25.07.2013 Views

Experiments with Supersonic Beams as a Source of Cold Atoms

Experiments with Supersonic Beams as a Source of Cold Atoms

Experiments with Supersonic Beams as a Source of Cold Atoms

SHOW MORE
SHOW LESS

Create successful ePaper yourself

Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.

that they can be prepared ex-situ and will remain clean enough to still reflect helium<br />

well. The crystal chosen for this experiment, is hydrogen p<strong>as</strong>sivated Si(111). Lithium<br />

fluoride w<strong>as</strong> also examined <strong>as</strong> a possible crystal substrate, and the details <strong>of</strong> this<br />

examination may be found in [55].<br />

To use Si(111) <strong>as</strong> an atomic mirror which is prepared ex-situ, thecrystalmust<br />

be p<strong>as</strong>sivated. A freshly cleaved Si(111) surface will have dangling bonds and the<br />

surface will not be p<strong>as</strong>sive enough to keep contaminants from sticking to the surface.<br />

By wet etching the surface, the dangling bonds are terminated <strong>with</strong> hydrogen, which<br />

p<strong>as</strong>sivates the surface, resulting in Si(111)-(1×1)H [56, 57]. The mirrors are created<br />

from phosphor doped 200μm thick wafers <strong>with</strong> a pre-existing oxide layer and a miscut<br />

angle <strong>of</strong> ±0.1 ◦ acquired from Virginia Semiconductor. The 100 mm diameter waferes<br />

were pre-cut into smaller circles [58], but the cutting process scratched the crystal<br />

surfaces and rendered the area <strong>with</strong>in 2 mm <strong>of</strong> a cut unusable. The wafers are cut to<br />

their final size for etching and insertion into the vacuum chamber by a dicing saw,<br />

removing the damaged regions. The wet etching process used to create this surface<br />

is now described.<br />

3.2.2 Crystal Preparation and Wet Etching<br />

To produce an atomically flat p<strong>as</strong>sivated Si surface, the crystal must first be<br />

cleaned <strong>as</strong> much <strong>as</strong> possible to remove contaminants, especially organic residues. The<br />

procedure described below is b<strong>as</strong>ed on suggestions from the group <strong>of</strong> Dr. Ken Shih at<br />

The University <strong>of</strong> Tex<strong>as</strong> at Austin, and the group <strong>of</strong> Dr. Bill Allison at the Cavendish<br />

Lab in Cambridge [57]. All chemicals used are LP grade or better, and the ammonium<br />

fluoride is MB grade. Additionally, any water used in the procedure is ultra pure and<br />

h<strong>as</strong> a resistivity <strong>of</strong> greater than 17 MΩ cm. Finally, all beakers, bottles, containers,<br />

and tools used to handle the wafers or in contact <strong>with</strong> the chemicals are made <strong>of</strong><br />

26

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!