar to the previously performed integrated 

module test, however, at this stage at ambient temperature. Further to the instrument tests, the total integrated 

spacecraft is tested at this stage. 

7.1.4.3 System Validation Test (ESOC Compatibility Test) 

The system validation test has been included at two stages of the Planck System test phase. The main purpose 

of these tests is the verification of the ground segment operations with the real flight hardware system. 

7.1.4.4 Vibration test and Acoustic noise test 

The mechanical system verification is performed through a three-axis sine vibration test and the acoustic noise 

test. After completion of each axis vibration and the acoustic test, short functional tests demonstrate the health 

of the system and the instruments. 

The mechanical test sequence is completed by alignment checks afterwards. These are alignment checks of 

the instruments to the telescope and the spacecraft elements to each other. 

7.1.4.5 EMC test 

The system test sequence assumes that the system radiative EMC test is conducted at ambient temperature 

conditions for the instruments 

7.1.4.6 Thermal Vacuum, Thermal Balance and PPLM Cryogenic test 

The thermal test is the last main test in the Planck test sequence. During this sequence also the cool-down of 

the PLM will be measured. The actual facility test duration is taken long enough to perform the electrical 

functional tests of the spacecraft, integrated satellite test for the instruments and to verify adequate cooldown/transient 

behaviour of the Planck PLM. At completion of the actual test the system is removed from the 

facility for the second ground segment compatibility test and preparation of the system for the carrier test 

programme. 

The cryogenic test is limited to the functional verification of the PLM thermal control and the proper operation 

of the active coolers of the instruments. Once the proper temperatures at the FPU are achieved an instrument 

functional test is expected to be performed. 

Both Sorption coolers will have to be tested. For that, Planck will have to be warmed up to allow the Second 

sorption cooler compressor to be oriented horizontally (rotate spacecraft by 90°) 





DATE : 12/02/2004 

ISSUE : 3.1 PAGE : 7-26/27 

Planck FM Test sequence: 

Step 1 Planck cryogenic test (with Nominal Sorption cooler): 76 days, incl. 36 days under vacuum. 


• Specimen instrumentation and preparation 

• Vacuum chamber preparation 

• Test set up installation 

• Specimen and GSE verification 

• Specimen cleaning 

• Ambient functional test 

• Last check before closure (thermocouples, test heaters check), last specimen control (photos…) 

• Shrouds closure 


• Pumping 

• Ambient leak checks (Facility tight, instrument pipes/coolers leak tight) 

• Instrument vibration measurement in parallel with above 

• De-sorption of CFRP under vacuum at ambient temperature: 2 days (TBC), vacuum better than 10 -3 Pa 

• Temperature monitoring 

PLM cooling down and SVM thermal cycling (8 days) 

• Cooling down of cryogenic shrouds 

• SVM thermal cycling 

• Functional test of SVM subsystems 

• Wait for reaching 60K on the coldest V-groove shield (shield 3). 

• SVM thermal balance (in parallel to other activities) 

Instruments test phase: (20 days) 

• Switch-on the Sorption Cooler Compressor #N. 

• Switch-on the pre-cooling of the HFI by the ground He loop until a TBD temperature criterion is met 

on HFI FPU 

• Wait for reaching 20 K on the LFI FPU. 

• Switch-on the LFI 

• Preliminary functional test & switch-on the optical cryogenic shield 

• Switch-on the HFI 4 K cooler (HFI pre-cooling loop will be stopped) 

• LFI functional test II 

• Wait for reaching 4 K on the HFI FPU and stable condition on the optical cryogenic shield 

• HFI cool-down - Start the Dilution cooler (in parallel with LFI functional test) 

• Wait for reaching 0.1 K on the HFI detectors 

• HFI functional test 


• Instrument short ambient functional test. 

Shrouds removal: (3 working days) 

Step 2 Planck cryogenic test (with Redundant Sorption cooler) (52 days, 22 under vacuum) 


• Change the orientation of the S/C in order to test the SSC#R + see §5.2.1 with reduced functional 

test. 


• (Same as above) 



PLM cooling down (7 days) 

• (Same as above) 



DATE : 12/02/2004 

ISSUE : 3.1 PAGE : 7-27/27 

Instrument test phase: (10 days) 

• This phase is reduced to the verification of the SCC#R 

• Switch-on the sorption cooler compressor #R. 

• Wait for reaching 20 K on the LFI FPU. 

• Switch on/off the LFI. 

• Limited cooler switchover procedure (TBC) (non-operational configuration of the SCC#N). 


Test set-up dismounting : (5 working days) 

Functionnal test at ambient (8 working days) 

Packing, Loading and departure: (4 working days) 

7.5 Operations 

Requirements in the OIRD, the PSICD and the naming convention (AD 16, 21, 22) apply. 


For the activities in chapters 7.2 and 7.3 commonality shall be pursued as per the applicable parts of chapter 

6.3. 



8. PRODUCT ASSURANCE 


Product assurance requirements are given in AD 2. 


Date : 12/02/2004 

Issue : 3.1 PAGE :8- 8-1/2 

(this document applicable for instruments only. PA requirement for industry is covered by a specific 

document)



Date : 12/02/2004 

Issue : 3.1 PAGE :8- 2/2


9. DEVELOPMENT AND VERIFICATION 

9.1 General 

# Reference IIDA-DV-REQ-0005 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-1/63 

The PI shall, in a systematic manner, verify the instrument design and build status against each requirement in 

the IID-A and Bs (AD 04,05,06,07,08) 

This section establishes the verification requirements for the qualification and flight certification of the 

instrument units also giving specific test levels and durations and describing acceptance test and analytical 

methods for implementation of these requirements. 


The PI shall include in the Design Development and Verification Plan the tests and analyses that collectively 

demonstrate that hardware and software complies with the requirements. 

The plan shall allow the overall approach to accomplish the instrument qualification and acceptance 

programme. The interaction of the test and analysis activity shall be described. 

9.1.1 Definitions 

The following definitions are to be used: 

9.1.1.1 Design Qualification Verification: 

Tests and analyses intended to demonstrate that the item will function with performance specifications under 

simulated conditions more severe than those expected from ground handling, launch and orbital operations. 

The purpose is to uncover deficiencies in design and method of manufacture and is not intended to exceed 

design safety margins or to introduce unrealistic modes of failure. 

9.1.1.2 Acceptance Verification: 

Tests intended to demonstrate that hardware is acceptable for flight. 

It also serves as a quality control screen to detect deficiencies, and normally to provide the basis for delivery of 

an item under terms of a contract or agreement. 

9.1.1.3 Functional Tests: 

The operation of a unit in accordance with defined operational procedures to determine that functional 

performance is within the specified requirements. 



# * 

# *


9.1.1.4 Performance verification: 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-2/63 

Determination by test, analysis, or a combination of the two that the complete instrument or instrument unit 

can operate as intended in a particular mission: this includes proof that the design of the complete instrument 

or instrument unit has been qualified and that the particular item has been accepted as compliant to the 

design and ready for flight operations. 

9.1.1.5 Thermal Balance Test: 

A test conducted to verify the adequacy of the Thermal Model, the adequacy of the thermal design, and the 

capability of the thermal control system to maintain thermal conditions within established mission limits. 

9.1.1.6 Thermal Cycling Tests: 

Tests to be conducted to verify that the instrument or instrument unit can withstand without degradation of its 

performance thermal cycles under vacuum. 

9.1.1.7 Thermal Vacuum Test: 

A test to demonstrate the validity of the design in meeting functional goals: it also demonstrates the capability 

of the test item to operate satisfactorily in vacuum at temperatures based on those expected for the mission. 

The test can also uncover latent defects in design, parts and workmanship. 

9.1.1.8 Thermal Shock Test: 

A test to be conducted to verify that the instrument or the instrument unit can withstand without degradation a 

cool down from room temperature. 

9.1.1.9 Static Loads: 

The maximum combination (longitudinal and lateral) of static loads which acts on an instrument, during the 

various segments of the flight profile. It consists of steady state accelerations (e.g. due to engine constant thrust 

or lateral wind loads) and quasi-static loads which are structure borne loads generated by the launch vehicle 

in the low frequency (less than 100 Hz) range (e.g. engine cut-off loads or wind gusts). 

9.1.1.10 Sine Vibration Test: 

A test to demonstrate that the instrument can withstand the mechanical environment of the low frequency (less 

than 100 Hz) sinusoidal and transient vibrations. This test can also be used to demonstrate compatibility with 

the static loads. 

9.1.1.11 Acoustic Random Vibration: 

An environment induced by high-intensity acoustic noise associated with various segments of the flight profile: 

it manifests itself throughout the instrument in the form of directly transmitted acoustic excitation and as 

structure-borne random vibration excitation. 




9.1.1.12 Integrated Satellite Test (IST): 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-3/63 

The detailed demonstration that the instrument and their units meet there performance requirements in all 

operational modes. 

9.1.1.13 Short Functional Test (SFT): 

The correctness of the instrument functions, for instance after a transport, is the objectives of the SFT. 

9.1.1.14 Electromagnetic Compatibility (EMC): 

The condition that prevails when various electronic devices are performing their functions according to design 

in a common electromagnetic environment. 

9.1.1.15 Electromagnetic Interference (EMI): 

Electromagnetic energy that interrupts, obstructs, or otherwise degrades or limits the effective performance of 

electrical equipment. 

9.1.1.16 Electromagnetic Susceptibility: 

Undesired response by a component, instrument or system to conducted or radiated electromagnetic 

emissions. 

9.1.2 Documentation 

The following plans, procedures, and reports are requested to document the instrument environmental 

verification programme. 

These documents shall be prepared by the instrument teams and are under their responsibility. 

The test procedures and test reports shall be available on request and will be part of the Qualification or 

Acceptance Data Package. 

9.1.2.1 Design Development and Verification Plan 


A design development and verification plan (DDVP) shall be prepared and shall describe the overall approach 

to accomplish the instrument qualification and acceptance programme. When appropriate, the interaction of 

the test and analyses activity shall be described. The overall logic shall be clearly established. 

For each analysis activity, the plan shall include objectives of the mathematical model with underlying 

assumptions. The DDVP shall be supported by the procedures and reports. 



# *

9.1.2.2 Test Matrix 




DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-4/63 

In addition to the DDVP, the PI shall provide a test matrix that is in essence a synthesis of the verification 

programme. The test matrix summarises all the tests that will be performed on each instrument unit. The 

purpose of the matrix is to provide a ready reference to the contents of the test program in order to identify 

easily the deviations that could be requested. It has also the purpose of ensuring that flight hardware has been 

exposed to various environmental tests that are sufficient to demonstrate acceptable workmanship. 

In addition, the matrix shall provide traceability of the qualification heritage of hardware. All models shall be 

included in the matrix that shall be prepared in conjunction with the DDVP. 

9.1.2.3 Test Procedures 


For each verification test activity conducted at the instrument level, test procedures shall be prepared that 

describe the test objectives and success criteria, the configuration, the test article, and how it fits in the DDVP. 

The procedures shall contain all details which are necessary to make meaningful interpretations of the results, 

such as test parameters, instrumentation, monitoring, data collection, post-test verifications (alignment). 

It shall also address safety and contamination control provisions. 

Test procedures shall be provided to ESA for review prior to tests. 

9.1.2.4 Test Reports 


After each instrument verification activity has been completed a test report shall be submitted. The report shall 

describe the most significant results, comparison of the measured parameters with requirements or allocations 

and the degree to which the initial objectives were accomplished. 

In addition all as run procedures, test and analysis data shall be retained for review. Every failure shall be 

reported through an NCR (non-conformance report) in accordance with QA provisions. 

9.2 Model Philosophy 

9.2.1 Spacecraft Models 

9.2.1.1 Model Philosophy at Spacecraft Level 

See section 7.1.1 



# * 

# * 

# *


9.2.1.2 Model Philosophy at Instrument level 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-5/63 

Each instrument has its own critical areas and specific needs. 

ESA therefore expects each PI to define a set of development tests and their related hardware, software and 

support equipment to demonstrate progressively during the development period that all scientific and technical 

requirements are met (see Table 9.2.1-1). 


The Design and Development Plan (DDVP) of the instrument will therefore consider and integrate these 

development tests and the needs of the tests at system level. Table 9.2.1-1 lists the models required for each 

class of instrument units. 

The AVM and PFM units, when delivered to ESA, will not be returned to the PI’s. 

Herschel FPU’s (PACS & SPIRE DM 

FPU's for Herschel 

PLM STM test 

Development AVM CQM FM/PFM FS 



Sim’s Yes Yes CQM’s 

Herschel Warm Electronics no Yes TBD Yes Kits 

Herschel HIFI LOU no TBD Yes Yes Kits and 

partly 

CQM’s 

PLANCK HFI/LFI FPU’s no Sim’s Yes Yes Kits 

PLANCK HFI/LFI coolers No Sim’s Yes Yes Kits 

PLANCK HFI/LFI/Coolers 

Warm electronics 

Note: Sim’s stands for Simulators 

9.2.2 Deliverable Instrument Models 

9.2.2.1 Avionics Model 

The AVM system test objectives are: 

No Yes Yes Yes Kits 

Table 9.2.1-1: System level tests for instruments 

− verification of all electrical (including EMC) and software interfaces 

− verification of subsystem and instrument functional performance within system environment 

− Full validation of on-board software 

− verification of system performance 

− verification of operational procedures. 

For instruments AVM, the verification is therefore limited to the interfaces with the SVM (communication, 

software Power, EMC, Synchronisation). 

# *


The instrument AVM units therefore have to have the following built standard: 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-6/63 

− electronics flight standard except for parts. The build standard of AVM units EEE parts that will be 

used in the qualification program, have to be identical in form, fit and function to the flight parts, 

mechanisms flight representative for electrical actuators 

− software flight standard. 

− form, fit and function of the flight model 

− software of flight quality must be able to be run. 

In order to save cost the AVM hardware contents may be reduced by reducing redundancy: 

− cold redundant units or channels may be deleted if no automatic switch-over function is involved 

− multiple redundancy of hot redundant units or modules may be reduced by electrical dummies (to e.g. 

dual redundancy) if compatible with the AVM test objectives 

− simulators may be supplied of units not directly interfacing with spacecraft subsystems. The level of 

these simulators, to be agreed with ESA, will allow verification of the correct execution of the flight 

procedures. 

9.2.2.2 Cryogenic Qualification models 

Because of their new development status and/or of the criticality of their performance to the flow of the AIV 

program, specific units will deliver CQM models for the assembly tests at payload module level. 

These are: 

− Herschel focal plane units (HIFI, PACS and SPIRE), HIFI LOU, PACS BOLA 

− Planck focal plane unit (HFI and LFI) 

− Planck coolers (HFI and LFI) 

The cryogenic qualification models standard will be the same as flight models. It has been agreed that for 

PLM or S/C testing the AVM units could be used to control the CQM units. The AVM’s will be taken from the 

AVM test sequence for this period. 

9.2.2.3 Flight Model 

The PFM system test objective is the qualification of spacecraft system by functional and environmental tests 

The PFM units therefore shall have full flight standard verified by formal functional and environmental 

acceptance tests. 

9.2.2.4 Flight spares 

The FS objectives are: 

− replacement of failed or damaged equipment at integration and launch site. 

The FS units have to have the following built standard: 

− full flight standard verified by formal acceptance tests. 

In order to save cost the FS units: 

− may be derived from refurbished cryogenic qualification units if flight worthiness can be agreed, 

− may be reduced to repair kits for repair at manufacturer's site if predetermined turnaround time of one 

month is ensured for unit repair after failure. 




This approach has to be agreed with the project office on a case by case basis. 

9.2.3 Instruments Deliverable Hardware Matrix 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-7/63 

The following table give the Instrument deliverable hardware matrixes, as proposed in IID-B's. Product tree 

Identifiers (PTI's) s have been attributed to each instrument deliverable item (Box, cables, GSE), to fit both the 

herschel Planck product tree philosoply, and the instrument internal product hierarchy. For numbering, 

Herschel is 100000, Planck is 200000, Custumer Furnished Equipments are numbered x10000 (x=1 or 2 for 

Herschel & Planck), then instruments root PTI's are 111000 for HIFI , 112000 for SPIRE, 113000 for PACS, 

211000 for LFI, & 212000 for HFI) 


The instruments shall deliver instruments according to the tables given below. 



# *

9.2.3.1 Herschel HIFI 



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-8/63 

Product 

tree id 

111110 

111230 

111260 

111270 

111271 

111120 

111125 

111125 

111210 

111220 

111241 

111242 

111251 

111252 

111253 

111254 

111311 

111312 

111313 

111314 

111321 

111322 

111323 

111324 

111325 

111326 

111327 

111328 

111329 

111330 

111331 

111332 

111333 

111334 

111341 

111342 

111343 

111344 

111345 

111346 

111347 

111348 

111349 

111350 

111351 

111352 

description 

Focal Plane Unit 

Focal Plane Control Unit 

Instrument Control Unit 

IF upconverter Horizontal 

IF up converter Vertical 

Local Oscillator Unit 



Local Oscillator Control Unit 

Local Oscillator Source Unit 

HRS ACS Horizontal polarisation 

HRS ACS Vertical polarisation 

WBS Electronics for Horizontal Polarisation 

WBS Electronic for Vertical Polarisation 

WBS Optic for Horizontal Polarisation 

WBS Optic for Vertical Polarisation 

LCU to LSU secondary Power Main 

LCU to LSU secondary Redundant 

ICU to FCU secondary Main 

ICU to FCU secondary Redundant 

ICU Main to LCU Main 

ICU redundant to LCU Redundant 

ICU main to FCU Main 

ICU redundant to FCU Redundant 

ICU Main to HRH 

ICU Main to HRV 

ICU Main to WEH 

ICU Main to WEV 

ICU Redundant to HRH 

ICU Redundant to HRV 

ICU Redundant to WEH 

ICU Redundant to WEV 

LCU main to LSU Main 

LCU redundant to LSU Redundant 

LSU to HRH 

LSU to HRV 

LSU to WEH 

LSU to WEV 

HRH to HRV 

HRV to HRH 

3DH to HRH 

3DH to WEH 

3DV to HRV 

3DV to WEV 

WEH to WOH 

WEV to WOV 

code 

FH FPU 

FH FCU 

FH ICU 

FH IFH 

FH IFV 

FH LOU 

FH LOR 

FH LOR 

FH LCU 

FH LSU 

FH HRH 

FH HRV 

FH WEH 

FH WEV 

FH WOH 

FH WOV 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH HRS 

FH HRS 

FH WIH 

FH WIH 

FH WIH 

FH WIH 

FH WBS 

FH 

EQM 

CQM 

DM 

QM 

DM 

N/A 

QM 

QM 

QM 

DM 

DM 

QM 

N/A 

QM 

N/A 

QM 

N/A 

QM 

N/A 

QM 

N/A 

QM 

N/A 

QM 

N/A 

QM 

N/A 

QM 

N/A 

N/A 

N/A 

N/A 

N/A 

QM 

N/A 

QM 

N/A 

QM 

N/A 

N/A 

N/A 

QM 

N/A 

QM 

N/A 

QM 

STM 

(MTD) (*) 

(MTD) (*) 

(MTD) (*) 

(MTD) (*) 

(MTD) (*) 

(MTD) (*) 

(MTD) (*) 

(MTD) (*) 

(MTD) (*) 

(MTD) (*) 

(MTD) (*) 

(MTD) (*) 

(MTD) (*) 

(MTD) (*) 

(MTD) (*) 

(MTD) (*) 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

0 

AVM 

N/A 

N/A 

DM 

N/A 

N/A 

N/A 

N/A 

N/A 

Simulator 

N/A 

Simulator 

Simulator 

Simulator 

Simulator 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

N/A 

PFM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

FM 

Spare 

Spare 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

kits 

Spare 

kits 

Spare 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

Spare kits 

kits 

Comments 

Only band 3 for QM 

includes radiator. For QM only band 3 LOA 

+ mounting plate. 

No redundancy for DM, Resistors for 

simulator No redundancy for DM, Resistors for 

simulator 

111510 HIFI MGSE FH 

111520 HIFI Unit transport Container FH 



9.2.3.2 Herschel SPIRE 



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-9/63 

Product 

tree id 

description code EQM STM AVM PFM Spare Comments 

112110 Focal Plane Unit HS FPU CQM (MTD) (*) 0 PFM CQM refurb. 

112122 JFET (Spectrometer) HS JFP CQM (MTD) (*) 0 PFM CQM refurb. 

112121 JFET (Photometer) HS JFS CQM (MTD) (*) 0 PFM CQM refurb. 

112220 Focal Plane Control unit HS FCU QM1 (MTD) (*) DRCU Sim. PFM 

QM1 has different foot print (no Power 

CQM refurb. 

supply ?) 

