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"Chapter 1 - The Op Amp's Place in the World" - HTL Wien 10

"Chapter 1 - The Op Amp's Place in the World" - HTL Wien 10

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Packages<br />

17-26<br />

IN1<br />

+<br />

OUT1<br />

IN2 IN3<br />

OUT2<br />

OUT3<br />

Figure 17–20. Quad <strong>Op</strong> Amp Package Layout with Half-Supply Generator<br />

This example shows all of <strong>the</strong> connections actually required to produce three <strong>in</strong>dependent<br />

<strong>in</strong>vert<strong>in</strong>g stages. Note that <strong>the</strong> half-supply connection can be made entirely under <strong>the</strong> IC,<br />

keep<strong>in</strong>g <strong>the</strong> trace length short. This example is not meant to be used as a suggested PCB<br />

layout, it merely illustrates what can be done. <strong>The</strong> half-supply op amp, for example, could<br />

be any one of <strong>the</strong> four. <strong>The</strong> passive components can be selected so that <strong>the</strong>y span <strong>the</strong><br />

lead pitch. Surface-mount 0402 packages, for example, span a width equal to or less than<br />

a standard SO package. This can keep traces lengths extremely short for high frequency<br />

applications.<br />

Package styles for op amps <strong>in</strong>clude <strong>the</strong> dual-<strong>in</strong>-l<strong>in</strong>e (DIP) and small-outl<strong>in</strong>e (SO). Lead<br />

pitches for op amps have been cont<strong>in</strong>ually decreas<strong>in</strong>g, as has been <strong>the</strong> case for all ICs<br />

<strong>in</strong> general. Decreas<strong>in</strong>g lead pitches have been accompanied by a decrease <strong>in</strong> <strong>the</strong> size<br />

of passive components as well. Decreas<strong>in</strong>g <strong>the</strong> overall circuit dimensions reduces parasitic<br />

<strong>in</strong>ductance, which should allow higher frequency circuits, but it also <strong>in</strong>creases <strong>the</strong> potential<br />

for crosstalk by plac<strong>in</strong>g conductors closer to each o<strong>the</strong>r where capacitive effects<br />

<strong>in</strong>crease.<br />

17.7.1 Through-Hole Considerations<br />

<strong>The</strong> older technology for op amps and o<strong>the</strong>r components is through-hole. Components<br />

are constructed with leads that <strong>in</strong>sert through holes <strong>in</strong> <strong>the</strong> board — hence <strong>the</strong> name.<br />

Through-hole components, due to <strong>the</strong>ir size, are more suited to applications where space<br />

is not an issue. <strong>The</strong> components <strong>the</strong>mselves are frequently lower <strong>in</strong> cost, but <strong>the</strong> PCB is<br />

more expensive due to <strong>the</strong> fact that <strong>the</strong> PCB fabrication house has to drill holes for component<br />

leads. PCBs are primarily a mechanical fabrication — <strong>the</strong> number of holes and number<br />

of different drills have a big impact on <strong>the</strong> price.<br />

<strong>The</strong> leads on a through-hole op amp are arranged on a 0.1-<strong>in</strong>ch grid. Many PCB layout<br />

people like to ma<strong>in</strong>ta<strong>in</strong> <strong>the</strong> 0.1-<strong>in</strong>ch grid for <strong>the</strong> rest of <strong>the</strong> components as well. Resistors

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