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JAEA-Review-2010-065.pdf:15.99MB - 日本原子力研究開発機構

JAEA-Review-2010-065.pdf:15.99MB - 日本原子力研究開発機構

JAEA-Review-2010-065.pdf:15.99MB - 日本原子力研究開発機構

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1-10<br />

Hole Concentration [cm -3 ]<br />

10 15<br />

Mechanisms of Changes of Hole Concentration in<br />

Al-doped 6H-SiC by Electron Irradiation and Annealing<br />

H. Matsuura a) , H. Yanagisawa a) , K. Nishino a) , Y. Myojin a) , T. Nojiri a) , Y. Matsuyama a) ,<br />

S. Onoda b) and T. Ohshima b)<br />

a) Dept. of Electric and Electronic Engineering, Osaka Electro-Communication University,<br />

b) Environment and Industrial Materials Research Division, QuBS, <strong>JAEA</strong><br />

By comparing electron-radiation damage in p-type<br />

4H-SiC with that in p-type Si, 1, 2) it was found that the<br />

reduction in the temperature-dependent hole concentration<br />

p(T) in Al-doped p-type 4H-SiC by electron irradiation was<br />

much larger than in Al-doped p-type Si. From p(T) for<br />

lightly Al-doped 6H-SiC epilayers, an acceptor species with<br />

E V+0.2 eV, which is ascribed to an Al atom at a Si<br />

sublattice site, was observed. In heavily Al-implanted<br />

p-type 6H-SiC layers, the removal cross section of Al<br />

acceptors (κ Al) for 1 MeV electron irradiation was<br />

determined to be 6.4 × 10-18 cm 2, 3) .<br />

A 4.9 μm-thick lightly Al-doped p-type 6H-SiC epilayer<br />

on n-type 6H-SiC (resistivity: 0.027 Ωcm) was cut to a<br />

1 × 1 cm2 size. The sample was irradiated with 200 keV<br />

electrons with total fluences (Φ) of 0, 1.0, 2.0, and 3.0 ×<br />

10 16 cm -2 at room temperature. The value of p(T) were<br />

obtained by Hall-effect measurements. Since the p(T) at Φ<br />

of 3.0 × 1016 cm -2 could not be obtained, the sample was<br />

annealed at 500 °C for 2 min in an Ar atmosphere. The<br />

densities and energy levels of acceptors were determined by<br />

free carrier concentration spectroscopy (FCCS) 1-4) from<br />

p(T).<br />

Figure 1 shows the experimental p(T) before irradiation<br />

(○) and after irradiation with 200 keV electrons with Φ of<br />

1.0 × 1016 cm -2 (▲) and 2.0 × 1016 cm -2 (□). The value of<br />

p(T) in the annealed sample is denoted by + in Fig. 1.<br />

Using p(T), the densities (N Al and N DA) and levels (E Al and<br />

E DA) of Al and deep acceptors were determined by FCCS.<br />

200 keV electrons<br />

Fluence [cm -2 ]<br />

: 0<br />

: 1x10 16<br />

: 2x10 16<br />

: 3x10 16 and<br />

500 o C annealing for 2 min<br />

1000/T [K -1 10<br />

1 2 3 4 5<br />

]<br />

13<br />

10 14<br />

Fig. 1 Temperature dependence of hole concentration for<br />

Al-doped p-type 6H-SiC before and after irradiation<br />

with three difference Φ of 200 keV electrons. The<br />

p(T) for the annealed sample was shown by +. The<br />

solid lines represent p(T) simulations with N Al, E Al,<br />

N DA, E DA, and N comp obtained by FCCS.<br />

<strong>JAEA</strong>-<strong>Review</strong> <strong>2010</strong>-065<br />

- 14 -<br />

Since each p(T) simulation (solid line) with the obtained<br />

values is in good agreement with the corresponding<br />

experimental p(T), the values obtained by FCCS are<br />

reliable.<br />

Figure 2 shows the dependence of N Al and N DA on Φ,<br />

denoted by ○ and Δ, respectively. At Φ of 3.0 × 1016 cm -2 ,<br />

N Al and N DA in the 500 °C-annealed sample were shown by<br />

● and ▲, respectively. Although N Al and N DA in the<br />

sample irradiated with Φ of 3 × 1016 cm -2 could not be<br />

determined, they are expected to be 4.3 × 1013 and<br />

2.1 × 1015 cm -3 , respectively, by simulation 4) with κ Al of<br />

1 × 10-16 cm 2 and κ DA of 9 × 10-18 cm 2 . The simulations of<br />

the dependence of N Al and N DA on Φ represent the solid and<br />

broken lines in Fig. 2, respectively. After annealing the<br />

sample at 500 °C for 2 min, N Al and N DA could be<br />

determined to be 4.0 × 1014 and 1.5 × 10 15 cm -3 , respectively.<br />

By annealing at 500 °C, N Al is increased, and N DA is<br />

decreased. From Fig. 2, furthermore, the increment of N Al<br />

is nearly equal to the decrement of N DA. These suggest<br />

that the 500 °C annealing transforms the deep acceptors into<br />

the Al acceptors.<br />

References<br />

1) H. Matsuura et al., Jpn. J. Appl. Phys. 45 (2006) 2648.<br />

2) H. Matsuura et al., Physica B 376-377 (2006) 342.<br />

3) H. Matsuura et al., Jpn. J. Appl. Phys. 47 (2008) 5355.<br />

4) H. Matsuura et al., J. Appl. Phys 104 (2008) 043702.<br />

Density [x10 15 cm -3 ]<br />

3<br />

2<br />

1<br />

N A2<br />

N A1<br />

After 773 K<br />

annealing<br />

for 2 min<br />

Fluence of 200 keV electrons [x10 16 cm -2 0 1 2 3<br />

]<br />

Fig. 2 Dependence of N Al and N DA on Φ of 200 keV<br />

electrons. Since NAl and N DA in the sample irradiated<br />

at Φ of 3 × 1016 cm -2 could not be obtained, the sample<br />

was annealed at 500 °C for 2 min. N Al and N DA in the<br />

annealed sample are denoted by ● and ▲, respectively.<br />

The dependence of N Al and N DA on Φ, simulated with<br />

κ Al of 1 × 10-16 cm 2 and κ DA of 9 × 10 -18 cm 2 , are shown<br />

by solid and broken lines, respectively.

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