112230 Detector Control unit HS DCU QM1 (MTD) (*) (one box) PFM Spare kits Spare kits from QM2 

112210 Digital Processing Unit HS DPU AVM (MTD) (*) AVM PFM Spare kits AVM = EM type 

112311 W1 HSDPU-P to HSDCU-P HS W1 QM1 (MTD) (*) QM1 PFM FS 

112312 W2 HSDPU-R to HSDCU-R HS W2 QM1 (MTD) (*) QM1 PFM FS 

112313 W3 HSDPU-P to HSSCU-P HS W3 QM1 (MTD) (*) QM1 PFM FS 

112314 W4 HSDPU-R to HSSCU-R HS W4 QM1 (MTD) (*) QM1 PFM FS 

112315 W5 HSDPU-P to HSMCU-P HS W5 QM1 (MTD) (*) QM1 PFM FS 

112316 W6 HSDPU-R to HSMCU-R HS W6 QM1 (MTD) (*) QM1 PFM FS 

112317 W7 HSFCU-P to HSDCU-P HS W7 QM1 (MTD) (*) QM1 PFM FS 

112318 W8 HSFCU-R to HSDCU-R HS W8 QM1 (MTD) (*) QM1 PFM FS 

112131 JFP to FPU HS BP QM1 (MTD) (*) QM1 PFM FS 

112132 JFS to FPU HS BS QM1 (MTD) (*) QM1 PFM FS 

112510 SPIRE MGSE HS 0 0 0 0 0 0 

112511 SPIRE unit transport containers HS 0 0 0 0 0 0 

112512 SPIRE instrument/cryostat integr HS 0 0 0 0 0 0 

112520 SPIRE OGSE HS 0 0 0 0 0 0 

112521 SPIRE optics primary alignment/ HS 0 0 0 0 0 0 

112530 SPIRE EGSE HS 0 0 0 0 0 0 

9.2.3.3 Herschel PACS 

Product 

description 

tree id 

code 

EQM STM AVM PFM Spare Comments 

113110 Focal Plane Unit FP FPU CQM (MTD) (*) Simulator PFM CQM refurb. 

113210 Detector & Mechanism Control (DEC/ FP DECM BB (MTD) (*) BB PFM Spare kits BB shall fit envelop 

113230 Bolometer Cooler Control unit FP BOLC BB (MTD) (*) BB PFM Spare kits No Power supply layer 

113240 Data Processing Unit FP DPU AVM (MTD) (*) AVM PFM Spare kits AVM type TBC 

113250 Signal processing unit Nominal (stacke FP SPU1 AVM (MTD) (*) AVM PFM Spare kits stacked 

113260 Signal processing unit Redundant FP SPU2 N/A (MTD) (*) N/A PFM Spare kits stacked 

113311 DPU nominal to MEC1 FP AVM (MTD) (*) AVM PFM - 

113312 DPU redundant to MEC2 FP AVM (MTD) (*) AVM PFM 0 

113313 DPU nominal to SWL SPU nominal FP AVM (MTD) (*) AVM PFM 0 

113314 DPU nominal to LWL SPU nominal FP AVM (MTD) (*) AVM PFM 0 

113315 DPU redundant to SWL SPU redundan FP AVM (MTD) (*) AVM PFM 0 

113316 DPU redundant to LWL SPU redundan FP AVM (MTD) (*) AVM PFM 0 

113321 SPU nominal to MEC1 FP AVM (MTD) (*) AVM PFM 0 

113322 SPU redundant to MEC2 FP AVM (MTD) (*) AVM PFM 0 

113331 MEC1 to SWL SPU (nominal) FP AVM (MTD) (*) AVM PFM 0 

113332 MEC1 to LWL SPU (nominal) FP AVM (MTD) (*) AVM PFM 0 

113333 MEC2 to SWL SPU (redundant) FP AVM (MTD) (*) AVM PFM 0 

113334 MEC2 to LWL SPU (redundant) FP AVM (MTD) (*) AVM PFM 0 

113335 MEC1 to BOLC data (nominal) FP AVM (MTD) (*) AVM PFM 0 

113336 MEC1 to BOLC Sync (nominal) FP AVM (MTD) (*) AVM PFM 0 

113337 MEC2 to BOLC data (redundant) FP AVM (MTD) (*) AVM PFM 0 

113338 MEC2 to BOLC Sync (redundant) FP AVM (MTD) (*) AVM PFM 0 

113339 MEC1 to DEC1 data (nominal) FP AVM (MTD) (*) AVM PFM 0 

113340 MEC1 to DEC1 Sync (nominal) FP AVM (MTD) (*) AVM PFM 0 

113341 MEC1 to DEC2 data (nominal) FP AVM (MTD) (*) AVM PFM 0 

113342 MEC1 to DEC2 Sync (nominal) FP AVM (MTD) (*) AVM PFM 0 

113343 MEC2 to DEC1 data (redundant) FP AVM (MTD) (*) AVM PFM 0 

113344 MEC2 to DEC1 Sync (redundant) FP AVM (MTD) (*) AVM PFM 0 

113345 MEC2 to DEC2 data (redundant) FP AVM (MTD) (*) AVM PFM 0 

113346 MEC2 to DEC2 Sync (redundant) FP AVM (MTD) (*) AVM PFM 0 

113510 PACS MGSE FP 

113511 PACS unit transport containers FP 

113520 PACS EGSE FP 

113530 PACS OGSE FP 




9.2.3.4 Planck LFI + Sorption cooler 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-10/63 

Product 

description 

tree id 

code 

STM AVM PFM Spare Comments 

211111 Front End Unit (FEU) PL FEU (MTD)(*) N/A FM Spare kits 

211112 DAE Back End Unit (BEU) PL BEU (MTD)(*) AVM FM Spare kits AVM = CQM + Loads 

211113 DAE Power Box PL CB (MTD)(*) CQM FM Spare kits 

211114 

4K Reference load (Mounted on 

HFI) 

PL 4K (MTD)(*) N/A FM CQM FS = refurbished CQM 

211115 Wave Guides (WG) PL WG (MTD)(*) N/A FM CQM FS = refurbished CQM 

211116 Heat switch PL A10 (MTD)(*) N/A FM CQM FS = refurbished CQM 

211131 FEU/DAE cryo Harness PL AHB (MTD)(*) N/A FM CQM FS = refurbished CQM 

211132 DAE Power Box/BEU Harness A PL AHA/A (MTD)(*) CQM FM Spare kits 

211133 DAE Power Box/BEU Harness B PL AHA/B (MTD)(*) CQM FM Spare kits 

211134 DAE BEU/lateral trays Harness PL AHA/C (MTD)(*) CQM FM Spare kits 

211121 REBA Nominal PL REN (MTD)(*) CQM FM Spare kits AVM shall be form and fit 

211122 REBA Redundant PL RER (MTD)(*) N/A FM 0 

same set of spare kits (MTD not part of 

instrument delivery) 

211135 REBA/BEU Harness PL EBO (MTD)(*) CQM FM Spare kits 

211510 LFI MGSE PL 0 

211511 LFI Transport Container PL 0 

211520 LFI EGSE PL 0 

211211 SC Cold End (SCCE) Nominal PS M1 CQM N/A FM1 parts SCCE + SCP = PACE 

211212 SC Pipes (SCP) Nominal PS M2 CQM N/A FM1 parts 

QM Pipes fed by PGSE (H2 supply 

system) provided by Alcatel 

211213 SC Compressor (SCC) Nominal PS M3 (MTD)(*) N/A FM1 parts 

211221 SC Electronics (SCE) Nominal PS M4 (MTD)(*) N/A FM1 FS 

211231 

SCE/SCC Harness (Power) 

Nominal 

PS M5A (MTD)(*) N/A FM1 FS 

211232 

SCE/SCC Harness (Signal) 

Nominal 

PS M5B (MTD)(*) N/A FM1 FS 

211233 SCE/SCCE Harness Nominal PS M5C (MTD)(*) N/A FM1 FS 

211234 SCC-SCCE Harness Nominal PS M5D (MTD)(*) N/A FM1 FS integrated with SCP 

211216 SC Cold End (SCCE) Redundant PS R1 (MTD)(*) N/A FM2 none 

211217 SC Pipes (SCP) Redundant PS R2 (MTD)(*) N/A FM2 none 

211218 

SC Compressor (SCC) 

Redundant 

PS R3 (MTD)(*) 

Simulato 

r 

FM2 none 

211222 SC Electronics (SCE) Redundant PS R4 (MTD)(*) CQM FM2 none 

211235 

SCE/SCC Harness (Power) 

Redundant 

PS R5A (MTD)(*) N/A FM2 FS 

211236 

SCE/SCC Harness (Signal) 

Redundant 

PS R5B (MTD)(*) CQM FM2 FS 

211237 SCE/SCCE Harness Redundant PS R5C (MTD)(*) CQM FM2 FS 

211238 SCC-SCCE Harness Redundant PS R5D (MTD)(*) CQM FM2 FS integrated with SCP 

211240 SCS MGSE 0 0 

211241 PACE transport Container 0 0 

211242 SCC Transport container 0 0 



9.2.3.5 Planck HFI 



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-11/63 

Product 

tree id 

description code 

STM AVM PFM Spare Comments 

212111 Focal Plane Unit (FPU) PH A CQM N/A PFM kits 

212112 Data Processing Unit (DPU) Nominal PH BA-N CQM CQM PFM FS only one FS for both N&R 

212113 Data Processing Unit (DPU) Redundant PH BA-R (MTD)(*) N/A PFM - (MTD not part of instrument delivery) 

212114 JFET Box PH CA CQM N/A PFM Spare kits 

212115 Pre-Amplifier Unit (PAU) PH CBA CQM CQM PFM Spare kits 

212116 Readout Electronics Unit (REU) PH CBC CQM CQM PFM Spare kits 

212151 FPU/JFET Box Harness PH AD CQM N/A PFM FS 

212152 DPU-N/REU Harness (Signal) PH BBA-N CQM CQM PFM FS only one FS for both N&R 

212153 DPU-R/REU Harness (Signal) PH BBA-R (MTD)(*) N/A PFM FS (MTD not part of instrument delivery) 

212154 DPU-N/REU Harness (Power) PH BBB-N CQM CQM PFM FS only one FS for both N&R 

212155 DPU-R/REU Harness (Power) PH BBB-R (MTD)(*) N/A PFM FS (MTD not part of instrument delivery) 

212156 DPU-N/4K-CDE Harness PH BBE-N CQM CQM PFM FS only one FS for both N&R 

212157 DPU-R/4K-CDE Harness PH BBE-R (MTD)(*) N/A PFM FS (MTD not part of instrument deliver)y 

212158 DPU-N/0.1K-DCCU Harness PH BBC-N CQM CQM PFM FS only one FS for both N&R 

212159 DPU-R/0.1K-DCCU Harness PH BBC-R (MTD)(*) N/A PFM FS (MTD not part of instrument delivery) 

212160 DPU-N/DPU-R Harness (x2) PH BBG (MTD)(*) N/A PFM FS (x1) (MTD not part of instrument delivery) 

212161 PAU/JFET Box Harness PH CBB CQM N/A PFM FS 

212162 PAU/REU Harness PH CBD CQM CQM PFM FS 

212211 4K Cooler Compressor Unit (CCU) PH DA CQM Simulator PFM CQM FS = refurbished CQM Simulator with 

212212 4K Cooler Ancillary Unit (CAU) PH DB CQM Simulator PFM CQM FS = refurbished CQM Simulator 

212213 4K Cooler Electronics Unit (4K-CDE) PH DC CQM CQM PFM kits 

212214 4K Cooler Cold End (CCE) PH DD CQM N/A PFM CQM FS = refurbished CQM 

212215 4K Cooler Current Regulator (CCR) PH DJ CQM CQM PFM CQM or kits FS = refurbished CQM 

212240 4K warm pipework CAU/SVM PH DE CQM N/A PFM CQM FS = refurbished CQM 

212251 4K-CDE/CCU PPO A Harness PH DFA-A CQM N/A PFM CQM 

212252 4K-CDE/CCU PPO B Harness PH DFA-B CQM N/A PFM CQM 

212253 4K-CDE/CCU Force Harness PH DFB CQM N/A PFM CQM 

212254 4K-CDE/CCU Drive A Harness PH DFC-A CQM N/A PFM CQM 

212255 4K-CDE/CCU Drive B Harness PH DFC-B CQM N/A PFM CQM 

212256 4K-CDE/CCU Temperature Harness PH DFE CQM N/A PFM CQM 

212257 4K-CDE/CAU Harness PH DFD CQM N/A PFM CQM 

212258 4K-CAU to to SVM connector harness PH FF CQM CQM PFM CQM 

212314 0.1K Dilution Cooler GSU 3He Tank (D3T) PH EAAA CQM N/A PFM CQM FS = refurbished CQM 

212311 0.1K Dilution Cooler GSU 4He Tank (D4T) #1 PH EAAB CQM N/A PFM CQM 

FS = refurbished CQM one FS for the 3 

tanks 

212312 0.1K Dilution Cooler GSU 4He Tank (D4T) #2 PH EAAC (MTD)(*) N/A PFM - (MTD not part of instrument delivery) 

212313 0.1K Dilution Cooler GSU 4He Tank (D4T) #3 PH EAAD (MTD)(*) N/A PFM - (MTD not part of instrument delivery) 

212321 D3T/0.1K-DCPU piping PH EABA CQM N/A PFM CQM 

212322 D4T #1/0.1K-DCPU piping PH EABB CQM N/A PFM CQM 

212323 D4T #2/0.1K-DCPU piping PH EABC CQM N/A PFM CQM 

212324 D4T #3/0.1K-DCPU piping PH EABD CQM N/A PFM CQM 

212325 GSU pipe fixing clamps on SVM PH EABE CQM N/A PFM Kits 

212351 D3T/0.1K-DCPU harness PH EACA CQM N/A PFM CQM 

212352 D4T #1/0.1K-DCPU harness PH EACB CQM N/A PFM CQM 

212353 D4T #2/0.1K-DCPU harness PH EACC CQM N/A PFM CQM 

212354 D4T #3/0.1K-DCPU harness PH EACD CQM N/A PFM CQM 

212355 GSU harness fixing clamps on SVM PH EACE CQM N/A PFM Kits 

212331 0.1K Dilution Cooler Control Unit (0.1K-DCCU) PH EB CQM CQM PFM kits 

plate with DCPU (DC pneumatic unit) & 

DCE (dilution control electronics) 

212241 0.1K Pipes between DCPU & SVM connector PH ECA CQM N/A PFM CQM FS = refurbished CQM 

212242 0.1K-Pipes between SVM connetor to 18K PH ECB CQM N/A PFM CQM FS = refurbished CQM 

212243 0.1K Harness between DCPU & SVM connector PH ECC CQM N/A PFM CQM FS = refurbished CQM 

212244 0.1K-Harness between SVM connetor to 18K PH ECD CQM N/A PFM CQM FS = refurbished CQM 

212510 HFI MGSE PH ZZ 

212511 HFI Transport Container PH 0 

212520 HFI EGSE PH ZY 

212521 HFI OGSE PH ZX 

212530 0.1K DCP MGSE PH EZZ 




9.3 Deliverable Instrument Test Plan 

9.3.1 Instrument Verification 



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-12/63 

The different types of instrument models and sub-units which will be used at system level will, as a minimum, 

be required a set of tests, necessary to insure that they will be able to perform correctly and reliably their 

functions within the overall system. 

For each type and model instrument the following minimum set of tests are requested (aside the verification of 

the performance requirements defined per each instrument see § 9.3.2). 

- AVM: 

AVM Electrical 

Functional (1) 

Herschel FPU (Sim’s) X 

Flight 

SW 



Limited 

EMC (2) 

Herschel Warm Electronics X X X 

Herschel HIFI LOU (Sim’s) X 

PLANCK FPU HFI/LFI (Sim’s) X 

PLANCK Coolers (Sim’s) X 

PLANCK HFI/LFI 

Warm Electronics 

X X X 

Sim’s stands for simulators 

Note: 

Functional tests will be run with procedures validated before the delivery to the system tests. 

Conductive EMC tests, as a minimum, will be those representative and coherent with the simulator standard. 

- CQM/PFM: 

CQM/PFM* Electrical 

functiona 

l 

Flight 

SW 

Sine/ 

Random/ 

Shock 

Mech. 

functiona 

l 

Thermal 

tests 

EMC 

Cond. 

# * 

EMC 

radiated 

Herschel FPU X X X X X X 

Herschel Warm 

Electronics 

X X X X X X 

Herschel HIFI LOU X X X X X X 

PLANCK FPU HFI and 

LFI 

X X X X X X 

PLANCK Coolers X X X X X X 

PLANCK 

HFI/LFI/Coolers 

Warm Electronics 

X X X X X X



DATE : 12/02/2004 

* Those instruments or part of them which have delivered a qualification unit, will be 

allowed to be tested at acceptance level. 

9.3.2 Instrument Scientific Performance Validation 


ISSUE : 3.1 PAGE :9-13/63 

Each instrument shall carry out the verification steps required to insure that the scientific performance of 

his/her instrument is met. The instruments performance validation shall also include a proper calibration of 

the instruments or the units. 

9.4 Design and Analysis Requirements 

9.4.1 Mechanical Design and Analysis 

9.4.1.1 General Requirements 


A series of tests and analyses shall be conducted to qualify the design of the hardware, to verify the stiffness 

and mechanical environment requirements as well as the general requirements. 

9.4.1.2 Mechanical Models and Analyses 


Structural analysis of instrument units shall be performed in order to show that the stiffness and mechanical 

environment requirements as well as general requirements and shall be performed in NASTRAN. The 

structural analysis shall include stress and dynamic analysis. Requirements on the standards of the mechanical 

mathematical models are detailed in documents RD 52. 

9.4.1.2.1 Detailed Stress Analyses 


The stress analysis shall demonstrate that the instrument unit can withstand the limit loads factored by the 

appropriate safety factors. The analysis results shall be compiled in a technical note with at least: 

− a description of the configuration analysed with reference to interface controlled drawings, 

− a description of the mathematical finite element model and/or of the assumptions taken to verify the 

structure, 



# * 

# * 

# *



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-14/63 

− a description of all possible loading cases and an identification of the design driving load cases or 

load combinations, 

− a detailed description of the most loaded elements listed with relevant stresses, and the loading cases 

that generated them, 

− a list of the materials and structural components with characteristics data sheets (including long-life 

effects under space environment), 

− a set of tables showing, for each structural element, the maximum value on each type of stress or 

combination of them with the allowable value, and the load case that determines it together with its 

margin of safety. 

9.4.1.2.2 Dynamic Analyses 


The dynamic analysis shall be performed to demonstrate that the instrument and/or unit meets the stiffness 

requirements. 

Furthermore, it shall be detailed enough to predict the dynamic loads which size the structural elements, the 

interface loads and the notching necessary in the dynamic tests input spectrum. 

When mechanisms are part of the unit, different models shall be developed to account for the various 

configurations (stowed, fully deployed ...). 

The analysis results shall be compiled in a technical note with at least: 

− a description of the configuration analysed with reference to interface controlled drawings, 

− a description of the mathematical finite element model and/or the definition of the assumptions and 

reductions introduced in the analysis, 

− a description of the checks performed on the model to verify its quality (e.g. rigid body modes, 

residual forces), 

− a list of eigen-frequencies with relevant mode type and associated modal effective masses, 

− plots and listings of eigen-vectors. 

And when necessary: 

− frequency response analysis 

− acoustic response analysis 

− shock response analysis. 

9.4.1.2.3 Safety Factors and Sizing Factors 


Following safety factors are defined for the dimensioning of the equipment to cover uncertainties of load factor 

evaluation, material data and analysis as well as to avoid undesirable influences of manufacturing tolerances. 

They shall be applied to the design limit loads, yield against permanent deformation, ultimate against rupture 

and loss of functionality. 



# * 

# *



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-15/63 

Item Yield SF Ultimate SF Buckling SF 

Conventional metallic materials 1.1 1.5 2.0 

Unconventional materials 1.4 2.0 2.0 

Inserts and joints 1.5 2.0 N/A 

9.4.1.2.4 Design Limit Loads 


The following limit loads (table 9.4.1.1) shall be applied for the structural design considering in addition the 

safety factors defined in 9.4.1.2.3: 

Longitudinal loads can have any sign. 

Lateral loads can have any direction. 

Longitudinal & Lateral loads should be combined 

DESIGN Limit Loads 

Location Case 

Longitudinal 

[g] 

Lateral [g] 

Herschel Optical Bench Instr. 

