Presentation - HFSS™ Simulation of a Test Board to Improve ...

More documents

Recommendations

Info

Methodology � Module interface cannot be probed � Test input return loss of the test board & socket under 3 conditions – Matched load 50 ohm chip resistor between socket package RF IN and GND contacts – Open (no connection) circuit at socket package contacts – Shorted wire across socket package RF IN and GND contacts � Test and modeled input return loss of each test piece – Matched, open, and short loads tested separately – Modeled the loads to determine their parasitics – Isolates performance limitations of the loads from the test board & socket models � Compare simulated board & socket + cascaded load with measured data Slide 8
Test Board and Socket HFSS Model Slide 9
Page 1 and 2: Design of a Custom Printed Circuit
Page 3 and 4: Overview � Mass production effort
Page 5 and 6: SiP Return Loss at Test Board Input
Page 7: Test Board with Socket Attached Are
Page 11 and 12: Model Components � SMA - No shell
Page 13 and 14: Model Components � PCB with micro
Page 15 and 16: Model Components � Socket (cont
Page 17 and 18: Return Loss for Matched Load - Meas
Page 19 and 20: Return Loss for Open Circuit Load -
Page 21 and 22: Return Loss for Short Circuit Load
Page 23 and 24: Issues � Board impedance in desig
Page 25 and 26: Conclusion � Model of test board

Presentation - HFSS™ Simulation of a Test Board to Improve ...

Create successful ePaper yourself

Delete template?

Save as template?