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JAEA-Review-2010-065.pdf:15.99MB - 日本原子力研究開発機構

JAEA-Review-2010-065.pdf:15.99MB - 日本原子力研究開発機構

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4-47<br />

Fabrication of Dielectrophoretic Devices Using<br />

Poly-dimethylsiloxane Microstructures<br />

by Proton Beam Writing<br />

Y. Shiine a) , H. Nishikawa a) , Y. Furuta a) , T. Satoh b) , Y. Ishii b) , T. Kamiya b) ,<br />

R. Nakao c) and S. Uchida c)<br />

a) Department of Electrical Engineering, Shibaura Institute of Technology,<br />

b) Department of Advanced Radiation Technology, TARRI, <strong>JAEA</strong>,<br />

c) Department of Electrical and Electronic Engineering, Tokyo Metropolitan University<br />

Proton Beam Writing (PBW) is a direct write process<br />

1), 2)<br />

using focused beam of MeV protons . The focused MeV<br />

proton beam has several advantages over other techniques<br />

using sources such as electrons, x-rays, and UV light.<br />

When the high-aspect ratio microstructures such as pillar<br />

arrays produced by PBW were applied to dielectrophoretic<br />

(DEP) devices, it was previously demonstrated that a<br />

spatially modulated electric field can serve as an efficient<br />

trapping sites for microbes such as Escherichia coli<br />

(E.coli) 3) . Since the PBW is serial and a relatively slow<br />

lithographic process, it is time consuming to expose large<br />

area of resists for the whole device including micro fluidic<br />

channels with a length of several tens of millimeters. Such<br />

a drawback can be overcome by a coupled use of soft<br />

lithography techniques 4) with a master produced by PBW on<br />

poly-dimethylsiloxane (PDMS). In this paper, we<br />

demonstrate the fabrication of prototypes of 3D-DEP<br />

devices equipped with high-aspect-ratio pillars, which were<br />

combined with micro fluidic channels produced by a<br />

replication SU-8 master.<br />

High-aspect-ratio pillar arrays with area of 60 × 1000 m2<br />

were fabricated by PBW with a 13-m thick SU-8 on a<br />

SU-8 layer on<br />

silica or silicon<br />

Pour PDMS over the<br />

master<br />

Development<br />

(a) PBW.<br />

Pillar arrays<br />

SU-8 master<br />

PDMS peeled off<br />

from the master<br />

(b) Soft lithography of micro fluidic channel by a<br />

SU-8 master.<br />

Sealed pillar<br />

Cross section image<br />

(c) Sealing pillar arrays on silica with PDMS.<br />

Fig. 1 Fabrication processes of a DEP device by (a)<br />

proton beam writing of SU-8 for pillar arrays and a<br />

master, coupled with (b) a soft lithography using<br />

SU-8 master on PDMS, followed by (c) sealing the<br />

pillar arrays on silica with PDMS.<br />

<strong>JAEA</strong>-<strong>Review</strong> <strong>2010</strong>-065<br />

- 171 -<br />

silica substrate. A master for a PDMS micro fluidic<br />

channel was fabricated by PBW on SU-8 layer on a silicon<br />

substrate. The PBW was performed at 1.0-1.7 MeV proton<br />

beam focused around 1 m, using a dedicated PB writer at<br />

the Center for Flexible Micromachining, Shibaura Institute<br />

of Technology, or at the Takasaki Ion Accelerators for<br />

Advanced Radiation Application (TIARA), Japan Atomic<br />

Energy Agency.<br />

Figure 1 shows a process flow of fabricating DEP<br />

devices, including (a) PBW of SU-8 layer, (b) soft<br />

lithography of micro fluidic channel, and (c) sealing the<br />

pillar arrays with the PDMS, where the silica substrate with<br />

pillar arrays is sealed with PDMS with a micro fluidic<br />

channel. Figure 2 (a) show an optical microscope image of<br />

the pillar arrays on silica, which were successfully sealed<br />

with a PDMS micro fluidic channel. Figure 2 (b) shows a<br />

photograph the DEP device with tubing at inlet and outlet<br />

ports.<br />

A soft lithography technique with PDMS was<br />

successfully applied to the fabrication of the 3D-DEP device<br />

equipped with high-aspect-ratio pillar arrays. By the<br />

coupled use of the soft lithography technique with PBW, the<br />

fast prototyping capability of the PBW was highlighted for<br />

the development of the 3D-DEP devices.<br />

References<br />

1) F. Watt et al., Materials Today 10, 6 (2007) 20-29.<br />

2) Y. Furuta et al., J. Vac. Sci. Tech. B. 25 (2007)<br />

2171-2174.<br />

3) Y. Furuta et al., Microelectron. Eng. 86 (2009)<br />

1396-1400.<br />

4) J. C. McDonald and G. M. Whitesides, Acc. Chem. Res.<br />

35 (2002) 491-499.<br />

Pillar arrays<br />

Micro fluidic<br />

channel<br />

200 μm<br />

(a) Optical microscope image<br />

of pillar arrays on silica.<br />

Access port<br />

1mm<br />

(b) Photograph of<br />

the sealed device.<br />

Fig. 2 (a) Optical microscope image of a sealed pillar<br />

arrays on silica and (b) photograph DEP device.

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