1 

2 

18 

7 

5 

8 

Herschel CVV LOU 

1 

2 

14 

7 

2.5 

8 

Herschel LOU Wave Guides TBD 

Herschel CVV BOLA 

1 

2 

removed 

Herschel SVM 

1 

2 

25 20 

Planck LFI/HFI (FPU) 

1 

2 

15 25 

Planck HFI JFET box 

1 30 15 

Planck HFI 0.1K & 4K pipes 1 50 50 

on Primary Reflector panel 2 50 50 

Planck LFI Wave Guides see sinus 

Planck Sorption Cooler 

Compressor Assembly 

1 25 20 

SVM subplateform 

(BEU/PAU/DAE control box 

Planck SVM warm units 

4K & 0.1K Pipes on SVM 

4K & 0,1K Pipes on subplatform 

IID-A 3.1 

1 

2 

25g (any direction) 

1 

2 

25 20 

1 150 40 

2 32 110 

1 75 40 

Frequency 

requirement > 

140Hz, except 

freq > 100Hz 

freq > 130HZ 

2 48 55 

Planck SCS Pipes on SVM 100 

freq > 130HZ 



ref fax H-P-ASP-LT 

4281 (21/1/04)



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-16/63 

Table 9.4.1-1: Limit Loads for Herschel and Planck Instruments units 

9.4.1.2.5 Stiffness Requirements 


The structural stiffness of the instruments FPU’s shall be designed so that both the longitudinal eigenfrequency 

and lateral eigenfrequency is greater than 100 Hz. In hard-mounted condition all other units shall be 

designed with eigenfrequencies (any axis) above 140 Hz. 

Resonances of internal items (e.g. PCBs, CCD benches shall be at least one octave above these frequencies to 

avoid coupling). 

Note: Above mentioned levels cover the instrument global design. However, resonances can lead to important 

responses under random test conditions. 

This shall be covered by local sizing for the specified random test levels. 

9.4.1.2.6 Structural Design Margins 


All structural elements shall be designed to exhibit a positive margin of safety (MOS) after application of the 

relevant safety factors (yield and ultimate) for all worst load cases. 

The margin of safety is defined as the ratio of the allowable load (or stress) to the applied load (or stress): 

Allowable Load ( or Stress) 

MOS = 

−1 

Applied Load ( or Stress) 

9.4.1.3 Validation of Dynamic Mathematical Model 


The unit structural mathematical model shall be updated if necessary according to test results and supplied to 

ESA in order to run meaningful system analyses. 

This validation may be performed either through a specific modal survey test or a low level sine test whichever 

is the most practical and efficient. 

All the modes observed during the test will be identified by their mode shape, their frequency and their 

damping ratio. 

The predicted modes of the Structural Mathematical Model (SMM) shall be correlated / updated against 

modes whose effective mass is greater than 10 % of the rigid body mass. Local modes which require 

secondary notching shall be included whatever the effective mass. After validation, the SMM shall still describe 

the main nodes up 150 Hz. 



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# * 

# * 

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9.4.2 Thermal Verification Requirements 




DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-17/63 

An appropriate set of tests and analyses shall be conducted by the PI to demonstrate the following instrument 

capabilities: 

− the satisfactory performances of all the instrument units in vacuum within the qualification or 

acceptance operating temperature range, 

− the capability of the instrument units to withstand without degradation, the qualification or acceptance 

non operating temperature range and the switch-on minimum temperature, 

− the ability of the internal thermal design of the instrument units to guarantee the required 

temperatures on internal critical items from the specified interface temperature at reference point and 

thermal environment of each instrument unit taking into account the repartition of heat sources, 

− the quality of the workmanship and the selected materials to pass thermal cycle test. In addition, the 

test must show the adequacy of the thermal mathematical model with the hardware thermal behaviour 

and the accuracy of the thermal predictions. 

9.4.2.1.1 Definition of the Thermal Environment 


The thermal design of the instruments and their units shall be compliant with the thermal interface temperature 

ranges defined in IID-B. 

9.4.2.1.2 Thermal Models and Analyses 


Each instrument unit shall be modelled by a Thermal Mathematical Model (TMM) under PI responsibility. All 

the thermal mathematical models are delivered to ESA. A simplified version of the instrument thermal model 

shall be build in ESATAN format to be incorporated in the general spacecraft thermal mathematical model. 

A corresponding simplified geometry mathematical model (GMM) shall be provided in ESARAD format. 

The degree of detail (i.e. number of nodes and conductors, etc.) shall be at least sufficient to show that all 

interface requirements are met. The model shall allow to perform transient analyses, hence a thermal capacity 

must be allocated to each node. 

Heat dissipation shall be identified in each operating mode, in steady state (average), and in a typical 

transient timeline. In case of an instrument unit with a large number of operating modes, the number of these 

operating modes can be reduced for thermal modelling purposes, in agreement with ESA. 

In particular, the following information is required: 

− material, cross-sections and length of all relevant suspensions 

− dissipations (average and vs. time) on different stages 



# * 

# *


− material, cross-sections, lengths, currents and duty-cycles of harness 

− material of the various temperature stages for transient calculations 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-18/63 

− thermo-optical properties of surfaces 

The PI shall give a description of the configuration, the interface control drawing as well as all the assumptions 

and simplifications used for modelling. The accuracy of all the thermal mathematical model shall be 

demonstrated by the PI using simple reference thermal loads. 

The requirements for reduced thermal models are given in RD 53. 

9.4.2.2 Validation of the Thermal Mathematical Models 


The unit thermal mathematical model shall be updated if necessary according to test results of the thermal 

vacuum and thermal balance tests and supplied to ESA in order to run meaningful system analyses. The level 

of required agreement between the mathematical model prediction and the test results will be agreed upon 

after completion of instrument design. 

9.4.3 Mechanism Verification Requirements 


All subassemblies featuring parts moving under the action of command able internal forces shall be 

considered as mechanisms. They include all hold-down and release mechanisms, hinges, actuators and 

latches which are required for latching, alignment, positional control etc. of subsystems. 

9.4.3.1.1 Performance and Functional Requirements 


Each mechanism shall be analysed functionally and the following information shall be at least supplied: 

− a detailed description of the mechanisms, with particular reference to its discrete components 

(bearings, actuators, switches) and to its operational/ safety features, 

− a detailed description of the operating modes with reference to ground and orbital activations, 

− a definition of operating loads in various configurations with a clear definition of analysis 

assumptions. In particular, the functional analysis shall include the effects of the worst environmental 

conditions that could produce distortions or changes in clearance between movable parts (e.g. 

thermal gradient through bearings), 

− a Failure Modes, Effects and Criticality Analysis (FMECA) defining the failure modes and the functional 

margins of safety against each of them, 

− a performance description of the control system which includes the mechanisms. 



# * 

# * 

# *


9.4.3.1.2 Design Requirements 



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-19/63 

In addition to the functional requirements for the mechanisms, the following design specifications shall be 

taken into account by the PI’s: 

− the design of the mechanisms shall comply with the general requirements for mechanisms (ECSS-E- 

30A Part 3), 

− a detailed stress analysis of the mechanisms shall be established taking into account the applicable 

thermal environment and the safety factors and sizing factors defined in § 9.4.1.2.3. 

− Margins of safety will be evaluated, 

− stiffness requirements shall be established and demonstrated compatible with the structural and 

functional needs for all the envisaged configurations of the mechanisms, 

− sliding surfaces shall be avoided, only lubricants which are compliant with ESA PA requirements shall 

be allowed, 

− the lifetime of the mechanism shall be evaluated and demonstrated/qualified using representative 

samples with acceptable safety factors. 

The mathematical models of mechanisms shall comply with paragraph 4.2 of ECSS-E-30A Part 3. 

9.4.3.1.3 Mechanism Kinematics Mathematical Models 


The following mathematical models shall be established for the mechanisms: 

− structural models representative of the different configurations of the mechanisms, 

− thermal models representative of the different configurations of the mechanisms, 

− dynamical models representative of the various envisaged displacements and capable of describing 

the Kinematics and Dynamical Variables of the mechanisms with respect to time and taking into 

account ground and in orbit environmental conditions including mechanical shocks, 

− models establishing the maximal/minimal driving forces/torques compared to the worst realistic 

combinations of resistive forces/torques in both static and dynamic conditions. 

9.4.3.2 Validation of the Mechanism Mathematical Models 


The different mathematical models used for the evaluation of the mechanism shall be updated if necessary 

according to test results of performance/functionality and lifetime tests. 



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# * 

# *


9.4.4 Electrical and Software Verification Requirements 




DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-20/63 

All electrical functions and on-board software of the units and the instruments shall be verified and qualified. 

9.4.4.2 Integrated System Tests 


The Integrated System Test (IST) shall be a detailed demonstration that the hardware and software meet their 

performance requirements within allowed tolerances. The test shall demonstrate operations of all redundant 

circuitry. It shall also demonstrate satisfactory performance in all operational modes. The initial IST shall serve 

as a baseline against which the results of all later IST’s can be readily compared. 

The test shall also demonstrate that when provided with appropriate stimuli, performance is satisfactory and 

outputs are within allowed limits. 

A limited version of the IST may be used in cases where comprehensive performance testing is unwarranted or 

impracticable. This limited version, Short Integrated System Test (SIST), shall be a subset of the IST and could 

for example be performed before, during and after environmental tests, as appropriate, in order to 

demonstrate that functional capability has not been degraded by the environmental tests. 

9.4.4.3 Short Functional Tests 


The purpose of the Short Functional Test (SFT) is to prove the correctness of the principal instrument functions 

via its housekeeping values. No connection for test signals, such as stimulation or calibration signals, is 

foreseen. This type of test will be applied for instance after transport and shall not exceed a duration of 30 

minutes per instrument. Normally instrument personnel are not required to attend the tests, which will be 

carried out by the Contractor, following procedures agreed with the PI. 

9.4.4.4 Software Verification 

9.4.4.4.1 General and Design Requirements 


The general requirements for the development of the software dedicated to the instruments are as follows: 

− The instrument on board software shall be verified and qualified before launch. 

− The on board software shall follow the requirements as defined in 5.13.2 above. 



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DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-21/63 

− The software development includes also ground software needed to support the validation and 

qualification of the on board software of the instruments. 

− The software verification shall be included in the instrument DDVP. Software tests shall be documented 

in line with the documentation requirements defined in tbd. 

As a general rule no untested software shall be used on any instrument model. 

9.4.4.4.2 Software Verification 

The detailed software verification approach is tbd. 

The instrument software deliveries are linked to the delivery of the instrument units. 

9.4.5 Radiation Environment Verification 

9.4.5.1 Radiation Environment 

The environment is described in IID-A section 5.16.2 (equivalent satellite protection) , and to RD2 (Enviroment 

& Test requirements, section 3.4.4.2) 


The instrument shall demonstrate by analysis that their equipement will survive the radiation environment 

during the mission if the components used have design dose lower than 10krads. 

9.5 Verification and Testing 

9.5.1 General Test Requirements 

− Verification approach : 

The instrument units belong in general to the category of new design equipment with performances to be fully 

demonstrated by both qualification and acceptance. 

Qualification acquisition through different models shall require ESA approval. 

− Test Sequences: 

No specific environmental test sequence is required. But the test programme should be arranged in a way to 

best disclose problems and failures associated with the characteristics of the hardware and the mission 

objectives. It is strongly recommended that the vibration/acoustic test precede the thermal vacuum test unless 

there is an overriding reason to reverse that sequence. Functional tests shall be performed before and after 

each test sequence and will be detailed in the DDVP. 

− Test facilities: 

The facilities shall be capable of maintaining operating conditions that ensure safe testing of the units, with 

special emphasis on cleanliness. Facility performance should be checked prior to any major test. 

− Test documentation : 

see 9.1.2 



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# *


9.5.2 Test Level Tolerances 



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-22/63 

For the mechanical and thermal tests, the following test tolerances are applicable, unless otherwise specified: 

Parameter Measurement Range Tolerances 

Temperature -55°C to +180°C 

- maximum temperature 

- minimum temperature 

below –55°C and above 10 K 



below 10 K 



Pressure - p > 0,1 mbar 

- p < 0,1 mbar 

0°C/+ 3°C 

- 3°C/0°C 

0K/+1 K 

-1 K/0 K 

0K/+0.1 K 

-0.1 K/0 K 

< ±1 % 

± 10 % 

Solar intensity ± 3 % 

Relative Humidity + 5 % RH 

Static test Force 0 % / 5 % 

Sinusoidal Vibration Acceleration/amplitude 

Frequency below 50 Hz 

Frequency above 50 Hz 

Random Vibration Power Spectral Density (g 2 /Hz) 

Overall g RMS 

Acoustic Vibration 1/3 octave band 

overall 

0 % / +5 % 

± 0.5 Hz 

± 2 % 

-1 dB/ +1.5 dB 

± 10% 

Shock response (Q=10) 1/6 octave band ± 3.0 dB 

Test Duration 0 %/ 5 % 

RF Power Level < ± 0.3 dB 

Spurious level < -20 dBc and up to 80 dBc < ± 0.5 dB 

Frequencies Audio < 20 kHz 

Video > 10 MHz 

Video < 10 Mz 

Voltage < 5 Volt 

> 5 Volt 

Current < 1 A 

> 1 A 



-1.0 dB/3.0 dB (63 to 2000 Hz) 

-2.0 dB/4.0 dB (31.5 Hz) 

-1.0 dB/3.0 dB 

10 ppm 

1 ppm 

0.01 ppm 

≤ 0.2 % 

≤ 0.5 % 

≤ 0.5 % 

≤ 0.1 % 

DC Power ≤ 1.0 % 

VSWR 0.2 dB 

Leak Rate ±10 -5 Pa m 3. s -1 of Helium at 1013 hPa 

pressure differential 

± 10 -10 .Pa.m 3 s -1 for cryogenics parts


Table 9.5.2-1: Test Level Tolerances 

9.1.3 Mechanical Verification and Testing 



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-23/63 

Mechanical testing shall be performed to show that the CQM unit meets the stiffness and environment 

mechanical requirements or that the FM unit is acceptable for flight. 

9.1.3.1 Mass, Moment of Inertia, Centre of Gravity 


The PI shall verify that all units comply with the requirements of interface control documents, that fixation 

points have the correct position and definition within specified tolerances. When necessary, 3D control results 

of the unit interface shall be supplied. 

The PI shall provide the following unit properties: 

− Mass 

− Moments of inertia 

− Position of the centre of gravity 

Except for mass and when tight balancing is required the other properties may be determined by analysis. 

9.1.3.2 Quasi Static Test and Strength Tests 

The main objective of this test is to demonstrate that the load carrying structure is able to withstand the flight 

limit loads without rupture, collapse, damage, permanent deformation or misalignment. 

Amplitude (g level) is the flight limit loads factored by the qualification or acceptance factor (see 9.4.1.2.3) 


The Quasi static test is required except for the following cases (which are usually the case): 

− if analysis demonstrates positive margin of safety against the limit loads 

− if the test is being covered by the sine vibration test at low frequency. 

9.1.3.3 Sine Vibration Tests 


Sinusoidal tests are required to demonstrate that the instrument units can survive all stressing events whether 

during launch, handling, transportation or the S/C AIV program. 



# * 

# * 

# *


9.1.3.3.1 General Requirements 

9.1.3.3.1.1 Facility 



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-24/63 

The vibration test facility and procedure shall satisfy the following minimum requirements: 

− the shaker shall have at least 20% margin with respect to the maximum expected interface load, 

− the control equipment shall be able to maintain the specified tolerances, 

− the data handling equipment shall be sized according to the requested instrumentation. 

− in case of unexpected incidents, smooth abort shall be programmed 

− all test incidents shall be reported and fully explained before going on with the test sequence. 

− blank test using the item fixture is not mandatory but is strongly advised. 

9.1.3.3.1.2 Test facility cleanliness 


Every precaution shall be taken to avoid contamination by oils, greases... The test should take place in a class 

100,000 clean room or better. A protection shall be used if needed. 

9.1.3.3.1.3 Fixture requirement 


The Unit shall be hard mounted on a stiff fixture by all its spacecraft attachment points. The PI will be 

responsible for the definition and procurement of the test fixture. The design of the fixture shall guarantee that 

the major modes of the unit are not modified (as a typical value, frequency shifts should be less than 5 % on 

the lower frequency modes). 

9.1.3.3.1.4 Configuration 


The unit shall be vibrated in the launch configuration, except possibly for thermal hardware (MLI) when it does 

not contribute to the test article stiffness. All non-flight items shall be removed except for optical cubes, which 

may be needed to monitor the unit alignment and any other low weight instrumentation control equipment. 



# * 

# * 

# * 

# * 

# *


9.1.3.3.1.5 Vibration and control equipment 



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-25/63 

To control the vibration level applied to the test specimen, at least 2 three-axis accelerometers shall be rigidly 

attached on the test fixture near the specimen/fixture interface and shall be aligned with the excitation axis. 

Accelerometers shall be calibrated for frequency response in the range 5-2000 Hz. 

9.1.3.3.1.6 Recording instrumentation 


All tests shall be fully recorded and records be properly labelled. All accelerometers shall be calibrated and 

show linear response in the range 5-2000 HZ for amplitudes up to 1.25 times the maximum expected during 

the tests. Some carefully selected accelerometers will be used for automatic notching and abort in order to 

protect the test article. 

9.1.3.3.2 Sine Vibration Test Levels and Duration 

Note: The values below have been derived from PDR system level frequency response analysis and are 

considered as the most suitable mechanical environment expected to be experienced by the instruments. Steps 

are initiated within Arianespace (Coupled Load Analysis with launcher) to further refine these values with the 

intention to reduce them whenever possible. 


Sinus vibration Qualification test levels are specified in the table 9.5.3.1 below. 

Herschel 

FPU 

LOU 

SVM 

Longit. 

Lateral 

Longit. 

Lateral 

Out of Plane 

in plane 

Frequency 

acceleration 

qualif accept 

Hz Hz g g 

5 21 10 mm 8 mm 

21 40 18 14.4 

40 100 18 14.4 

5 14 10 mm 8 mm 

14 45 8 6.4 

45 100 8 6.4 

5 19 10 mm 8 mm 

19 80 14 11.2 

80 100 14 11.2 

5 14 10 mm 8 mm 

14 20 8 6.4 

20 100 8 6.4 

5 25 10 mm 8 mm 

25 100 25 20 

5 22 10 mm 8 mm 

22 100 20 16 

qualif factor 1.25 



# * 

# *

Sweep rate: 2 Oct./min 


FPU 

JFET Box 

20K Pipes on 

PPLM 

0.1K & 4K Pipes 

on PPLM 

HFI bellow 

LFI wave-guides 

all Pipes on SVM all directions 

SCC 

BEU/PAU/DAE 

power box 

Other units on 

SVM 

Planck 

Out of Plane 

In Plane 

Out of Plane 

In Plane 

Out of Plane 

In Plane 

all directions 

Out of Plane 

in plane 

Out of Plane 

In Plane 

Out of Plane 

In Plane 

Frequency 

acceleration 

qualif accept 

Hz Hz g g 

5 30 5 mm 4 mm 

30 100 15 12 

5 30 7 mm 6mm 

30 100 25 20 

5 30 9mm 7mm 

30 100 30 24 

5 30 5mm 4mm 

30 100 15 12 

5 25 10 mm 8 mm 

25 50 25 20 

50 65 60 48 

65 110 25 20 

5 25 10 mm 8 mm 

25 100 25 20 

5 25 10 mm 8 mm 

25 110 25 20 

see 9.5.3.3.2.1 

see 9.5.3.3.2.1 

5 25 10 mm 8 mm 

25 110 25 20 

5 25 10 mm 8 mm 

25 60 25 20 

60 100 25 20 

5 22 10 mm 8 mm 

22 60 20 16 

60 100 20 16 

5 25 10 mm 8 mm 

25 100 25 20 

5 22 10 mm 8 mm 

22 100 20 16 

5 25 10 mm 8 mm 

25 100 25 20 

5 22 10 mm 8 mm 

22 100 20 16 

qualif factor 1.25 


DATE : 12/02/2004 

Table 9.5.3-1 Sine Vibration Qualification Test Levels 

Acceptance levels are to be derived by dividing the qualification levels by a factor 1.25. 

Acceptance sweep rate is 4 Oct./min. 


ISSUE : 3.1 PAGE :9-26/63 

Low level sine test shall be performed to determine resonance frequencies to evaluate the behaviour of the test 

fixture and item integrity. Resonance search shall be carried out before and after vibration test for each axis 

between 5 to 2000 Hz with a level of 0.5 g (sweep rate: 2 oct/min). 



# * 

# *


9.1.3.3.2.1 Special case for wave-guides and HFI bellow 



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-27/63 

For the HFI PAU to JFET bellow, and the LFI wave-guides, the following equivalent sinus test levels shall be 

applied on the equipment. 

