- Page 1 and 2: Virtex-II Platform FPGA User Guide
- Page 3 and 4: Contents About This Guide Additiona
- Page 5 and 6: Capacity...........................
- Page 7 and 8: R About This Guide Additional Resou
- Page 9 and 10: Virtex-II Platform R Introduction t
- Page 11 and 12: R Timing Models Summary Introductio
- Page 13 and 14: Timing Parameters Parameter Functio
- Page 15 and 16: Slice Distributed RAM Timing Model
- Page 17 and 18: Figure 1-4 illustrates the timing c
- Page 19 and 20: Timing Parameters Parameter Functio
- Page 21: Block SelectRAM Timing Model Introd
- Page 25 and 26: Table 1-1: Multiplier Switching Cha
- Page 27 and 28: IOB Timing Model Introduction This
- Page 29 and 30: Parameter Function T IOPICKD/T IOIC
- Page 31 and 32: IOB Output Timing Model and Paramet
- Page 33 and 34: Figure 1-18 illustrates IOB DDR out
- Page 35 and 36: Parameter Function T IOTCECK/T IOCK
- Page 37 and 38: Pin-to-Pin Timing Model Introductio
- Page 39 and 40: Global Clock Setup and Hold Figure
- Page 41 and 42: Digital Clock Manager Timing Model
- Page 43 and 44: Input Clock Tolerances Timing Param
- Page 45 and 46: The waveforms in Figure 1-27 demons
- Page 47 and 48: R Design Considerations Summary Int
- Page 49 and 50: DCM BRAM Multiplier BRAM Multiplier
- Page 51 and 52: Global Clock Inputs The clock buffe
- Page 53 and 54: Primary/Secondary: Rule 2 In a BUFG
- Page 55 and 56: IBUFG DCM DCM DCM 4 4 4 BUFGMUX GCL
- Page 57 and 58: CLK_A is used in three quadrants, a
- Page 59 and 60: BUFGMUX is the preferred circuit fo
- Page 61 and 62: This means the output stays Low whe
- Page 63 and 64: component BUFGMUX port ( I0 : in st
- Page 65 and 66: -architecture BUFGCE_1_SUBM_arch of
- Page 67 and 68: Using Digital Clock Managers (DCMs)
- Page 69 and 70: Input Clock Requirements The clock
- Page 71 and 72: Port Signals Source Clock Input —
- Page 73 and 74:
Submodules clk_in clko_w clk1x CLKI
- Page 75 and 76:
Figure 2-28: Frequency Synthesis Ou
- Page 77 and 78:
Frequency Mode for Frequency Synthe
- Page 79 and 80:
Two separate components of the phas
- Page 81 and 82:
PSINCDEC => ’0’, RST => rst, CL
- Page 83 and 84:
Port Signals 1x Clock Outputs — C
- Page 85 and 86:
Locked Output — LOCKED The LOCKED
- Page 87 and 88:
Table 2-9: DCM Attributes Summary o
- Page 89 and 90:
VHDL Template -- Module: BUFG_CLK0_
- Page 91 and 92:
BUFG Instantiation // BUFG U_BUFG (
- Page 93 and 94:
Figure 2-41: DCM_DFS Waveforms The
- Page 95 and 96:
Using Block SelectRAM Memory Introd
- Page 97 and 98:
READ_FIRST or Read-Before-Write Mod
- Page 99 and 100:
Characteristics Library Primitives
- Page 101 and 102:
VHDL and Verilog Instantiation Port
- Page 103 and 104:
Table 2-13: Port Address Mapping Po
- Page 105 and 106:
Applications Creating Larger RAM St
- Page 107 and 108:
-- Output value after configuration
- Page 109 and 110:
); -- -- Use of the free inverter o
- Page 111 and 112:
INITP_04 "0000000000000000000000000
- Page 113 and 114:
Write Operations The write operatio
- Page 115 and 116:
VHDL and Verilog Instantiation Port
- Page 117 and 118:
and write. The second slice impleme
- Page 119 and 120:
VHDL and Verilog Templates VHDL and
- Page 121 and 122:
