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FIB cross-sectioning Using a 30 kV Ga + ion beam pairs <strong>of</strong> trenches are cut into grain surfaces leaving an electron-transparent (~100 nm thick) slice:
FIB cross-sectioning Using a 30 kV Ga + ion beam pairs <strong>of</strong> trenches are cut into grain surfaces leaving an electron-transparent (~100 nm thick) slice:
Page 1 and 2: High-resolution characterization of
Page 3 and 4: Models for feldspar weathering
Page 5 and 6: Models for feldspar weathering
Page 7: Our approach: 100 nm thick cross-se
Page 11 and 12: FIB milling artifacts Modeling show
Page 13 and 14: Shap alkali feldspars: Reactive sit
Page 15 and 16: Shap alkali feldspars: Etch pit net
Page 17 and 18: Shap alkali feldspars: Microstructu
Page 19 and 20: Glen Feshie alkali feldspars Most g
Page 21 and 22: Glen Feshie feldspars: Weathering p
Page 23 and 24: Glen Feshie (1.1 kyr soil): Reconst
Page 25: Conclusions The FIB-TEM technique

presentation (pdf) - University of Glasgow

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