9.1.3.3.2.1.1 Bellow 

These specifications shall be applied separately for each interface. Other interface points are clamped. 

Each tubing shall be sized separately for each interface. That is to say : the accelerations shall be applied 

homogeneously on all the attachment points on the interface considered. The part of the pipe going up or 

down from the interface (to another interface for instance) shall be simply supported at the next attachment 

point, with no acceleration applied. The stiffness of this attachment point shall be introduced. 

9.1.3.3.2.1.1.1 JFET interface 

The results are given in the ORDP coordinate system, that is to say : Z perpendicular to the PR panel and X in 

the satellite (XZ) plane. 

X axis Y axis Z axis 

0-6 Hz 10mm 0-7 Hz 10mm 0-6 Hz 10mm 

6-20 Hz 1.7g 5-12 Hz 2.25g 6-15 Hz 1.8g 

20-30 Hz 4.5g 12-20 Hz 6.45g 15-30 Hz 10.5g 

30-40 Hz 5.7g 20-35 Hz 3.75g 30-40 Hz 5.7g 

40-50 Hz 13.8g 35-60 Hz 1.5g 40-52 Hz 12.6g 

50-70 Hz 3g 60-75 Hz 2.9g 52-65 Hz 25.5g 

70-90 Hz 4.8g 75-100 Hz 0.8g 65-75 Hz 4.5g 

90-100 Hz 0.6g 75-90 Hz 11g 

Acceptance levels will be obtained by dividing those values by 1.25. 

9.1.3.3.2.1.1.2 PAU interface 



90-100 Hz 4.2g 

Those results are given in the satellite coordinate system (uptated in version 3.1 to take into account the 

behaviour of the subplateform). 


0-8Hz 10mm 0-6Hz 10mm 0-6Hz 10mm 

8-20Hz 2.0g 6-25Hz 1.6g 6-25Hz 1.6g 

20-35Hz 2.5g 25-35Hz 12.9g 25-35Hz 10.7g 

35-55Hz 3.5g 35-50Hz 2.3g 35-50Hz 2.4g 

# *



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-28/63 


55-65Hz 4.7g 50-70Hz 8.4g 50-70Hz 7.4g 

65-85Hz 33g 70-90Hz 8.7g 70-90Hz 6.3g 

85-100Hz 14.8g 90-100Hz 3g 90-100Hz 1.7g 


9.1.3.3.2.1.1.3 Frame interface 

Those results are given with respect to the plane of the frame, at the attachment point location. 

Out of plane In plane 

0-7Hz 10mm 0-6Hz 10mm 

7-20Hz 1.8g 6-13Hz 1.5g 

20-40Hz 3.1g 13-35Hz 4.4g 

40-47Hz 5.9g 35-50Hz 5.4g 

47-70Hz 3g 50-65Hz 3.6g 

70-75Hz 1g 65-85Hz 1.9g 

75-90Hz 2.6g 85-100Hz 0.6g 

90-100Hz 0.9g 


9.1.3.3.2.1.1.4 Cryo-struts Interface 

The results are given in the cylindrical coordinate frame of the cryostructure (with Z axis corresponding to X 

satellite axis). 

Radial Tangential Longitudinal 

0-10Hz 10mm 0-10Hz 10mm 0-10Hz 10mm 

10-20Hz 2.5g 10-25Hz 2.5g 10-25Hz 2.0g 

20-35Hz 8.2g 25-35Hz 10.5g 25-35Hz 7.2g 

35-100Hz 4.2g 35-65Hz 3.3g 35-50Hz 3.2g 


9.1.3.3.2.1.2 LFI Wave guides 

65-100Hz 1.2g 50-65Hz 8.3g 



65-100Hz 2.3g 

The Planck cooler pipes and LFI wave guides are connecting units located on the SVM and FPU, and have 

mechanical and thermal interfaces on the V-Groove shields.



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-29/63 

As this mechanical environment is complex, we propose here an equivalent mechanical environment that is 

applied at the interface points, giving similar dynamic levels and frequencies. 

By running such dynamic analysis, it should allow: 

− - to optimise the location of natural frequencies of the WG 

− - to optimise the WG support structure to minimise the stresses and the acceleration levels on the WG. 

This environment will be applied on a rigid support on which the FPU, the BEU and the WG support structure 

are rigidly mounted (all degrees of rotation are clamped, only translations are free) 

The equivalent sine environment includes three load cases which correspond to the three sine excitation axis X, 

Y Z. This environment are presented on the following tables 

Load Case 1 Satellite X excitation 

Sine excitation applied along X axis Sine excitation applied along Z axis 

Frequency IF Acceleration [g] Frequency [Hz] IF Acceleration [g] 

4 Hz - 45 Hz 1.8 4 Hz - 45 Hz 2 

45 Hz - 47 Hz 4 45 Hz - 50 Hz 6 

47 Hz - 50 Hz 4 50 Hz - 80 Hz 4.5 

50 HZ - 68 Hz 5 80 Hz - 100 Hz 2.7 

68 Hz - 80 Hz 25 

80 Hz - 100 Hz 4 

Table 9.5.3-2 Planck PLM Load case 1 (X satellite excitation) 

Load Case 2 Satellite Y excitation 

Sine excitation applied along Y axis 

Frequency IF Acceleration [g] 

4 Hz - 20 Hz 1 

20 Hz - 28 Hz 1.6 

28 Hz - 60 Hz 0.1 

60 HZ - 70 Hz 0.1 

70 Hz - 82 Hz 0.55 

82 Hz - 90 Hz 0.75 

90 Hz - 95 Hz 0.2 

95 Hz - 100 Hz 4 

Table 9.5.3-3: Load case 2 (Y satellite excitation) 

Load Case 3 Satellite Z excitation 




Load Case 3 Satellite Z excitation 

Sine excitation applied along Z axis 

Frequency IF Acceleration [g] 

IF Acceleration [g] 1.5 

43 Hz - 50 Hz 2 

50 Hz - 60 Hz 0.8 

60 HZ - 100 Hz 1 

9.1.3.4 Random Vibration Tests 


DATE : 12/02/2004 

Table 9.5.3-4 Load case 3 (Z satellite excitation) 

ISSUE : 3.1 PAGE :9-30/63 

Note: The values below have been derived from an early system level analysis and are considered 

conservative. Steps are initiated within the project to further evaluate these values with the intention to reduce 

them. 


The Random vibration test Qualification levels to be applied to instrument units are specified in the tables 

9.5.3.5 to 9.5.3.7 below. Duration: 2 min. per axis. 



Herschel Random 

vibration test 

Qualification levels 

HPLM 

SVM 

warm 

units 



DATE : 12/02/2004 

F1 F2 Slope / Unit g RMS 

Level 

(Hz) (Hz) (calc) 

FPU 

Normal to 

fixation 

plane 

20 

100 

150 

300 

20 

100 

150 

300 

2000 

100 

3 

0.05 

0.02 

-7 

3 

dB/Oct 

g2/Hz 

g2/Hz 

dB/Oct 

dB/Oct 

3.47 

2.54 

Other axes 

100 

150 

150 

300 

0.02 

0.0125 

g2/Hz 

g2/Hz 

300 2000 -7 dB/Oct 

Normal to 20 100 3 dB/Oct 7.57 

fixation 100 300 0.1 g2/Hz 

LOU 

plane 300 

20 

2000 

100 

-5 

3 

dB/Oct 

dB/Oct 5.35 

Other axes 100 300 0.05 g2/Hz 

300 2000 -5 dB/Oct 

BOLA removed 


PACS 

Warm 

units 

fixation 

plane 

Other axes 

80 

300 

20 

80 

300 

2000 

80 

300 

0.2 

-5 

3 

0.1 

g2/Hz 

dB/Oct 

dB/Oct 

g2/Hz 

7.63 

300 2000 -5 dB/Oct 


HIFI 

Warm 

units 

fixation 

plane 

Other axes 

80 

300 

20 

80 

300 

2000 

80 

300 

0.2 

-5 

3 

0.1 

g2/Hz 

dB/Oct 

dB/Oct 

g2/Hz 

7.63 

300 2000 -5 dB/Oct 


SPIRE 

Warm 

units 

fixation 

plane 

Other axes 

80 

300 

20 

80 

300 

2000 

80 

300 

0.2 

-5 

3 

0.1 

g2/Hz 

dB/Oct 

dB/Oct 

g2/Hz 

7.63 

300 2000 -5 dB/Oct 

Qualification Duration: 2 min. per axis. 

Acceptance levels are to be derived by dividing 

the qualification levels by a factor 1.5625 . 

Acceptance duration is 1 min. per axis. 

Qualification factor 1.5625 

ISSUE : 3.1 PAGE :9-31/63 

Table 9.5.3-5: Random Vibration for Herschel, Qualification test levels" 



# *



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-32/63 

Planck Random vibration test F1 F2 Slope / Unit g RMS 

Qualification levels (Hz) (Hz) Level 

(calc) 

20 100 3 dB/Oct 12.00 

Normal to 100 200 0.4 g2/Hz 

Planck FPU 

(levels at LFI 

bipods / PPLM 

interface) 

fixation plane 

Other axes 

200 

300 

20 

100 

170 

300 

2000 

100 

170 

300 

0.2 

-5 

3 

0.1 

0.25 

g2/Hz 

dB/Oct 

dB/Oct 

g2/Hz 

g2/Hz 

11.20 

rem. This is for X axis only (FPU ref frame) 

300 2000 -5 dB/Oct 

Y (horizontal) can remain at 0.1g2/Hz between 100 & 

170Hz 

HFI JFET 

Normal to 


20 

100 

300 

20 

100 

300 

2000 

100 

3 

0.4 

-5 

3 

dB/Oct 

g2/Hz 

dB/Oct 

dB/Oct 

15.13 

10.70 


300 2000 -5 dB/Oct 

dB/Oct FPU interface: To be estimated by LFI 

PPLM 

Wave guides 

Normal to 


g2/Hz 

dB/Oct 

Primary panel I/F = FPU I/F 

PPLM Frame= No excitation from acoustic (TBC) 

dB/Oct Lower part = BEU 

Other axes 

g2/Hz 

dB/Oct 

Normal to 

HFI coolers (0.1K fixation plane 

& 4K Pipes on V- 

10 

100 

350 

100 

350 

1000 

6 

4 

-6 

dB/Oct 

g2/Hz 

dB/Oct 

45.24 update mail from JBR 28/3/2003 H-P-ASP-LT-2915 

Grooves 1, 2, & Other axes 10 70 6 dB/Oct 14.58 

3) 

70 350 0.4 g2/Hz 

350 1000 -6 dB/Oct 

30 100 6 dB/Oct 12.48 ref fax H-P-ASP-LT 4281 (21/1/04) 

HFI coolers (0.1K 

& 4K Pipes) on 

Any direction 

Primary 

reflector panel 

100 

180 

180 

350 

0.2 

0.35 

g2/Hz 

g2/Hz 

between groove 3 and FPU 

300 1000 -6 dB/Oct 

SVM 

Subplatf 

orm 

Normal to 

HFI PAU, LFI fixation plane 

BEU, DAE Power 

box 

Other axes 

Normal to 


Cooler pipes on 

20 

80 

300 

20 

80 

300 

20 

50 

300 

80 

300 

2000 

80 

300 

2000 

50 

300 

2000 

3 

0.3 

-5 

3 

0.15 

-5 

3 

0.9 

-5 

dB/Oct 

g2/Hz 

dB/Oct 

dB/Oct 

g2/Hz 

dB/Oct 

dB/Oct 

g2/Hz 

dB/Oct 

13.21 

9.34 

23.15 

subplatform 

20 50 3 dB/Oct 16.37 


300 2000 -5 dB/Oct 




Planck Random vibration F1 F2 Slope / Unit g RMS 

Qualification levels (Hz) (Hz) Level 

(calc) 

Sorption 

cooler 

Out of 

Plane 

20 

80 

300 

80 

300 

2000 

3 

0.2 

-5 

dB/Oct 

g2/Hz 

dB/Oct 

10.79 

compres 

20 80 3 dB/Oct 7.63 

sor In Plane 80 300 0.1 g2/Hz 

300 2000 -5 dB/Oct 

Normal 20 80 3 dB/Oct 13.21 

Sorption to 80 300 0.3 g2/Hz 

cooler fixation 300 2000 -5 dB/Oct 

Electroni 

cs 

Other 

axes 

20 

80 

300 

80 

300 

2000 

3 

0.15 

-5 

dB/Oct 

g2/Hz 

dB/Oct 

9.34 

Normal 20 80 3 dB/Oct 13.21 

4K CU, to 80 300 0.3 g2/Hz 

4KCDE, fixation 300 2000 -5 dB/Oct 

4KCR, 

4KU 

Other 

axes 

20 

80 

300 

80 

300 

2000 

3 

0.15 

-5 

dB/Oct 

g2/Hz 

dB/Oct 

9.34 

Normal 20 80 3 dB/Oct 10.79 

HFI 

DCCU, 

LFI REBA 

to 

fixation 

Other 

axes 

80 

300 

20 

80 

300 

300 

2000 

80 

300 

2000 

0.2 

-5 

3 

0.1 

-5 

g2/Hz 

dB/Oct 

dB/Oct 

g2/Hz 

dB/Oct 

7.63 

Normal 20 80 3 dB/Oct 10.79 

to 

SVM 

HFI fixation 

warm 

REU/DPU 

units 

Other 

axes 

80 

300 

20 

80 

300 

300 

2000 

80 

300 

2000 

0.2 

-5 

3 

0.1 

-5 

g2/Hz 

dB/Oct 

dB/Oct 

g2/Hz 

dB/Oct 

7.63 

Normal 

TBD dB/Oct 

HFI He 

tanks in 

SVM 

to 

fixation 

Other 

axes 

TBD 

TBD 

TBD 

TBD 

TBD 

g2/Hz 

dB/Oct 

dB/Oct 

g2/Hz 

dB/Oct 

Normal 20 50 3 dB/Oct 10.91 

Pipes in to 50 300 0.2 g2/Hz 

SVM fixation 300 2000 -5 dB/Oct 

lateral 

panels 

Other 

axes 

20 

50 

300 

50 

300 

2000 

3 

0.1 

-5 

dB/Oct 

g2/Hz 

dB/Oct 

7.72 

Normal 20 70 3 dB/Oct 20.26 

Pipes on to 70 300 0.7 g2/Hz 

shear fixation 300 2000 -5 dB/Oct 

webs (4K 

Other 

& 0.1K) 

axes 

20 

70 

300 

70 

300 

2000 

3 

0.35 

-5 

dB/Oct 

g2/Hz 

dB/Oct 

14.33 

Normal 20 100 3 dB/Oct 10.70 

Pipes on to 100 300 0.2 g2/Hz 

Cone (4K fixation 300 2000 -5 dB/Oct 

/ 0.1K / 

SCC) 

Other 

axes 

20 

100 

300 

100 

300 

2000 

3 

0.1 

-5 

dB/Oct 

g2/Hz 

dB/Oct 

7.57 


DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-33/63 

Table 9.5.3-6: Random Vibration Qualification test levels for Planck. 

Acceptance levels are to be derived by dividing the qualification levels by a factor 1.5625 . 

Acceptance duration is 1 min. per axis. 

For Planck cooler pipes on V_Groove shields, the specific levels shall be used to size the pipes and supports: 



V-groove 1 

V-groove 2 

V-groove 3 


Out of Plane 

In Plane 

Out of Plane 

In Plane 

Out of Plane 

In Plane 


DATE : 12/02/2004 

F1 F2 Slope / Unit g RMS 

(Hz) (Hz) Level 

(g) 

10 50 3 dB/Oct 53.93 

50 300 6 g2/Hz 

300 1000 -6 dB/Oct 

10 70 6 dB/Oct 21.72 

70 250 0.4 g2/Hz 

250 400 1 g2/Hz 

400 1000 -6 dB/Oct 

10 60 6 dB/Oct 50.04 

60 200 4 g2/Hz 

200 300 6 g2/Hz 

300 1000 -6 dB/Oct 

10 70 6 dB/Oct 11.80 

70 300 0.3 g2/Hz 

300 1000 -6 dB/Oct 

10 70 6 dB/Oct 71.19 

70 170 8 g2/Hz 

170 350 10 g2/Hz 

350 1000 -6 dB/Oct 

10 70 6 dB/Oct 24.08 

70 170 0.4 g2/Hz 

170 350 1.3 g2/Hz 

350 1000 -6 dB/Oct 

Qualification factor 1.5625 

Qualification test duration is 2 min. per axis. 

Acceptance test duration is 1 min. per axis. 

Acceptance levels are to be derived by dividing the 

qualification levels by a factor 1.5625 

ISSUE : 3.1 PAGE :9-34/63 

Table 9.5.3-7: Random Vibration Qualification test levels for Sorption cooler pipes on Planck 

V-Grooves. 


Low level sine test shall be performed to determine resonance frequencies to evaluate the behaviour of the test 

fixture and item integrity. Resonance search shall be carried out before and after vibration test for each axis 

between 5 to 2000 Hz with a level of 0.5g (sweep rate: 2 oct/min).. 

Note: Random vibration levels heve been estimated from a vibroacoustic analysis performed on the complete 

satellites configuration, and using ASTRYD software (with 26 distributed sources). 

9.1.3.5 Acoustic Tests 


The accoustic levels to be used for design and test of equipments are specified in the table 9.5.3.8 below. The 

are extracted from the ARIANE 5 Users Manual. Relevance level: 2 10 -5 Pascal. 



# *

Octave Band 

Centre Frequency (Hz) 

31,5 

63 

125 

250 

500 

1000 

2000 



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-35/63 

Qualification level (dB) Acceptance level (dB) Test Tolerance 

132 

134 

139 

143 

138 

132 

128 


128 

130 

135 

139 

134 

128 

124 

Overall level 146 142 

Duration 2 min 1 min 

9.1.3.6 Shock Test Levels 


Table 9.5.3-8:Acoustic test levels 


-2g +4g 

-1g +3g 

-1g +3g 

-1g +3g 

-1g +3g 

-1g +3g 

-1g +3g 

The shock response spectrumspecified below (figure 9.5.3-1) is applicable to the instrument of Planck and to 

the Herschel instruments accommodated in the SVM. 

It is to be applied along all three axes. 

All units Pipes (Planck) 

Frequency (Hz) Shock Level (g) Frequency (Hz) Shock Level (g) 

200 200 100 25 

600 800 350 350 

2000 2000 1000 2000 

10000 2000 4000 2930 

10000 2930 

Acceleration (g) 

10000 

1000 

100 

10 

Shock Qualification at Unit Level in SVM 

Pipes (Planck) 

Units 

IID-A 3.1 

100 1000 10000 


Figure 9.5.3-1: Shock Response Spectrum for units and pipes on SVM. 

The present assumptions are confirmed with Herschel and Planck in a dual launch configuration. 

# * 

# *

9.1.3.7 Displacements 



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-36/63 

For Planck, cooler pipes and bellows are routed between the Service module and the PPLM. These modules 

are behaving differently under launch loads, and displacement between Planck components are expected, with 

impact on the pipes and bellows. 

In this section are introduced the dynamic displacements (new requirements) and the integration and 

thermoelastic displacements have been moved from section 5.16.4 (IID 3.0) 


The rule for combination of displacements to design the pipes is the following: 

Dynamic displacements shall be combined with integration displacements 

Thermoelastic displacements shall be combined with Integration displacements. 

9.1.3.7.1 Dynamic displacements 

9.1.3.7.1.1 Dynamic displacement inside Planck SVM 


In the Planck SVM, the cooler pipes shall be compatible with the following displacements: 

Item in plane 

out of 

plane unit 

4K Pipes ± 1.5 1.5 mm 

0.1K Pipes - He Tank to DCCU Shear web ± 1.2 1.6 mm 

0.1K pipes - DCCU to subplatform Lateral panel ± 2.1 2.1 mm 

0.1K pipes - DCCU to subplatform Shear web ± 1.7 2.2 mm 

SCS Pipes ± 2 2.5 mm 

9.1.3.7.1.2 Dynamic displacements in the PPLM 

9.1.3.7.1.2.1 Sorption Cooler Pipes in PPLM 

The sorption cooler pipe shall be compliant with the following displacements occuring between planck V- 

Grooves 1 to 3. 