Verilog Template // // Module: Sele
- Page 123 and 124:
Shift Operation The shift operation
- Page 125 and 126:
Add. 5 A4 A3, A2, A1, A0 D D 4 A[3:
- Page 127 and 128:
Location Constraints Each CLB resou
- Page 129 and 130:
Figure 2-61: Fully Synchronous Shif
- Page 131 and 132:
-- Architecture Section: -- -- Attr
- Page 133 and 134:
Figure 2-64 shows the relative posi
- Page 135 and 136:
The slice S3 of each CLB has a MUXF
- Page 137 and 138:
Library Primitives and Submodules P
- Page 139 and 140:
end MUX_16_1_SUBM; architecture MUX
- Page 141 and 142:
4’b1100 : DATA_O
- Page 143 and 144:
4 4 4 4 LUT LUT LUT LUT MUXCY MUXCY
- Page 145 and 146:
AND_LOGIC_inst : AND_LOGIC port map
- Page 147 and 148:
Verilog Templates // Module : AND_C
- Page 149 and 150:
Using Embedded Multipliers Introduc
- Page 151 and 152:
Table 2-28: Embedded Multiplier Sub
- Page 153 and 154:
Inequality Conditions for Two Multi
- Page 155 and 156:
VHDL Template: -- Module: SIGNED_MU
- Page 157 and 158:
all of the supported single-ended I
- Page 159 and 160:
Library Symbols IBUF The Xilinx lib
- Page 161 and 162:
OBUF An OBUF must drive outputs thr
- Page 163 and 164:
Table 2-35 details variations of th
- Page 165 and 166:
Table 2-36: Variations of the IOBUF
- Page 167 and 168:
IOBUF), the desired drive strength
- Page 169 and 170:
Table 2-37: Guidelines for Max Numb
- Page 171 and 172:
Table 2-37: Guidelines for Max Numb
- Page 173 and 174:
GTL GTL + A sample circuit illustra
- Page 175 and 176:
HSTL Class II Figure 2-87 shows a s
- Page 177 and 178:
HSTL Class I (1.8V) Figure 2-90 sho
- Page 179 and 180:
HSTL Class IV (1.8V) Figure 2-93 sh
- Page 181 and 182:
SSTL2_I Table 2-50 lists DC voltage
- Page 183 and 184:
PCI33_3, PCI66_3, and PCIX LVTTL Ta
- Page 185 and 186:
LVCMOS25 Table 2-57 lists DC voltag
- Page 187 and 188:
Using Digitally Controlled Impedanc
- Page 189 and 190:
Termination to V CCO (Single Termin
- Page 191 and 192:
Driver With Single Termination Some
- Page 193 and 194:
Software Support This section lists
- Page 195 and 196:
The following are DCI I/O buffer li
- Page 197 and 198:
dout_intdout_int(1), O=>dout(1)); U
- Page 199 and 200:
Conventional DCI Transmit Conventio
- Page 201 and 202:
Figure 2-110 provides examples illu
- Page 203 and 204:
CLK0 and CLK1 are 180 degrees out o
- Page 205 and 206:
Both registers share the SET/PRE an
- Page 207 and 208:
All four registers share the SET/PR
- Page 209 and 210:
Port Signals FDDRRSE Data inputs -
- Page 211 and 212:
egin q1reg : process (clk, d, rst)
- Page 213 and 214:
Q : out std_logic; D0 : in std_logi
- Page 215 and 216:
egin if tri = ’1’ then data_out
- Page 217 and 218:
Figure 2-119: LVDS Input and Clock
- Page 219 and 220:
signal. Figure 2-122 illustrates a
- Page 221 and 222:
LDT Verilog Instantiation Port Sign
- Page 223 and 224:
LVPECL Receiver Termination All LVP
- Page 225 and 226:
Using Bitstream Encryption What DES
- Page 227 and 228:
encryption. When the KeyFile option
- Page 229 and 230:
Using the CORE Generator System Int
- Page 231 and 232:
A parameterized Verilog or VHDL beh
- Page 233 and 234:
A complete catalog of Xilinx cores
- Page 235 and 236:
LogiCORE products are continuously
- Page 237 and 238:
Table 2-65: Virtex-II IP Cores Supp
- Page 239 and 240:
Table 2-65: Virtex-II IP Cores Supp
- Page 241 and 242:
Table 2-65: Virtex-II IP Cores Supp
- Page 243 and 244:
Table 2-65: Virtex-II IP Cores Supp
- Page 245 and 246:
R Configuration Summary Introductio
- Page 247 and 248:
Table 3-2 lists the total number of
- Page 249 and 250:
Power Up The V CCINT power pins mus
- Page 251 and 252:
Device Startup Device startup is a
- Page 253 and 254:
If V CCO is less than 3.3V on banks
- Page 255 and 256:
Boundary Scan Flash The ACE Control
- Page 257 and 258:
Configuration PROMs Using XC18V00 P
- Page 259 and 260:
Embedded Solutions Using an Embedde
- Page 261 and 262:
Master Serial Programming Mode In s
- Page 263 and 264:
synchronization word. Nothing of th
- Page 265 and 266:
CCLK Data Loading The CCLK pin is a
- Page 267 and 268:
RDWR_B CS_B BUSY CCLK When asserted
- Page 269 and 270:
Controlled CCLK Some applications r
- Page 271 and 272:
TCK - This pin is the JTAG test clo
- Page 273 and 274:
Boundary-Scan Architecture Virtex-I
- Page 275 and 276:
Virtex-II Identification Register T
- Page 277 and 278:
cap0 SHIFT cap1 cap2 TDI SEL1 0 1 D
- Page 279 and 280:
Users seeking to implement a Virtex
- Page 281 and 282:
Multiple Device Configuration It is
- Page 283 and 284:
1. Move the TAP to TLR state. 2. Go
- Page 285 and 286:
Clocking Startup and Shutdown Seque
- Page 287 and 288:
TAP Instr. ISC_Enabled ISC_Done End
- Page 289 and 290:
Table 3-16: Internal Configuration
- Page 291 and 292:
address after writing each frame fo
- Page 293 and 294:
Table 3-21: Configuration Register
- Page 295 and 296:
Packet Header Bits[31:0] Type 1 Pac
- Page 297 and 298:
Readback 0 1 A CRC Reset resets all
- Page 299 and 300:
START Load JSHUTDWN RTI minimum 12
- Page 301 and 302:
Using ChipScope ILA The ChipScope I
- Page 303 and 304:
R PCB Design Considerations Summary
- Page 305 and 306:
Table 4-1: Virtex-II Pin Definition
- Page 307 and 308:
Table 4-2: FG256 BGA — XC2V40, XC
- Page 309 and 310:
Table 4-2: FG256 BGA — XC2V40, XC
- Page 311 and 312:
Table 4-2: FG256 BGA — XC2V40, XC
- Page 313 and 314:
Pinout Diagrams This section contai
- Page 315 and 316:
FG256 Fine-Pitch BGA Composite Pino
- Page 317 and 318:
FG256 Dedicated Pins A B C D E F G
- Page 319 and 320:
FG456 Fine-Pitch BGA Composite Pino
- Page 321 and 322:
FG456 Dedicated Pins FG456 - Top Vi
- Page 323 and 324:
FG676 Fine-Pitch BGA Composite Pino
- Page 325 and 326:
FG676 Dedicated Pins A B C D E F G
- Page 327 and 328:
BG575 Standard BGA Composite Pinout
- Page 329 and 330:
BG575 Dedicated Pins A B C D E F G
- Page 331 and 332:
BG728 Standard BGA Composite Pinout
- Page 333 and 334:
BG728 Dedicated Pins BG728 - Top Vi
- Page 335 and 336:
FF896 Flip-Chip Fine-Pitch BGA Comp
- Page 337 and 338:
FF896 Dedicated Pins FF896 - Top Vi
- Page 339 and 340:
FF1152 Flip-Chip Fine-Pitch BGA Com
- Page 341 and 342:
FF1152 Dedicated Pins FF1152 - Top
- Page 343 and 344:
Bank 2 (144 User I/Os) Bank 3 (144
- Page 345 and 346:
FF1517 Dedicated Pins FF1517 - Top
- Page 347 and 348:
BF957 Flip-Chip BGA Composite Pinou
- Page 349 and 350:
BF957 Dedicated Pins BF957 - Top Vi
- Page 351 and 352:
FF896 - FF1152 Pinout Compatibility
- Page 353 and 354:
Package Specifications This section
- Page 355 and 356:
FG256 Fine-Pitch BGA Package (1.00
- Page 357 and 358:
FG676 Fine-Pitch BGA Package (1.00
- Page 359 and 360:
BG728 Standard BGA Package (1.27 mm
- Page 361 and 362:
FF1152 Flip-Chip Fine-Pitch BGA Pac
- Page 363 and 364:
BF957 Flip-Chip BGA Package (1.27 m
- Page 365 and 366:
Thermal Data Thermal Considerations
- Page 367 and 368:
Printed Circuit Board Consideration
- Page 369 and 370:
Impedence (Ohms) 10 1 0.1 10 100 Fr
- Page 371 and 372:
Virtex-II devices offer digitally c
- Page 373 and 374:
Board Routing Strategy The diameter
- Page 375 and 376:
Using premium board technology, suc
- Page 377 and 378:
Figure 4-51: FG256 Routing With LVD
- Page 379 and 380:
Figure 4-53: FG456 Routing With LVD
- Page 381 and 382:
Figure 4-55: FG676 Routing With LVD
- Page 383 and 384:
Figure 4-57: BG575 Routing With LVD
- Page 385 and 386:
Figure 4-59: BG728 Routing With LVD
- Page 387 and 388:
48 UG002 (v1.4) 1 November 2002 www
- Page 389 and 390:
UG002 (v1.4) 1 November 2002 www.xi
- Page 391 and 392:
Figure 4-65: FF1517 Routing With LV
- Page 393 and 394:
Figure 4-67: BF957 Routing With LVD
- Page 395 and 396:
The Virtex-II power estimator allow
- Page 397 and 398:
Block SelectRAM Power Table 4-8 sho
- Page 399 and 400:
Registered Multiplier Power Data en
- Page 401 and 402:
Estimated Total Power This section
- Page 403 and 404:
IBIS File Structure An IBIS file co
- Page 405 and 406:
U(A0) Virtex-II LVTTL12F_0 U(A0) Vi
- Page 407 and 408:
BSDL and Boundary Scan Models BSDL
- Page 409 and 410:
R Application Notes Appendix A This
- Page 411 and 412:
: provides parameterizable Verilog
- Page 413 and 414:
R Appendix B BitGen and PROMGen Swi
- Page 415 and 416:
: BitGen Options MSK file—an opti
- Page 417 and 418:
: M2Pin This option selects an inte
- Page 419 and 420:
: -h or -help (Command Usage) -h ar
- Page 421 and 422:
: Bit Swapping in PROM Files PROMGe
- Page 423 and 424:
: Examples -r (Load PROM File) -r p
- Page 425 and 426:
R XC18V00 Series PROMs Appendix C T
- Page 427 and 428:
: SO20 Specification Figure C-2: SO
- Page 429 and 430:
Features In-system programmable 3.3
- Page 431 and 432:
R Table 1: Pin Names and Descriptio
- Page 433 and 434:
DATA(D0) D2 CLK TDI TMS TCK CF/D4*
- Page 435 and 436:
R V CC IEEE 1149.1 Boundary-Scan (J
- Page 437 and 438:
R TCK TMS TDI TDO TAP AC Parameters
- Page 439 and 440:
TDI TMS TCK TDO TDI TMS TCK TDO J1
- Page 441 and 442:
R Reset Activation On power up, OE/
- Page 443 and 444:
R XC18V00 Series of In-System Progr
- Page 445 and 446:
R XC18V00 Series of In-System Progr
- Page 447 and 448:
R XC18V00 Series of In-System Progr
- Page 449 and 450:
R Revision History The following ta
- Page 451 and 452:
Glossary AQL ASIC R asynchronous AT
- Page 453 and 454:
: configuration frame The configura
- Page 455 and 456:
: function generator gate gate arra
- Page 457 and 458:
: netlist NRE optimization pad Para
- Page 459 and 460:
: schematic Graphic representation
- Page 461 and 462:
Index Numerics 3-state output buffe
- Page 463 and 464:
H Hardware Description Language (HD
- Page 465 and 466:
thermal considerations 365 thermal