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"Chapter 1 - The Op Amp's Place in the World" - HTL Wien 10

"Chapter 1 - The Op Amp's Place in the World" - HTL Wien 10

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17.3 Ground<strong>in</strong>g<br />

Circuit Board Layout Techniques<br />

Ground<strong>in</strong>g<br />

ponents and feed-throughs will be exposed. <strong>The</strong>refore, any shield<strong>in</strong>g effects are compromised.<br />

It is far better to take advantage of <strong>the</strong> distributed capacitance between <strong>the</strong> power<br />

and ground plane by mak<strong>in</strong>g <strong>the</strong>m <strong>in</strong>ternal.<br />

Ano<strong>the</strong>r advantage of plac<strong>in</strong>g <strong>the</strong> planes <strong>in</strong>ternally is that <strong>the</strong> signal traces are available<br />

for prob<strong>in</strong>g and modification on <strong>the</strong> top and bottom layers. Anyone who has had to change<br />

connections on buried traces will appreciate this feature.<br />

For more than four layers, it is a general rule to shield higher speed signals between <strong>the</strong><br />

ground and power planes, and route slower signals on <strong>the</strong> outer layers.<br />

Good ground<strong>in</strong>g is a system-level design consideration. It should be planned <strong>in</strong>to <strong>the</strong><br />

product from <strong>the</strong> first conceptual design reviews.<br />

17.3.1 <strong>The</strong> Most Important Rule: Keep Grounds Separate<br />

Separate ground<strong>in</strong>g for analog and digital portions of circuitry is one of <strong>the</strong> simplest and<br />

most effective methods of noise suppression. One or more layers on multi-layer PCBs are<br />

usually devoted to ground planes. If <strong>the</strong> designer is not careful, <strong>the</strong> analog circuitry will<br />

be connected directly to <strong>the</strong>se ground planes. <strong>The</strong> analog circuitry return, after all, is <strong>the</strong><br />

same net <strong>in</strong> <strong>the</strong> netlist as digital return. Autorouters respond accord<strong>in</strong>gly and connect all<br />

of <strong>the</strong> grounds toge<strong>the</strong>r, creat<strong>in</strong>g a disaster.<br />

After <strong>the</strong> fact separation of grounds on a mixed digital and analog board is almost impossible.<br />

Every ground connection <strong>in</strong> <strong>the</strong> analog circuitry must be lifted from <strong>the</strong> board and connected<br />

toge<strong>the</strong>r. For surface mount boards, this results <strong>in</strong> a colossal mess of “tombstoned”<br />

passive components and float<strong>in</strong>g IC leads.<br />

17.3.2 O<strong>the</strong>r Ground Rules<br />

Ground and power planes are at <strong>the</strong> same ac potential, due to decoupl<strong>in</strong>g capacitors<br />

and distributed capacitance. <strong>The</strong>refore, it is important to isolate <strong>the</strong> power planes<br />

as well.<br />

Do not overlap digital and analog planes (Figure 17–2). <strong>Place</strong> analog power<br />

co<strong>in</strong>cident with analog ground, and digital power co<strong>in</strong>cident with digital ground. If<br />

any portion of analog and digital planes overlap, <strong>the</strong> distributed capacitance<br />

between <strong>the</strong> overlapp<strong>in</strong>g portions will couple high-speed digital noise <strong>in</strong>to <strong>the</strong><br />

analog circuitry. This defeats <strong>the</strong> purpose of isolated planes.<br />

17-7

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