# * 

# *


Pipe portion 

V-Groove 1 to 

V-Groove 2 

V-Groove 2 to 

V-Groove 3 

Precooler 3B 

to Precooler 

3C 

Groove 3 pipe 

support to Coil 


Axis 

(respon 

se) 

Sine X 

mm 

Sine Y 

mm 

Sine Acoust 

Z mm ic mm 

X 2 0.6 0.7 2.9 

Y 0.4* 0.4* 0.8* 1 

Z 0.6* 1.1* 0.8* 1 

X 1 0.7 0.3 2.1 

Y 0.7* 0.7* 0.3* 0.9 

Z 0.7* 0.8* 0.3* 1.1 

X 2.1 1.3 1 - 

Y 0.3 0.2 0.2 

Z 0.4 0.3 0.2 

X 2 0.9 0.4 - 

Y 0.4 0.3 0.4 

Z 0.6 0.5 0.5 


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Load cases (excitation) data related to SCS FEM 


Pairi 

ng 

Lower 

grid 

point 


Upper 

grid 

point 

3 90204 90226 

4 90249 90273 

5 90374 90397 

6 90432 90538 

Load cases to be applied separately 

*expressed in the nodes local coordinate system 

For each load case, displacements shall have any sign and shall be combined. 

Integration displacements must be added to those load cases. 

These displacements have been computed with the JPL FEM provided in 

September 2002, ref 352G:02:024:PDM. They are expressed in the satellite 

Only grey-coloured load cases must be applied (other load cases are covered 

by the grey ones). 

In addition, between the SVM, and the V-groove 1, the following displacements shall be taken into account for 

the sorption cooler pipes 

# *

Pipe portion 


Axis 

(response 

) 

Sine X 

(mm) 

Load cases (Excitation) 

Sine Y 

(mm) 


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ISSUE : 3.1 PAGE :9-38/63 


Sine Z 

(mm) 

Acoustic 

(mm) 

Between last cone support X 1.7 1.6 1.3 1.8 

and 1st V-groove 1 support Y 0.3 3.8 0.3 0.6 

(-Y side) 

Z 1.4 0.5 3 0.6 

Between 1st V-groove 1 X 0.8 0.9 1.1 - 

support and H.E. I/F (-Y Y 0.1 0.2 0.1 

side) 

Z 0.1 0.1 0.1 

Between last cone support 

and H.E. I/F (+Y side) 

X 

Y 

Z 

2.4 

0.3 

1.4 

2.3 

3.9 

0.4 

1.2 

0.3 

3 

1.8 

0.6 

0.6 

Between megaphone-pipe 

I/F and cold end 

X 

Y 

1.1 

0.2 

0.6 

5 

1 

0.3 

2 

0.8 

Z 1.9 0.3 3.5 1 

For each load case, displacements shall have any sign and shall be combined. Integration 

displacements must be added to those load cases. 

Note : the lateral displacement between the subplatform and the V-groove 1 of 3.5mm under 

sine environment, mentioned during the meeting on February 24th in Alcatel was computed with 

the JPL FEM that is no more valid. This explains the slight increase of the lateral displacement 

between the cone and the V-groove 1. 

These displacements have been computed directly on the PPLM FEM, because no pipe FEM 

corresponding to the last design issue was available. They are expressed in the satellite coordinate 

system. 

Only grey-coloured load cases must be applied (other load cases are covered the grey ones). 

9.1.3.7.1.2.2 0.1K & 4K Cooler pipes 


For the HFI 4K & 0.1K Cooler pipes, the following dynamic displacements shall apply (expressed in satellite 

reference frame): 


Pipe portion 

Between subplatform 

and V-groove 1 

Between V-groove 1 





and frame 

Primary reflector Panel 

Interface (between the 

last point on the lower 

beam, and the FPU 

interface) 


Axis 

(response) 

Sine X (mm) Sine Y (mm) Sine Z (mm) 


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Acoustic 

(mm) 

X 0.7 0.9 0.4 0.6 

Y 0.2 3.4 0.2 0.7 

Z 1.4 0.3 2.7 0.7 

X 0.5 1.2 

Y 0.4 1.2 

Z 1.2 1.1 

X 1.5 

Y 1.1 

Z 1.3 

X 1.4 0.8 

Y 2.9 1.7 

Z 2.2 3.1 

X 

Y 

Z 

Load cases (Excitation) 

9.1.3.7.2 Integration and thermoelastic displacements 

(moved from section 5.16.4 in previous version 3.0 of IID-A) 

9.1.3.7.2.1 Displacements in Planck PPLM 


0.4 

2.5 

0.3 

Boundary conditions: The last attachment point on 

the lower beam is clamped, the displacement are 

applied at the FPU interface. ref H-P-ASP-LT-4281 

21/01/04 

The following section gives the expected displacement of the Planck PLM interface points during integration or 

cool-down. These displacements shall be used to size the pipes and supports, with the combination rules as 

given in section 9.5.3.7. 

9.1.3.7.2.1.1 Sorption cooler 

Integration displacements 

S/C interface part SVM Panel Subplatform Groove 1 Groove 2 Groove 3 int. Groove 3 ext. FPU 

Concerned items Compressors 

Support points on 

Subplatform 

1st heat exchanger 

+Support points on G1 

2nd heat exchanger 



Rem 

3rd and 4th heat 

exchangers +Support 

points on G3 

5th heat exchanger 


SC Cold End 

Radial translation 0 +/-0.5 +/-2.5 +/-2.5 +/-2.5 

+/-3.8 

Tangent translation 0 +/-0.5 +/-1.5 +/-1.5 +/-1.5 

+/-1 

Axial translation 0 +/-0.5 +/-2 +/-2 +/-2 

+/-4.3 

Radial rotation 0 +/-0.5 mrd +/-1 mrd +/-1 mrd +/-1 mrd 

+/-0.50 mrd 

Tangent rotation 0 +/-0.5 mrd +/-1 mrd +/-1 mrd +/-1 mrd 

+/-0.50 mrd 

Axial rotation 0 +/-0.5 mrd +/-1 mrd +/-1 mrd +/-1 mrd 

+/-0.50 mrd 

Thermo-elastic instability 

# * 

# *



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S/C interface part SVM Panel Subplatform Groove 1 Groove 2 Groove 3 int. Groove 3 ext. FPU 

Concerned items Compressors 

Support points on 

Subplatform 





3rd and 4th heat 

exchangers +Support 

points on G3 





SC Cold End 

Radial translation 0 +/-0.2 -2,3 -3,1 -3,8 -4,5 +/-1 

Tangent translation 0 +/-0.2 0 0 0 0 0 

Axial translation 0 +/-0.2 +/-0,5 -1 -1,5 +1 -0,5 

Radial rotation 0 +/-0.3 mrd +/-3 mrd +/-3 mrd +/-3 mrd +/-1 mrd +/-0.10 mrd 

Tangent rotation 0 +/-0.3 mrd +10 mrd +10 mrd +10 mrd +5 mrd +/-0.10 mrd 

Axial rotation 0 +/-0.3 mrd +/-0.02 mrd +/-0.05 mrd +/-0.10 mrd +/-0.15 mrd +/-0.10 mrd 

Nota : the Coordinate system is a cylindrical one with Xs/c for the axial axis. 

Integration displacements and thermo-elastic instability shall be combined 

9.1.3.7.2.1.2 4 K cooler 


S/C interface part SVM Panel Subplatform Groove 1 Groove 2 Groove 3 Telescope FPU 

Concerned items Ancillary Deconnexion box Support points on G1 Support points on G2 



Telescope Back Rod and 

Frame support points 

HFI 18K Plate IF 

Radial translation / +/-3.8 +/-2.5 +/-2.5 +/-2.5 +/-1 +/-3.8 

Tangent translation / +/-1 +/-1.5 +/-1.5 +/-1.5 +/-1 +/-1 

Axial translation / +/-4.3 +/-2 +/-2 +/-2 +/-1 +/-4.3 

Radial rotation / +/-0.5 mrd +/-1 mrd +/-1 mrd +/-1 mrd +/-0.50 mrd +/-0.50 mrd 

Tangent rotation / +/-0.5 mrd +/-1 mrd +/-1 mrd +/-1 mrd +/-0.50 mrd +/-0.50 mrd 

Axial rotation / +/-0.5 mrd +/-1 mrd +/-1 mrd +/-1 mrd +/-0.50 mrd +/-0.50 mrd 



Concerned items Ancillary Deconnexion box Support points on G1 Support points on G2 




Frame 


Radial translation / +/-0.2 -2,7 -3,6 -4,4 -4,4 +/-1 

Tangent translation / +/-0.2 0 0 0 0 0 

Axial translation / +/-0.2 -2 -1 -2,5 -2,5 -0,5 

Radial rotation / +/-0.3 mrd +/-3 mrd +/-3 mrd +/-1 mrd +/-1 mrd +/-0.10 mrd 

Tangent rotation / +/-0.3 mrd +10 mrd +10 mrd +5 mrd +5 mrd +/-0.10 mrd 

Axial rotation / +/-0.3 mrd +/-0.02 mrd +/-0.05 mrd +/-0.10 mrd +/-0.10 mrd +/-0.10 mrd 

All the values are TBC 



9.1.3.7.2.1.3 0.1K cooler 



Concerned items DCCU Deconnexion box 








Frame support points 


Radial translation / +/-3.8 +/-2.5 +/-2.5 +/-2.5 +/-1 +/-3.8 

Tangent translation / +/-1 +/-1.5 +/-1.5 +/-1.5 +/-1 +/-1 

Axial translation / +/-4.3 +/-2 +/-2 +/-2 +/-1 +/-4.3 

Radial rotation / +/-0.5 mrd +/-1 mrd +/-1 mrd +/-1 mrd +/-0.50 mrd +/-0.50 mrd 

Tangent rotation / +/-0.5 mrd +/-1 mrd +/-1 mrd +/-1 mrd +/-0.50 mrd +/-0.50 mrd 

Axial rotation / +/-0.5 mrd +/-1 mrd +/-1 mrd +/-1 mrd +/-0.50 mrd +/-0.50 mrd




DATE : 12/02/2004 

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Concerned items DCCU Deconnexion box 










Frame 


Radial translation / +/-0.2 -2,7 -3,6 -4,4 -4,4 +/-1 

Tangent translation / +/-0.2 0 0 0 0 0 

Axial translation / +/-0.2 -2 -1 -2,5 -2,5 -0,5 

Radial rotation / +/-0.3 mrd +/-3 mrd +/-3 mrd +/-1 mrd +/-1 mrd +/-0.10 mrd 

Tangent rotation / +/-0.3 mrd +10 mrd +10 mrd +5 mrd +5 mrd +/-0.10 mrd 

Axial rotation / +/-0.3 mrd +/-0.02 mrd +/-0.05 mrd +/-0.10 mrd +/-0.10 mrd +/-0.10 mrd 



9.1.3.7.2.1.4 Displacements at the FPU/telescope interface 

Maximum displacement/rotation 

1 Radial translation in the PR panel plane : relative displacement between the FPU 

and the telescope panel induced by cooling down the FPU from 293 K down 40 K 

when the 6 I/F areas are clamped on a support which has a CTE = 0 

µm/µrd 

2 Translation in the PR panel plane : random displacement of each I/F area ± 200 

(TBC) 

3 Out the panel plane translation (along Zordp : random displacement of each I/F 

area 

/ 

± 100 (TBC) 

4 Rotation around the axis in the PR panel plan: random rotation of each I/F area ± 500 (TBC) 

All these load cases shall be combined 

9.1.4 Thermal Verification and Testing 

9.1.4.1 General Test Requirements and Test Arrangement 

When possible development tests will be performed with samples to demonstrate the adequacy of the selected 

materials and of the design. However, the qualification thermal tests will be performed with fully representative 

hardware. The details of the thermal tests to be performed and the logic how the thermal qualification of the 

units will be achieved shall be presented in the instrument Design & Development Plan. 


As a general requirement each instrument unit must be tested with conductive and radiative interfaces as close 

as possible with the spacecraft interfaces in orbit. In particular: 

− each instrument unit shall be connected to the test mounting panel using identical fixation interfaces 

as its fixation onto the PLM or SVM (insulation washers, interface filler,...), 

− the test mounting panel temperature must be representative of the flight mounting panel temperature 

(margin to be added in test), 

− its external thermo-emissive properties must be identical to the flight ones, 

− the radiative environment must be as close as possible with the flight one (margin to be added in test).



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Because qualification and acceptance temperature range encompass in orbit temperature range, the test 

interface temperature and/or power must be such to ensure the margin on temperature equipment is 

adequate 

The thermal vacuum test arrangement must be designed to give the required qualification or acceptance 

temperatures on the equipment with approximately representative heat flows to and from the environment. 

A possible test set-up is that the in flight mounting panel is replaced by a thermally controlled conductive 

support frame used as heat sink. The equipment is directly mounted to this heat sink. 

A shroud surrounding the instrument unit simulates the radiative environment. The temperature of the 

instrument unit can be controlled both radiatively by adjusting the shroud temperature and conductively by 

adjusting the temperature of the fluid circulating in the mounting frame. 

For all electronics units located into the SVM, the shroud temperature is maintained around the ambient 

temperature during the test. The conductive heat sink temperature is controlled to achieve the required 

temperature level on the instrument unit base-plate. Temperature range can be controlled using both the 

shroud and the heat sink temperatures. 

9.1.4.2 General Test Condition and Instrumentation 


The following minimum test requirements shall be satisfied: 

− equipment shall be tested in a thermal vacuum environment having a pressure of 0.0013 Pa or less. 

The test may begin when the pressure falls below 0.013 Pa, and a pressure of 0.0013 Pa or less shall 

be achieved prior to startup of the units not operating during first ascent, 

− stabilisation is achieved when the equipment temperatures have been maintained within tolerance and 

have not changed by more than 1°C during the previous one hour period. 


The PI shall be responsible to define the adequate test instrumentation in order to demonstrate that 

temperature levels are achieved and to validate the instrument unit thermal mathematical model. 

This test instrumentation shall include as a minimum: 

− for the shroud temperature, the instrumentation necessary to allow accurate temperature control by 

using fluid loop or/and electrical resistance heaters, 

− for the instrument unit at least one temperature sensor on each unit casing wall, and one temperature 

sensor on each unit foot, 

− for the mounting plate, at least one temperature sensor close to each unit mounting foot, and four 

temperature sensors to derive the lateral gradients inside the mounting panel. 


The general requirements for the design verification, qualification and proto-qualification tests are the 

following: 

− During testing, the same item shall be tested in the normal post-lift-off sequence, to the thermal 

environments appropriate to non-operating, switch-on (start-up) and operating qualification 

temperature limits. 



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# * 

# *



DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-43/63 

− If preferred the temperature cycle profile can be changed to give a hot phase first. The temperature 

gradient dT/dt must be < 2°C/min for electronics boxes inside the SVM. For instrument units mounted 

externally of PLM and SVM, temperature profiles with higher slopes can be defined in the equipment 

specification. 

− Heat dissipations: the PI shall demonstrate the units dissipate not more than the maximum values 

defined in IID-B (AD 04,05,06,07,08) for each unit and instrument. 


The general requirements for the acceptance tests are the following: 

− In order to ensure the application of the maximum stress condition, the unit shall be operated 

continuously throughout the test which shall comprise 8 cycles for Qualification and 4 cycles for 

Acceptance (ref ECSS-E-10-03A), with full functional testing at the last 2 extremes, and adequate 

monitoring during the remainder of the test. 

9.1.4.3 Thermal Vacuum and Balance Test 

9.1.4.3.1 Thermal Vacuum Test: 


The thermal vacuum test is required to evaluate and demonstrate the functional performance under vacuum of 

the instrument units. This is performed under the extreme and nominal modes of operation, with temperature 

conditions for the instrument more severe than the maximum and minimum temperatures predicted for the 

mission, namely within the acceptance or qualification temperature range. 

9.1.4.3.2 Thermal Balance Test: 


A thermal balance test at instrument level shall be conducted on instrument units whose thermal control is 

under PI responsibility. The results of the thermal balance test are used to correlate and update the instrument 

thermal mathematical models. 

The thermal balance test simulates nominal conditions to verify the thermal control system. The number of 

energy balance conditions simulated during the tests shall be sufficient to verify the thermal design. The 

exposure shall be sufficient enough for the test item to reach stabilisation so that the temperature distribution 

in steady state condition may be verified. 

The PI shall establish in the Design & Development Plan how and when the thermal vacuum and thermal 

balance will take place and shall demonstrate what is the logic to reach the qualification/ acceptance of the 

instruments and its units. 



# * 

# * 

# * 

# *


9.1.4.4 Thermal Cycling Tests 



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Thermal cycling tests will be performed in order to demonstrate that the instruments and its units are able to 

withstand without degradation and under vacuum a number of thermal cycles representative of the lifetime of 

the instruments with margins starting from the minimal temperatures to the maximal temperatures defined in 

the IID-B (AD 04, 05, 06, 07, 08). Each thermal cycle shall include a soak time long enough to achieve 

thermal equilibrium of the instrument or the unit (T change 1°C/hour). 

The PI shall define in the Design & Development Plan how the demonstration of the thermal cycling test 

adequacy will be conducted on the basis of results with representative samples or with flight units/instruments. 

9.1.4.5 Thermal Shock Test 


A thermal shock test will be conducted to verify that the instruments or the units can withstand a rapid cooldown 

under vacuum from room temperature to the minimal temperature defined in the IID-B. The PI shall 

establish what is the minimal duration of the cool-down still compatible with the unit/instrument. However, this 

duration shall be no greater than 5 hours for Herschel, and 24 hours for Planck (interface PPLM-FPU). 

9.1.4.6 Thermal Bake-out Test 


A thermal bake-out will be conducted (at least) for the Herschel focal plane units inside the cryostat (about 

80°C for 3 days). The capability of the FPU to withstand this bake out shall be demonstrated by test. 

9.1.5 Mechanism Verification and Testing 

9.1.5.1 General Test Conditions 

In the Design & Development Plan, the PI shall present how he intends to demonstrate the functional 

performances of the mechanisms of the instruments and/or units on the basis of the results of tests at sample 

or of instrument/units tests and how the mechanisms will be qualified. 

9.1.5.2 Performance Verification Testing 


The performance validation of the mechanisms shall be established in agreement with the following 

requirements: 

− the verification of the performances of the mechanisms shall be possible on ground at unit, assembly 

and system level, 



# * 

# * 

# *



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− the operation of the mechanisms at system level shall not require special jigs or special attitudes of the 

units/instruments. (Note that it has been agreed to accept certain attitude of the HPLM for sorption 

cooler recycling and for SPIRE FTS), 

− the testing shall demonstrate that all functional requirements are met with margins in representative 

environmental conditions. 

9.1.5.3 Lifetime Verification Testing 

Because mechanisms will operate during the whole lifetime of the mission, special attention shall be devoted 

to demonstrate the lifetime capabilities of the mechanisms. 


The following requirements for lifetime verification shall be fulfilled: 

− the lifetime of the mechanisms shall be demonstrated/qualified by test in a configuration 

representative of the realistic worst case conditions of the flight model, 

− for test demonstration, the nominal number of cycles predicted for the flight items shall be multiplied 

by the following factors: 

Type/number of predicted cycles Applicable factor for tests 

ground operation before flight 4 (min. number is 10) 

in orbit predicted cycles (when prediction is 1 - 10) 10 

in orbit predicted cycles (when prediction is 11 - 1000) 4 (min. number is 100) 

in orbit predicted cycles (when prediction is 1001 - 

100000) 

2 (min. number is 4000) 

in orbit predicted cycles (when prediction > 100000) 1.25 (min. number is 20000) 

An actuation is a full output cycle or a full revolution of the mechanism to be applied. 


lifetime of critical mechanism components shall be declared successful if the following conditions are satisfied: 

− no metal to metal contact identified, 

− no chemical degradation of dry lubricant, 

− operational requirements met within specified tolerances for entire life tests, 

− no rupture or loss of functionality of any part, 

− stiffness requirement met for entire life test. 

9.1.6 EMC Verification and Testing 

The approach taken for the system EMC verification is by analysis and test. This is outlined below and defined 

in the EMC control plan (document Alcatel H-P-1-ASPI-PL-0038). The analysis and the inputs to be provided 



# * 

# * 

# *



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by the instruments are defined in Alcatel Herschel/Planck EMC Control Plan H-P-1-ASPI-PL-0038 §5.1.2 

"Instruments EMC models". 

9.1.6.1 EMC Verification Methods 

The methods to be used in verifying the specified design requirements for both subsystem and equipment are 

defined in this section. The verification activities include: 

9.1.6.1.1 Analysis (A) 

Verification by analysis will be accomplished to satisfy specified requirements that do not necessitate test or 

demonstration to assure that these requirements have been met. Calculation replaces the test results. 

9.1.6.1.2 Review of Design (ROD) 

The verification of physical requirements will be performed by review of drawings, circuit diagrams etc. 

Commentary: Example Correct use of shielded wires, twisted wires, twisting rate, shield grounding, 

grounding diagrams. 

