JAEA-Review-2010-065.pdf:15.99MB - 日本原子力研究開発機構
JAEA-Review-2010-065.pdf:15.99MB - 日本原子力研究開発機構
JAEA-Review-2010-065.pdf:15.99MB - 日本原子力研究開発機構
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1-10<br />
Hole Concentration [cm -3 ]<br />
10 15<br />
Mechanisms of Changes of Hole Concentration in<br />
Al-doped 6H-SiC by Electron Irradiation and Annealing<br />
H. Matsuura a) , H. Yanagisawa a) , K. Nishino a) , Y. Myojin a) , T. Nojiri a) , Y. Matsuyama a) ,<br />
S. Onoda b) and T. Ohshima b)<br />
a) Dept. of Electric and Electronic Engineering, Osaka Electro-Communication University,<br />
b) Environment and Industrial Materials Research Division, QuBS, <strong>JAEA</strong><br />
By comparing electron-radiation damage in p-type<br />
4H-SiC with that in p-type Si, 1, 2) it was found that the<br />
reduction in the temperature-dependent hole concentration<br />
p(T) in Al-doped p-type 4H-SiC by electron irradiation was<br />
much larger than in Al-doped p-type Si. From p(T) for<br />
lightly Al-doped 6H-SiC epilayers, an acceptor species with<br />
E V+0.2 eV, which is ascribed to an Al atom at a Si<br />
sublattice site, was observed. In heavily Al-implanted<br />
p-type 6H-SiC layers, the removal cross section of Al<br />
acceptors (κ Al) for 1 MeV electron irradiation was<br />
determined to be 6.4 × 10-18 cm 2, 3) .<br />
A 4.9 μm-thick lightly Al-doped p-type 6H-SiC epilayer<br />
on n-type 6H-SiC (resistivity: 0.027 Ωcm) was cut to a<br />
1 × 1 cm2 size. The sample was irradiated with 200 keV<br />
electrons with total fluences (Φ) of 0, 1.0, 2.0, and 3.0 ×<br />
10 16 cm -2 at room temperature. The value of p(T) were<br />
obtained by Hall-effect measurements. Since the p(T) at Φ<br />
of 3.0 × 1016 cm -2 could not be obtained, the sample was<br />
annealed at 500 °C for 2 min in an Ar atmosphere. The<br />
densities and energy levels of acceptors were determined by<br />
free carrier concentration spectroscopy (FCCS) 1-4) from<br />
p(T).<br />
Figure 1 shows the experimental p(T) before irradiation<br />
(○) and after irradiation with 200 keV electrons with Φ of<br />
1.0 × 1016 cm -2 (▲) and 2.0 × 1016 cm -2 (□). The value of<br />
p(T) in the annealed sample is denoted by + in Fig. 1.<br />
Using p(T), the densities (N Al and N DA) and levels (E Al and<br />
E DA) of Al and deep acceptors were determined by FCCS.<br />
200 keV electrons<br />
Fluence [cm -2 ]<br />
: 0<br />
: 1x10 16<br />
: 2x10 16<br />
: 3x10 16 and<br />
500 o C annealing for 2 min<br />
1000/T [K -1 10<br />
1 2 3 4 5<br />
]<br />
13<br />
10 14<br />
Fig. 1 Temperature dependence of hole concentration for<br />
Al-doped p-type 6H-SiC before and after irradiation<br />
with three difference Φ of 200 keV electrons. The<br />
p(T) for the annealed sample was shown by +. The<br />
solid lines represent p(T) simulations with N Al, E Al,<br />
N DA, E DA, and N comp obtained by FCCS.<br />
<strong>JAEA</strong>-<strong>Review</strong> <strong>2010</strong>-065<br />
- 14 -<br />
Since each p(T) simulation (solid line) with the obtained<br />
values is in good agreement with the corresponding<br />
experimental p(T), the values obtained by FCCS are<br />
reliable.<br />
Figure 2 shows the dependence of N Al and N DA on Φ,<br />
denoted by ○ and Δ, respectively. At Φ of 3.0 × 1016 cm -2 ,<br />
N Al and N DA in the 500 °C-annealed sample were shown by<br />
● and ▲, respectively. Although N Al and N DA in the<br />
sample irradiated with Φ of 3 × 1016 cm -2 could not be<br />
determined, they are expected to be 4.3 × 1013 and<br />
2.1 × 1015 cm -3 , respectively, by simulation 4) with κ Al of<br />
1 × 10-16 cm 2 and κ DA of 9 × 10-18 cm 2 . The simulations of<br />
the dependence of N Al and N DA on Φ represent the solid and<br />
broken lines in Fig. 2, respectively. After annealing the<br />
sample at 500 °C for 2 min, N Al and N DA could be<br />
determined to be 4.0 × 1014 and 1.5 × 10 15 cm -3 , respectively.<br />
By annealing at 500 °C, N Al is increased, and N DA is<br />
decreased. From Fig. 2, furthermore, the increment of N Al<br />
is nearly equal to the decrement of N DA. These suggest<br />
that the 500 °C annealing transforms the deep acceptors into<br />
the Al acceptors.<br />
References<br />
1) H. Matsuura et al., Jpn. J. Appl. Phys. 45 (2006) 2648.<br />
2) H. Matsuura et al., Physica B 376-377 (2006) 342.<br />
3) H. Matsuura et al., Jpn. J. Appl. Phys. 47 (2008) 5355.<br />
4) H. Matsuura et al., J. Appl. Phys 104 (2008) 043702.<br />
Density [x10 15 cm -3 ]<br />
3<br />
2<br />
1<br />
N A2<br />
N A1<br />
After 773 K<br />
annealing<br />
for 2 min<br />
Fluence of 200 keV electrons [x10 16 cm -2 0 1 2 3<br />
]<br />
Fig. 2 Dependence of N Al and N DA on Φ of 200 keV<br />
electrons. Since NAl and N DA in the sample irradiated<br />
at Φ of 3 × 1016 cm -2 could not be obtained, the sample<br />
was annealed at 500 °C for 2 min. N Al and N DA in the<br />
annealed sample are denoted by ● and ▲, respectively.<br />
The dependence of N Al and N DA on Φ, simulated with<br />
κ Al of 1 × 10-16 cm 2 and κ DA of 9 × 10 -18 cm 2 , are shown<br />
by solid and broken lines, respectively.