9.1.6.1.3 Inspection (INS) 

Verification by inspection will be accomplished to satisfy requirements such as: 

− Conformance of drawings 

− Workmanship 

− Use of proper parts and materials 

Commentary: Example Use of correct wire and cable types, minimum distance between different wire 

classes for harness routing. 

9.1.6.1.4 Test (T), (DT), (QT), (AT) 

Several kind of testing will be used for verification of requirements during the different stages of the subsystem 

equipment project. 

9.1.6.1.4.1 Development testing (DT) 

Development testing is performed to substantiate analyses and to verify: 

− Conformance characteristics 

− Safety Margins 

− Failure Modes. 

The development tests will not be performed to formal test procedures. Breadboards and engineering models 

that must be of flight configuration in all the important electrical aspects will be used for these tests. 

9.1.6.1.4.2 Qualification Testing (QT) 

Formal qualification testing will be fully documented. Test data will be recorded on data sheets that are an 

integral part of the formal test procedures utilised for verification of the subsystem equipment. 




The EMC qualification test sequence is outlined below: 

− Bonding 

− Isolation 

− Grounding and conductivity test of space exposed surfaces 

− Conducted emission 

− Conducted susceptibility 

− Radiated emission 

− Radiated suceptibility 


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− ESD. 

Note: Electrostatic susceptibility tests can be waived if they are critical for the health of the units. 

9.1.6.1.4.3 Acceptance testing (AT) 

Acceptance testing are conducted to prove that the subsystem equipment design is like the design that was 

qualified, to demonstrate that the workmanship used meets the required standards and to demonstrate that 

the subsystem equipment meets the specification requirements. Formal acceptance testing will also be fully 

documented as required for qualification testing. 

This test shall be accomplished on all FM hardware. Acceptance level testing shall comprise the verification of: 

− Bonding 

− Isolation 

− Grounding and conductivity test of space exposed surfaces 

− Conducted emission 

− Conducted susceptibility 

− ESD. 

Note: Electrostatic susceptibility tests can be waived if they are critical for the health of the units. 

9.1.6.1.5 Similarity Assessment (SIM) 

Similarity verification will be accomplished for equipment/components where proof exists that it was previously 

qualified to the same, or more severe, environment. 

Commentary: Example A qualified pressure transducer used in an earlier mission and still manufactured 

can be verified by similarity. 

9.1.6.1.6 Verification Matrix 

Verification Method Verification Phase 

Similarity A. Design 

AnalysisB. Development 

Inspection C. Qualification 

Review D. 

Test 

Acceptance 





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It is responsibility of the Prime Contractor and/or the relevant Subcontractor to complete the matrix in Table 

9.5.6-1 in accordance with the requirements of the previous section and to submit it to ESA for approval. 

The Prime Contractor is responsible to provide an overall verification matrix at subsystem level for approval by 

ESA. 

EMC Performance 

Requirement Reference 

Verification Methods Document Reference 

and Remarks 

N/A A B C D 

Table 9.5.6-1: Example of Verification Matrix 

9.1.6.2 Test Facility and Test Instrumentation Requirements 

The test shall be performed following the applicable requirements contained in this section. Any condition, 

method not covered by these requirements or deviation to them shall be agreed with the prime. 


The actual test condition and methods selected for the test in question shall be described and documented in 

the relevant test documentation. 

9.1.6.2.1 Ambient Electromagnetic Levels 


Ambient conducted and radiated emission levels shall be measured prior to test and shall be at least 6 dB 

below the applicable limits. These measurements shall be performed with the test article turned off and with all 

the auxiliary equipment turned on. Ambient levels on power leads shall be measured with the leads 

disconnected from the test article and connected to a resistive load which draws the same current as the test 

article. The LISN shall be included in the test set-up. 

9.1.6.2.2 Test Site Conditions 


Testing shall be performed under the following atmospheric conditions where possible: 

− Temperature 19° C to 26° C 

− Pressure 813 to 1040 hPa 

− Relative humidity 20% to 80% 

Restriction as required by the ESA (e.g. Cleanliness class) might be added to those requirements. 



# * 

# * 

# *


9.1.6.2.3 Shielded Enclosures 



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Shielded enclosures shall be of sufficient size to adequately accept the test article without sacrificing test 

accuracy or requiring deviation from the methods specified herein. 

9.1.6.2.4 RF Absorber Material 


RF absorber material shall be used in shielded enclosures to reduce reflections from the surface of the 

enclosure to the measurement antennas. 

9.1.6.2.5 Ground Plane 


A solid plate ground plane shall be used. It shall have a minimum thickness of 0.25 mm for copper or 0.63 

mm for brass and be 2.25 m 2 or larger in area with the smaller side no less than 76 cm in length. When 

testing is performed in a shielded enclosure, the ground plane shall be bonded to the shielded room such that 

the DC bonding resistance shall not exceed 2.5 mΩ. In addition, the bonds shall be placed at distances no 

greater than 90 cm apart. For large test articles mounted on a metal test stand, the test stand shall be 

considered a part of the ground plane for testing purposes and shall be bonded accordingly. 

9.1.1.3 Measuring Equipment/Instrumentation 

This section describes the test equipment and instrumentation used in the test methods contained in this 

document. 

Any other instruments that are capable of measuring the parameters of this specification may be used, after 

approval by the prime. In any case, the actual characteristics of the instrumentation used (factors, useful 

bandwidths, accuracy, sweep speeds etc) shall be listed in the test documentation. 

9.1.1.3.1 Measurement Receivers / Spectrum Analysers. 

Any frequency selective receiver can be used to perform the testing described in this document. The receiver 

characteristics (i.e. sensitivity, selection of the bandwidths, detector functions dynamic range and frequency of 

operations) shall meet the requirements specified in this standard and shall be sufficient to demonstrate 

compliance with the applicable limits. Concerning the use of spectrum analysers, they can be used when 

overloading protection is provided by means of pre-selection input filters. 

Commentary: In EMI testing, one of the most important considerations is preventing saturation of the 

spectrum analyser because spurious responses can be created within the instrument. A solution is to use a 

band-pass or tracking pre-selector that will greatly increase the analyser’s tolerance to broadband overload. 

These pre-selectors will virtually eliminate multiple and image responses. For these reasons, EMI receivers are 

preferred but spectrum analysers are allowed if input pre-selectors are used. 



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# * 

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9.1.1.3.2 Computer Controlled Receivers 


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A detailed description of the operations that are directed by software for computer controlled receivers, shall 

be included in the test plan. Verification techniques used to demonstrate proper performance of the software 

shall also be included. 

9.1.1.3.3 Detector Function 


A peak detector shall be used for all emission and susceptibility measurements. This device shall detect the 

peak value of the modulation envelope in the receiver band-pass. The output of the measurement receiver 

shall be calibrated in terms of equivalent root mean square (RMS) value of a sine wave with the same peak 

value. When other measurement devices such as oscilloscopes, non-selective voltmeters etc are used for 

testing, correction factors shall be applied for modulated test signals to correct the reading to equivalent RMS 

values under the peak of the modulation envelope. 

9.1.1.3.4 Current Probes 

The current probe transfer impedance which is defined as the ratio between secondary voltage across a 50 Ω 

load to the primary current shall be determined using the following procedure: 

Terminate the signal generator with a short length of wire (20 cm) and a 50 Ω non-inductive resistor. The 

primary current Ip can be calculated. 

Clamp the current probe around the wire between the signal generator and the 50 Ω load. 

Connect the current probe to a receiver (50 Ω input impedance) and measure the secondary voltage Vs. The transfer impedance is Zt = Vs/ Ip # Reference IIDA-DV-REQ-0380 

The transfer impedance of the current probe shall be included in the Test Procedure and Test Report. Any 

current probe capable of measuring to the limits specified in this document may be used. The current probe 

shall be located not more than 5 cm apart from the test article. 

9.1.1.1.5 Test Antennas 


Antennas used in performing the radiated emission and susceptibility tests shall be listed in the EMI test 

procedure. 

The following antenna characteristics are recommended: 

− 30 Hz – 50 kHz, (RE01): Sensors that measure only magnetic fields 

• a): Electrically small loops, whose impedance shall not resonate over the frequency range of use. 

• b): Active magnetic sensors, which sense amplitude as opposed to the time derivative of the 

amplitude. 



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DATE : 12/02/2004 

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− 14 kHz – 30 MHz, (RE02): Electrically short high impedance electric field probe, vertically polarised. 

Traditionally the 41’’ rod with active or passive matching network to 50 Ω has been used. 

− 14 kHz – 30 MHz, (RS03): The parallel plate (and its numerous modifications), long wire, and E-Field 

generator are available and listed in order of preference. The E-Field generator should be reserved for 

the case in which the test article is too large for other methods. 

− 30 MHz – 200 MHz, (RE02/RS03): Dipole-like antennas. Typical antenna used in this band has been 

the bi-conical. Care should be exercised in the antenna selection to ascertain that the balun does an 

adequate job of matching the low frequency high antenna impedance to 50 Ω. 

− 200 MHz – 1 GHz, (RE02, RS03): The traditional Log-Periodic and Log-Conical are available. The 

double ridge horn can also be used, although the gain increases dramatically with the frequency. In 

this case, accurate calibration of the double ridge horn shall be proven and included in the EMC Test 

procedure. 

− 1 GHz – 10 GHz, (RE02/RS03): Broadband (ridged) or standard gain horn. Log-Conicals are also 

available. 

− 10 GHz and above (RE02/RS03): 20 dB standard gain horns. 

9.1.1.1.6 Test Antenna Counterpoise (Monopole): 


The following requirements shall be used when rod antennas that require a counterpoise are used. The test 

antenna counterpoise shall be referenced to the same ground reference used for the Electromagnetic 

Interference (EMI) meters. In shielded enclosures, the counterpoise shall be bonded to the reference ground 

plane. The bonding strap shall be a solid metal sheet having the same width as the counterpoise, welded 

along the entire edge at the points of contact. Alternatively, the counterpoise shall be clamped and/or 

soldered to the ground plane in two places. If desired, the counterpoise may be configured so that one 

dimension is of adequate length to reach the test article ground plane. 

9.1.1.1.7 Impulse generators 

Impulse generators shall conform to the above requirements: 

− Calibrated in terms of output to a 50 Ω load. 

− Spectrum shall be flat over its frequency range with an amplitude accuracy of ± 1 dB within the 

frequency band being displayed by the spectrum analyser. 

9.1.1.1.8 Standard Laboratory Equipment (SLE) 


All SLE shall be operated as prescribed by the applicable instruction manual unless otherwise specified therein. 

This requirements document shall take precedence in the event of conflict with instruction manuals or other 

documents issued by industry or other Agencies unless identified in an approved test plan. For test 

repeatability, all test parameters used to configure the test shall be recorded in the EMI test plan and the EMI 

test report. These parameters shall include measurement bandwidths, video bandwidths, sweep speeds etc. 



# * 

# *


9.1.1.1.9 Power Supply Characteristics 


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ISSUE : 3.1 PAGE :9-52/63 

Power supplies for test articles requiring a power source for their operation, supplied or not as part of the test 

article Electrical Ground Support Equipment (EGSE), shall have characteristics and tolerances as specified in 

the test article detailed specification measured at the test article input. 

9.1.1.1.10 Signal Sources 


Any commercially available signal source, power amplifier and general purpose amplifier capable of 

supplying the power required to develop the susceptibility level specified herein, may be used provided the 

following requirements are met: 

− Frequency accuracy shall be within ± 2%. 

− Amplitude accuracy shall be within ± 2 dB. 

− Harmonic content and spurious outputs shall be no more that –30 dB as related to fundamental 

power level. 

9.1.1.1.11 Test Article Electrical Ground Support Equipment (EGSE) 


The EGSE shall simulate the actual loads of the test article using the actual interface required in flight. 

Grounding techniques different from those approved are forbidden. The EGSE shall not interfere or cause EMI 

to the normal test article operations and shall withstand without malfunctions the environment in which it shall 

operate. Whenever possible, during the EMC tests the EGSE shall be located outside the shielded test 

enclosure area in an adjacent, attached shielded enclosure. 

9.1.1.4 Measurement Requirements 

9.1.1.4.1 Measuring Equipment Calibration 


Measuring instruments and accessories used in determining compliance with this document shall be calibrated 

under an approved program in accordance with MIL-STD-45662A. 

9.1.1.4.2 Measurement Accuracy 


All test equipment (SLE, EGSE etc) shall be capable of measuring to within the following accuracy: 

− 2% for frequency 



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− 3 dB for amplitude 


9.1.1.4.3 Measurement Bandwidths 


DATE : 12/02/2004 

Narrow-band ranges for each tuned frequency range are listed in Table 9.5.7-1 below: 

ISSUE : 3.1 PAGE :9-53/63 

Tuned Frequency (Hz) Bandwidth Range (Hz) 

30 – 300 1 – 30 

300 – 3 k 5 – 50 

3k – 30 k 10 – 500 

30k – 1M 300 – 5k 

1M – 30 M 1k – 50 k 

30M – 1G 1k – 100 k 

1G – 40G 100k – 50 M 

Table 9.5.7-1: Narrow-band range for each tuned frequency range 

N.B. For conducted emission 30 Hz to 15 kHz (CE01) range the limit shall be measured with an effective 

bandwidth not exceeding 100 Hz. 

9.1.1.4.4 Measurement frequency range 

A continuous scan and recording of the specified frequency range for each applicable test shall be performed. 

9.1.1.4.5 Susceptibility Frequency Range 

Whether the interference shall be applied as continuous swept or as discrete frequencies shall be determined 

on the basis of the susceptibility criteria. When acceptable, discrete frequencies and their number/decade shall 

be approved by the prime. 

9.1.1.5 Test set-up arrangement. 

9.1.1.5.1 Isolation 

Test instruments shall use an isolation transformer on the AC power lines and a separate ground cable to the 

central ground point. The ground cable shall consist of a braided cable. 

9.1.1.5.2 Test Article Arrangement 


Interconnecting cable assemblies and supporting structures shall simulate actual installation and usage. 

Shielded leads shall not be used in the test set up unless they have been specified in approved installation 

drawings. Diagrams of all cables that interconnect the test article showing all conductors, shielded and 



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unshielded, shall be included in both the EMC test plan and EMC test report. In the event that the as-run 

procedure is included as an appendix to the test report, the cable diagrams in the test procedure will satisfy 

the requirement. Cables and test article shall be so arranged that there is minimum shielding interposed 

between the test article cables and the measurement antennas. 

All leads and cables shall be located within 10 cm from the ground plane edge nearest the measurement 

antenna and shall be supported at least 5 cm above the ground plane on non-conductive spacers. 

9.1.1.6 Test Harness 

The test article shall be connected to the relevant EGSE and SLE via dedicated cabling, which consist of: 

− Standard Cabling 

− Additional Cabling 

− Connector Savers 

9.1.1.6.1 Standard Cabling 

The standard cabling shall implement the connection between the test article and its interfaces, simulated by 

the EGSE and SLE. It shall be identical to the respective flight cabling for the following aspects: 

− Number and type of wires. 

− Shielding termination 

− Over-shielding and termination 

The adopted shielding termination technology shall be agreed with ESA. In particular, shield disconnection 

shall be possible. 

9.1.1.6.2 Additional Cabling 

The additional cabling shall be interposed between the test article and the standard cabling as required by test 

methods. This cabling shall be configured as necessary to accommodate test needs (probe insertion, LISN 

insertion, etc) while maintaining the standard cabling configuration for all the other cables that are not 

involved. 

9.1.1.6.3 Connector Savers 

The type of connector savers shall be agreed with ESA. They shall not impair the shielding effectiveness of the 

standard cabling. 

9.1.1.6.4 Shock and Vibration Isolators 

If the test article is mounted on a base with shock or vibration isolators in the operational installation, the test 

set up shall include such mounting provisions. Bonding hardware and application for the test article shall be 

identical to the approved installation drawing. If no provisions for bond strap are made on the installation 

drawings, then no bond straps shall be used during testing. 



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9.1.1.7 Test Article loading 


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The test article shall be loaded with the full mechanical and electrical load or equivalent for which it is 

designed. If worst case EMI condition exist at a reduced load, the test shall include the reduced level loads as 

well as the full load. 

9.1.1.7.1 Representative loading 

The loads used shall simulate the impedance of the actual load. Mechanical devices, if any, shall also be 

operated under load. The test article shall be actuated by the same means as in the installation. As an 

example, if a solenoid is actuated through a silicon-controlled rectifier (SCR), a toggle switch shall not be used 

to operate the solenoid for the test. 

9.1.1.7.2 Signal Inputs 

Actual or simulated signal inputs and software required to activate, utilise or operate a representative set of all 

circuits shall be used during emission and susceptibility testing. 

9.1.1.7.3 Source/Loads for Communication-Electronics Test Articles 

All RF outputs of communication electronics test article shall be terminated with shielded dummy loads as 

appropriate for the test article and the test being performed to produce maximum normal output. At the 

frequencies of concern, the Voltage Standing Wave Ratio (VSWR) of the resistive dummy loads, attenuators, 

directional couplers, samplers, power dividers and the internal standard impedance of the signal generators 

shall not be greater than: 

− Transmitter Loads 1.5:1 

− All other dummy loads and pads 1.3:1 

− Standard signal generators 1.3:1 

9.1.1.8 Measurement Antenna Position 

9.1.1.8.1 Location 


When performing radiated emission and susceptibility tests, no points of the antennas shall be less than 1 m 

from the walls, ceiling or floors of the shielded enclosure or obstruction. 

9.1.1.8.2 Biconical Antenna 

A minimum distance of 30 cm from the floor and ceiling and 1 m from the walls of the shielding enclosure or 

obstruction can be accepted when the biconical antenna is used in vertical polarisation. 



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9.1.1.8.3 Linearly polarised antennas 



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For radiated emission measurements above 30 MHz, linearly polarised antennas shall be positioned to 

measure the vertical and horizontal components of the emission 

For radiated susceptibility measurements above 30 MHz, linearly polarised test antennas shall be positioned 

so as to generate vertical and horizontal fields. 

9.1.1.9 Line Impedance Stabilisation Network (LISN) 


In order to reproduce the system power bus impedance and to standardise the measurement conditions used 

in different test sites, emissions and susceptibility measurements on primary power lines shall be performed on 

inserting a Line Stabilisation Network (LISN) between the EGSE power supply and the unit under test. 

The LISN schematic and the relevant impedance versus frequency are given in Fig. 9.5.6-1 and Fig. 9.5.6-2 

shall be used. 

Figure 9.5.6-1: LISN schematic 



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Impedance Amplitude (Ohms) 

10 2 

10 1 

10 0 

10 -1 

10 2 

125 mOhm 

10 4 

10 6 



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ISSUE : 3.1 PAGE :9-57/63 


50 Ohm 

Figure 9.5.6-2:Output impedance of the LISN with shorted input terminals 

9.1.1.10 Test Configuration and Operation Requirements 

9.1.1.10.1 Test Article Operations 


For a representative set of all modes of operation, controls on the EUT shall be operated and adjusted as 

prescribed in the instruction manuals or as required by the test article specification in order to obtain optimum 

design performance. For susceptibility testing, the expected most susceptible modes shall be selected. For 

emission noise, the noisier modes shall be selected. 

9.1.1.10.2 Input Voltage Selection 

Except when specified differently, the voltage at the test article input power leads shall be selected as the worst 

case value with respect to the test within the nominal voltage range. 

9.1.1.10.3 Interface Signal Operation 

Interface signal of the test article shall be active during testing as required by operations defined in paragraph 

9.5.6.10.1. 

9.1.1.10.4 Susceptibility Criteria 


The threshold of susceptibility shall be determined for test articles unable to meet the susceptibility criteria. 


10 8 

10 10 

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9.1.1.10.5 Time Duration 




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Each susceptibility level shall be maintained for a minimum time in order to ensure that possible susceptibility 

conditions are achievable and detectable. 

9.1.1.10.6 Test Equipment Warm-up time. 

Prior to performing tests, the measuring equipment shall have been switched on for a period of time adequate 

to allow parameter stabilisation. If the operation manual does not specify a specific warm up time, the 

minimum warm up period shall be 1 hour. 

9.1.1.11 Bonding, Isolation and Grounding/Conductivity Tests 

These tests are carried out to demonstrate compliance with the required instrument performance. 

9.1.1.12 Conducted Emission Tests 

The suggested test set-ups for CEDM and CECM are shown in figure 9.5.6-3. 

I DM 

to spectrum 

analyser 

I DM 

HF probe 

I CM/2 

I CM/2 

to spectrum 

analyser 

HF probe 

Figure 9.5.6-3: Conducted Emission - Test set-up for DM and CM 

9.1.1.13 Conducted Susceptibility Tests 

The test set-up for differential mode susceptibility on primary power lines is shown in Figure 9.5.6-4 for 

frequencies up to 50kHz. For the frequency range 50kHz-50MHz then the test set-ups shown in Figure 9.5.6-5 

or Figure 9.5.6-6 should be used. The injected voltage relevant to the susceptibility threshold shall be 

monitored and recorded. The injected current shall be limited to 1 Ar.m.s on the input power lines. 



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DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-59/63 

Figure 9.5.6-4: Conducted susceptibility on primary power lines, differential mode. Frequency 

domain 30Hz-50kHz 

EGSE 

Primary Power 

Signal Lines 

+ve 

-ve 

Generator Amplifier 

Ground Plane 

Isolation 

Transformer 

Oscilloscope 

Note: 

Coupling Capacitor C 

50kHz-1MHz - 1uF 

1MHz-50MHz - 0.1uF 

or use R.F. Coupler 


domain 50kHz-50MHz 



C


Power 

Supply 

Signal 

Generator 

LISN 

Amplifier 

(power return 

grounded at input) 

Injection 

probe 


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ISSUE : 3.1 PAGE :9-60/63 

Oscilloscope 

(voltage measured 

with differential input 

or differential probe) 

Equipment 

Under Test 

(performance monitor 

for degradation or deviation) 


domain 50kHz-50MHz 

The text set-up for common mode susceptibility on primary power lines and on signal bundles is shown in 

Figure 9.5.6-7. The signal lines shall be loaded with electrical simulators of the interfacing circuits. 

Signal 

Generator 

Power 

Supply 

LISN 

Amplifier 

(power return 

grounded at input) 

Injection 

probe 

Oscilloscope 

(voltage measured 

with differential input 

or differential probe) 

Equipment 

Under Test 

(performance monitor 

for degradation or deviation) 

Figure 9.5.6-7 Conducted susceptibility on primary power lines and signal bundles. Common 

mode, frequency domain 10kHz-50MHz 

The test set-up for common mode conducted susceptibility between the subsystem equipment signal reference 

and the ground plane (transient and steady state) is shown in Figure 9.5.6-8 (externally accessible ground 

wire) and Figure 9.5.6-9 (no accessible ground wire). 





DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-61/63 

Figure 9.5.6-8; Conducted susceptibility, common mode between signal reference and ground, 

transient and steady state, externally accessible ground wire 

Figure 9.5.6-9: Conducted susceptibility, common mode between signal reference and ground, 

transient and steady state, no accessible ground wire 

9.1.1.14 Radiated Emission Tests 


The suggested test set-up is as shown in Figure 9.5.6-10. The emission at the antenna at one metre distance 

from the test object, which gives the highest reading, shall be the Radiated Electric Field Emission (REE). Above 

30 MHz, the requirement shall be met for both horizontally and vertically polarised waves. The upper 

frequency range of the measurement shall be in accordance with the following Table 9.5.6-2. 

Tenth harmonic of highest operating frequency 

of equipment 

Required Upper Limit 

< 1 GHz 1 GHz 

> 1 GHz 18 GHz 

Table 9.5.6-2: Radiated E-Field Frequency Range for Emission Test 






DATE : 12/02/2004 

Figure 9.5.6-10: Radiated Emission E-Field Test 

ISSUE : 3.1 PAGE :9-62/63 

The Radiated Emission E-field in the notch defined to protect the spacecraft TC band shall be tested for all 

equipment involving high frequency (> 10 MHz) clocks or signals. 

9.1.1.15 Electro Static discharge ESD Tests 

Figure 9.5.6-11 contains a suggested arc source schematic capable of establishing the required discharge. 

The discharge circuit must be adjusted in order to get the energy and the voltage specified in paragraph 

5.14.3.11. 

Any other equivalent type of circuitry (e.g. ESD simulator) can be used and shall be fully described in the 

relevant plan. 



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DATE : 12/02/2004 

ISSUE : 3.1 PAGE :9-63/63 

Figure 9.5.6-11: Arc source schematic capable of generating the discharge 

A minimum of 10 discharges shall be performed. 

The discharge shall be a direct discharge of current through the equipment chassis and shall be generated by 

putting the tip of the gun in contact with the chassis or/and by moving it closer to the chassis until the 

discharge occurs 

9.1.7 Qualification to the Radiation Environment 

Although, it will not be possible to effectively demonstrate the compatibility of the design of the instruments 

and their units with the specified radiation environment, the design shall achieve the following requirements: 

− the components and their shielding shall be compatible with the requirements of the radiation 

environment such that neither Cumulative Effects (Dose / Displacement Damage) neither Single Event 

Effects will cause failures or produce unacceptable changes in performance, 

− components shall be qualified (either based on existing or new test data) to withstand twice the 

expected level of ionising Dose . Displacement Damage sensitivity shall be considered for optoelectronics 

− in the design there shall be included the tools necessary to restore the original performance of the 

detector systems (curing). It is highly recommended that detectors and associated electronics are 

exposed to a simulated radiation environment with the objectives of establishing preliminary curing 

procedures and determining realistic performance predictions. 

− Single Event Effects such as SEU (logic devices) or SET (linear bipolar devices and digital optocouplers) 

shall not result in failure propagation outside the instruments. 




10 MANAGEMENT, PROGRAMME, SCHEDULE 

10.1 General 


Date : 12/02/2004 

Issue : 3.1 PAGE : 10-1/19 

A major constraint of ESA’s Herschel/Planck programme is to implement a mission, which meets its 

scientific objectives within the defined financial envelope. In order to meet these constraints, it is ESA’s 

policy to minimise the spacecraft development risks by using as far as possible off the shelf hardware 

and to minimise the risks by following a properly phased design, development and verification 

programme. However, the programme may also be extremely vulnerable to potential payload 

problems. It is therefore essential that the PI adheres to the requirements established in this chapter. 

These requirements address: 

the management structure of the instrument team, to ensure that an efficient organisational 

structure is established which will perform the design, development and verification of the 

instrument within the constraints of the programme 

project control processes to ensure that the work to be performed is adequately scoped and 

scheduled, and that appropriate configuration management principles are implemented 

regular reviews and reporting to provide an assessment of the completion status of the instruments 

and early identification of potential risks which may impact the performance of the instruments, the 

satellite interfaces and resources, and the schedule of deliverables 

the definition of deliverables as a working basis for spacecraft development and implementation 

the Herschel/Planck programme baseline schedule to synchronise due dates of deliverables. 

10.2 Management 

10.2.1 ESA Responsibilities 

The overall management of the implementation and execution of the Herschel/Planck programme will 

be under the responsibility of the ESA Project Manager (PM) located at ESTEC, Noordwijk, The 

Netherlands. He will have overall responsibility for the implementation and execution of all technical 

and programmatic aspects including: 

- Spacecraft development, integration and test 

- Launch 

- Initial Orbit Phase 

- Spacecraft/Instrument Commissioning Phase 

The ESA PM will be directly supported in the execution of the programme by an ESA Project Office 

located at ESTEC. 

All scientific aspects of the programme will be co-ordinated by the ESA Herschel/Planck Project 

Scientists (PS’s), who are the formal interface for scientific matters. 

The ESA Space Science Department will be responsible for the Herschel/Planck scientific operations 

after successful completion of the Spacecraft/Instrument Commissioning Phase.

10.2.2 ESA Organisation 



Date : 12/02/2004 

Issue : 3.1 PAGE : 10-2/19 

Under the responsibility of the ESA PM, a formal ESA Project Office structure will be implemented, 

which will include the following disciplines: 

- System Engineering 

- Spacecraft Engineering 

- Payload Engineering 

- Overall Spacecraft Assembly, Integration and Verification 

- Mission Operations 

- Product Assurance 

Within the Payload Engineering, a group of engineers will be the interface on the ESA side between the 

Project Office and the Principal Investigator (PI) team, and will: 

- Co-ordinate with the Pl and his/her team on all matters pertaining to their instrument 

- control the programmatic and technical interfaces as defined in the (to be) approved Instrument 

Interface Documents (AD 04,05,06,07,08) 

- ensure that the Project Office is fully cognisant of the PI’s needs on the spacecraft and mission 

design 

- assist the PI’s from the Project Office’s side in resolution of technical or programmatic problems as 

appropriate, and pursue formal approval of possible changes 

- witness the pre-delivery acceptance tests of the instrument on behalf of the ESA using appropriate 

PI team expertise. 

10.2.3 Prime contractor Responsibilities 

The ESA intends to delegate to the Prime contractor the responsibility of the management of all 

technical interfaces of the payload with the spacecraft system including all margins and schedules. 

In the frame of its responsibilities, the Prime contractor will: 

• Design, produce and verify Herschel and Planck spacecraft in compliance with the ESA 

system requirements and; 

• Deliver in time a flight-worthy Flight Model for both spacecraft including the respective 

scientific instruments. 

As part of its tasks related to instrument interfaces, the Prime contractor and its industrial team will 

jointly : 

• Maintain (update & issue) the Instrument Interface Document (IID) part B, describing each 

instrument interface data to be used for the spacecraft design, manufacturing and 

verification, using inputs from each relevant instrument team and after agreement with the 

relevant PI, 

• Design, develop and verify both spacecraft in compliance with instrument interfaces as 

specified in each Instrument Interface Document (IID) part B, 

• Produce this Instrument Interface Document (IID) part A, describing each spacecraft 

interface data to be used for the instrument design, manufacturing and verification. 

These activities will be conducted under the supervision of the ESA and according to the rules defined in 

the ESA prime Contract. In particular, the Prime contractor with participation of the Instrument



Date : 12/02/2004 

Issue : 3.1 PAGE : 10-3/19 

Consortium shall directly manage, define, analyse, verify all technical interfaces (mechanical, thermal, 

electrical, optical, software, …) between the Instrument and the spacecraft in order to guarantee the 

compatibility of the instrument with the spacecraft and with the other instruments. 

Monitoring of the interfaces will be done via a close follow up of the instrument activities, and 

synchronisation with the satellites developments: technical meetings, teleconferences, exchange of 

technical documents, analyses of monthly report, reviews, … 

The agency will approve the IID-B / IID-A, ensure the compliance of these documents with the scientific 

objectives of the mission and manage the interfaces of the instruments with the ground segment. 

Industry responsibilities related to instrument interfaces are described in more details in RD10. 

10.2.4 Prime contractor Organisation related to instrument interfaces 

(refer to RD 91) 

PACS 

HIFI 

HIFI FPU 

SPIRE 

SPIRE FPU 

PACS FPU 

Herschel EPLM contractor: 

ASED 

Prime contractor Herschel - Planck : Alcatel 

Herschel EPLM 

Project Manager 

K;Moritz / W.Ruehe 

Payload engineering 

manager 

E.Hoelzle 

HIFI FPU 

Interfaces 

S.Idler 

SPIRE FPU 

Interfaces 

H.Faas 

PACS FPU 

Interfaces 

D.Schink 

Herschel / Planck 

Alcatel Project Manager 

J.J.Juillet 

Herschel 

Instruments 

Manager 

G.Doubrovik 

Instrument Interface 

Manager 

B.Collaudin 

Planck Instrument 

Manager 

J.P.Chambelland 

SVM contractor: Alenia 


SVM's Project 

Manager 

O.Tornani / P.Musi 

System Engineer 

M.Sias 

Instrument 

interface engineer 

Marco Cesa 

Figure 10.2.4-1 Prime contractor organisation related to Instrument interfaces 

10.2.5 Principal Investigator Responsibilities 

The PI shall represent the single point formal interface for the instrument with the ESA Project Office. It 

is the overall responsibility of the PI to ensure that the complete instrument programme is implemented 

and executed in a manner such that the science objectives are achieved within the mission constraints 

of the approved project. 

HFI 

LFI


Specifically the responsibility of the PI will include: 

10.2.5.1 Management 


Date : 12/02/2004 

Issue : 3.1 PAGE : 10-4/19 

- Taking full responsibility for the instrument at all times and retaining full authority within the 

instrument team over all aspects related to the procurement and execution of the instrument 

programme. In this context the PI shall be empowered to take commitments and make decisions on 

behalf of the other participants in the instrument team. 

- Establishing an efficient and effective managerial scheme to be utilised in all aspects of the 

instrument project. 

- Organising the efforts, assigning tasks and guiding other members of his/her team 

- The establishment, implementation, analysis and reporting of schedule network planning as 

required 

- Providing the formal managerial interface of the instrument to ESA Project Office and supporting 

ESA management requirements (e.g. Instrument progress reviews, Spacecraft and Mission Project 

reviews, Change procedures, Product Assurance etc.) as required. 

10.2.5.2 Scientific 

- Attending meetings of the Science Teams and supporting groups as appropriate and taking a full 

and active part in their work 

- Participation in Herschel/Planck workshops and scientific conferences 

- Publishing scientific results 

- Cooperation with other Herschel/Planck PIs, Guest Observers, Mission and Survey 

- Scientists, or other science colleagues in order to maximise the scientific return of the 

Herschel/Planck mission. 

10.2.5.3 Hardware 

- Defining functional requirements of his/her instrument and its ancillary equipment 

- Ensuring the development, construction, testing and delivery of the hardware associated with the 

instrument. This shall be in accordance with the scientific performance, technical and 

programmatic requirements in the (to be) approved IIDs (AD04, 05, 06, 07, 08) 

- Ensuring adequate scientific calibration of all parts of the instrument both on the ground and in 

orbit 

- Ensuring that the design and construction of necessary hardware, and its development and test 

programmes are appropriate to the objectives of his/her instrument, and reflect properly the 

environmental and interface constraints to which the hardware will be subjected during the 

complete mission 

- To ensure that all procured hardware is compliant with ESA requirements through participation in 

technical working groups and control boards as requested, to ensure system level compatibility to 

be maintained.

10.2.5.4 Software 



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Issue : 3.1 PAGE : 10-5/19 

- To ensure the development, testing and documenting of all software necessary for the control, 

monitoring, testing, operation and data retrieval of his/her instrument 

- To ensure the delivery of such software and its documentation to ESA or elsewhere, as requested in 

due time, to support each project phase such as Assembly, Integration, Verification (AIV), Launch 

and Flight Operations 

- To ensure that all instrument software that interfaces with the project is compliant with ESA 

requirements 

10.2.5.5 Documentation 

- Providing all required analysis and documentation as specified in the IIDs (AD 04,05,06,07,08). 

10.2.5.6 Product Assurance 

- Providing Product Assurance functions that are compliant with the requirements in AD 19. 

10.2.5.7 Data Processing and Dissemination 

- Ensuring that calibrated data of the instrument is made available in due time for payload 

operations and planning as agreed by the Herschel/Planck Science Teams. 

- Generation of retrieval and processing software that will ensure accessibility of the data generated 

by the instrument to Guest Observers and/or users of data banks. 

- Making data and scientific results available to ESA in a timely manner and in a form suitable for 

public relations purposes (also for general public) as and when required. 

- Provision of due acknowledgement to ESA in all published material 

10.2.6 Instrument Team Organisation 

The PI shall establish a detailed organisation chart for his/her team with defined named responsibilities 

clearly showing that all aspects of the instrument are efficiently covered by the appropriate expertise. 

Co-investigators shall be identified in the organisation chart. Managerially team members shall have 

no FORMAL interface with ESA and shall communicate formally to ESA via the PI. 

Key personnel, including technical Instrument Managers, should be identified within the management 

scheme together with a short description of their tasks and functions. 

10.2.7 Formal Communication 

10.2.7.1 Principal Investigators 

All FORMAL communication and agreements concerning technical and programmatic aspects shall be 

agreed between the PI, the Prime contractor PM and are to be approved of ESA PM.



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Issue : 3.1 PAGE : 10-6/19 

All formal communication and agreements concerning scientific aspects shall be made between the PI 

and the ESA PS. 

10.2.7.2 Communication with ESA Contractors 

All communication between PI’s and the Spacecraft Prime Contractor shall be conducted directly, with 

copy to the ESA Project Manager. 

10.2.7.3 Communication with ESA Departments 

Contacts with ESA departments concerning all non-scientific aspects of the instrument controlled by the 

PI/ESA agreement including post-launch activities shall be via the ESA Project Office. 

This does not apply for direct, separate contracts outside the PI/ESA agreement. 

10.2.8 Financing 

PI’s shall at all times be responsible for the funding arrangements of their instruments and the 

management thereof. 

PI’s shall not assume any funding from ESA for any part of their instrument. Should, for programmatic 

or technical reasons, a PI requests to use an ESA facility, then the use will be charged to the PI. 

This requirement shall apply up to the point of final acceptance of the instrument by ESA. 

10.3 Project Control 

10.3.1 Project Control Objectives 

In order to manage the overall Herschel/Planck programme, the Principal Investigator (PI) will 

implement project control systems and procedures focusing on the definition, maintenance and 

reporting of schedule, costs, and configuration information. 

The objective of this section is to clearly specify the management information required from each 

Instrument Team. Due to the importance of the instruments in the programme, it is critical that each PI 

supports this scheme with relevant schedule and configuration information. In case the Principal 

Investigator feels that the spirit of the requirement could be met by a more appropriate approach, he 

should propose alternatives which will be reviewed by ESA. 

10.3.2 Project Breakdown Structures 

In order to clearly identify the instrument, the scope of the work and the responsibilities involved, the 

following structures will be created by the Instrument Team: 

- the Product Tree (PT) to break down the instrument into its components, both hardware and 

software 

- the Work Breakdown Structure (WBS) to define the scope of the work and the responsibilities of the 

Co-I’s involved. 

- 

Product Tree:



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A Product Tree shall be developed by the PI, depicting a product oriented breakdown of the instrument 

into successive levels of detail. The Product Tree shall be submitted to ESA. 

Work Breakdown Structure: 

A Work Breakdown Structure shall be developed by the PI, based on its agreed Product Tree and 

extending the applicable elements to include appropriate development models and support functions 

necessary to produce all the deliverables. 

For each Work Package, the PI shall complete a Work Package Description (WPD). The PI shall ensure 

all the responsibilities assigned to manage or to perform all the Work Packages are identified in the 

instrument team organisation chart (see section 10.1). The WBS shall be submitted to ESA. 

10.4 Schedule Control 

10.4.1 Baseline Master Schedule 

The PI shall establish and submit to ESA, a Baseline Master Schedule covering all the instrument 

programme activities identified in the Work Breakdown Structure. 

All milestones specified by ESA, shall be included in the schedule and be agreed by the Instrument 

Team. The PI shall identify additional milestones as required and agree them with ESA. 

All interfaces, such as procurement items, hardware deliveries, reviews, etc. shall be clearly identified. 

The schedule shall reflect the result of detailed task analysis and critical review of all the activities 

associated with the instrument programme. It shall contain all activity interdependencies, durations and 

constraints. 

Directly from the Baseline Master Schedule, a set of bar charts shall be created, covering: 

- Overall instrument programme 

- Individual instrument models 

- Instrument model integration and testing 

- Detailed bar chart of critical activities 

Changes to the Baseline Master Schedule shall only be made with the approval of ESA. 

10.4.2 Schedule Monitoring 

The PI shall continuously record progress achieved and maintain forecasts. 

The PI shall consolidate the progress and forecasts of all groups contributing to the instrument and 

compare schedule performance with respect to the overall Baseline Master Schedule. 

Where deviations to the baseline have occurred or are predicted, the PI shall develop and implement 

corrective actions. 

10.4.3 Schedule Reporting 

In order to track the progress, the PI shall provide to the prime contractor and to ESA, the following 

schedule reports as part of the reporting procedure (see section 10.10): 

- on a monthly basis:



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- Quick Look Report 

- additionally, on a quarterly basis, progressed bar charts showing: 

- a summary of the whole instrument project 

- a summary of each constituent and each organisation 

- details of the next 6 months period. 

During the manufacture and test phases the frequency of schedule reports may be increased should the 

ESA judge progress to be critical. 

10.5 Configuration Management 

10.5.1 Objectives 

The objectives of Configuration Management are to establish: 

- a configuration identification baseline system which defines through approved specifications, 

interface documents and associated data the requirements for the instrument 

- a configuration control system which controls all the changes to the identified configuration of the 

instrument 

- a configuration accounting system which documents all changes to the baseline configurations, 

maintains an accurate record of configuration change incorporation, and ensures conformity 

between the end item As Built Configuration (ABCL) and its appropriate design and qualification 

identification (CIDL including waivers). 

10.5.2 Responsibilities 

The PI shall be responsible for managing the configuration of his/her instrument and the lower level 

products of which it consists. For this purpose, he shall set up the necessary organisation and means for 

satisfying the objectives and requirements of configuration management. 

The PI shall also impose configuration management requirements on contractors and suppliers as 

appropriate for the items being provided to the instrument. For this purpose, the PI shall ensure 

compatibility between his/her own configuration management and the one implemented by all other 

participants to his/her instrument programme. 

The PI shall be responsible for the implementation and operation of a Configuration Control Board 

(CCB) at his/her level. 

10.5.3 Configuration Identification 

The configuration baseline shall be established with respect to requirements, design and verification. 

The baseline shall include: 

- Instrument System Specification 

- Instrument System Support Specification 

- Interface Control Documents 

- Design Analysis documents 

- Design Specification



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- Drawings (Design and manufacturing) 

- Manufacturing Procedures 

- Alignment Plan 

- Parts, Materials and Process lists 

- Verification test plan. 

The configuration baseline shall be established and reviewed at each Instrument Review. It may also be 

established and reviewed as required at selected intermediate stages. 

The "as designed" baseline shall be finalised at the Instrument Hardware Design Review. Verification 

documents including design analyses and test reports shall make reference to the configuration status 

of the design or the hardware or software being evaluated. 

10.6 Configuration Control 

10.6.1 Instrument Internal Configuration Control 

As a Herschel/Planck part of the management structure, the PI shall set up a configuration control 

procedure for his/her instrument in such a manner that the status of all aspects of the instrument such 

as the design and manufacturing of hardware and development of software can be unambiguously 

defined at any time. 

The control procedure shall allow ESA, to conduct a configuration audit at any point in the programme 

in order to obtain the up-to-date status of the instrument. 

10.6.2 IID Configuration Control 

The requirements defined in the IID Part A and Bs (AD 04,05,06,07,08) will be subject to configuration 

control and shall reflect the up to date agreed configuration baseline between ESA, prime contractor 

and the PI. Changes to these documents shall be handled using the Engineering Change Request (ECR) 

form. Deviations from the requirements defined in IID A and B will be handled using the Request for 

Waiver (RFW) form. 

10.7 Configuration Status Accounting 

The current status of all configured documents shall be sent to ESA, as part of the reporting procedure 

required in section 10.10. 

Configuration Item Data Lists (CIDL) listing all the documents and their applicable issues and revisions 

which define the configuration baseline shall be prepared and submitted for each Instrument Review. 

The PI shall establish and maintain As Built Configuration Lists (ABCL) listing all the documents and 

their issues and revisions defining the as built configuration. 

Differences between the as designed baseline and the as built configuration list shall be identified for 

all qualification and flight hardware and software. The validity of all design verifications, including 

analyses and tests, shall be assessed for all the differences and modifications from the as designed 

baseline.

10.8 Reviews and reporting 

10.8.1 General 



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The technical and programmatic aspects of each instrument programme shall be assessed between 

ESA, and each Instrument Team through: 

- a cycle of formal Instrument Reviews 

- instrument progress meetings 

- regular progress reporting. 

The overall scientific performance shall be monitored by ESA, during the review cycle and through the 

regular progress reporting supplied by the PI. Detailed scientific aspects shall be reviewed within the 

context of the Herschel/Planck Science Teams, as defined in the Herschel/Planck Science Management 

Plans. 

Operations and data processing aspects shall be reviewed according to the Herschel and Planck 

SIRD’s. (AD 4-1 & 2) 

10.8.2 Instrument Reviews 

10.8.2.1 General 

There shall be six major reviews for each instrument selected for the Herschel/Planck mission. The 

reviews form part of the overall Herschel/Planck review programme. 

For each of the reviews, a review board will be set-up. The board will consist of ESA Personnel and will 

be chaired by the Herschel/Planck Payload Manager together with the Project Scientist or their 

designated representatives. 

The reviews shall be conducted by ESA, nominally at ESA premises. The objectives will be to ensure 

that: 

- The instrument design will be compatible for achieving the instrument performance. 

- The instrument design complies with the interface requirements of the Instrument Interface 

Documents (IID’s) 

- The scheduled delivery dates are compliant with the system level programme. 

The data package to be reviewed shall cover both the instrument hardware and software together with 

details of any other deliverables such as MGSE, EGSE, OGSE and documentation and shall be 

delivered to the ESA Project Team as a minimum twenty working days prior to the scheduled review 

date. 

The output of the review shall provide recommendations for consideration by the ESA Project Manager 

of the Principal Investigator in technical or programmatic areas. Either party shall provide a formal 

response to such recommendations within one month of review completion. 

Non-compliance with other system elements will be brought forward to the following system level 

review for resolution. 

Following the system level reviews the IID’s will be formally reissued to reflect the results of the review. 

It is realised that, aside the formal ESA reviews defined in this paper, instruments might want to conduct 

further instrument reviews, e.g. for internal monitoring of progress, request from funding agencies. In 

order to avoid duplication of effort combination of instrument internal and formal ESA reviews can be



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Issue : 3.1 PAGE : 10-11/19 

envisaged, as long as the objectives of both reviews match. For that reason it is planned to handle the 

below given dates for reviews in a flexible way, i.e. allowing a bandwidth of several months. 

The following Instrument Reviews shall be held: 

- the Instrument Science Verification Review (ISVR, end 1999 / early 2000 ) 

- the Instrument Intermediate Design Review (IIDR, end 2000 / early 2001) 

- the Instrument Baseline Design Review (IBDR, mid/end 2002) 

- the Instrument Hardware Design Review (IHDR, mid/end 2003) 

- the Instrument Critical Design Review (ICDR, mid/end 2004) 

- the Instrument Flight Acceptance Review (IFAR, date 3rd quarter 2006) 

In addition, Instrument Acceptance Reviews (IAR's) will be held at delivery of each of the instrument 

models. 

10.8.2.2 Instrument Science Verification Review (ISVR) 

It shall be conducted after instrument selection, in preparation for the release of the ITT for S/C 

development. 

The objectives of the review shall be to demonstrate that: 

- the instrument conceptual design has been finalised/ i.e. is compatible for achieving the 

instrument performance 

- the instrument design will achieve the anticipated science objectives 

- the overall interface requirements definition has been finalised 

- the conceptual design for on-board software has been finalised 

- the conceptual design for the necessary MGSE, EGSE and OGSE has been finalised. 

10.8.2.3 Instrument Intermediate Design Review (IIDR) 

It shall be conducted at the time of Prime Contractor selection. 

The objectives of the review shall be to demonstrate that: 

- the instrument detailed system design has been finalised 

- the instrument subsystem design has been finalised 

- the detailed interface requirements have been finalised 

- the design for the on-board software has been finalised (User Requirements Document) 

- the design of the necessary MGSE, EGSE and OGSE has been finalised. 

10.8.2.4 Instrument Baseline Design Review (IBDR) 

It shall be conducted in preparation for the S/C SRR. 

The objectives of the review shall be:


- the freeze of instrument system and subsystem requirements 


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- the freeze of the on-board software requirements (Software Requirements Documents) 

- the release for manufacture of instrument Avionics Model (AVM) and Cold Qualification 

Model (CQM) 

- the freeze of the MGSE, EGSE and OGSE design 

- the release for manufacture of the MGSE, EGSE and OGSE. 

10.8.2.5 Instrument Hardware Design Review (IHDR) 

It shall be conducted in preparation for the S/C AVM/CQM phase. 

The objectives of the review shall be: 

- the assessment of the instrument AVM/CQM programme 

- acceptance of the AVM/CQM models for spacecraft system level 

- the acceptance and freeze of the on-board software (Architectural Design Document) 

10.8.2.6 Instrument Critical Design Review (ICDR) 

It shall be conducted towards the end of the industrial phase C, in preparation for the S/C CDR, after 

release of the AVM/CQM test reports. 


- the assessment of the results of the instrument level tests of the AVM/CQM 

- the assessment of the results of qualification on instrument unit and subsystem level 

- the confirmation of instrument Flight Model Design, its Instrument Users' Manual and the 

on-board software Detailed Design Document. 

10.8.2.7 Instrument Flight Acceptance Review (IFAR) 

This review shall be conducted after completion of the spacecraft system level FM electrical verification 

including on-line compatibility tests with the respective flight operations centres and shall precede the 

programme level Flight Acceptance Review. 


- the assessment of the results of the system level FM testing with respect to the instrument 

- the assessment of the completion of qualification of instrument units and subsystems 

- the update of the Instrument Users' Manual as required 

- the close out any outstanding issue. 

10.9 Instrument Progress Meetings 

Regular Instrument Progress Meetings shall be held nominally on the premises of the PI’s during the 

design, development and verification programme of the instrument.



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These meetings will be conducted between ESA, the Prime Contractor and each Instrument Team with 

the objective of ensuring that the interface technical design integrity of the instrument, its compatibility 

with the spacecraft system, and instrument programmatics are proceeding in a manner which will not 

jeopardise the overall programme. 

The Instrument Team shall be represented by the necessary team to provide the required information, 

i.e. by the PI, the CO-Is, the Instrument Manager and the Local Project Managers as necessary. 

The meetings shall be held on a quarterly basis. The frequency may be changed on request of ESA. 

Detailed technical problems occurring on either side of the interface shall be flagged during these 

meetings and corrective actions, including their schedule impact, agreed and implemented. 

10.10 Reporting 

The Principal Investigator shall submit to the Prime contractor and to ESA, 5 days after the end of the 

month, a Monthly Progress Report in which the current status of each activity is described and problem 

areas or potential problem areas are highlighted together with identification of proposed remedial 

action. 

The Monthly Progress Report shall include the following topics: 

- Overall summary 

- Design Development and Verification status 

- PA status 

- Programmatic status, including schedule reports 

- Science Performance status 

- Problem areas and corrective actions. 

The Monthly Progress Reports submitted will be analysed in conjunction with the overall spacecraft 

programme by the prime contractor and ESA, and will serve as input to the regular Instrument Progress 

Meetings. By this monitoring action early alerting to potential conflicts will be communicated back to 

the PI. In the case of major conflicts ESA and the prime contractor, may call for special schedule 

meetings to resolve the issue. 

10.11 Deliverable Items 

10.11.1 Mathematical Models 

The PI shall deliver a Structural Mathematical Model (SMM) ,a Thermal Mathematical Model (TMM), an 

optical model, and a straylight model of his/her instrument units. These instrument mathematical 

models shall be updated as the design progresses. They will serve as input to the spacecraft 

mathematical models. 

10.11.2 Instrument Models 

10.11.2.1 General 

The PI shall deliver the instrument models as defined in section 9.2:



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Issue : 3.1 PAGE : 10-14/19 

Warm Electronic Units: 

After the delivery of the PFM and for the duration of its testing, the AVM shall stay with the PFM for 

immediate replacement in the case of a failure in a PFM unit for which only spare subassemblies are 

available. The failed PFM shall be reparable within a period of 30 calendar days. 

FPU/LOU/ Coolers: 

For all units where CQM units will be refurbished as flight spares (see para 9.2.1.2), the CQM/FS units 

will be returned after test to the instrument team and shall be delivered at the defined date. 

Each delivery shall include, as appropriate, instrument hardware, on-board software and ground 

support equipment. Each item delivered shall be accompanied by an 

End Item Data Package. 

Prior to delivery, each item shall undergo formal acceptance on the basis of mutually agreed 

acceptance programme witnessed by engineers from ESA, and the spacecraft Prime Contractor. 

This acceptance shall include as a minimum the formal verification of all interfaces between the 

instrument and spacecraft together with review of all applicable test reports and supporting analyses 

and documentation. 

Shipment of the instrument models and any other equipment required by either ESA or the PI, shall be 

the financial responsibility of the PI. This responsibility shall extend to return for repair and return of all 

equipment following launch. 

The points of delivery of all items will be determined later in the programme and be included in this 

document. 

Any insurance deemed necessary by the Principal Investigator for his/her equipment during shipment or 

whilst on the premises of ESA, its Contractors or on the launch site, shall be the financial responsibility 

of the Principal Investigator. 

10.11.2.2 Instrument Hardware 

The build standard of each model shall be defined in IID-B and agreed with ESA. 

The PFM and the FS shall be fully calibrated before delivery. 

The PI shall support the system level integration and test activities as well as the launch preparation by 

supplying the GSE and the appropriate manpower and expertise. 

10.11.2.3 On-board Software 

The instrument on-board software shall be delivered together with the corresponding instrument model. 

The on-board software shall either reside in the instrument in a non volatile memory or be delivered in 

a format such that it can be loaded through the spacecraft telecommand up-link. 

In addition to the flight software, special test software for instrument diagnostics and failure 

investigation may be required. 

The on-board software to be delivered shall comply with the ESA software standard AD 14 and its 

guide to implementation. 

The PI remains responsible for the maintenance of the instrument software after delivery up to the end 

of mission. He shall support the verification of updated instrument software at system level.


10.11.2.4 Ground Support Equipment 


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Issue : 3.1 PAGE : 10-15/19 

The PI shall deliver the following ground support equipment together with each instrument model: 

- Mechanical Ground Support Equipment (MGSE) necessary to transport, handle and integrate 

instrument hardware together with appropriate documentation and proof load and calibration 

certificates, 

- Electrical Ground Support Equipment (EGSE) necessary to stimulate the instrument and to perform 

quick look analysis of instrument TM during system tests. It shall be designed such that it can be 

integrated into the system EGSE set-up. The instrument EGSE software to be delivered with the 

EGSE equipment shall comply with the ESA software standard AD14. 

The instrument ground support equipment shall remain at the spacecraft integration site until launch. 

However, the PI remains responsible for the maintenance of this equipment. 

The PI shall also provide the necessary manpower and expertise support to integrate the instrument 

EGSE into the system EGSE. 

10.12 Review Data Packages 

A data package shall be provided for each of the scheduled Instrument reviews, detailed above. The 

package shall be delivered to the ESA Project Team in electronic form (PDF-file). 

The packages shall contain the following information to the appropriate level (system, subsystem, unit) 

as required by the objective of the review and shall be adapted to each specific review. In order to 

avoid duplication of effort, the project is prepared to discuss and accept on a case by case basis 

different ways to provide the required information, i.e. either in a self-standing document package 

(preferred way) or distributed among instrument generated documents and technical notes with a guide 

identifying the location of the information. 

Instrument Description Document: 

- A description of the current instrument design, its expected performance and interfaces 

Instrument Interface Document(s): 

- The IID-B updated to the current status 

Development Plan/AIV: 

Test reports: 

User Manual: 

- A New/critical technologies demonstration plan 

- The Instrument Development and Verification plan 

- Integration Plan and Procedures 

- Test reports of environmental and functional tests, which demonstrate that the objectives of 

the instrument development, scheduled for the time of the review, have been met 

- The User Manual

Product Assurance: 

Schedule: 

Management: 



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Issue : 3.1 PAGE : 10-16/19 

- Product Assurance documentation as required in the Product Assurance Requirements for 

the Herschel/Planck instruments 

- Schedule network and bar-chart together with an assessment of progress and problem 

areas covering all aspects of the instrument and associated equipment 

- Management Plan 

Ground Support Equipment: 

Software: 

Notes: 

- Electrical ground support equipment, design, development and verification status including 

both hardware and software 

- Mechanical ground support equipment, design, development and verification status 

- Optical ground support equipment, design, development and verification status. 

- Onboard software (OBSW) – URD, SRD, ADD, DDD 

- GSE’s, e.g. s/c simulator 

- Technical notes, covering any topic or analysis which is either required by the IID or has 

been requested by the ESA Project Team 

10.13 Baseline schedule 

10.13.1 Overall Herschel/Planck Baseline Schedule 

The overall baseline schedule for Herschel/Planck is given on next page. 

10.13.2 Baseline Schedule of Deliverables 

The baseline schedule for all deliverables is given in Table 10.13.2-1 

Deliverable item Need/Delivery Date 

Herschel AVM (involved in QM test) 13 May 2004 

Herschel CQM 3 May2004 

Return Herschel CQM to PI (1 year after delivery by PI’s)


Herschel PFM 3 May2005 

Herschel FS 1 Jan 2006 

AVMs not involved in QM test (LFI, SCE, 

HIFI) 


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Issue : 3.1 PAGE : 10-17/19 

1 March 2005 

Planck HFI CQM 13 April 2004 

Return Planck CQM to PI warm electronics are kept for AVM tests, 

the rest returns for FS upgrade 1 year 

after delivery 

Planck PFM 31 Jan 2005 

Planck FS 1 Jan 2006 

Note: LFI QM is not delivered, and replaced by a MTD (mass & thermal dummy) provided by Alcatel. 

Special agreement for Planck Sorption cooler 

Sorption Cooler Need/Delivery Date 

CQM PACE (simulates redundant cooler 

ie +Y side) + Cryoharnesses (JPL & ISN) 

1 March 2004 

FM1 & FM2 SCS (TMU + SCE) 15 Feb 2005 

Note: Sorption cooler compressors for the QM tests are provided by Alcatel: PGSE for the PPLM 

cryogenic test, and MTD’s for the SVM thermal test and system mechanical test 

Table 10.13.2-1: Baseline Schedule of Instrument Deliverables


Planck Satellite 


Date : 12/02/2004 

Issue : 3.1 PAGE : 10-18/19 

ASPI 

Update 9th July 2003 

2002 2003 2004 2005 2006 

N D J F M A M J J A S O N D J F M A M J J A S O N D J F M A M J J A S O N D J F M A M J J A S O N D 

SVM STM AIT (Alenia) 

Planck CQM/SM 

RFQM 

SVM FM AIT (Alenia) 

Planck FM 

21/05 08/09 

STM AIT Transportation to test facility 

09/09 25/11 

Thermal Balance (Alenia at Estec) & NO Shocks test/Shogun Transportation to Alcatel 

01/03 

PACE CQM 

03/05 

HFI QM 

01/03 24/03 

SVM dummy SVM dummy preparation 

30/03 28/04 

Cryostructure QM Telescope & baffle QM 

03/05 17/09 

CQM assembly 

19/07 

CSL available 

28/02 

LFI and SCE AVM 

03/01 16/03 

SM Integration 

20/09 24/12 17/03 30/05 

CSL Thermal tests Mechanical tests 

22/12 

SVM Batch 1 

22/10 

Cryo-structure FM 

03/05 

02/01 

CQM to PI except WU (need date) Instruments FS 

11/01 

WUs for AVM Dismounting 

17/06 09/11 

RFQM (TBD) 

08/12 16/09 

SVM FM AIT 

31/01 

PFM instruments 

15/02 

SCC FMs 

01/04 

Batch 2 

08/02 

Telescospe struct.FM 

16/09 

Batch 3 

15/02 26/07 25/08 25/10 

FM WU preparation & assy & full integration 

IST1, RF, EMC & SVT 1 tests 

27/07 24/08 

FM S/C end of integration (ALS with ASP support DURATION TBC) 

26/10 10/02 

Mechanical tests 

13/02 15/08 

CSL thermal tests (2 config.) 

Figure 10.13-1: Planck Schedule 

16/08 03/10 

IST2 / (SVT2 shifted was 10d) Del.


Herschel EPLM & Satellite 


Date : 12/02/2004 

Issue : 3.1 PAGE : 10-19/19 

ASPI 

Update 11th July 2003 

2002 2003 2004 2005 2006 

N D J F M A M J J A S O N D J F M A M J J A S O N D J F M A M J J A S O N D J F M A M J J A S O N D 

Herschel PLM EQM 

13/05 

AVM's (involved in QM test) 

07/01 

WU need date 

31/07 

ISO refurbisht / prep. & assy 

01/08 24/10 

Integration AXT & Closure 

15/10 16/01 

EQM early training phase 

03/05 

CQM's 

SVM STM AIT (Alenia) STM AIT 

H-EPLM & Satellite Qualification 

07/06 

Cryo Unit need date 

24/03 13/09 

Final integration PLM 

23/12 15/09 

Integration PLM PFM 

16/09 18/10 

PLM Level Qualification Test 

02/05 

CQM FPUs return to PIs 

02/09 14/03 

EQM Test phase 

30/11 

Delivered to ASED 

19/10 31/05 

STM sat. Integr., Qualif. & TV/TB test 

SVM FM AIT (Alenia) FM AIT 

H-EPLM & Satellite Acceptance 

17/02 

WU panels del. to ASED 

22/03 

AVM's and EGSE available for AVM campaign 

03/05 

FM's 

31/01 

Cryo. Units need date 

31/01 

WU need date 

16/11 07/04 

FM EGSE & WU int. 

17/01 

Delivered to ASED 

02/01 

Instr. FS 

16/06 23/09 

FM Cryo Unit Integration & PLM FM Completion 

26/09 16/12 

PLM FM acceptance tests 

16/12 14/02 

PFM Satellite Integration 

15/02 29/09 

PFM Sat. Acceptance Tests Del. 

Figure 10.13-2: Herschel Schedule

iida - section 5 - Research Services

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